1SS400T1G
PACKAGE DIMENSIONS
SOD−523
CASE 502−01
ISSUE D
−X−
NOTES:
D
1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M,
1982.
−Y−
2. CONTROLLING DIMENSION: MILLIMETER.
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH
THICKNESS. MINIMUM LEAD THICKNESS IS THE MINIMUM
THICKNESS OF BASE MATERIAL.
E
1
2
MILLIMETERS
NOM
INCHES
NOM
0.024
DIM
A
b
c
D
E
H E
L
MIN
MAX
0.70
0.35
MIN
0.020
0.010
MAX
0.028
0.014
2X b
0.50
0.25
0.07
1.10
0.70
1.50
0.15
0.60
0.30
0.14
1.20
0.80
1.60
0.20
M
0.08 (0.003)
T X Y
0.012
0.20 0.0028 0.0055 0.0079
1.30
0.90
1.70
0.25
0.043
0.028
0.059
0.006
0.047
0.032
0.063
0.008
0.051
0.035
0.067
0.010
A
−T−
SEATING
PLANE
L
c
HE
SOLDERING FOOTPRINT*
1.40
0.0547
0.40
0.0157
0.40
0.0157
mm
inches
ǒ
Ǔ
SCALE 10:1
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
ON Semiconductor and
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“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
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