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AZ810NRTR-G1

型号：

AZ810NRTR-G1

描述：

3引脚微处理器复位电路[ 3-PIN MICROPROCESSOR RESET CIRCUITS ]

品牌：

BCDSEMI[ BCD SEMICONDUCTOR MANUFACTURING LIMITED ]

页数：

9 页

PDF大小：

572 K

下载PDF手册
Data Sheet  
3-PIN MICROPROCESSOR RESET CIRCUITS  
AZ809/AZ810  
General Description  
Features  
The AZ809/810 microprocessor supervisory circuits  
can be used to monitor the power supplies in micropro-  
cessor and digital systems. They provide a reset to the  
microprocessor in power-up, power-down and brown-  
out conditions. The function of the AZ809/810 is to  
·
·
·
Precise Monitoring of 3.0V, 3.3V and 5.0V Sup-  
ply Voltages  
Improved Maxim MAX809/MAX810 Replace-  
ment  
140ms Min. Reset Pulse Width  
Active-low Reset Output (AZ809)  
Active-high Reset Output (AZ810)  
No External Components  
monitor the V supply voltage, and assert a reset sig-  
CC  
nal whenever this voltage declines below the factory-  
programmed reset threshold. The reset signal remains  
·
·
asserted for 240ms after V rises above the threshold.  
CC  
Specified Over Full Temperature Range: -40 to  
105oC  
The AZ809 has an active-low RESET output, while  
the AZ810 has an active-high RESET output. Seven  
standard reset voltage options are available, suitable  
for monitoring 3.0V, 3.3V and 5.0V supply voltages.  
Applications  
With a typical supply current of only 8μA when V is  
CC  
3.3V, the AZ809/810 are ideal for use in portable  
equipment.  
·
·
·
·
·
Embedded Controllers  
Battery Operated Systems  
Intelligent Instruments  
Wireless Communication Systems  
PDAs and Handheld Equipment  
These ICs are available in SOT-23 package.  
SOT-23  
Figure 1. Package Type of AZ809/810  
Sep. 2012 Rev. 1. 3  
BCD Semiconductor Manufacturing Limited  
1
Data Sheet  
3-PIN MICROPROCESSOR RESET CIRCUITS  
AZ809/AZ810  
Pin Configuration  
N Package  
(SOT-23)  
RESET/RESET  
GND  
2
V
3
CC  
1
Figure 2. Pin Configuration of AZ809/810 (Top View)  
Pin Description  
Pin Number  
Pin Name  
Function  
AZ809 AZ810  
1
1
GND  
Ground pin  
RESET is asserted LOW if VCC falls below the reset threshold and remains LOW for  
the 240ms typical reset timeout period (140ms minimum) after VCC exceeds the  
threshold  
2
RESET  
2
3
RESET  
VCC  
RESET is asserted HIGH if VCC falls below the reset threshold  
Power supply input voltage (3.0V, 3.3V, 5.0V)  
3
Sep. 2012 Rev. 1. 3  
BCD Semiconductor Manufacturing Limited  
2
Data Sheet  
AP2218  
AZ809/AZ810  
1A LOW DROPOUT LINEAR REGULATOR  
3-PIN MICROPROCESSOR RESET CIRCUITS  
Functional Block Diagram  
Reset  
Logic  
+
3
V
CC  
2
RESET/RESET  
Timer  
1
GND  
Oscillator  
Reference  
Voltage  
Figure 3. Functional Block Diagram of AZ809/810  
Ordering Information  
AZ8XX  
-
E1: Lead Free  
G1: Green  
Circuit Type  
09: AZ809  
10: AZ810  
TR: Tape and Reel  
Detect Voltage:  
Package  
N: SOT-23  
L: 4.63V  
S: 2.93V  
R: 2.63V  
T: 3.08V  
Sep. 2012 Rev. 1. 3  
BCD Semiconductor Manufacturing Limited  
3
Data Sheet  
3-PIN MICROPROCESSOR RESET CIRCUITS  
AZ809/AZ810  
Ordering Information (Continued)  
Part Number  
Lead Free  
Marking ID  
Lead Free Green  
Temperature  
Range  
Package  
Packing Type  
Green  
AZ809NLTR-E1  
AZ809NTTR-E1  
AZ809NSTR-E1  
AZ809NRTR-E1  
AZ810NLTR-E1  
AZ810NTTR-E1  
AZ810NSTR-E1  
AZ810NRTR-E1  
AZ809NLTR-G1  
AZ809NTTR-G1  
AZ809NSTR-G1  
AZ809NRTR-G1  
AZ810NLTR-G1  
AZ810NTTR-G1  
AZ810NSTR-G1  
AZ810NRTR-G1  
EC1  
EC4  
EC5  
EC6  
ED1  
ED4  
ED5  
ED6  
GC1  
GC4  
GC5  
GC6  
GD1  
GD4  
GD5  
GD6  
Tape & Reel  
Tape & Reel  
Tape & Reel  
Tape & Reel  
Tape & Reel  
Tape & Reel  
Tape & Reel  
Tape & Reel  
-40 to 105oC  
SOT-23  
-40 to 105oC  
BCD Semiconductor's Pb-free products, as designated with "E1" suffix in the part number, are RoHS compliant. Products with  
"G1" suffix are available in green packages.  
Absolute Maximum Ratings (Note 1)  
Parameter  
Symbol  
Value  
Unit  
V
Supply Voltage  
VCC  
-0.3 to 6  
RESET, RESET  
-0.3 to VCC+0.3  
V
Input Current, VCC Pin  
Output Current, RESET, RESET Pin  
Rate of Rise, VCC  
20  
20  
mA  
mA  
V/μs  
mW  
100  
Continuous Power Dissipation  
Junction Temperature  
Storage Temperature  
320  
oC  
oC  
oC  
TJ  
125  
TSTG  
TLEAD  
-65 to 150  
300  
Lead Temperature (Soldering, 10sec)  
Note 1: Stresses greater than those listed under "Absolute Maximum Ratings" may cause permanent damage to  
the device. These are stress ratings only, and functional operation of the device at these or any other conditions  
beyond those indicated under "Recommended Operating Conditions" is not implied. Exposure to "Absolute Max-  
imum Ratings" for extended periods may affect device reliability.  
Recommended Operating Conditions  
Parameter  
Symbol  
Min  
Max  
Unit  
oC  
Operating Junction Temperature Range  
TJ  
-40  
105  
Sep. 2012 Rev. 1. 3  
BCD Semiconductor Manufacturing Limited  
4
Data Sheet  
AP2218  
AZ809/AZ810  
1A LOW DROPOUT LINEAR REGULATOR  
3-PIN MICROPROCESSOR RESET CIRCUITS  
Electrical Characteristics  
o
o
o
(T =-40 C to 105 C, Typical values at T =25 C, V =5V for L devices, V =3.3V for T/S devices and V =3V  
A
A
CC  
CC  
CC  
for R devices, unless otherwise specified.)  
Parameter  
Symbol  
Conditions  
Min  
Typ  
Max  
5.5  
5.5  
20  
Unit  
TA=0oC to 70oC  
Input Voltage (VCC) Range  
VCC  
1.1  
1.2  
V
TA=-40oC to 105oC  
TA=-40oC to 85oC, VCC<5.5V,  
L
TA=-40oC to 85oC, VCC<3.6V,  
R/S/T  
TA=85oC to 105oC, VCC<5.5V,  
L
11  
8
16  
25  
20  
Supply Current  
ICC  
μA  
TA=85oC to 105oC, VCC<3.6V,  
R/S/T  
TA=25oC  
L Devices  
4.56  
4.50  
4.40  
3.04  
3.00  
2.92  
2.89  
2.85  
2.78  
2.59  
2.55  
2.50  
4.63  
3.08  
2.93  
2.63  
4.70  
4.75  
4.86  
3.11  
3.15  
3.23  
2.96  
3.00  
3.08  
2.66  
2.70  
2.76  
TA=-40oC to 85oC  
L: 4.63V  
TA=85oC to 105oC  
TA=25oC  
T Devices  
TA=-40oC to 85oC  
T: 3.08V  
TA=85oC to 105oC  
Detect Voltage  
VTH  
V
TA=25oC  
S Devices  
TA=-40oC to 85oC  
S: 2.93V  
TA=85oC to 105oC  
TA=25oC  
R Devices  
TA=-40oC to 85oC  
R: 2.63V  
TA=85oC to 105oC  
%/oC  
Detect Voltage Temperature  
Coefficient  
±0.003  
VCC to Reset Delay  
VCC=VTH to VTH-100mV  
20  
μs  
Sep. 2012 Rev. 1. 3  
BCD Semiconductor Manufacturing Limited  
5
Data Sheet  
3-PIN MICROPROCESSOR RESET CIRCUITS  
AZ809/AZ810  
Electrical Characteristics (Continued)  
o
o
o
(T =-40 C to 105 C, Typical values at T =25 C, V =5V for L devices, V =3.3V for T/S devices and V =3V  
A
A
CC  
CC  
CC  
for R devices, unless otherwise specified.)  
Parameter  
Symbol  
Conditions  
Min  
140  
100  
Typ  
Max  
560  
840  
0.3  
Unit  
TA=-40oC to 85oC  
TA=85oC to 105oC  
Reset Active Timeout Period  
240  
ms  
Low RESET Output Voltage  
(AZ809)  
VOL  
VCC=VTH min, ISINK=1.2mA,  
AZ809R/S/T  
V
V
CC=VTH min, ISINK=3.2mA,  
0.4  
0.3  
AZ809L  
VCC>1.1V, ISINK=50μA  
High RESET Output Voltage  
(AZ809)  
V
CC>VTH max, ISOURCE=500μA,  
AZ809R/S/T  
CC>VTH max, ISOURCE=800μA, VCC-1.5  
0.8VCC  
V
V
V
V
AZ809L  
Low RESET Output Voltage  
(AZ810)  
VOL  
VCC=VTH max, ISINK=1.2mA,  
AZ810R/S/T  
0.3  
0.4  
VCC=VTH max, ISINK=3.2mA,  
AZ810L  
High RESET Output Voltage  
(AZ810)  
VOH  
1.8V<VCC<VTH min,  
0.8VCC  
ISOURCE=150μA  
Sep. 2012 Rev. 1. 3  
BCD Semiconductor Manufacturing Limited  
6
Data Sheet  
3-PIN MICROPROCESSOR RESET CIRCUITS  
AZ809/AZ810  
Operating Diagram  
VCC 5V  
0V  
VTH  
Active Reset  
Timeout Period  
20μs  
typical  
240ms  
typical  
5V  
0V  
5V  
0V  
RESET  
RESET  
AZ809  
AZ810  
Note: The reset signal is asserted LOW for the AZ809 and HIGH for the AZ810 when the V signal falls below  
CC  
the threshold trip voltage and remains asserted for 240ms typical after the V has risen above the threshold.  
CC  
Figure 4. Reset Timing Diagram of AZ809/810  
Typical Application  
VCC  
VCC  
AZ809  
VCC  
(AZ810)  
RESET  
INPUT  
RESET  
(RESET)  
GND  
GND  
Figure 5. Typical Application of AZ809/810  
Sep. 2012 Rev. 1. 3  
BCD Semiconductor Manufacturing Limited  
7
Data Sheet  
3-PIN MICROPROCESSOR RESET CIRCUITS  
AZ809/AZ810  
Mechanical Dimensions  
SOT-23  
Unit: mm(inch)  
0.100(0.004) GAUGE PLANE  
7.0°  
4×R0.100(0.004)  
3.0 °  
0.500(0.020)  
0.700(0.028)  
R0.100(0.004)  
0.900(0.035)  
1.100(0.043)  
7.0°  
~
0.0° 10.0°  
2.0°  
0.020(0.001)  
0.100(0.004)  
1.050(0.041)REF  
0.080(0.003)  
0.150(0.006)  
0.200(0.008)MIN  
0.550(0.022)REF  
2.800(0.110)  
3.000(0.118)  
1.200(0.047)  
1.400(0.055)  
2.300(0.091)  
2.500(0.098)  
0.390(0.015)  
0.450(0.018)  
0.920(0.036)  
0.980(0.039)  
1.900(0.075)REF  
Sep. 2012 Rev. 1. 3  
BCD Semiconductor Manufacturing Limited  
8
BCD Semiconductor Manufacturing Limited  
http://www.bcdsemi.com  
- Headquarters  
- Wafer Fab  
BCD Semiconductor Manufacturing Limited  
Shanghai SIM-BCD Semiconductor Manufacturing Co., Ltd.  
No. 1600, Zi Xing Road, Shanghai ZiZhu Science-based Industrial Park, 200241, China  
800 Yi Shan Road, Shanghai 200233, China  
Tel: +86-21-24162266, Fax: +86-21-24162277  
Tel: +86-21-6485 1491, Fax: +86-21-5450 0008  
REGIONAL SALES OFFICE  
Shenzhen Office  
Taiwan Office  
USA Office  
Shanghai SIM-BCD Semiconductor Manufacturing Co., Ltd., Shenzhen Office  
BCD Semiconductor (Taiwan) Company Limited  
BCD Semiconductor Corp.  
Unit A Room 1203, Skyworth Bldg., Gaoxin Ave.1.S., Nanshan District, Shenzhen,  
4F, 298-1, Rui Guang Road, Nei-Hu District, Taipei,  
30920 Huntwood Ave. Hayward,  
China  
Taiwan  
Tel: +886-2-2656 2808  
CA 94544, USA  
Tel: +86-755-8826 7951  
Tel : +1-510-324-2988  
Fax: +86-755-8826 7865  
Fax: +886-2-2656 2806  
Fax: +1-510-324-2788  
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