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4N27FR2VM

型号:

4N27FR2VM

描述:

光电耦合器\n[ OPTOCOUPLER ]

品牌:

ETC[ ETC ]

页数:

7 页

PDF大小:

104 K

4N25  
4N26  
4N27  
4N28  
GlobalOptoisolator  
The 4N25, 4N26, 4N27 and 4N28 devices consist of a gallium arsenide  
infrared emitting diode optically coupled to a monolithic silicon phototransistor  
detector.  
Most Economical Optoisolator Choice for Medium Speed, Switching Applications  
Meets or Exceeds All JEDEC Registered Specifications  
To order devices that are tested and marked per VDE 0884 requirements, the  
suffix ”V” must be included at end of part number. VDE 0884 is a test option.  
Applications  
General Purpose Switching Circuits  
Interfacing and coupling systems of different potentials and impedances  
I/O Interfacing  
6
1
Solid State Relays  
STANDARD THRU HOLE  
MAXIMUM RATINGS (T = 25°C unless otherwise noted)  
A
Rating  
Symbol  
Value  
Unit  
INPUT LED  
Reverse Voltage  
V
3
Volts  
mA  
R
SCHEMATIC  
Forward Current — Continuous  
I
F
60  
LED Power Dissipation @ T = 25°C  
with Negligible Power in Output Detector  
P
D
120  
mW  
A
1
2
3
6
Derate above 25°C  
1.41  
mW/°C  
OUTPUT TRANSISTOR  
Collector–Emitter Voltage  
Emitter–Collector Voltage  
Collector–Base Voltage  
5
4
V
V
V
30  
7
Volts  
Volts  
Volts  
mA  
CEO  
ECO  
CBO  
PIN 1. LED ANODE  
2. LED CATHODE  
3. N.C.  
70  
Collector Current — Continuous  
I
C
150  
150  
4. EMITTER  
5. COLLECTOR  
6. BASE  
Detector Power Dissipation @ T = 25°C  
with Negligible Power in Input LED  
Derate above 25°C  
P
D
mW  
A
1.76  
mW/°C  
TOTAL DEVICE  
(1)  
Isolation Surge Voltage  
(Peak ac Voltage, 60 Hz, 1 sec Duration)  
V
ISO  
7500  
Vac(pk)  
Total Device Power Dissipation @ T = 25°C  
Derate above 25°C  
P
D
250  
2.94  
mW  
mW/°C  
A
Ambient Operating Temperature Range  
Storage Temperature Range  
T
55 to +100  
55 to +150  
260  
°C  
°C  
°C  
A
T
stg  
Soldering Temperature (10 sec, 1/16from case)  
T
L
1. Isolation surge voltage is an internal device dielectric breakdown rating.  
1. For this test, Pins 1 and 2 are common, and Pins 4, 5 and 6 are common.  
4N25 4N26 4N27 4N28  
(1)  
ELECTRICAL CHARACTERISTICS (T = 25°C unless otherwise noted)  
A
(1)  
Typ  
Characteristic  
INPUT LED  
Symbol  
Min  
Max  
Unit  
V
F
Forward Voltage (I = 10 mA)  
T
= 25°C  
= 55°C  
= 100°C  
1.15  
1.3  
1.05  
1.5  
Volts  
F
A
T
A
T
A
Reverse Leakage Current (V = 3 V)  
R
I
100  
µA  
R
Capacitance (V = 0 V, f = 1 MHz)  
C
18  
pF  
J
OUTPUT TRANSISTOR  
CollectorEmitter Dark Current  
4N25,26,27  
4N28  
I
1
1
50  
100  
nA  
CEO  
(V  
CE  
= 10 V, T = 25°C  
A
(V  
= 10 V, T = 100°C)  
All Devices  
I
I
30  
70  
7
1
0.2  
45  
100  
7.8  
500  
7
µA  
nA  
CE  
A
CEO  
CollectorBase Dark Current (V  
= 10 V)  
CollectorEmitter Breakdown Voltage (I = 1 mA)  
CB  
CBO  
V
V
V
Volts  
Volts  
Volts  
C
(BR)CEO  
(BR)CBO  
(BR)ECO  
CollectorBase Breakdown Voltage (I = 100 µA)  
C
EmitterCollector Breakdown Voltage (I = 100 µA)  
E
DC Current Gain (I = 2 mA, V  
CE  
= 5 V)  
h
C
C
C
FE  
CE  
CB  
CollectorEmitter Capacitance (f = 1 MHz, V  
= 0)  
= 0)  
pF  
CE  
CollectorBase Capacitance (f = 1 MHz, V  
CB  
19  
9
pF  
EmitterBase Capacitance (f = 1 MHz, V  
= 0)  
C
pF  
EB  
EB  
COUPLED  
(2)  
I (CTR)  
C
Output Collector Current (I = 10 mA, V  
CE  
= 10 V)  
mA (%)  
F
4N25,26  
4N27,28  
2 (20)  
1 (10)  
7 (70)  
5 (50)  
CollectorEmitter Saturation Voltage (I = 2 mA, I = 50 mA)  
V
CE(sat)  
0.15  
2.8  
4.5  
1.2  
1.3  
0.5  
Volts  
µs  
C
F
(3)  
TurnOn Time (I = 10 mA, V  
= 10 V, R = 100 )  
t
F
CC  
L
on  
off  
(3)  
TurnOff Time (I = 10 mA, V  
= 10 V, R = 100 )  
t
µs  
F
CC  
L
(3)  
Rise Time (I = 10 mA, V  
CC  
= 10 V, R = 100 )  
t
r
µs  
F
L
(3)  
Fall Time (I = 10 mA, V  
CC  
= 10 V, R = 100 )  
t
f
µs  
F
L
(4)  
Isolation Voltage (f = 60 Hz, t = 1 sec)  
V
ISO  
R
ISO  
C
ISO  
7500  
Vac(pk)  
(4)  
11  
10  
Isolation Resistance (V = 500 V)  
Isolation Capacitance (V = 0 V, f = 1 MHz)  
(4)  
0.2  
pF  
1. Always design to the specified minimum/maximum electrical limits (where applicable).  
2. Current Transfer Ratio (CTR) = I /I x 100%.  
C F  
3. For test circuit setup and waveforms, refer to Figure 11.  
4. For this test, Pins 1 and 2 are common, and Pins 4, 5 and 6 are common.  
4N25 4N26 4N27 4N28  
TYPICAL CHARACTERISTICS  
2
10  
PULSE ONLY  
PULSE OR DC  
NORMALIZED TO:  
= 10 mA  
1.8  
I
F
1
1.6  
1.4  
1.2  
1
0.1  
T
= 55  
°
C
C
A
25°  
100°  
C
1
10  
100  
1000  
0.01  
0.5  
1
2
5
10  
20  
50  
I , LED FORWARD CURRENT (mA)  
I , LED INPUT CURRENT (mA)  
F
F
Figure 1. LED Forward Voltage versus Forward Current  
Figure 2. Output Current versus Input Current  
10  
28  
7
5
24  
I
= 10 mA  
5 mA  
F
NORMALIZED TO T = 25°C  
A
20  
16  
12  
8
2
1
0.7  
0.5  
2 mA  
1 mA  
0.2  
0.1  
4
0
0
1
2
3
4
5
6
7
8
9
10  
60  
40 20  
0
20  
40  
60  
80  
100  
V
, COLLECTOREMITTER VOLTAGE (VOLTS)  
T , AMBIENT TEMPERATURE (°C)  
CE  
A
Figure 3. Collector Current versus  
Figure 4. Output Current versus Ambient Temperature  
CollectorEmitter Voltage  
100  
50  
NORMALIZED TO:  
V
= 10 V  
CC  
V
T
= 10 V  
CE  
= 25°C  
100  
10  
A
20  
10  
5
t
f
R
= 1000  
L
{
V
= 30 V  
CE  
R
= 100  
L
{
t
r
1
t
f
2
1
t
10 V  
20  
r
0.1  
0
40  
60  
80  
100  
0.1  
0.2  
0.5  
1
2
5
10  
20  
50  
100  
T , AMBIENT TEMPERATURE (  
°C)  
I , LED INPUT CURRENT (mA)  
A
F
Figure 5. Dark Current versus Ambient Temperature  
Figure 6. Rise and Fall Times  
(Typical Values)  
4N25 4N26 4N27 4N28  
100  
70  
50  
100  
70  
50  
V
= 10 V  
V
= 10 V  
CC  
CC  
R
= 1000  
L
20  
20  
10  
R
= 1000  
L
10  
7
100  
10  
7
5
100  
10  
5
2
1
2
1
0.1  
0.2  
0.5 0.7  
1
2
5
7
10  
20  
50 70 100  
0.1  
0.2  
0.5 0.7  
1
2
5
7
10  
20  
50 70100  
I , LED INPUT CURRENT (mA)  
I , LED INPUT CURRENT (mA)  
F
F
Figure 7. TurnOn Switching Times  
Figure 8. TurnOff Switching Times  
(Typical Values)  
(Typical Values)  
20  
18  
4
I
= 7 µA  
I
= 0  
C
B
F
LED  
f = 1 MHz  
16  
6 µA  
C
3
2
1
CB  
14  
12  
5
µ
A
A
10  
8
4
µ
C
EB  
3
2
1
µA  
µA  
µA  
6
C
CE  
4
2
0
0.05 0.1  
0.2  
0.5  
1
2
5
10  
20  
50  
0
2
4
6
8
10  
12  
14  
16  
18  
20  
V
, COLLECTOREMITTER VOLTAGE (VOLTS)  
V, VOLTAGE (VOLTS)  
CE  
Figure 9. DC Current Gain (Detector Only)  
Figure 10. Capacitances versus Voltage  
TEST CIRCUIT  
WAVEFORMS  
INPUT PULSE  
V
= 10 V  
CC  
I
= 10 mA  
INPUT  
F
R
= 100 Ω  
L
10%  
OUTPUT PULSE  
OUTPUT  
90%  
t
t
f
r
t
t
on  
off  
Figure 11. Switching Time Test Circuit and Waveforms  
4N25 4N26 4N27 4N28  
PACKAGE DIMENSIONS  
A–  
NOTES:  
1. DIMENSIONING AND TOLERANCING PER ANSI  
Y14.5M, 1982.  
2. CONTROLLING DIMENSION: INCH.  
3. DIMENSION L TO CENTER OF LEAD WHEN  
FORMED PARALLEL.  
6
4
3
B–  
1
INCHES  
MILLIMETERS  
DIM  
A
B
C
D
E
MIN  
MAX  
0.350  
0.260  
0.200  
0.020  
0.070  
0.014  
MIN  
8.13  
6.10  
2.93  
0.41  
1.02  
0.25  
MAX  
8.89  
6.60  
5.08  
0.50  
1.77  
0.36  
C
F 4 PL  
L
0.320  
0.240  
0.115  
0.016  
0.040  
0.010  
N
F
T–  
SEATING  
PLANE  
K
G
J
K
L
M
N
0.100 BSC  
2.54 BSC  
0.008  
0.100  
0.012  
0.150  
0.21  
2.54  
0.30  
3.81  
J 6 PL  
G
0.300 BSC  
7.62 BSC  
M
M
M
0.13 (0.005)  
T
B
A
M
0
15  
0
15  
E 6 PL  
0.015  
0.100  
0.38  
2.54  
D 6 PL  
M
M
M
0.13 (0.005)  
T
A
B
STYLE 1:  
PIN 1. ANODE  
2. CATHODE  
3. NC  
4. EMITTER  
5. COLLECTOR  
6. BASE  
THRU HOLE  
A–  
6
4
3
NOTES:  
B–  
1. DIMENSIONING AND TOLERANCING PER ANSI  
Y14.5M, 1982.  
2. CONTROLLING DIMENSION: INCH.  
1
INCHES  
MILLIMETERS  
DIM  
A
B
C
D
E
MIN  
MAX  
0.350  
0.260  
0.200  
0.020  
0.070  
0.014  
MIN  
8.13  
6.10  
2.93  
0.41  
1.02  
0.25  
MAX  
8.89  
6.60  
5.08  
0.50  
1.77  
0.36  
L
F 4 PL  
0.320  
0.240  
0.115  
0.016  
0.040  
0.010  
H
C
F
T–  
SEATING  
PLANE  
G
H
J
K
L
0.100 BSC  
2.54 BSC  
G
J
0.020  
0.008  
0.006  
0.320 BSC  
0.332  
0.025  
0.012  
0.035  
0.51  
0.20  
0.16  
8.13 BSC  
8.43  
0.63  
0.30  
0.88  
K 6 PL  
0.13 (0.005)  
M
E 6 PL  
M
M
M
T
B
A
D 6 PL  
S
0.390  
9.90  
M
M
0.13 (0.005)  
T
A
B
SURFACE MOUNT  
4N25 4N26 4N27 4N28  
NOTES:  
A–  
1. DIMENSIONING AND TOLERANCING PER ANSI  
Y14.5M, 1982.  
2. CONTROLLING DIMENSION: INCH.  
3. DIMENSION L TO CENTER OF LEAD WHEN  
FORMED PARALLEL.  
6
4
3
B–  
INCHES  
MILLIMETERS  
1
DIM  
A
B
C
D
E
MIN  
MAX  
0.350  
0.260  
0.200  
0.020  
0.070  
0.014  
MIN  
8.13  
6.10  
2.93  
0.41  
1.02  
0.25  
MAX  
8.89  
6.60  
5.08  
0.50  
1.77  
0.36  
0.320  
0.240  
0.115  
0.016  
0.040  
0.010  
L
N
F 4 PL  
F
C
G
J
K
L
0.100 BSC  
2.54 BSC  
0.008  
0.100  
0.400  
0.015  
0.012  
0.150  
0.425  
0.040  
0.21  
2.54  
0.30  
3.81  
T–  
SEATING  
PLANE  
10.16  
0.38  
10.80  
1.02  
N
G
J
K
D 6 PL  
0.13 (0.005)  
E 6 PL  
M
M
M
T
A
B
0.4" LEAD SPACING  
DISCLAIMER  
FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO  
ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION OR DESIGN. FAIRCHILD DOES NOT ASSUME  
ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN;  
NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS.  
LIFE SUPPORT POLICY  
FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES  
OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF FAIRCHILD SEMICONDUCTOR  
CORPORATION. As used herein:  
1. Life support devices or systems are devices or systems  
which, (a) are intended for surgical implant into the body,  
or (b) support or sustain life, and (c) whose failure to  
perform when properly used in accordance with  
instructions for use provided in the labeling, can be  
reasonably expected to result in a significant injury of the  
user.  
2. A critical component in any component of a life support  
device or system whose failure to perform can be  
reasonably expected to cause the failure of the life support  
device or system, or to affect its safety or effectiveness.  
www.fairchildsemi.com  
© 2000 Fairchild Semiconductor Corporation  
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