F-213
QTE–014–01–F–D–DP–A
®
QTE–040–01–L–D–A
QTE–060–01–L–D–A
(0,80 mm) .0315"
QTE SERIES
HIGH SPEED GROUND PLANE HEADER
Integral metal plane
for power or ground
Board Mates:
QSE
Standard stack heights
from 5 mm to 25 mm
SPECIFICATIONS
®
For complete specifications and
recommended PCB layouts see
www.samtec.com?QTE
Cable Mates:
EQCD, EQSD, EQDP, EQRF
(See Application Specific note)
Insulator Material:
Liquid Crystal
Polymer
TM
Terminal Material:
Phosphor Bronze
Plating:
EXTENDED LIFE PRODUCT
Au or Sn over
50µ" (1,27 µm) Ni
Current Rating:
Contacts:
10 year Mixed Flowing Gas with 50µ" Gold
Call Samtec for maximum cycles mated with QSE
1.3A per contact @ 95°C
Ground Plane:
Rated @ 3dB Insertion Loss
with PCB effects* w/o PCB effects**
QTE/QSE
Type
10.1A per ground plane @ 95°C
Operating Temp Range:
-55°C to +125°C
Voltage Rating:
225 VAC mated with QSE
& 5 mm Stack Height
Max Cycles:
5 mm Stack Height
Single-Ended Signaling
–D 9 GHz / 18 Gbps
9 GHz / 18 Gbps
14 GHz / 28 Gbps
Differential Pair Signaling –D 8 GHz / 16 Gbps
Differential Pair Signaling –DP 8.5 GHz / 17 Gbps 13.5 GHz / 27 Gbps
*Performance data includes effects of a non-optimized PCB.
**Test board losses de-embedded from performance data.
100
RoHS Compliant:
Yes
Performance data for other stack heights and complete test data
available at www.samtec.com?QTE or contact sig@samtec.com
Processing:
Lead–Free Solderable:
Yes
LEAD
PINS PER ROW
NO. OF PAIRS
PLATING
OPTION
OTHER
TYPE
QTE
A
SMT Lead Coplanarity:
(0,10 mm) .004" max (020-060)
Board Stacking:
For applications requiring
more than two connectors per
board contact ipg@samtec.com
STYLE
OPTION
Specify
LEAD
STYLE
from
–K
= (7,00 mm)
.275" DIA
Polyimide
Film Pick &
Place Pad
–020, –040, –060
–F
–D
APPLICATION
SPECIFIC OPTION
(40 total pins per bank = –D)
= Gold Flash
= Single-Ended
on Signal Pins and
Ground Plane,
Matte Tin on tails
chart
–014, –028, –042
–D–DP
= Differential Pair
(–01 only)
• 14mm, 15 mm, 22 mm
and 30 mm stack height
(Caution: Some automatic
placement/inspection
machines may have
component height
restrictions. Please consult
machinery specifications.)
• 30µ" (0,76 µm) Gold
(Specify -H plating for
Data Rate cable mating
applications.)
• Edge Mount
• 56(-DP), 80, 100
positions per row
(14 pairs per bank = –D–DP)
–TR
–L
–D–DP = (No. of Positions per Row/14)
x (20,00) .7875
= Tape & Reel
Packaging
= 10µ" (0,25 µm)
Gold on Signal Pins
and Ground Plane,
Matte Tin on tails
(N/A on 56 &
80 positions
or -05 & -07
lead style)
–D = (No. of Positions per Row/20)
x (20,00) .7875
(20,00) .7875
QTE
LEAD
STYLE
HEIGHT
WITH
QSE*
A
01
–C*
(4,27) (5,00)
–01
–02
–03
–04
–05
–07
(5,97)
.235
(7,11)
.280
.168 .197
= Electro-Polished
Selective
–L
(7,26) (8,00)
.286 .315
= Latching
Option
50µ" (1,27 µm) min
Au over 150µ"
02
(0,80)
.0315
(0,20)
.008
(10,27) (11,00)
.404 .433
(N/A on 42,
56, 60 & 80
positions)
(3,81 µm) Ni on Signal
Pins in contact area,
10µ" (0,25 µm) min Au
over 50µ" (1,27 µm) Ni
on Ground Plane
in contact area,
Matte Tin over 50µ"
(1,27 µm) min Ni on
all solder tails
(15,25) (16,00)
.600 .630
(18,26) (19,00)
.718 .748
A
• Guide Posts, Screw Down
& Friction Lock
• Retention Option
Call Samtec.
(24,24) (25,00)
.954 .984
*Processing conditions
will affect mated height.
(0,76)
.030
ALSO AVAILABLE
Board Spacing Standoffs.
See SO Series.
*Note: –C Plating passes
(0,64)
.025
(0,89)
.035 DIA
10 year MFG testing
––L
Note: Some lengths, styles
and options are non-standard,
non-returnable.
WWW.SAMTEC.COM
