OEM PQFP Sockets
• Accepts JEDEC MO-069 packages, lead
counts 84, 100 and 132
• .025"(0.64mm) center line contacts for
high-density packaging
• Lid design separates, maintains IC lead
spacing
• Lid acts as package carrier and transport
protector
• Lid is compatible with conventional package
shipping tubes and trays
• Slotted, “open” socket walls and corners
permit airflow around capturedpackage (aids
in package heat dissipation)
• Latches secure lid/package assembly to base
• Mirror image contact pin-out available on
most lead counts
• Required tooling available in two styles
TS-0361-10
Sheet 1 of 4
Date Issued: November 1, 1999
8.
Physical
Insulation
Material: Glass Filled Polyethersulfone ( PES )
Flammability: UL 94V-0
Color: Black
Contact
Material: Beryllium Copper
Plating
Underplate: 50 m" [ 1.27
iping Area & Solder Tails: 200 m" [ 5.08 mm ] 60/40 Tin Lead
m
m ] Nickel
W
Latching Aid
Material: Polycarbonate (PC)
Color: Black
Marking: Raised Letters: 3M Logo & Part Identification
Electrical
Current Rating: 1 A
Insulation Resistance: > 1
ithstanding Voltage: 1000 Vrms at Sea Level
¥
1012 Wat 500 Vdc
W
Mechanical
Durablity: 25 acuations
Normal Force: 150 grams average per contact
Environmental
Temperature Rating Operating: 0°C to +105°C
UL File No.: E68080
3M Electronic Handling and Protection Division
6801 River Place Blvd.
Austin, TX 78726-9000
800-328-0411
or visit our website: http://www.3M.com/ehpd
For technical, sales or ordering information call
