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TXS0104E_102

型号:

TXS0104E_102

描述:

4位双向电压电平转换为漏极开路和推挽应用[ 4-BIT BIDIRECTIONAL VOLTAGE-LEVEL TRANSLATOR FOR OPEN-DRAIN AND PUSH-PULL APPLICATIONS ]

品牌:

TI[ TEXAS INSTRUMENTS ]

页数:

26 页

PDF大小:

909 K

TXS0104E  
www.ti.com............................................................................................................................................................... SCES651DJUNE 2006REVISED MAY 2008  
4-BIT BIDIRECTIONAL VOLTAGE-LEVEL TRANSLATOR  
FOR OPEN-DRAIN AND PUSH-PULL APPLICATIONS  
1
FEATURES  
2
No Direction-Control Signal Needed  
IEC 61000-4-2 ESD (B Port)  
Max Data Rates  
±8-kV Contact Discharge  
±10-kV Air-Gap Discharge  
24 Mbps (Push Pull)  
2 Mbps (Open Drain)  
GXU/ZXU (BGA) PACKAGE  
(TOP VIEW)  
Available in the Texas Instruments NanoFree™  
Package  
A
B C  
1.65 V to 3.6 V on A port and 2.3 V to 5.5 V on  
B port (VCCA VCCB  
)
4
3
2
1
No Power-Supply Sequencing Required – VCCA  
or VCCB Can Be Ramped First  
Latch-Up Performance Exceeds 100 mA Per  
JESD 78, Class II  
ESD Protection Exceeds JESD 22  
TERMINAL ASSIGNMENTS  
(GXU/ZXU Package)  
A Port  
2000-V Human-Body Model (A114-B)  
A
B
C
200-V Machine Model (A115-A)  
4
3
2
1
A4  
A3  
A2  
A1  
GND  
OE  
B4  
B3  
B2  
B1  
1000-V Charged-Device Model (C101)  
B Port  
VCCA  
VCCB  
15-kV Human-Body Model (A114-B)  
200-V Machine Model (A115-A)  
1000-V Charged-Device Model (C101)  
RGY PACKAGE  
(TOP VIEW)  
D OR PW PACKAGE  
(TOP VIEW)  
VCCA  
VCCB  
B1  
1
2
3
4
5
6
7
14  
13  
12  
11  
10  
9
A1  
A2  
A3  
A4  
1
14  
B2  
A1  
A2  
A3  
A4  
NC  
13 B1  
2
3
4
5
6
B3  
12  
11  
10  
9
B2  
B3  
B4  
NC  
B4  
NC  
NC  
OE  
GND  
8
7
8
NC − No internal connection  
NC − No internal connection  
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of  
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
2
NanoFree is a trademark of Texas Instruments.  
PRODUCTION DATA information is current as of publication date.  
Products conform to specifications per the terms of the Texas  
Instruments standard warranty. Production processing does not  
necessarily include testing of all parameters.  
Copyright © 2006–2008, Texas Instruments Incorporated  
TXS0104E  
SCES651DJUNE 2006REVISED MAY 2008............................................................................................................................................................... www.ti.com  
YZT (WCSP) PACKAGE  
(TOP VIEW)  
TERMINAL ASSIGNMENTS  
(YZT Package)  
3 2  
1
3
2
1
D
C
B
A
A4  
A3  
A2  
A1  
GND  
OE  
B4  
B3  
B2  
B1  
D
C
B
A
VCCA  
VCCB  
DESCRIPTION/ORDERING INFORMATION  
This 4-bit noninverting translator uses two separate configurable power-supply rails. The A port is designed to  
track VCCA. VCCA accepts any supply voltage from 1.65 V to 3.6 V. VCCA must be less than or equal to VCCB. The  
B port is designed to track VCCB. VCCB accepts any supply voltage from 2.3 V to 5.5 V. This allows for low-voltage  
bidirectional translation between any of the 1.8-V, 2.5-V, 3.3-V, and 5-V voltage nodes.  
When the output-enable (OE) input is low, all outputs are placed in the high-impedance state.  
The TXS0104E is designed so that the OE input circuit is supplied by VCCA  
.
To ensure the high-impedance state during power up or power down, OE should be tied to GND through a  
pulldown resistor; the minimum value of the resistor is determined by the current-sourcing capability of the driver.  
ORDERING INFORMATION  
TA  
PACKAGE(1)(2)  
ORDERABLE PART NUMBER  
TOP-SIDE MARKING(3)  
NanoFree — WCSP  
(DSBGA)  
0.23-mm Large Bump – YZT Reel of 3000  
(Pb-free) 0.625-mm max  
height)  
TXS0104EYZTR  
2N7  
UFBGA – GXU  
TXS0104EGXUR  
TXS0104EZXUR  
TXS0104ERGYR  
TXS0104ERGYRG4  
TXS0104ED  
Reel of 2500  
YF04E  
YF04E  
UFBGA – ZXU (Pb-free)  
QFN – RGY  
SOIC – D  
Reel of 1000  
Tube of 50  
–40°C to 85°C  
TXS0104EDG4  
TXS0104EDR  
TXS0104E  
Reel of 2500  
Reel of 2000  
TXS0104EDRG4  
TXS0104EPWR  
TXS0104EPWRG4  
TSSOP – PW  
YF04E  
(1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI  
website at www.ti.com.  
(2) Package drawings, thermal data, and symbolization are available at www.ti.com/packaging.  
(3) YZT: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one following  
character to designate the assembly/test site. Pin 1 identifier indicates solder-bump composition (1 = SnPb, • = Pb-free).  
2
Submit Documentation Feedback  
Copyright © 2006–2008, Texas Instruments Incorporated  
Product Folder Link(s): TXS0104E  
TXS0104E  
www.ti.com............................................................................................................................................................... SCES651DJUNE 2006REVISED MAY 2008  
PIN DESCRIPTION  
PIN NO.  
BALL NO.  
GXU/ZXU  
NAME  
FUNCTION  
D, PW,  
OR RGY  
YZT  
1
2
3
4
5
6
7
B2  
A1  
A2  
A3  
A4  
B2  
A3  
B3  
C3  
D3  
VCCA  
A1  
A-port supply voltage. 1.65 V VCCA 3.6 V and VCCA VCCB.  
Input/output A1. Referenced to VCCA  
Input/output A2. Referenced to VCCA  
Input/output A3. Referenced to VCCA  
Input/output A4. Referenced to VCCA  
.
.
.
.
A2  
A3  
A4  
NC  
GND  
No connection. Not internally connected.  
Ground  
B4  
D2  
3-state output-mode enable. Pull OE low to place all outputs in 3-state  
mode. Referenced to VCCA  
8
B3  
C2  
OE  
.
9
NC  
B4  
No connection. Not internally connected.  
10  
11  
12  
13  
14  
C4  
C3  
C2  
C1  
B1  
D1  
C1  
B1  
A1  
A2  
Input/output B4. Referenced to VCCB  
Input/output B3. Referenced to VCCB  
Input/output B2. Referenced to VCCB  
Input/output B1. Referenced to VCCB  
.
.
.
.
B3  
B2  
B1  
VCCB  
B-port supply voltage. 2.3 V VCCB 5.5 V.  
Absolute Maximum Ratings(1)  
over operating free-air temperature range (unless otherwise noted)  
MIN  
–0.5  
–0.5  
–0.5  
–0.5  
–0.5  
–0.5  
MAX UNIT  
VCCA  
4.6  
V
Supply voltage range  
VCCB  
6.5  
A port  
B port  
A port  
B port  
A port  
B port  
VI < 0  
VO < 0  
4.6  
V
VI  
Input voltage range(2)  
6.5  
4.6  
V
Voltage range applied to any output  
VO  
VO  
in the high-impedance or power-off state(2)  
6.5  
–0.5 VCCA + 0.5  
Voltage range applied to any output in the high or low state(2)(3)  
V
–0.5 VCCB + 0.5  
IIK  
IOK  
IO  
Input clamp current  
–50  
–50  
±50  
±100  
86  
mA  
mA  
mA  
mA  
Output clamp current  
Continuous output current  
Continuous current through each VCCA, VCCB, or GND  
D package(4)  
PW package(4)  
RGY package(5)  
GXU/ZXU package(4)  
YZT package  
113  
θJA  
Package thermal impedance  
Storage temperature range  
47 °C/W  
128  
TBD  
150  
Tstg  
–65  
°C  
(1) Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings  
only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating  
conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.  
(2) The input and output negative-voltage ratings may be exceeded if the input and output current ratings are observed.  
(3) The value of VCCA and VCCB are provided in the recommended operating conditions table.  
(4) The package thermal impedance is calculated in accordance with JESD 51-7.  
(5) The package thermal impedance is calculated in accordance with JESD 51-5.  
Copyright © 2006–2008, Texas Instruments Incorporated  
Submit Documentation Feedback  
3
Product Folder Link(s): TXS0104E  
TXS0104E  
SCES651DJUNE 2006REVISED MAY 2008............................................................................................................................................................... www.ti.com  
Recommended Operating Conditions(1)(2)  
VCCA  
VCCB  
MIN  
1.65  
MAX  
3.6  
UNIT  
VCCA  
VCCB  
Supply voltage(3)  
V
2.3  
5.5  
1.65 V to 1.95 V  
2.3 V to 3.6 V  
VCCI – 0.2  
VCCI – 0.4  
VCCI – 0.4  
VCCI  
A-port I/Os  
2.3 V to 5.5 V  
2.3 V to 5.5 V  
VCCI  
VIH  
High-level input voltage  
V
V
B-port I/Os  
OE input  
VCCI  
1.65 V to 3.6 V  
VCCA × 0.65  
5.5  
A-port I/Os  
B-port I/Os  
OE input  
0
0
0
0.15  
VIL  
Low-level input voltage  
1.65 V to 3.6 V  
2.3 V to 5.5 V  
0.15  
VCCA × 0.35  
A-port I/Os,  
push-pull  
driving  
10  
10  
Input transition  
rise or fall rate  
Δt/Δv  
B-port I/Os,  
push-pull  
driving  
1.65 V to 3.6 V  
2.3 V to 5.5 V  
ns/V  
Control input  
10  
85  
Operating free-air  
temperature  
TA  
–40  
°C  
(1) VCCI is the supply voltage associated with the input port.  
(2) VCCO is the supply voltage associated with the output port.  
(3) VCCA must be less than or equal to VCCB, and VCCA must not exceed 3.6 V.  
4
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Copyright © 2006–2008, Texas Instruments Incorporated  
Product Folder Link(s): TXS0104E  
TXS0104E  
www.ti.com............................................................................................................................................................... SCES651DJUNE 2006REVISED MAY 2008  
Electrical Characteristics(1)(2)(3)  
over recommended operating free-air temperature range (unless otherwise noted)  
TA = 25°C  
TA = 25°C to 85°C  
PARAMETER  
VOHA  
TEST CONDITIONS  
VCCA  
VCCB  
UNIT  
MIN TYP MAX  
MIN  
MAX  
IOH = –20 µA,  
VIB VCCB – 0.4 V  
1.65 V to 3.6 V  
1.65 V to 3.6 V  
1.65 V to 3.6 V  
1.65 V to 3.6 V  
2.3 V to 5.5 V  
2.3 V to 5.5 V  
2.3 V to 5.5 V  
2.3 V to 5.5 V  
VCCA × 0.8  
V
V
V
V
IOL = 1 mA,  
VIB 0.15 V  
VOLA  
VOHB  
VOLB  
0.4  
IOH = –20 µA,  
VIA VCCA – 0.2 V  
VCCB × 0.8  
IOL = 1 mA,  
VIA 0.15 V  
0.4  
II  
OE  
VI = VCCI or GND  
1.65 V to 3.6 V  
2.3 V to 5.5 V  
2.3 V to 5.5 V  
2.3 V to 5.5 V  
0
±1  
±1  
±2  
±2  
2.4  
2.2  
–1  
12  
–1  
1
µA  
µA  
IOZ  
A or B port OE = VIL  
1.65 V to 3.6 V  
1.65 V to VCCB  
VI = VO = Open,  
IO = 0  
ICCA  
3.6 V  
µA  
µA  
0
5.5 V  
1.65 V to VCCB  
2.3 V to 5.5 V  
0
VI = VO = Open,  
IO = 0  
ICCB  
3.6 V  
0
5.5 V  
VI = VO = Open,  
IO = 0  
ICCA + ICCB  
1.65 V to VCCB  
3.3 V  
2.3 V to 5.5 V  
3.3 V  
14.4  
µA  
CI  
OE  
2.5  
5
3.5  
6.5  
pF  
A port  
B port  
Cio  
3.3 V  
3.3 V  
pF  
12  
16.5  
(1) VCCI is the supply voltage associated with the input port.  
(2) VCCO is the supply voltage associated with the output port.  
(3) VCCA must be less than or equal to VCCB, and VCCA must not exceed 3.6 V.  
Copyright © 2006–2008, Texas Instruments Incorporated  
Submit Documentation Feedback  
5
Product Folder Link(s): TXS0104E  
TXS0104E  
SCES651DJUNE 2006REVISED MAY 2008............................................................................................................................................................... www.ti.com  
Timing Requirements  
over recommended operating free-air temperature range, VCCA = 1.8 V ± 0.15 V (unless otherwise noted)  
VCCB = 2.5 V  
± 0.2 V  
VCCB = 3.3 V  
± 0.3 V  
VCCB = 5 V  
± 0.5 V  
UNIT  
MIN  
MAX  
MIN  
MAX  
MIN  
MAX  
Push-pull driving  
Open-drain driving  
Push-pull driving  
Open-drain driving  
24  
2
24  
2
24  
2
Data rate  
Mbps  
ns  
41  
41  
41  
tw  
Pulse duration  
Data inputs  
500  
500  
500  
Timing Requirements  
over recommended operating free-air temperature range, VCCA = 2.5 V ± 0.2 V (unless otherwise noted)  
VCCB = 2.5 V  
± 0.2 V  
VCCB = 3.3 V  
± 0.3 V  
VCCB = 5 V  
± 0.5 V  
UNIT  
MIN  
MAX  
MIN  
MAX  
MIN  
MAX  
24  
Push-pull driving  
Open-drain driving  
Push-pull driving  
Open-drain driving  
24  
2
24  
2
Data rate  
Mbps  
ns  
2
41  
41  
41  
tw  
Pulse duration  
Data inputs  
500  
500  
500  
Timing Requirements  
over recommended operating free-air temperature range, VCCA = 3.3 V ± 0.3 V (unless otherwise noted)  
VCCB = 3.3 V  
± 0.3 V  
VCCB = 5 V  
± 0.5 V  
UNIT  
MIN  
MAX  
24  
MIN  
MAX  
Push-pull driving  
Open-drain driving  
Push-pull driving  
Open-drain driving  
24  
2
Data rate  
Mbps  
ns  
2
41  
41  
tw  
Pulse duration  
Data inputs  
500  
500  
6
Submit Documentation Feedback  
Copyright © 2006–2008, Texas Instruments Incorporated  
Product Folder Link(s): TXS0104E  
TXS0104E  
www.ti.com............................................................................................................................................................... SCES651DJUNE 2006REVISED MAY 2008  
Switching Characteristics  
over recommended operating free-air temperature range, VCCA = 1.8 V ± 0.15 V (unless otherwise noted)  
VCCB = 2.5 V VCCB = 3.3 V VCCB = 5 V  
FROM  
(INPUT)  
TO  
(OUTPUT)  
TEST  
CONDITIONS  
± 0.2 V  
± 0.3 V  
± 0.5 V  
PARAMETER  
UNIT  
MIN  
2.9  
45  
MAX MIN MAX MIN MAX  
Push-pull driving  
Open-drain driving  
Push-pull driving  
Open-drain driving  
Push-pull driving  
Open-drain driving  
Push-pull driving  
Open-drain driving  
4.6  
8.8  
6.8  
260  
4.4  
5.3  
5.3  
175  
200  
50  
4.7  
9.6  
6.8  
208  
4.5  
4.4  
4.5  
140  
200  
40  
5.8  
10  
7
tPHL  
tPLH  
tPHL  
tPLH  
2.9  
36  
3
A
B
B
A
ns  
27 198  
4.7  
1.9  
45  
1.1  
36  
1.2  
4
ns  
0.5  
27 102  
200  
ten  
OE  
OE  
A or B  
A or B  
ns  
ns  
tdis  
35  
Push-pull driving  
Open-drain driving  
Push-pull driving  
Open-drain driving  
Push-pull driving  
Open-drain driving  
Push-pull driving  
Open-drain driving  
3.2  
38  
4
9.5  
165  
10.8  
145  
5.9  
6.9  
7.6  
13.8  
1
2.3  
30  
9.3  
132  
9.1  
106  
6
2
22  
7.6  
95  
trA  
trB  
tfA  
A-port rise time  
ns  
ns  
2.7  
23  
2.7  
10  
7.6  
58  
B-port rise time  
A-port fall time  
34  
2
1.9  
4.3  
2.8  
7.5  
1.7 13.3  
4.4  
2.9  
6.9  
6.4  
7.5  
16.2  
1
4.2  
2.8  
7
6.1  
8.8  
16.2  
1
ns  
tfB  
B-port fall time  
tSK(O)  
Channel-to-channel skew  
ns  
Push-pull driving  
24  
24  
24  
Max data rate  
Mbps  
Open-drain driving  
2
2
2
Copyright © 2006–2008, Texas Instruments Incorporated  
Submit Documentation Feedback  
7
Product Folder Link(s): TXS0104E  
TXS0104E  
SCES651DJUNE 2006REVISED MAY 2008............................................................................................................................................................... www.ti.com  
Switching Characteristics  
over recommended operating free-air temperature range, VCCA = 2.5 V ± 0.2 V (unless otherwise noted)  
VCCB = 2.5 V VCCB = 3.3 V VCCB = 5 V  
FROM  
(INPUT)  
TO  
(OUTPUT)  
TEST  
CONDITIONS  
± 0.2 V  
± 0.3 V  
± 0.5 V  
PARAMETER  
UNIT  
MIN  
1.7  
43  
MAX MIN MAX MIN MAX  
Push-pull driving  
Open-drain driving  
Push-pull driving  
Open-drain driving  
Push-pull driving  
Open-drain driving  
Push-pull driving  
Open-drain driving  
3.2  
6.3  
3.5  
250  
3
3.3  
6
3.4  
5.8  
4.4  
tPHL  
tPLH  
tPHL  
tPLH  
2
36  
2.1  
A
B
B
A
ns  
4.1  
206  
3.6  
4.2  
1.6  
140  
200  
40  
27 190  
4.3  
1.8  
44  
4.7  
2.5  
170  
200  
50  
2.6  
37  
1.2  
4
ns  
0.7  
27 103  
200  
ten  
OE  
OE  
A or B  
A or B  
ns  
ns  
tdis  
35  
Push-pull driving  
Open-drain driving  
Push-pull driving  
Open-drain driving  
Push-pull driving  
Open-drain driving  
Push-pull driving  
Open-drain driving  
2.8  
34  
7.4  
149  
8.3  
151  
5.7  
6.9  
7.8  
8.8  
1
2.6  
28  
6.6  
121  
7.2  
112  
5.5  
6.2  
6.7  
9.4  
1
1.8  
24  
5.6  
89  
trA  
trB  
tfA  
A-port rise time  
ns  
ns  
ns  
3.2  
35  
2.9  
24  
2.4  
12  
6.1  
64  
B-port rise time  
A-port fall time  
1.9  
4.4  
2.2  
5.1  
1.9  
4.3  
2.4  
5.4  
1.8  
4.2  
2.6  
5.3  
5.8  
6.6  
tfB  
B-port fall time  
ns  
ns  
5.4 10.4  
tSK(O)  
Channel-to-channel skew  
1
Push-pull driving  
24  
2
24  
2
24  
2
Max data rate  
Mbps  
Open-drain driving  
8
Submit Documentation Feedback  
Copyright © 2006–2008, Texas Instruments Incorporated  
Product Folder Link(s): TXS0104E  
TXS0104E  
www.ti.com............................................................................................................................................................... SCES651DJUNE 2006REVISED MAY 2008  
Switching Characteristics  
over recommended operating free-air temperature range, VCCA = 3.3 V ± 0.3 V (unless otherwise noted)  
VCCB = 3.3 V  
± 0.3 V  
VCCB = 5 V  
± 0.5 V  
FROM  
(INPUT)  
TO  
(OUTPUT)  
TEST  
CONDITIONS  
PARAMETER  
UNIT  
MIN  
1.3  
36  
1
MAX MIN MAX  
Push-pull driving  
Open-drain driving  
Push-pull driving  
Open-drain driving  
Push-pull driving  
Open-drain driving  
Push-pull driving  
Open-drain driving  
2.4  
4.2  
4.2  
204  
2.5  
124  
2.5  
139  
200  
40  
3.1  
4.6  
4.4  
165  
3.3  
97  
tPHL  
tPLH  
tPHL  
tPLH  
1.4  
28  
1
A
B
B
A
ns  
ns  
2.6  
105  
200  
35  
3
3
ten  
OE  
OE  
A or B  
A or B  
ns  
ns  
tdis  
Push-pull driving  
Open-drain driving  
Push-pull driving  
Open-drain driving  
Push-pull driving  
Open-drain driving  
Push-pull driving  
Open-drain driving  
2.3  
25  
2.5  
26  
2
5.6  
116  
6.4  
116  
5.4  
6.1  
7.4  
7.6  
1
1.9  
19  
4.8  
85  
trA  
trB  
tfA  
A-port rise time  
B-port rise time  
A-port fall time  
B-port fall time  
ns  
ns  
ns  
2.1  
14  
7.4  
72  
1.9  
4.2  
2.4  
4.8  
5
4.3  
2.3  
5
5.7  
7.6  
8.3  
1
tfB  
ns  
ns  
tSK(O)  
Channel-to-channel skew  
Push-pull driving  
24  
2
24  
2
Max data rate  
Mbps  
Open-drain driving  
PRINCIPLES OF OPERATION  
Applications  
The TXS0104E can be used in level-translation applications for interfacing devices or systems operating at  
different interface voltages with one another. The TXS0104E is ideal for use in applications where an open-drain  
driver is connected to the data I/Os. The TXS0104E can also be used in applications where a push-pull driver is  
connected to the data I/Os, but the TXB0104 might be a better option for such push-pull applications.  
Architecture  
The TXS0104E architecture (see Figure 1) does not require a direction-control signal to control the direction of  
data flow from A to B or from B to A.  
Copyright © 2006–2008, Texas Instruments Incorporated  
Submit Documentation Feedback  
9
Product Folder Link(s): TXS0104E  
TXS0104E  
SCES651DJUNE 2006REVISED MAY 2008............................................................................................................................................................... www.ti.com  
V
V
CCB  
CCA  
T1  
One-shot  
One-shot  
T2  
10 kΩ  
10 kΩ  
Gate Bias  
A
B
Figure 1. Architecture of a TXS01xx Cell  
Each A-port I/O has an internal 10-kpullup resistor to VCCA, and each B-port I/O has an internal 10-kpullup  
resistor to VCCB. The output one-shots detect rising edges on the A or B ports. During a rising edge, the one-shot  
turns on the PMOS transistors (T1,T2) for a short duration, which speeds up the low-to-high transition.  
Input Driver Requirements  
The fall time (tfA, tfB) of a signal depends on the output impedance of the external device driving the data I/Os of  
the TXS0104E. Similarly, the tPHL and max data rates also depend on the output impedance of the external  
driver. The values for tfA, tfB, tPHL, and maximum data rates in the data sheet assume that the output impedance  
of the external driver is less than 50 .  
Power Up  
During operation, ensure that VCCA VCCB at all times. During power-up sequencing, VCCA VCCB does not  
damage the device, so any power supply can be ramped up first.  
Enable and Disable  
The TXS0104E has an OE input that is used to disable the device by setting OE low, which places all I/Os in the  
Hi-Z state. The disable time (tdis) indicates the delay between the time when OE goes low and when the outputs  
actually get disabled (Hi-Z). The enable time (ten) indicates the amount of time the user must allow for the  
one-shot circuitry to become operational after OE is taken high.  
Pullup or Pulldown Resistors on I/O Lines  
Each A-port I/O has an internal 10-kpullup resistor to VCCA, and each B-port I/O has an internal 10-kpullup  
resistor to VCCB. If a smaller value of pullup resistor is required, an external resistor must be added from the I/O  
to VCCA or VCCB (in parallel with the internal 10-kresistors).  
10  
Submit Documentation Feedback  
Copyright © 2006–2008, Texas Instruments Incorporated  
Product Folder Link(s): TXS0104E  
TXS0104E  
www.ti.com............................................................................................................................................................... SCES651DJUNE 2006REVISED MAY 2008  
PARAMETER MEASUREMENT INFORMATION  
V
CCI  
V
CCO  
V
CCI  
V
CCO  
DUT  
DUT  
IN  
IN  
OUT  
OUT  
1 MW  
1 MW  
15 pF  
15 pF  
DATA RATE, PULSE DURATION, PROPAGATION DELAY,  
OUTPUT RISE AND FALL TIME MEASUREMENT USING  
AN OPEN-DRAIN DRIVER  
DATA RATE, PULSE DURATION, PROPAGATION DELAY,  
OUTPUT RISE AND FALL TIME MEASUREMENT USING  
A PUSH-PULL DRIVER  
2 × V  
CCO  
S1  
50 kW  
Open  
From Output  
Under Test  
15 pF  
50 kW  
TEST  
/t  
S1  
2 × V  
t
PZL PLZ  
CCO  
LOAD CIRCUIT FOR ENABLE/DISABLE  
TIME MEASUREMENT  
t
/t  
Open  
PHZ PZH  
t
w
V
CCI  
V
CCA  
V
/2  
V
/2  
Output  
Control  
(low-level  
enabling)  
Input  
CCI  
CCI  
V /2  
CCA  
V /2  
CCA  
0 V  
VOLTAGE WAVEFORMS  
PULSE DURATION  
0 V  
t
PLZ  
t
PZL  
V
V
CCO  
Output  
Waveform 1  
V
CCI  
V
V
/2  
CCO  
Input  
V
/2  
/2  
V
/2  
CCI  
CCI  
0.1 y V  
CCO  
S1 at 2 × V  
CCO  
OL  
0 V  
(see Note B)  
t
PHZ  
t
t
t
PLH  
PHL  
PZH  
Output  
Waveform 2  
S1 at GND  
V
OH  
0.9 y V  
V
OH  
CCO  
0.9 y V  
CCO  
/2  
Output  
V
CCO  
V
CCO  
/2  
CCO  
(see Note B)  
0.1 y V  
CCO  
0 V  
V
OL  
t
f
t
r
VOLTAGE WAVEFORMS  
PROPAGATION DELAY TIMES  
VOLTAGE WAVEFORMS  
ENABLE AND DISABLE TIMES  
A.  
C
L
includes probe and jig capacitance.  
B. Waveform 1 is for an output with internal conditions such that the output is low, except when disabled by the output control.  
Waveform 2 is for an output with internal conditions such that the output is high, except when disabled by the output control.  
C. All input pulses are supplied by generators having the following characteristics: PRRv10 MHz, Z = 50 , dv/dt 1 V/ns.  
O
D. The outputs are measured one at a time, with one transition per measurement.  
E.  
F.  
G.  
H.  
I.  
t
t
t
V
V
and t  
and t  
and t  
are the same as t  
.
dis  
.
PLZ  
PZL  
PLH  
PHZ  
are the same as t  
PZH  
en  
are the same as t .  
pd  
PHL  
is the V associated with the input port.  
CC  
CCI  
is the V associated with the output port.  
CCO  
CC  
J. All parameters and waveforms are not applicable to all devices.  
Figure 2. Load Circuit and Voltage Waveforms  
Copyright © 2006–2008, Texas Instruments Incorporated  
Submit Documentation Feedback  
11  
Product Folder Link(s): TXS0104E  
PACKAGE OPTION ADDENDUM  
www.ti.com  
6-Aug-2010  
PACKAGING INFORMATION  
Status (1)  
Eco Plan (2)  
MSL Peak Temp (3)  
Samples  
Orderable Device  
Package Type Package  
Drawing  
Pins  
Package Qty  
Lead/  
Ball Finish  
(Requires Login)  
TXS0104ED  
TXS0104EDG4  
TXS0104EDR  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
SOIC  
SOIC  
SOIC  
SOIC  
D
D
14  
14  
14  
14  
12  
50  
Green (RoHS  
& no Sb/Br)  
CU NIPDAU Level-1-260C-UNLIM  
Contact TI Distributor  
or Sales Office  
50  
Green (RoHS  
& no Sb/Br)  
CU NIPDAU Level-1-260C-UNLIM  
CU NIPDAU Level-1-260C-UNLIM  
CU NIPDAU Level-1-260C-UNLIM  
Contact TI Distributor  
or Sales Office  
D
2500  
2500  
2500  
Green (RoHS  
& no Sb/Br)  
Request Free Samples  
Request Free Samples  
Purchase Samples  
TXS0104EDRG4  
TXS0104EGXUR  
D
Green (RoHS  
& no Sb/Br)  
BGA  
GXU  
TBD  
SNPB  
Level-1-240C-UNLIM  
MICROSTAR  
JUNIOR  
TXS0104EPWR  
TXS0104EPWRG4  
TXS0104ERGYR  
TXS0104ERGYRG4  
TXS0104EYZTR  
TXS0104EZXUR  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
TSSOP  
TSSOP  
VQFN  
PW  
PW  
14  
14  
14  
14  
12  
12  
2000  
2000  
3000  
3000  
3000  
2500  
Green (RoHS  
& no Sb/Br)  
CU NIPDAU Level-1-260C-UNLIM  
CU NIPDAU Level-1-260C-UNLIM  
CU NIPDAU Level-2-260C-1 YEAR  
CU NIPDAU Level-2-260C-1 YEAR  
SNAGCU Level-1-260C-UNLIM  
SNAGCU Level-1-260C-UNLIM  
Request Free Samples  
Request Free Samples  
Request Free Samples  
Request Free Samples  
Request Free Samples  
Request Free Samples  
Green (RoHS  
& no Sb/Br)  
RGY  
RGY  
YZT  
ZXU  
Green (RoHS  
& no Sb/Br)  
VQFN  
Green (RoHS  
& no Sb/Br)  
DSBGA  
Green (RoHS  
& no Sb/Br)  
BGA  
MICROSTAR  
JUNIOR  
Green (RoHS  
& no Sb/Br)  
(1) The marketing status values are defined as follows:  
ACTIVE: Product device recommended for new designs.  
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.  
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.  
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.  
OBSOLETE: TI has discontinued the production of the device.  
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability  
information and additional product content details.  
TBD: The Pb-Free/Green conversion plan has not been defined.  
Addendum-Page 1  
PACKAGE OPTION ADDENDUM  
www.ti.com  
6-Aug-2010  
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that  
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.  
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between  
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.  
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight  
in homogeneous material)  
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.  
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information  
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and  
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.  
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.  
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.  
Addendum-Page 2  
PACKAGE MATERIALS INFORMATION  
www.ti.com  
26-Aug-2010  
TAPE AND REEL INFORMATION  
*All dimensions are nominal  
Device  
Package Package Pins  
Type Drawing  
SPQ  
Reel  
Reel  
A0  
B0  
K0  
P1  
W
Pin1  
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant  
(mm) W1 (mm)  
TXS0104EDR  
SOIC  
D
14  
12  
2500  
2500  
330.0  
330.0  
16.4  
8.4  
6.5  
2.3  
9.0  
2.8  
2.1  
1.0  
8.0  
4.0  
16.0  
8.0  
Q1  
Q2  
TXS0104EGXUR  
BGA MI  
CROSTA  
R JUNI  
OR  
GXU  
TXS0104EPWR  
TXS0104ERGYR  
TXS0104EYZTR  
TXS0104EZXUR  
TSSOP  
VQFN  
PW  
RGY  
YZT  
ZXU  
14  
14  
12  
12  
2000  
3000  
3000  
2500  
330.0  
330.0  
180.0  
330.0  
12.4  
12.4  
8.4  
6.9  
3.75  
1.49  
2.3  
5.6  
3.75  
1.99  
2.8  
1.6  
1.15  
0.75  
1.0  
8.0  
8.0  
4.0  
4.0  
12.0  
12.0  
8.0  
Q1  
Q1  
Q2  
Q2  
DSBGA  
BGA MI  
CROSTA  
R JUNI  
OR  
8.4  
8.0  
Pack Materials-Page 1  
PACKAGE MATERIALS INFORMATION  
www.ti.com  
26-Aug-2010  
*All dimensions are nominal  
Device  
Package Type Package Drawing Pins  
SPQ  
Length (mm) Width (mm) Height (mm)  
TXS0104EDR  
SOIC  
D
14  
12  
2500  
2500  
346.0  
340.5  
346.0  
338.1  
33.0  
20.6  
TXS0104EGXUR  
BGA MICROSTAR  
JUNIOR  
GXU  
TXS0104EPWR  
TXS0104ERGYR  
TXS0104EYZTR  
TXS0104EZXUR  
TSSOP  
VQFN  
PW  
RGY  
YZT  
ZXU  
14  
14  
12  
12  
2000  
3000  
3000  
2500  
346.0  
346.0  
190.5  
340.5  
346.0  
346.0  
212.7  
338.1  
29.0  
29.0  
31.8  
20.6  
DSBGA  
BGA MICROSTAR  
JUNIOR  
Pack Materials-Page 2  
MECHANICAL DATA  
MTSS001C – JANUARY 1995 – REVISED FEBRUARY 1999  
PW (R-PDSO-G**)  
PLASTIC SMALL-OUTLINE PACKAGE  
14 PINS SHOWN  
0,30  
0,19  
M
0,10  
0,65  
14  
8
0,15 NOM  
4,50  
4,30  
6,60  
6,20  
Gage Plane  
0,25  
1
7
0°8°  
A
0,75  
0,50  
Seating Plane  
0,10  
0,15  
0,05  
1,20 MAX  
PINS **  
8
14  
16  
20  
24  
28  
DIM  
3,10  
2,90  
5,10  
4,90  
5,10  
4,90  
6,60  
6,40  
7,90  
9,80  
9,60  
A MAX  
A MIN  
7,70  
4040064/F 01/97  
NOTES: A. All linear dimensions are in millimeters.  
B. This drawing is subject to change without notice.  
C. Body dimensions do not include mold flash or protrusion not to exceed 0,15.  
D. Falls within JEDEC MO-153  
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