Teccor® brandThyristors
25 Amp Standard & Alternistor (High Commutation) Triacs
Soldering Parameters
Reflow Condition
-Temperature Min (Ts(min)
Pb – Free assembly
tP
TP
)
150°C
Ramp-up
TL
TS(max)
Pre Heat -Temperature Max (Ts(max)
-Time (min to max) (ts)
)
200°C
tL
60 – 180 secs
Ramp-down
Preheat
Average ramp up rate (LiquidusTemp)
(TL) to peak
5°C/second max
5°C/second max
TS(min)
tS
TS(max) toTL - Ramp-up Rate
-Temperature (TL) (Liquidus) 217°C
25
Reflow
time to peak temperature
-Temperature (tL)
60 – 150 seconds
260+0/-5 °C
Time
PeakTemperature (TP)
Time within 5°C of actual peak
Temperature (tp)
20 – 40 seconds
Ramp-down Rate
5°C/second max
8 minutes Max.
280°C
Time 25°C to peakTemperature (TP)
Do not exceed
Physical Specifications
Environmental Specifications
Test
Specifications and Conditions
Terminal Finish
Body Material
Lead Material
100% MatteTin-plated
HighTemperature
Voltage Blocking
MIL-STD-750: Method 1040, Condition A
Rated VRRM, 125°C, 1008 hours
UL recognized epoxy meeting flammability
classification 94V-0
MIL-STD-750: Method 1051
-40°C to 125°C, 15-minute dwell,
100 cycles
Temperature Cycling
Copper Alloy
BiasedTemp &
Humidity
EIA/JEDEC: JESD22-A101
320VDC, 85°C, 85%RH, 1008 hours
MIL-STD-750: Method 1031
150°C, 1008 hours
HighTemp. Storage
Low-Temp Storage
Design Considerations
-40°C, 1008 hours
Careful selection of the correct device for the application’s
operating parameters and environment will go a long way
toward extending the operating life of theThyristor. Good
design practice should limit the maximum continuous
current through the main terminals to 75% of the device
rating. Other ways to ensure long life for a power discrete
semiconductor are proper heat sinking and selection of
voltage ratings for worst case conditions. Overheating,
overvoltage (including dv/dt), and surge currents are
the main killers of semiconductors. Correct mounting,
soldering, and forming of the leads also help protect
against component damage.
MIL-STD-750: Method 1056
0°C to 100°C, 5-minute dwell,
10-second transfer, 10 cycles
Thermal Shock
Autoclave
EIA/JEDEC: JESD22-A102
(Pressure CookerTest) 121°C, 100%RH, 2atm, 168 hours
Resistance to
Solder Heat
MIL-STD-750: Method 2031
260°C, 10 seconds
Solderability
Lead Bend
ANSI/J-STD-002, Category 3, Test A
MIL-STD-750: Method 2036, Condition E
Qxx25xx & Qxx25xHx Series
©2010 Littelfuse, Inc
Specifications are subject to change without notice.
Please refer to http://www.littelfuse.com for current information.
122
Revised: May 10, 2010 09:33 PM