Teccor® brandThyristors
Standard Bidirectional SIDACs
Soldering Parameters
Reflow Condition
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tP
TP
-Temperature Min (Ts(min)
)
150°C
Ramp-up
TL
TS(max)
Pre Heat -Temperature Max (Ts(max)
)
200°C
tL
-Time (min to max) (ts)
60 – 180 secs
Ramp-down
Preheat
Average ramp up rate (LiquidusTemp)
(TL) to peak
5°C/second max
TS(min)
tS
TS(max) toTL - Ramp-up Rate
5°C/second max
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-Temperature (TL) (Liquidus)
Reflow
25
time to peak temperature
-Temperature (tL)
60 – 150 seconds
260+0/-5 °C
Time
PeakTemperature (TP)
Time within 5°C of actual peak
Temperature (tp)
20 – 40 seconds
Ramp-down Rate
5°C/second max
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280°C
Time 25°C to peakTemperature (TP)
Do not exceed
Physical Specifications
Reliability/EnvironmentalTests
Test
Specifications and Conditions
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Dipped
Terminal Finish
Body Material
Lead Material
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hours
HighTemperature
Voltage Blocking
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Temperature Cycling -40°C to 150°C, 15-minute dwell, 100
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hours
BiasedTemperature &
Humidity
Design Considerations
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HighTemp Storage
Careful selection of the correct device for the application’s
operating parameters and environment will go a long
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SIDACs. Correct mounting, soldering, and forming of the
leads also help protect against component damage.
150°C, 1008 hours
Low-Temp Storage
Thermal Shock
Autoclave
-40°C, 1008 hours
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0°C to 100°C, 5-minute dwell,
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Resistance to
Solder Heat
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260°C, 10 seconds
Solderability
Lead Bend
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Kxxxzy Series
©2010 Littelfuse, Inc
318
Specifications are subject to change without notice.
Please refer to http://www.littelfuse.com for current information.
Revised:December21,201002:40PM