BZX84C43 - BZX84C51
350mW SURFACE MOUNT ZENER DIODE
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Features
Mechanical Data
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Planar Die Construction
350mW Power Dissipation
Zener Voltages from 43V - 51V
Ideally Suited for Automated Assembly Processes
Lead, Halogen and Antimony Free, RoHS Compliant
"Green" Device (Notes 3 and 6)
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Case: SOT-23
Case Material: Molded Plastic. UL Flammability Classification
Rating 94V-0
Moisture Sensitivity: Level 1 per J-STD-020D
Terminals: Solderable per MIL-STD-202, Method 208
Lead Free Plating (Matte Tin Finish annealed over Alloy 42
leadframe).
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Polarity: See Diagram
Marking Information: See Page 2
Ordering Information: See Page 2
Weight: 0.008 grams (approximate)
Top View
Device Schematic
Maximum Ratings @TA = 25°C unless otherwise specified
Characteristic
Symbol
Value
Unit
0.9
V
Forward Voltage
@ IF = 10mA
VF
Thermal Characteristics
Characteristic
(Note 1)
(Note 2)
Symbol
PD
PD
Value
300
350
Unit
mW
mW
Power Dissipation
Power Dissipation
Thermal Resistance, Junction to Ambient Air
Thermal Resistance, Junction to Ambient Air
Operating and Storage Temperature Range
(Note 1)
(Note 2)
417
°C/W
°C/W
°C
Rθ
Rθ
JA
357
JA
-65 to +150
TJ, TSTG
Electrical Characteristics @TA = 25°C unless otherwise specified
Typical
Temperature
Coefficient
@ IZT
Zener Voltage
Maximum Reverse
Current
Maximum Zener Impedance
(Note 4)
Range
(Note 5)
Type
Number
Type
Code
(Note 5)
mV/°C
VZ @ IZT
Nom (V) Min (V) Max (V)
IZT
(mA)
2.0
2.0
2.0
ZZT @ IZT
(Ω)
ZZK @ IZK
IR
(μA)
0.1
0.1
0.1
VR
(V)
30.1
32.9
35.7
Min
Max
(mA)
0.5
(Ω)
375
375
400
BZX84C43 Y15/KYF
BZX84C47 Y16/KYG
BZX84C51 Y17/KYH
43
47
51
40.0
44.0
48.0
46.0
50.0
54.0
150
170
180
10.0
10.0
10.0
12.0
12.0
12.0
0.5
0.5
Notes:
1. Device mounted on FR-4 PC board with recommended pad layout, which can be found on our website at
http://www.diodes.com/datasheets/ap02001.pdf.
2. Valid provided the terminals are kept at ambient temperature.
3. No purposefully added lead. Halogen and Antimony Free.
4. f = 1KHz.
5. Short duration pulse test used to minimize self-heating effect.
6. Product manufactured with Data Code V9 (week 33, 2008) and newer are built with Green Molding Compound. Product manufactured prior to Date
Code V9 are built with Non-Green Molding Compound and may contain Halogens or Sb2O3 Fire Retardants.
1 of 3
www.diodes.com
May 2008
© Diodes Incorporated
BZX84C43 - BZX84C51
Document number: DS30370 Rev. 6 - 2
