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NVSL219BT

型号:

NVSL219BT

描述:

无铅回流焊接的应用,内置ESD保护器件[ Pb-free Reflow Soldering Application, Built-in ESD Protection Device ]

品牌:

NICHIA[ NICHIA CORPORATION ]

页数:

20 页

PDF大小:

337 K

NICHIA STS-DA1-2009E <Cat.No.120828>  
SPECIFICATIONS FOR WARM WHITE LED  
NICHIA CORPORATION  
NVSL219BT  
Pb-free Reflow Soldering Application  
Built-in ESD Protection Device  
RoHS Compliant  
NICHIA STS-DA1-2009E <Cat.No.120828>  
SPECIFICATIONS  
(1) Absolute Maximum Ratings  
Item  
Symbol  
Absolute Maximum Rating  
Unit  
Forward Current  
IF  
IFP  
IR  
1500  
2000  
mA  
mA  
mA  
W
Pulse Forward Current  
Allowable Reverse Current  
Power Dissipation  
85  
PD  
5.4  
Operating Temperature  
Storage Temperature  
Junction Temperature  
Topr  
Tstg  
TJ  
-40~100  
-40~100  
150  
°C  
°C  
°C  
* Absolute Maximum Ratings at TS=25°C.  
* IFP conditions with pulse width 10ms and duty cycle 10%.  
(2) Initial Electrical/Optical Characteristics  
Item  
Symbol  
Condition  
Typ  
3.13  
2.95  
260  
140  
71  
Max  
Unit  
V
IF=700mA  
IF=350mA  
IF=700mA  
IF=350mA  
IF=700mA  
IF=350mA  
IF=700mA  
IF=700mA  
IF=700mA  
IF=700mA  
IF=350mA  
IF=700mA  
IF=350mA  
IF=700mA  
IF=700mA  
IF=700mA  
-
-
-
Forward Voltage  
VF  
-
Φv  
Luminous Flux  
lm  
cd  
-
-
Luminous Intensity  
Iv  
R70  
38  
-
Color Rendering Index  
Chromaticity Coordinate  
Ra  
-
73  
-
-
-
-
x
y
0.3817  
0.3795  
220  
117  
62  
-
-
-
-
Φv  
Luminous Flux  
lm  
cd  
-
-
Luminous Intensity  
Iv  
R8000  
33  
-
Color Rendering Index  
Chromaticity Coordinate  
Ra  
-
83  
-
-
x
y
0.4100  
0.3900  
6
-
-
-
-
-
Thermal Resistance  
RθJS  
11  
°C/W  
* Characteristics at TS=25°C.  
* Luminous Flux value as per CIE 127:2007 standard.  
* Chromaticity Coordinates as per CIE 1931 Chromaticity Chart.  
* RθJS is Thermal Resistance from junction to TS measuring point.  
1
NICHIA STS-DA1-2009E <Cat.No.120828>  
RANKS  
Item  
Rank  
Condition  
IF=700mA  
Min  
3.4  
3.2  
3.0  
2.8  
260  
240  
220  
200  
180  
70  
Max  
3.6  
3.4  
3.2  
3.0  
280  
260  
240  
220  
200  
-
Unit  
V
M2  
M1  
L2  
Forward Voltage  
Luminous Flux  
L1  
D260  
D240  
D220  
D200  
D180  
R70  
IF=700mA  
IF=700mA  
lm  
Ra  
Ra  
R9  
-
-
-
Color Rendering Index  
Color Ranks  
80  
-
R8000  
0
-
Rank d1  
x
y
0.3575  
0.3612  
0.3610  
0.3780  
0.3970  
0.3988  
0.3897  
0.3823  
0.3720  
0.3714  
0.3850  
0.4116  
Rank d2  
x
y
0.3545  
0.3408  
0.3575  
0.3612  
0.3720  
0.3714  
0.3897  
0.3823  
0.3822  
0.3580  
0.3667  
0.3484  
Rank sw27  
Rank sw30  
x
y
0.4373  
0.3893  
0.4562  
0.4260  
0.4813  
0.4319  
0.4593  
0.3944  
x
y
0.4147  
0.4299  
0.4562  
0.4260  
0.4373  
0.3893  
0.3814  
0.4165  
Rank sw35  
Rank sw40  
x
y
0.3898  
0.3716  
0.3996  
0.4015  
0.4299  
0.4165  
0.4147  
0.3814  
x
y
0.3670  
0.3578  
0.3736  
0.3874  
0.3996  
0.4015  
0.3898  
0.3716  
Rank sw45  
x
y
0.3515  
0.3487  
0.3548  
0.3736  
0.3736  
0.3874  
0.3670  
0.3578  
* Ranking at TS=25°C.  
* Forward Voltage Tolerance: ±0.05V  
* Luminous Flux Tolerance: ±7%  
* Color Rendering Index Ra Tolerance: ±2  
* Color Rendering Index R9 Tolerance: ±6.5  
* The R9 value for the above rank shall be greater than 0.  
* Chromaticity Coordinate Tolerance: ±0.005  
* LEDs from the above ranks will be shipped.  
The rank combination ratio per shipment will be decided by Nichia.  
2
NICHIA STS-DA1-2009E <Cat.No.120828>  
Luminous Flux Ranks by Color Rank, Color Rendering Index Rank  
Ranking by  
Luminous Flux  
D180  
D200  
D220  
D240  
D260  
Ranking by  
Color Coordinates, Color Rendering Index  
d1,d2  
R70  
sw27  
R8000  
R8000  
R8000  
sw30,sw35  
sw40,sw45  
3
NICHIA STS-DA1-2009E <Cat.No.120828>  
CHROMATICITY DIAGRAM  
0.50  
0.45  
d1  
sw27  
sw30  
0.40  
sw35  
sw40  
sw45  
0.35  
d2  
0.30  
0.30  
0.35  
0.40  
0.45  
0.50  
x
4
NICHIA STS-DA1-2009E <Cat.No.120828>  
NVSL219B  
OUTLINE DIMENSIONS  
*
本製品はRoHS指令に適合しております。  
管理番号 No.  
STS-DA7-1785  
This product complies with RoHS Directive.  
(単位 Unit: mm, 公差 Tolerance: ±0.2)  
3.5  
2.9  
0.4  
Cathode Mark  
項目 Item  
内容 Description  
パッケージ材質  
Package Materials  
セラミックス  
Ceramics  
封止樹脂材質  
Encapsulating Resin  
Materials  
シリコーン樹脂 (蛍光体入り)  
Silicone Resin (with phosphor)  
3.2  
0.5  
0.45  
1.3  
電極材質  
Electrodes Materials  
金メッキ  
Au-plated  
レンズ材質  
Lens Materials  
シリコーン樹脂  
Silicone Resin  
ダイヒートシンク材質  
Die Heat Sink  
Materials  
金メッキ  
Au-plated  
質量  
Weight  
0.031g (TYP)  
Anode  
Cathode  
ダイヒートシンク  
Die Heat Sink  
保護素子  
Protection Device  
K
A
5
NICHIA STS-DA1-2009E <Cat.No.120828>  
SOLDERING  
• Recommended Reflow Soldering Condition(Lead-free Solder)  
1 to 5°C per sec  
260°C Max  
10sec Max  
Pre-heat  
180 to 200°C  
60sec Max  
Above 220°C  
120sec Max  
Recommended Soldering Pad Pattern  
0.5  
0.4  
1.3  
(単位 Unit: mm)  
0.5  
4.1  
* This LED is designed to be reflow soldered on to a PCB. If dip soldered or hand soldered,  
Nichia cannot guarantee its reliability.  
* Reflow soldering must not be performed more than twice.  
* Avoid rapid cooling. Ramp down the temperature gradually from the peak temperature.  
* Nitrogen reflow soldering is recommended. Air flow soldering conditions can cause optical degradation,  
caused by heat and/or atmosphere.  
* Since the silicone used in the encapsulating resin is soft, do not press on the encapsulant resin.  
Pressure can cause nicks, chip-outs, encapsulant delamination and deformation, and bump breaks, decreasing reliability.  
When using automatic pick and place machine, use a pick up nozzle which does not directly apply stress  
to the encapsulation of the LEDs.  
Recommended conditions:  
It is recommended to use a pick up nozzle designed for the LEDs. (See Figure below.)  
* Avoid direct contact to the resin lens  
with the picking up nozzle.  
Failure to comply might result in catastrophic failure  
of the LEDs due to bump damage or breakage.  
3.5  
4.5  
(単位 Unit: mm)  
* Repairing should not be done after the LEDs have been soldered. When repairing is unavoidable,  
a hot plate should be used.  
It should be confirmed beforehand whether the characteristics of the LEDs will or will not be damaged by repairing.  
* The Die Heat Sink should be soldered to customer PCB.  
If it is difficult or impossible, use high heat-dissipating adhesive.  
* When soldering, do not apply stress to the LED while the LED is hot.  
* This product uses an electrode pad design which improves thermal shock resistance.  
After mounting, it is recommended to check if the solder fillets are properly formed on the sides of the pads.  
6
NICHIA STS-DA1-2009E <Cat.No.120828>  
Nxxx219x  
TAPE AND REEL DIMENSIONS  
テーピング部 Tape  
管理番号 No.  
STS-DA7-1728  
(単位 Unit: mm)  
2±0.054±0.1  
+0.1  
8±0.1  
Φ1.5  
0.25±0.05  
-0  
Cathode Mark  
2.25±0.1  
+0.2  
- 0  
Φ 1.5  
3.7±0.1  
エンボスキャリアテープ  
Embossed Carrier Tape  
トレーラ部/リーダ部 Trailer and Leader  
トップカバーテープ  
Top Cover Tape  
引き出し方向  
Feed  
Direction  
トレーラ部最小160mm(空部)  
Trailer 160mm MIN(Empty Pockets)  
LED装着部  
Loaded Pockets  
引き出し部最小100mm(空部)  
Leader with Top Cover Tape  
100mm MIN(Empty Pocket)  
リーダ部最小400mm  
Leader without Top Cover Tape 400mm MIN  
17.5±1  
13.5±1  
リール部 Reel  
330±2  
数量は1リールにつき 3500個入りです。  
Reel Size: 3500pcs  
*
*
JIS C 0806電子部品テーピングに準拠しています。  
The tape packing method complies with JIS C 0806  
(Packaging of Electronic Components on Continuous Tapes).  
ラベル  
Label  
7
NICHIA STS-DA1-2009E <Cat.No.120828>  
PACKAGING - TAPE & REEL  
Nxxxxxxx  
管理番号 No. STS-DA7-0006C  
シリカゲルとともにリールをアルミ防湿袋に入れ、熱シールにより封をします。  
Reels are shipped with desiccants in heat-sealed moisture-proof bags.  
ラベル Label  
リール  
Reel  
シリカゲル  
Desiccants  
XXXX LED  
TYPE Nxxxxxxx  
*******  
LOT YMxxxx-RRR  
QTY.  
PCS  
RoHS  
NICHIA CORPORATION 491 OKA, KAMINAKA, ANAN, TOKUSHIMA, JAPAN  
熱シール  
Seal  
アルミ防湿袋  
Moisture-proof Bag  
アルミ防湿袋を並べて入れ、ダンボールで仕切ります。  
Moisture-proof bags are packed in cardboard boxes  
with corrugated partitions.  
ラベル Label  
XXXX LED  
TYPE Nxxxxxxx  
*******  
RANK RRR  
QTY.  
PCS  
RoHS  
NICHIA CORPORATION  
491 OKA, KAMINAKA, ANAN, TOKUSHIMA, JAPAN  
*
*
客先型名を*******で示します。  
Nichia LED  
客先型名が設定されていない場合は空白です。  
******* is the customer part number.  
If not provided, it will not be indicated on the label.  
ロット表記方法についてはロット番号の項を  
参照して下さい。  
For details, see "LOT NUMBERING CODE"  
in this document.  
*
ランク分けがない場合はランク表記はありません。  
The label does not have the RANK field for  
un-ranked products.  
*
本製品はテーピングしたのち、輸送の衝撃から保護するためダンボールで梱包します。  
Products shipped on tape and reel are packed in a moisture-proof bag.  
They are shipped in cardboard boxes to protect them from external forces during transportation.  
*
*
*
取り扱いに際して、落下させたり、強い衝撃を与えたりしますと、製品を損傷させる原因になりますので注意して下さい。  
Do not drop or expose the box to external forces as it may damage the products.  
ダンボールには防水加工がされておりませんので、梱包箱が水に濡れないよう注意して下さい。  
Do not expose to water. The box is not water-resistant.  
輸送、運搬に際して弊社よりの梱包状態あるいは同等の梱包を行って下さい。  
Using the original package material or equivalent in transit is recommended.  
8
NICHIA STS-DA1-2009E <Cat.No.120828>  
LOT NUMBERING CODE  
Lot Number is presented by using the following alphanumeric code.  
YMxxxx - RRR  
Y - Year  
Year  
2009  
2010  
2011  
2012  
2013  
2014  
Y
9
A
B
C
D
E
M - Month  
Month  
M
1
2
3
4
5
6
Month  
7
M
7
8
9
A
B
C
1
2
3
4
5
6
8
9
10  
11  
12  
xxxx-Nichia's Product Number  
RRR-Ranking by Color Coordinates, Ranking by Luminous Flux, Ranking by Forward Voltage, Ranking by Color Rendering Index  
9
NICHIA STS-DA1-2009E <Cat.No.120828>  
NVSx219B  
DERATING CHARACTERISTICS  
No. STS-DA7-1723  
管理番号  
周囲温度-許容順電流特性  
カソード側はんだ接合部温度-許容順電流特性  
RθJA =15°C/W  
Solder Temperature(Cathode Side) vs  
Allowable Forward Current  
Ambient Temperature vs  
Allowable Forward Current  
RθJA =25°C/W  
RθJA =35°C/W  
Derating1  
Derating2  
2000  
2000  
1500  
1000  
500  
0
(94, 1500)  
(74, 1500)  
(24, 1500)  
(0, 1270)  
1500  
(100, 1350)  
1000  
500  
0
(100, 995)  
(100, 597)  
(100, 426)  
0
20  
40  
60  
80  
100  
120  
0
20  
40  
60  
80  
100  
120  
周囲温度  
カソードんだ接合部温度  
Solder Temperature(Cathode Side)(°C)  
Ambient Temperature(°C)  
デューティー比-許容順電流特性  
Duty Ratio vs  
Allowable Forward Current  
Duty  
TA=25°C  
10000  
2000  
1500  
1000  
100  
1
10  
100  
デューティー比  
Duty Ratio(%)  
10  
NICHIA STS-DA1-2009E <Cat.No.120828>  
NVSL219B  
OPTICAL CHARACTERISTICS  
本特性は参考です。  
*
No. STS-DA7-2444  
番号  
All characteristics shown are for reference only and are not guaranteed.  
スペクトル  
Spectrum  
TA=25°C  
IFP  
=
700mA  
Spectrum  
1.0  
0.8  
0.6  
0.4  
0.2  
0.0  
400  
450  
500  
550  
600  
650  
700  
750  
800  
波長  
Wavelength(nm)  
Directivity1  
特性  
Directivity  
TA=25°C  
IFP  
=
700mA  
0°  
-10°  
10°  
-20°  
20°  
30°  
-30°  
40°  
-40°  
50°  
-50°  
-60°  
60°  
-70°  
70°  
80°  
-80°  
-90°  
90°  
1
0.5  
0
0.5  
1
相対照度  
Relative Illuminance(a.u.)  
ク  
に対す。  
*
R70  
The graphs above show the characteristics for R70 LEDs of this product.  
11  
NICHIA STS-DA1-2009E <Cat.No.120828>  
NVSL219B  
OPTICAL CHARACTERISTICS  
本特性は参考です。  
*
No. STS-DA7-1729A  
番号  
All characteristics shown are for reference only and are not guaranteed.  
スペクトル  
Spectrum  
TA=25°C  
IFP  
=
700mA  
Spectrum  
1.0  
0.8  
0.6  
0.4  
0.2  
0.0  
400  
450  
500  
550  
600  
650  
700  
750  
800  
波長  
Wavelength(nm)  
Directivity1  
特性  
Directivity  
TA=25°C  
IFP  
=
700mA  
0°  
-10°  
10°  
-20°  
20°  
30°  
-30°  
40°  
-40°  
50°  
-50°  
-60°  
60°  
-70°  
70°  
80°  
-80°  
-90°  
90°  
1
0.5  
0
0.5  
1
相対照度  
Relative Illuminance(a.u.)  
本特性は演色性ランク  
に対ています。  
R8000  
*
The graphs above show the characteristics for R8000 LEDs of this product.  
12  
NICHIA STS-DA1-2009E <Cat.No.120828>  
FORWARD CURRENT CHARACTERISTICS / TEMPERATURE CHARACTERISTICS  
NVSL219B  
No. STS-DA7-1730  
は参考です。  
*
番号  
TaVf  
All characteristics shown are for reference only and are not guaranteed.  
順電圧-順電流特性  
周囲-順電圧特性  
Forward Voltage vs  
Forward Current  
Ambient Temperature vs  
Forward Voltage  
VfIf  
TA=25°C  
IFP=700mA  
10000  
4.0  
3.5  
3.0  
2.5  
2.0  
2000  
1000  
700  
100  
10  
2.0  
2.5  
3.0  
順電圧  
3.5  
4.0  
-60 -40 -20  
0
20 40 60 80 100 120  
周囲温度  
Forward Voltage(V)  
Ambient Temperature(°C)  
周囲-相対光束特性  
順電流-相対光束特性  
Forward Current vs  
Relative Luminous Flux  
Ambient Temperature vs  
Relative Luminous Flux  
TaIv  
IfIv  
IFP=  
700mA  
TA=25°C  
1.4  
1.2  
1.0  
0.8  
0.6  
3.0  
2.5  
2.0  
1.5  
1.0  
0.5  
0.0  
-60 -40 -20  
0
20 40 60 80 100 120  
0
500  
1000  
1500  
2000  
2500  
順電流  
Forward Current(mA)  
周囲温度  
Ambient Temperature(°C)  
13  
NICHIA STS-DA1-2009E <Cat.No.120828>  
FORWARD CURRENT CHARACTERISTICS / TEMPERATURE CHARACTERISTICS  
NVSL219B  
No. STS-DA7-2445A  
は参です。  
*
番号  
All characteristics shown are for reference only and are not guaranteed.  
-色度特性  
Forward Current vs  
Chromaticity Coordinate  
Ifxy  
TA=25°C  
0.40  
0.39  
20mA  
100mA  
0.38  
0.37  
0.36  
700mA  
1500mA  
2000mA  
0.36  
0.37  
0.38  
x
0.39  
0.40  
-特性  
Ambient Temperature vs  
Chromaticity Coordinate  
Taxy  
IFP  
=
700mA  
0.40  
0.39  
0.38  
0.37  
0.36  
50°C  
25°C  
0°C  
100°C  
-40°C  
0.36  
0.37  
0.38  
x
0.39  
0.40  
本特性は演色性ランク  
に対。  
*
R70  
The graphs above show the characteristics for R70 LEDs of this product.  
14  
NICHIA STS-DA1-2009E <Cat.No.120828>  
FORWARD CURRENT CHARACTERISTICS / TEMPERATURE CHARACTERISTICS  
NVSL219B  
No. STS-DA7-1731A  
は参です。  
*
番号  
All characteristics shown are for reference only and are not guaranteed.  
-色度特性  
Forward Current vs  
Chromaticity Coordinate  
Ifxy  
TA=25°C  
0.41  
0.40  
700mA  
1500mA  
2000mA  
300mA  
20mA  
0.39  
0.38  
0.37  
0.39  
0.40  
0.41  
0.42  
0.43  
x
-特性  
Ambient Temperature vs  
Chromaticity Coordinate  
Taxy  
IFP  
=
700mA  
0.41  
0.40  
0.39  
0.38  
0.37  
-40°C  
0°C  
25°C  
50°C  
100°C  
0.39  
0.40  
0.41  
x
0.42  
0.43  
本特演色性ランク  
に対応しています。  
R8000  
*
The graphs above show the characteristics for R8000 LEDs of this product.  
15  
NICHIA STS-DA1-2009E <Cat.No.120828>  
RELIABILITY  
(1) Tests and Results  
Test  
Failure  
Reference  
Standard  
Test  
Units  
Test Conditions  
Criteria  
#
Duration  
Failed/Tested  
Resistance to  
JEITA ED-4701  
300 301  
Tsld=260°C, 10sec, 2reflows,  
Soldering Heat  
(Reflow Soldering)  
Solderability  
#1  
0/22  
Precondition: 30°C, 70%RH, 168hr  
JEITA ED-4701  
303 303A  
Tsld=245±5°C, 5sec,  
#2  
#1  
#1  
#1  
#1  
#1  
#1  
#1  
#1  
#1  
#1  
#1  
0/22  
0/22  
0/22  
0/22  
0/22  
0/22  
0/22  
0/22  
0/22  
0/22  
0/10  
0/22  
(Reflow Soldering)  
Lead-free Solder(Sn-3.0Ag-0.5Cu)  
-40°C(30min)~25°C(5min)~  
100°C(30min)~25°C(5min)  
25°C~65°C~-10°C, 90%RH,  
24hr per cycle  
JEITA ED-4701  
100 105  
Temperature Cycle  
100cycles  
10cycles  
Moisture Resistance  
(Cyclic)  
JEITA ED-4701  
200 203  
High Temperature  
Storage  
JEITA ED-4701  
200 201  
TA=100°C  
1000hours  
1000hours  
1000hours  
1000hours  
1000hours  
500hours  
1000hours  
48minutes  
Temperature Humidity  
Storage  
JEITA ED-4701  
100 103  
TA=60°C, RH=90%  
TA=-40°C  
Low Temperature  
Storage  
JEITA ED-4701  
200 202  
Room Temperature  
Operating Life  
High Temperature  
Operating Life  
Temperature Humidity  
Operating Life  
Low Temperature  
Operating Life  
TA=25°C, IF=1000mA  
Test board: See NOTES below  
TA=100°C, IF=400mA  
Test board: See NOTES below  
60°C, RH=90%, IF=700mA  
Test board: See NOTES below  
TA=-40°C, IF=700mA  
Test board: See NOTES below  
200m/s2, 100~2000~100Hz,  
4cycles, 4min, each X, Y, Z  
HBM, 2kV, 1.5k, 100pF, 3pulses,  
alternately positive or negative  
JEITA ED-4701  
400 403  
Vibration  
JEITA ED-4701  
300 304  
Electrostatic Discharges  
NOTES:  
1) Test board: FR4 board thickness=1.6mm, copper layer thickness=0.07mm, RθJA35°C/W  
2) Measurements are performed after allowing the LEDs to return to room temperature.  
(2) Failure Criteria  
Criteria #  
Items  
Conditions  
IF=700mA  
Failure Criteria  
>Initial value×1.1  
Forward Voltage(VF)  
Luminous Flux(ΦV)  
Solderability  
#1  
#2  
IF=700mA  
-
<Initial value×0.7  
Less than 95% solder coverage  
16  
NICHIA STS-DA1-2009E <Cat.No.120828>  
CAUTIONS  
(1) Storage  
Conditions  
Temperature  
30°C  
Humidity  
90%RH  
Time  
Within 1 Year from Delivery Date  
168hours  
Before Opening Aluminum Bag  
After Opening Aluminum Bag  
Storage  
Baking  
30°C  
70%RH  
65±5°C  
-
24hours  
Product complies with JEDEC MSL 3 or equivalent. See IPC/JEDEC STD-020 for moisture-sensitivity details.  
Absorbed moisture in LED packages can vaporize and expand during soldering, which can cause interface delamination  
and result in optical performance degradation. Products are packed in moisture-proof aluminum bags  
to minimize moisture absorption during transportation and storage.  
Included silica gel desiccants change from blue to red if moisture had penetrated bags.  
After opening the moisture-proof aluminum bag, the products should go through the soldering process  
within the range of the conditions stated above. Unused remaining LEDs should be stored with silica gel desiccants  
in a hermetically sealed container, preferably the original moisture-proof bags for storage.  
After the “Period After Opening” storage time has been exceeded or silica gel desiccants are no longer blue,  
the products should be baked. Baking should only be done once.  
Although the leads or electrode pads (anode and cathode) of the product are plated with gold,  
prolonged exposure to a corrosive environment might cause the gold plated the leads or electrode pads to tarnish,  
and thus leading to difficulties in soldering. If unused LEDs remain, they must be stored in a hermetically sealed container.  
Nichia recommends using the original moisture-proof bag for storage.  
Do not use sulfur-containing materials in commercial products. Some materials, such as seals and adhesives, may contain sulfur.  
The contaminated plating of LEDs might cause an open circuit. Silicone rubber is recommended as a material for seals.  
Bear in mind, the use of silicones may lead to silicone contamination of electrical contacts inside the products,  
caused by low molecular weight volatile siloxane.  
To prevent water condensation, please avoid large temperature and humidity fluctuations for the storage conditions.  
(2) Directions for Use  
When designing a circuit, the current through each LED must not exceed the Absolute Maximum Rating.  
Operating at a constant current per LED is recommended. In case of operating at a constant voltage, Circuit B is recommended.  
If the LEDs are operated with constant voltage using Circuit A, the current through the LEDs may vary due to the variation  
in Forward Voltage characteristics of the LEDs.  
(A)  
(B)  
LEDs should be operated in forward bias. Driving circuits must not subject LEDs to either forward or reverse voltage while off.  
Continuous reverse voltage can cause migration and LED damage.  
It is recommended to operate the LEDs at a current greater than 10% of the sorting current to stabilize the LED characteristics.  
For outdoor use, necessary measures should be taken to prevent water, moisture and salt air damage.  
(3) Handling Precautions  
Do not handle LEDs with bare hands, it may contaminate the LED surface and affect optical characteristics.  
In the worst case, catastrophic failure from excess pressure through bump-bond breaks and package damage may result.  
When handling the product with tweezers, be careful not to apply excessive force to the resin.  
Otherwise, The resin can be cut, chipped, delaminate or deformed, causing bump-bond breaks and catastrophic failures.  
Dropping the product may cause damage.  
Do not stack assembled PCBs together. Failure to comply can cause the resin portion of the product to be cut, chipped,  
delaminated and/or deformed. It may cause bump to break, leading to catastrophic failures.  
17  
NICHIA STS-DA1-2009E <Cat.No.120828>  
(4) Design Consideration  
PCB warpage after mounting the products onto a PCB can cause the package to break.  
The LED should be placed in a way to minimize the stress on the LEDs due to PCB bow and twist.  
The position and orientation of the LEDs affect how much mechanical stress is exerted on the LEDs placed near the score lines.  
The LED should be placed in a way to minimize the stress on the LEDs due to board flexing.  
Board separation must be performed using special jigs, not using hands.  
If an aluminum PCB is used, customer is advised to verity the PCB with the products before use.  
Thermal stress during use can cause the solder joints to crack.  
(5) Electrostatic Discharge (ESD)  
The products are sensitive to static electricity or surge voltage. ESD can damage a die and its reliability.  
When handling the products, the following measures against electrostatic discharge are strongly recommended:  
Eliminating the charge  
Grounded wrist strap, ESD footwear, clothes, and floors  
Grounded workstation equipment and tools  
ESD table/shelf mat made of conductive materials  
Proper grounding is required for all devices, equipment, and machinery used in product assembly.  
Surge protection should be considered when designing of commercial products.  
If tools or equipment contain insulating materials such as glass or plastic,  
the following measures against electrostatic discharge are strongly recommended:  
Dissipating static charge with conductive materials  
Preventing charge generation with moisture  
Neutralizing the charge with ionizers  
The customer is advised to check if the LEDs are damaged by ESD  
when performing the characteristics inspection of the LEDs in the application.  
Damage can be detected with a forward voltage measurement or a light-up test at low current (1mA).  
ESD damaged LEDs may have current flow at a low voltage or no longer illuminate at a low current.  
Failure Criteria: VF<2.0V at IF=0.5mA  
(6) Thermal Management  
Proper thermal management is an important when designing products with LEDs. LED die temperature is affected  
by PCB thermal resistance and LED spacing on the board. Please design products in a way that the LED die temperature  
does not exceed the maximum Junction Temperature (TJ).  
Drive current should be determined for the surrounding ambient temperature (TA) to dissipate the heat from the product.  
The following equations can be used to calculate the junction temperature of the products.  
1) TJ=TA+RθJAW  
2) TJ=TS+RθJSW  
*TJ=LED junction temperature: °C  
TA=Ambient temperature: °C  
TS=Soldering temperature (cathode side): °C  
RθJA=Thermal resistance from junction to ambient: °C/W  
RθJS=Thermal resistance from junction to TS measuring point: °C/W  
W=Input power(IF×VF): W  
Ts Point  
18  
NICHIA STS-DA1-2009E <Cat.No.120828>  
(7) Cleaning  
If required, isopropyl alcohol (IPA) should be used. Other solvents may cause premature failure to the LEDs  
due to the damage to the resin portion. The effects of such solvents should be verified prior to use.  
In addition, the use of CFCs such as Freon is heavily regulated.  
Ultrasonic cleaning is not recommended since it may have adverse effects on the LEDs  
depending on the ultrasonic power and how LED is assembled.  
If ultrasonic cleaning must be used, the customer is advised to make sure the LEDs will not be damaged prior to cleaning.  
(8) Eye Safety  
In 2006, the International Electrical Commission (IEC) published IEC 62471:2006 Photobiological safety of lamps  
and lamp systems, which added LEDs in its scope.  
On the other hand, the IEC 60825-1:2007 laser safety standard removed LEDs from its scope.  
However, please be advised that some countries and regions have adopted standards  
based on the IEC laser safety standard IEC 60825-1:20112001, which still includes LEDs in its scope.  
Most of Nichia's LEDs can be classified as belonging into either the Exempt Group or Risk Group 1.  
High-power LEDs, that emit light containing blue wavelengths, may be classified as Risk Group 2.  
Please proceed with caution when viewing directly any LEDs driven at high current, or viewing LEDs  
with optical instruments which may greatly increase the damages to your eyes.  
Viewing a flashing light may cause eye discomfort. When incorporating the LED into your product,  
please be careful to avoid adverse effects on the human body caused by light stimulation.  
(9) Others  
The LEDs described in this brochure are intended to be used for ordinary electronic equipment (such as office equipment,  
communications equipment, measurement instruments and household appliances).  
Consult Nichia's sales staff in advance for information on the applications in which exceptional quality  
and reliability are required, particularly when the failure or malfunction of the LEDs may directly jeopardize life or  
health (such as for airplanes, aerospace, submersible repeaters, nuclear reactor control system, automobiles,  
traffic control equipment, life support systems and safety devices).  
The customer shall not reverse engineer by disassembling or analysis of the LEDs without having prior written consent  
from Nichia. When defective LEDs are found, the customer shall inform Nichia directly before disassembling or analysis.  
Both the customers and Nichia will agree on official specifications of supplied products before a customer's volume production.  
Specifications and appearance subject to change for improvement without notice.  
19  
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