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TXS0101_10

型号：

TXS0101_10

描述：

1位双向电压电平转换为漏极开路和推挽应用[ 1-BIT BIDIRECTIONAL VOLTAGE-LEVEL TRANSLATOR FOR OPEN-DRAIN AND PUSH-PULL APPLICATIONS ]

品牌：

TI[ TEXAS INSTRUMENTS ]

页数：

21 页

PDF大小：

831 K

下载PDF手册
TXS0101  
www.ti.com ............................................................................................................................................. SCES638B–OCTOBER 2007–REVISED JANUARY 2009  
1-BIT BIDIRECTIONAL VOLTAGE-LEVEL TRANSLATOR  
FOR OPEN-DRAIN AND PUSH-PULL APPLICATIONS  
1
FEATURES  
2
•
No Direction-Control Signal Needed  
•
ESD Protection Exceeds JESD 22  
•
Maximum Data Rates  
–
A Port  
–
–
24 Mbps (Push Pull)  
2 Mbps (Open Drain)  
–
–
–
2500-V Human-Body Model (A114-B)  
200-V Machine Model (A115-A)  
•
•
•
Available in the Texas Instruments NanoFree™  
Package  
1500-V Charged-Device Model (C101)  
–
B Port  
1.65 V to 3.6 V on A port and 2.3 V to 5.5 V on  
–
–
–
8-kV Human-Body Model (A114-B)  
B port (VCCA ≤ VCCB  
)
200-V Machine Model (A115-A)  
VCC Isolation Feature – If Either VCC Input Is at  
GND, Both Ports Are in the High-Impedance  
State  
1500-V Charged-Device Model (C101)  
DBV, DCK, OR DRL PACKAGE  
(TOP VIEW)  
•
•
•
No Power-Supply Sequencing Required –  
Either VCCA or VCCB Can be Ramped First  
V
V
CCB  
1
2
3
6
5
4
CCA  
Ioff Supports Partial-Power-Down Mode  
Operation  
GND  
A
OE  
B
Latch-Up Performance Exceeds 100 mA Per  
JESD 78, Class II  
YZP PACKAGE  
(BOTTOM VIEW)  
C1  
B1  
A1  
C2  
B2  
A2  
3 4  
2 5  
1 6  
A
B
GND  
OE  
V
V
CCA  
CCB  
DESCRIPTION/ORDERING INFORMATION  
This one-bit noninverting translator uses two separate configurable power-supply rails. The A port is designed to  
track VCCA. VCCA accepts any supply voltage from 1.65 V to 3.6 V. The B port is designed to track VCCB. VCCA  
must be less than or equal to VCCB. VCCB accepts any supply voltage from 2.3 V to 5.5 V. This allows for  
low-voltage bidirectional translation between any of the 1.8-V, 2.5-V, 3.3-V, and 5-V voltage nodes.  
When the output-enable (OE) input is low, all outputs are placed in the high-impedance state.  
To ensure the high-impedance state during power up or power down, OE should be tied to GND through a  
pulldown resistor; the minimum value of the resistor is determined by the current-sourcing capability of the driver.  
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas  
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
2
NanoFree is a trademark of Texas Instruments.  
PRODUCTION DATA information is current as of publication date.  
Products conform to specifications per the terms of the Texas  
Instruments standard warranty. Production processing does not  
necessarily include testing of all parameters.  
Copyright © 2007–2009, Texas Instruments Incorporated  
TXS0101  
SCES638B–OCTOBER 2007–REVISED JANUARY 2009 ............................................................................................................................................. www.ti.com  
ORDERING INFORMATION  
ORDERABLE  
PART NUMBER  
TOP-SIDE  
TA  
PACKAGE(1)(2)  
MARKING(3)  
NanoFree™ – WCSP (DSBGA)  
Reel of 3000  
TXS0101YZPR  
_ _ _2G_  
0.23-mm Large Bump – YZP (Pb-free)  
SOT (SOT-23) – DBV  
Reel of 3000  
Reel of 250  
Reel of 3000  
Reel of 250  
Reel of 3000  
Reel of 250  
TXS0101DBVR  
TXS0101DBVT  
TXS0101DCKR  
TXS0101DCKT  
TXS0101DRLR  
TXS0101DRLT  
NFF_  
2G_  
–40°C to 85°C  
SOT (SC-70) – DCK  
SOT (SOT-563) – DRL  
2G_  
(1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI  
web site at www.ti.com.  
(2) Package drawings, thermal data, and symbolization are available at www.ti.com/packaging.  
(3) DBV/DCK/DRL: The actual top-side marking has one additional character that designates the wafer fab/assembly site.  
YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one following  
character to designate the wafer fab/assembly site. Pin 1 identifier indicates solder-bump composition (1 = SnPb, • = Pb-free).  
PIN DESCRIPTION  
NO. NAME  
FUNCTION  
1
2
3
4
5
6
VCCA A-port supply voltage. 1.65 V ≤ VCCA ≤ 3.6 V and VCCA ≤ VCCB  
GND Ground  
A
B
Input/output A. Referenced to VCCA  
Input/output B. Referenced to VCCB  
.
.
OE  
Output enable. Pull OE low to place all outputs in 3-state mode. Referenced to VCCA.  
VCCB B-port supply voltage. 2.3 V ≤ VCCB ≤ 5.5 V  
TYPICAL OPERATING CIRCUIT  
1.8 V  
3.3 V  
V
CCA  
V
CCB  
1.8 V  
3.3 V  
System  
Controller  
System  
OE  
Data  
GND  
A
B
Data  
GND  
GND  
2
Submit Documentation Feedback  
Copyright © 2007–2009, Texas Instruments Incorporated  
Product Folder Link(s): TXS0101  
TXS0101  
www.ti.com ............................................................................................................................................. SCES638B–OCTOBER 2007–REVISED JANUARY 2009  
ABSOLUTE MAXIMUM RATINGS(1)  
over operating free-air temperature range (unless otherwise noted)  
MIN  
–0.5  
–0.5  
–0.5  
–0.5  
–0.5  
–0.5  
MAX  
4.6  
6.5  
4.6  
6.5  
4.6  
6.5  
UNIT  
V
VCCA  
VCCB  
Supply voltage range  
Supply voltage range  
V
A port  
VI  
Input voltage range(2)  
V
V
V
B port, OE  
A port  
Voltage range applied to any output  
VO  
VO  
in the high-impedance or power-off state(2)  
B port  
A port  
–0.5 VCCA + 0.5  
Voltage range applied to any output in the high or low state(2)(3)  
B port  
–0.5 VCCB + 0.5  
IIK  
IOK  
IO  
Input clamp current  
VI < 0  
–50  
–50  
mA  
mA  
mA  
mA  
°C  
Output clamp current  
VO < 0  
Continuous output current  
Continuous current through VCCA, VCCB, or GND  
Storage temperature range  
±50  
±100  
Tstg  
–65  
150  
(1) Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings  
only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating  
conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.  
(2) The input and output negative-voltage ratings may be exceeded if the input and output current ratings are observed.  
(3) The value of VCCA and VCCB are provided in the recommended operating conditions table.  
THERMAL IMPEDANCE RATINGS  
UNIT  
DBV package  
DCK package  
DRL package  
YZP package  
165  
259  
142  
123  
θJA  
Package thermal impedance(1)  
°C/W  
(1) The package thermal impedance is calculated in accordance with JESD 51-7.  
Copyright © 2007–2009, Texas Instruments Incorporated  
Submit Documentation Feedback  
3
Product Folder Link(s): TXS0101  
TXS0101  
SCES638B–OCTOBER 2007–REVISED JANUARY 2009 ............................................................................................................................................. www.ti.com  
RECOMMENDED OPERATING CONDITIONS(1)(2)  
VCCA  
VCCB  
MIN  
MAX UNIT  
VCCA  
VCCB  
1.65  
3.6  
V
Supply voltage(3)  
2.3  
5.5  
1.65 V to 1.95 V  
2.3 V to 3.6 V  
VCCI – 0.2  
VCCI  
A-port I/Os  
2.3 V to 5.5 V  
2.3 V to 5.5 V  
VCCI – 0.4  
VCCI  
VIH  
High-level input voltage  
V
B-port I/Os  
OE input  
VCCI – 0.4  
VCCI  
1.65 V to 3.6 V  
VCCA × 0.65  
5.5  
A-port I/Os  
B-port I/Os  
OE input  
0
0
0
0.15  
VIL  
Low-level input voltage  
1.65 V to 3.6 V  
2.3 V to 5.5 V  
2.3 V to 5.5 V  
0.15  
V
VCCA × 0.35  
A-port I/Os,  
push-pull driving  
10  
10  
Input transition rise or fall  
rate  
Δt/Δv  
B-port I/Os,  
push-pull driving  
1.65 V to 3.6 V  
ns/V  
°C  
Control Input  
10  
85  
TA  
Operating free-air temperature  
–40  
(1) VCCI is the supply associated with the input port.  
(2) VCCO is the supply associated with the output port.  
(3) VCCA must be less than or equal to VCCB, and VCCA must not exceed 3.6 V.  
ELECTRICAL CHARACTERISTICS(1)(2)(3)  
over recommended operating free-air temperature range (unless otherwise noted)  
TA = 25°C  
MIN TYP MAX  
–40°C to 85°C  
MIN MAX  
TEST  
CONDITIONS  
PARAMETER  
VOHA  
VOLA  
VOHB  
VOLB  
II  
VCCA  
VCCB  
UNIT  
IOH = –20 µA,  
VIB ≥ VCCB – 0.4 V  
1.65 V to 3.6 V  
1.65 V to 3.6 V  
1.65 V to 3.6 V  
1.65 V to 3.6 V  
2.3 V to 5.5 V  
2.3 V to 5.5 V  
2.3 V to 5.5 V  
2.3 V to 5.5 V  
VCCA × 0.67  
V
V
V
V
IOL = 1 mA,  
VIB ≤ 0.15 V  
0.4  
IOH = –20 µA,  
VIA ≥ VCCA – 0.2 V  
VCCB × 0.67  
IOL = 1 mA,  
VIA ≤ 0.15 V  
0.4  
OE  
1.65 V to 3.6 V  
0 V  
1.65 V to 5.5 V  
0 to 5.5 V  
0 V  
±1  
±1  
±1  
±1  
±2  
±2  
±2  
±2  
2.4  
2.2  
-1  
µA  
µA  
µA  
µA  
A port  
B port  
A or B port  
Ioff  
0 to 3.6 V  
1.65 V to 3.6 V  
1.65 V to VCCB  
3.6 V  
IOZ  
2.3 V to 5.5 V  
2.3 V to 5.5 V  
0 V  
VI = VO = open,  
IO = 0  
ICCA  
µA  
µA  
0 V  
5.5 V  
1.65 V to VCCB  
3.6 V  
2.3 V to 5.5 V  
0 V  
12  
-1  
VI = VO = open,  
IO = 0  
ICCB  
0 V  
5.5 V  
1
VI = VCCI  
IO = 0  
,
ICCA + ICCB  
1.65 V to VCCB  
3.3 V  
2.3 V to 5.5 V  
3.3 V  
14.4  
3.5  
µA  
CI  
OE  
2.5  
5
pF  
A port  
B port  
6
Cio  
3.3 V  
3.3 V  
pF  
6
7.5  
(1) VCCI is the VCC associated with the input port.  
(2) VCCO is the VCC associated with the output port.  
(3) VCCA must be less than or equal to VCCB, and VCCA must not exceed 3.6 V.  
4
Submit Documentation Feedback  
Copyright © 2007–2009, Texas Instruments Incorporated  
Product Folder Link(s): TXS0101  
TXS0101  
www.ti.com ............................................................................................................................................. SCES638B–OCTOBER 2007–REVISED JANUARY 2009  
TIMING REQUIREMENTS  
over recommended operating free-air temperature range, VCCA = 1.8 V ± 0.15 V (unless otherwise noted)  
VCCB = 2.5 V  
± 0.2 V  
VCCB = 3.3 V  
± 0.3 V  
VCCB = 5 V  
± 0.5 V  
UNIT  
MIN MAX  
MIN  
MAX  
MIN  
MAX  
Push-pull driving  
Open-drain driving  
Push-pull driving  
Open-drain driving  
21  
22  
2
24  
2
Data rate  
Mbps  
ns  
2
47  
45  
41  
tw  
Pulse duration  
Data inputs  
500  
500  
500  
TIMING REQUIREMENTS  
over recommended operating free-air temperature range, VCCA = 2.5 V ± 0.2 V (unless otherwise noted)  
VCCB = 2.5 V  
± 0.2 V  
VCCB = 3.3 V  
± 0.3 V  
VCCB = 5 V  
± 0.5 V  
UNIT  
MIN MAX  
MIN  
MAX  
MIN  
MAX  
Push-pull driving  
Open-drain driving  
Push-pull driving  
Open-drain driving  
20  
22  
2
24  
1
Data rate  
Mbps  
ns  
2
50  
45  
41  
tw  
Pulse duration  
Data inputs  
500  
500  
500  
TIMING REQUIREMENTS  
over recommended operating free-air temperature range, VCCA = 3.3 V ± 0.3 V (unless otherwise noted)  
VCCB = 3.3 V  
± 0.3 V  
VCCB = 5 V  
± 0.5 V  
UNIT  
MIN  
MAX  
23  
MIN  
MAX  
24  
Push-pull driving  
Open-drain driving  
Push-pull driving  
Open-drain driving  
Data rate  
Mbps  
ns  
2
2
43  
41  
tw  
Pulse duration  
Data inputs  
500  
500  
Copyright © 2007–2009, Texas Instruments Incorporated  
Submit Documentation Feedback  
5
Product Folder Link(s): TXS0101  
TXS0101  
SCES638B–OCTOBER 2007–REVISED JANUARY 2009 ............................................................................................................................................. www.ti.com  
SWITCHING CHARACTERISTICS  
over recommended operating free-air temperature range, VCCA = 1.8 V ± 0.15 V (unless otherwise noted)  
VCCB = 2.5 V VCCB = 3.3 V VCCB = 5 V  
FROM  
(INPUT)  
TO  
(OUTPUT)  
TEST  
CONDITIONS  
± 0.2 V  
± 0.3 V  
± 0.5 V  
PARAMETER  
UNIT  
MIN  
2.3  
45  
MAX MIN MAX MIN MAX  
Push-pull driving  
Open-drain driving  
Push-pull driving  
Open-drain driving  
Push-pull driving  
Open-drain driving  
Push-pull driving  
Open-drain driving  
5.3  
8.8  
5.4  
9.6  
7.1  
208  
4.5  
4.4  
4.5  
140  
200  
40  
6.8  
10  
tPHL  
tPLH  
tPHL  
tPLH  
2.4  
36  
2.6  
A
B
B
A
ns  
6.8  
7.5  
260  
4.4  
27 198  
4.7  
1.9  
45  
5.3  
1.1  
36  
1.2  
4
ns  
5.3  
0.5  
175  
200  
50  
27 102  
200  
ten  
OE  
OE  
A or B  
A or B  
ns  
ns  
tdis  
35  
Push-pull driving  
Open-drain driving  
Push-pull driving  
Open-drain driving  
Push-pull driving  
Open-drain driving  
Push-pull driving  
Open-drain driving  
Push-pull driving  
Open-drain driving  
3.2  
38  
1.1  
34  
1.9  
4.4  
2.2  
6.9  
21  
2
9.5  
2.3  
30  
1
9.3  
132  
9.1  
106  
6
2
22  
1
7.6  
95  
trA  
A-port rise time  
ns  
ns  
165  
10.8  
145  
5.9  
7.6  
76  
trB  
B-port rise time  
A-port fall time  
B-port fall time  
23  
1.9  
4.3  
2.2  
7.5  
22  
2
10  
1.4 13.3  
4.2 6.1  
2.6 16.2  
tfA  
6.9  
6.4  
16.2  
16.2  
ns  
13.8  
13.8  
tfB  
7
24  
2
16.2  
Max data rate  
Mbps  
6
Submit Documentation Feedback  
Copyright © 2007–2009, Texas Instruments Incorporated  
Product Folder Link(s): TXS0101  
TXS0101  
www.ti.com ............................................................................................................................................. SCES638B–OCTOBER 2007–REVISED JANUARY 2009  
SWITCHING CHARACTERISTICS  
over recommended operating free-air temperature range, VCCA = 2.5 V ± 0.2 V (unless otherwise noted)  
VCCB = 2.5 V VCCB = 3.3 V VCCB = 5 V  
FROM  
(INPUT)  
TO  
(OUTPUT)  
TEST  
CONDITIONS  
± 0.2 V  
± 0.3 V  
± 0.5 V  
PARAMETER  
UNIT  
MIN  
1.7  
43  
MAX MIN MAX MIN MAX  
Push-pull driving  
Open-drain driving  
Push-pull driving  
Open-drain driving  
Push-pull driving  
Open-drain driving  
Push-pull driving  
Open-drain driving  
3.2  
6.3  
3.5  
250  
3
3.7  
6
3.8  
5.8  
4.4  
tPHL  
tPLH  
tPHL  
tPLH  
2
36  
2.1  
A
B
B
A
ns  
4.1  
206  
3.6  
4.2  
1.6  
140  
200  
40  
27 190  
4.3  
1.8  
44  
4.7  
2.5  
170  
200  
50  
1.6  
37  
1.2  
4
1
ns  
27 103  
200  
ten  
OE  
OE  
A or B  
A or B  
ns  
ns  
tdis  
35  
Push-pull driving  
Open-drain driving  
Push-pull driving  
Open-drain driving  
Push-pull driving  
Open-drain driving  
Push-pull driving  
Open-drain driving  
Push-pull driving  
Open-drain driving  
2.8  
34  
1.3  
35  
1.9  
4.4  
2.2  
5.1  
20  
2
7.4  
149  
8.3  
151  
5.7  
6.9  
7.8  
8.8  
2.1  
28  
0.9  
24  
1.4  
4.3  
2.4  
5.4  
22  
2
6.6  
121  
7.2  
112  
5.5  
6.2  
6.7  
9.4  
0.9  
24  
5.6  
89  
trA  
A-port rise time  
ns  
ns  
0.4  
12  
6.1  
81  
trB  
B-port rise time  
A-port fall time  
B-port fall time  
0.8  
4.2  
2.6  
5.3  
5.8  
6.6  
tfA  
ns  
tfB  
ns  
5.4 10.4  
24  
2
Max data rate  
Mbps  
Copyright © 2007–2009, Texas Instruments Incorporated  
Submit Documentation Feedback  
7
Product Folder Link(s): TXS0101  
TXS0101  
SCES638B–OCTOBER 2007–REVISED JANUARY 2009 ............................................................................................................................................. www.ti.com  
SWITCHING CHARACTERISTICS  
over recommended operating free-air temperature range, VCCA = 3.3 V ± 0.3 V (unless otherwise noted)  
VCCB = 3.3 V  
± 0.3 V  
VCCB = 5 V  
± 0.5 V  
FROM  
(INPUT)  
TO  
(OUTPUT)  
TEST  
CONDITIONS  
PARAMETER  
UNIT  
MIN  
1.3  
36  
1
MAX MIN MAX  
Push-pull driving  
Open-drain driving  
Push-pull driving  
Open-drain driving  
Push-pull driving  
Open-drain driving  
Push-pull driving  
Open-drain driving  
2.4  
4.2  
4.2  
204  
2.5  
124  
2.5  
139  
200  
40  
3.1  
4.6  
4.4  
165  
3.3  
97  
tPHL  
tPLH  
tPHL  
tPLH  
1.4  
28  
1
A
B
B
A
ns  
ns  
2.6  
105  
200  
35  
3
3
ten  
OE  
OE  
A or B  
A or B  
ns  
ns  
tdis  
Push-pull driving  
Open-drain driving  
Push-pull driving  
Open-drain driving  
Push-pull driving  
Open-drain driving  
Push-pull driving  
Open-drain driving  
Push-pull driving  
Open-drain driving  
2.3  
25  
1.6  
26  
1.4  
4.3  
2.3  
5
5.6  
116  
6.4  
116  
5.4  
6.1  
7.4  
7.6  
1.9  
19  
0.6  
14  
1
4.8  
85  
trA  
A-port rise time  
B-port rise time  
A-port fall time  
B-port fall time  
ns  
ns  
7.4  
72  
trB  
5
tfA  
ns  
4.2  
2.4  
4.8  
24  
2
5.7  
7.6  
8.3  
tfB  
ns  
23  
2
Max data rate  
Mbps  
PRINCIPLES OF OPERATION  
Applications  
The TXS0101 can be used in level-translation applications for interfacing devices or systems operating at  
different interface voltages with one another. The TXS0101 is ideal for use in applications where an open-drain  
driver is connected to the data I/Os. The TXB0101 can also be used in applications where a push-pull driver is  
connected to the data I/Os, but the TXB0102 might be a better option for such push-pull applications.  
Architecture  
The TXS0101 architecture (see Figure 1) does not require a direction-control signal to control the direction of  
data flow from A to B or from B to A.  
8
Submit Documentation Feedback  
Copyright © 2007–2009, Texas Instruments Incorporated  
Product Folder Link(s): TXS0101  
TXS0101  
www.ti.com ............................................................................................................................................. SCES638B–OCTOBER 2007–REVISED JANUARY 2009  
VCCB  
VCCA  
One-  
shot  
One-  
shot  
T1  
T2  
10k  
10k  
Gate Bias  
A
B
Figure 1. Architecture of a TXS01xx Cell  
Each A-port I/O has an internal 10-kΩ pullup resistor to VCCA, and each B-port I/O has an internal 10-kΩ pullup  
resistor to VCCB. The output one-shots detect rising edges on the A or B ports. During a rising edge, the one-shot  
turns on the PMOS transistors (T1,T2) for a short duration, which speeds up the low-to-high transition.  
Input Driver Requirements  
The fall time (tfA, tfB) of a signal depends on the output impedance of the external device driving the data I/Os of  
the TXS0101. Similarly, the tPHL and max data rates also depend on the output impedance of the external driver.  
The values for tfA, tfB, tPHL, and maximum data rates in the data sheet assume that the output impedance of the  
external driver is less than 50 Ω.  
Power Up  
During operation, ensure that VCCA ≤ VCCB at all times. During power-up sequencing, VCCA ≥ VCCB does not  
damage the device, so any power supply can be ramped up first.  
Enable and Disable  
The TXS0101 has an OE input that is used to disable the device by setting OE low, which places all I/Os in the  
Hi-Z state. The disable time (tdis) indicates the delay between the time when OE goes low and when the outputs  
actually get disabled (Hi-Z). The enable time (ten) indicates the amount of time the user must allow for the  
one-shot circuitry to become operational after OE is taken high.  
Pullup or Pulldown Resistors on I/O Lines  
Each A-port I/O has an internal 10-kΩ pullup resistor to VCCA, and each B-port I/O has an internal 10-kΩ pullup  
resistor to VCCB. If a smaller value of pullup resistor is required, an external resistor must be added from the I/O  
to VCCA or VCCB (in parallel with the internal 10-kΩ resistors).  
Copyright © 2007–2009, Texas Instruments Incorporated  
Submit Documentation Feedback  
9
Product Folder Link(s): TXS0101  
TXS0101  
SCES638B–OCTOBER 2007–REVISED JANUARY 2009 ............................................................................................................................................. www.ti.com  
PARAMETER MEASUREMENT INFORMATION  
V
CCI  
V
CCO  
V
CCI  
V
CCO  
DUT  
DUT  
IN  
IN  
OUT  
OUT  
1 MW  
1 MW  
15 pF  
15 pF  
DATA RATE, PULSE DURATION, PROPAGATION DELAY,  
OUTPUT RISE AND FALL TIME MEASUREMENT USING  
AN OPEN-DRAIN DRIVER  
DATA RATE, PULSE DURATION, PROPAGATION DELAY,  
OUTPUT RISE AND FALL TIME MEASUREMENT USING  
A PUSH-PULL DRIVER  
2 × V  
CCO  
S1  
50 kW  
Open  
From Output  
Under Test  
15 pF  
50 kW  
TEST  
/t  
S1  
2 × V  
t
PZL PLZ  
CCO  
LOAD CIRCUIT FOR ENABLE/DISABLE  
TIME MEASUREMENT  
t
/t  
Open  
PHZ PZH  
t
w
V
CCI  
V
CCA  
V
/2  
V
/2  
Output  
Control  
(low-level  
enabling)  
Input  
CCI  
CCI  
V /2  
CCA  
V /2  
CCA  
0 V  
VOLTAGE WAVEFORMS  
PULSE DURATION  
0 V  
t
PLZ  
t
PZL  
V
V
CCO  
Output  
Waveform 1  
V
CCI  
V
V
/2  
CCO  
Input  
V
/2  
/2  
V
/2  
CCI  
CCI  
0.1 y V  
CCO  
S1 at 2 × V  
CCO  
OL  
0 V  
(see Note B)  
t
PHZ  
t
t
t
PLH  
PHL  
PZH  
Output  
Waveform 2  
S1 at GND  
V
OH  
0.9 y V  
V
OH  
CCO  
0.9 y V  
CCO  
/2  
Output  
V
CCO  
V
CCO  
/2  
CCO  
(see Note B)  
0.1 y V  
CCO  
0 V  
V
OL  
t
f
t
r
VOLTAGE WAVEFORMS  
PROPAGATION DELAY TIMES  
VOLTAGE WAVEFORMS  
ENABLE AND DISABLE TIMES  
A.  
C
L
includes probe and jig capacitance.  
B. Waveform 1 is for an output with internal conditions such that the output is low, except when disabled by the output control.  
Waveform 2 is for an output with internal conditions such that the output is high, except when disabled by the output control.  
C. All input pulses are supplied by generators having the following characteristics: PRRv10 MHz, Z = 50 Ω, dv/dt ≥ 1 V/ns.  
O
D. The outputs are measured one at a time, with one transition per measurement.  
E.  
F.  
G.  
H.  
I.  
t
t
t
V
V
and t  
and t  
and t  
are the same as t  
.
dis  
.
PLZ  
PZL  
PLH  
PHZ  
are the same as t  
PZH  
en  
are the same as t .  
pd  
PHL  
is the V associated with the input port.  
CC  
CCI  
is the V associated with the output port.  
CCO  
CC  
J. All parameters and waveforms are not applicable to all devices.  
Figure 2. Load Circuit and Voltage Waveforms  
10  
Submit Documentation Feedback  
Copyright © 2007–2009, Texas Instruments Incorporated  
Product Folder Link(s): TXS0101  
PACKAGE OPTION ADDENDUM  
www.ti.com  
21-Aug-2008  
PACKAGING INFORMATION  
Orderable Device  
TXS0101DBVR  
TXS0101DBVRG4  
TXS0101DBVT  
Status (1)  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
Package Package  
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)  
Qty  
Type  
Drawing  
SOT-23  
DBV  
6
6
6
6
6
6
6
6
6
6
6
3000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
SOT-23  
SOT-23  
SOT-23  
SC70  
DBV  
DBV  
DBV  
DCK  
DCK  
DCK  
DCK  
DRL  
DRL  
YZP  
3000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
TXS0101DBVTG4  
TXS0101DCKR  
TXS0101DCKRG4  
TXS0101DCKT  
TXS0101DCKTG4  
TXS0101DRLR  
TXS0101DRLRG4  
TXS0101YZPR  
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
3000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
SC70  
3000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
SC70  
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
SC70  
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
SOT  
4000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
SOT  
4000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
DSBGA  
3000 Green (RoHS &  
no Sb/Br)  
SNAGCU  
Level-1-260C-UNLIM  
(1) The marketing status values are defined as follows:  
ACTIVE: Product device recommended for new designs.  
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.  
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in  
a new design.  
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.  
OBSOLETE: TI has discontinued the production of the device.  
(2)  
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check  
http://www.ti.com/productcontent for the latest availability information and additional product content details.  
TBD: The Pb-Free/Green conversion plan has not been defined.  
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements  
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered  
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.  
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and  
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS  
compatible) as defined above.  
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame  
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)  
(3)  
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder  
temperature.  
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is  
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the  
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take  
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on  
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited  
information may not be available for release.  
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI  
Addendum-Page 1  
PACKAGE OPTION ADDENDUM  
www.ti.com  
21-Aug-2008  
to Customer on an annual basis.  
Addendum-Page 2  
PACKAGE MATERIALS INFORMATION  
www.ti.com  
20-Jul-2010  
TAPE AND REEL INFORMATION  
*All dimensions are nominal  
Device  
Package Package Pins  
Type Drawing  
SPQ  
Reel  
Reel  
A0  
B0  
K0  
P1  
W
Pin1  
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant  
(mm) W1 (mm)  
TXS0101DBVR  
TXS0101DBVT  
TXS0101DCKR  
TXS0101DCKT  
TXS0101DRLR  
TXS0101YZPR  
SOT-23  
SOT-23  
SC70  
DBV  
DBV  
DCK  
DCK  
DRL  
YZP  
6
6
6
6
6
6
3000  
250  
180.0  
180.0  
179.0  
179.0  
180.0  
180.0  
9.2  
9.2  
8.4  
8.4  
9.2  
8.4  
3.23  
3.23  
2.2  
3.17  
3.17  
2.5  
1.37  
1.37  
1.2  
4.0  
4.0  
4.0  
4.0  
4.0  
4.0  
8.0  
8.0  
8.0  
8.0  
8.0  
8.0  
Q3  
Q3  
Q3  
Q3  
Q3  
Q1  
3000  
250  
SC70  
2.2  
2.5  
1.2  
SOT  
4000  
3000  
1.78  
1.02  
1.78  
1.52  
0.69  
0.63  
DSBGA  
Pack Materials-Page 1  
PACKAGE MATERIALS INFORMATION  
www.ti.com  
20-Jul-2010  
*All dimensions are nominal  
Device  
Package Type Package Drawing Pins  
SPQ  
Length (mm) Width (mm) Height (mm)  
TXS0101DBVR  
TXS0101DBVT  
TXS0101DCKR  
TXS0101DCKT  
TXS0101DRLR  
TXS0101YZPR  
SOT-23  
SOT-23  
SC70  
DBV  
DBV  
DCK  
DCK  
DRL  
YZP  
6
6
6
6
6
6
3000  
250  
202.0  
202.0  
203.0  
203.0  
202.0  
220.0  
201.0  
201.0  
203.0  
203.0  
201.0  
220.0  
28.0  
28.0  
35.0  
35.0  
28.0  
34.0  
3000  
250  
SC70  
SOT  
4000  
3000  
DSBGA  
Pack Materials-Page 2  
IMPORTANT NOTICE  
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements,  
and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should  
obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are  
sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.  
TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard  
warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where  
mandated by government requirements, testing of all parameters of each product is not necessarily performed.  
TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and  
applications using TI components. To minimize the risks associated with customer products and applications, customers should provide  
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TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask work right,  
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Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all  
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TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are  
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