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2V7002W

型号:

2V7002W

描述:

小信号MOSFET 60 V 340毫安,单, N.Channel , SC.70[ Small Signal MOSFET 60 V, 340 mA, Single, N.Channel, SC.70 ]

品牌:

ONSEMI[ ONSEMI ]

页数:

5 页

PDF大小:

108 K

2N7002W, 2V7002W  
Small Signal MOSFET  
60 V, 340 mA, Single, NChannel, SC70  
Features  
ESD Protected  
Low R  
DS(on)  
http://onsemi.com  
Small Footprint Surface Mount Package  
These Devices are PbFree, Halogen Free/BFR Free and are RoHS  
V
R
MAX  
I MAX  
D
(BR)DSS  
DS(on)  
Compliant  
(Note 1)  
2V Prefix for Automotive and Other Applications Requiring Unique  
Site and Control Change Requirements; AECQ101 Qualified and  
PPAP Capable  
60 V  
1.6 W @ 10 V  
2.5 W @ 4.5 V  
340 mA  
Applications  
Low Side Load Switch  
Level Shift Circuits  
SIMPLIFIED SCHEMATIC  
DCDC Converter  
1
2
Gate  
Portable Applications i.e. DSC, PDA, Cell Phone, etc.  
3
Drain  
MAXIMUM RATINGS (T = 25°C unless otherwise stated)  
J
Rating  
DraintoSource Voltage  
GatetoSource Voltage  
Symbol  
Value  
60  
Unit  
V
Source  
V
DSS  
(Top View)  
V
GS  
20  
V
Drain Current (Note 1)  
Steady State  
I
D
mA  
MARKING DIAGRAM  
& PIN ASSIGNMENT  
Drain  
T = 25°C  
A
310  
220  
A
T = 85°C  
t < 5 s  
T = 25°C  
A
340  
240  
A
3
T = 85°C  
Power Dissipation (Note 1)  
Steady State  
P
mW  
D
280  
330  
71 MG  
SC70/SOT323  
CASE 419  
t < 5 s  
G
Pulsed Drain Current (t = 10 ms)  
I
1.4  
A
DM  
STYLE 8  
p
1
2
Operating Junction and Storage  
Temperature Range  
T , T  
55 to  
+150  
°C  
Gate  
Source  
J
STG  
71 = Device Code  
Source Current (Body Diode)  
I
250  
260  
mA  
S
M
= Date Code  
Lead Temperature for Soldering Purposes  
(1/8from case for 10 s)  
T
°C  
G
= PbFree Package  
L
(Note: Microdot may be in either location)  
GateSource ESD Rating  
(HBM, Method 3015)  
ESD  
900  
V
ORDERING INFORMATION  
Stresses exceeding Maximum Ratings may damage the device. Maximum  
Ratings are stress ratings only. Functional operation above the Recommended  
Operating Conditions is not implied. Extended exposure to stresses above the  
Recommended Operating Conditions may affect device reliability.  
Device  
Package  
Shipping  
2N7002WT1G  
SC70  
3000/Tape & Reel  
(PbFree)  
THERMAL CHARACTERISTICS  
2V7002WT1G  
SC70  
(PbFree)  
3000/Tape & Reel  
Characteristic  
Symbol  
Max  
Unit  
JunctiontoAmbient Steady State  
R
450  
°C/W  
q
JA  
(Note 1)  
†For information on tape and reel specifications,  
including part orientation and tape sizes, please  
refer to our Tape and Reel Packaging Specifications  
Brochure, BRD8011/D.  
JunctiontoAmbient t 5 s (Note 1)  
R
375  
q
JA  
1. Surfacemounted on FR4 board using 1 in sq pad size (Cu area = 1.127 in  
sq [1 oz] including traces)  
© Semiconductor Components Industries, LLC, 2012  
1
Publication Order Number:  
September, 2012 Rev. 5  
2N7002W/D  
 
2N7002W, 2V7002W  
ELECTRICAL CHARACTERISTICS (T = 25°C unless otherwise specified)  
J
Parameter  
Symbol  
Test Condition  
Min  
Typ  
Max  
Units  
OFF CHARACTERISTICS  
DraintoSource Breakdown Voltage  
V
V
GS  
= 0 V, I = 250 mA  
60  
V
(BR)DSS  
D
DraintoSource Breakdown Voltage  
Temperature Coefficient  
V
/T  
J
71  
mV/°C  
(BR)DSS  
Zero Gate Voltage Drain Current  
I
T = 25°C  
1.0  
15  
mA  
mA  
nA  
mA  
mA  
nA  
nA  
DSS  
J
V
V
= 0 V,  
= 60 V  
GS  
T = 150°C  
J
DS  
T = 25°C  
J
100  
10  
V
GS  
= 0 V,  
= 50 V  
V
DS  
T = 150°C  
J
GatetoSource Leakage Current  
I
V
= 0 V, V  
=
20 V  
10 V  
5.0 V  
10  
GSS  
DS  
DS  
DS  
GS  
GS  
GS  
V
= 0 V, V  
=
=
450  
150  
V
= 0 V, V  
ON CHARACTERISTICS (Note 2)  
Gate Threshold Voltage  
V
V
GS  
= V , I = 250 mA  
1.0  
2.5  
V
GS(TH)  
DS  
D
Negative Threshold Temperature  
Coefficient  
V
/T  
4.0  
mV/°C  
GS(TH)  
J
DraintoSource On Resistance  
R
V
= 10 V, I = 500 mA  
1.19  
1.33  
530  
1.6  
2.5  
W
DS(on)  
GS  
D
V
GS  
= 4.5 V, I = 200 mA  
D
Forward Transconductance  
CHARGES AND CAPACITANCES  
Input Capacitance  
g
FS  
V
= 5 V, I = 200 mA  
mS  
pF  
DS  
D
C
24.5  
4.2  
2.2  
0.7  
0.1  
0.3  
0.1  
ISS  
V
= 0 V, f = 1 MHz,  
GS  
Output Capacitance  
C
C
OSS  
RSS  
V
DS  
= 20 V  
Reverse Transfer Capacitance  
Total Gate Charge  
Q
nC  
ns  
V
G(TOT)  
Threshold Gate Charge  
GatetoSource Charge  
GatetoDrain Charge  
Q
G(TH)  
V
GS  
= 4.5 V, V = 10 V;  
DS  
I
D
= 200 mA  
Q
GS  
GD  
Q
SWITCHING CHARACTERISTICS, V = V (Note 3)  
GS  
TurnOn Delay Time  
Rise Time  
t
12.2  
9.0  
d(ON)  
t
r
V
I
= 10 V, V = 25 V,  
DD  
GS  
= 500 mA, R = 25 W  
TurnOff Delay Time  
Fall Time  
t
55.8  
29  
D
G
d(OFF)  
t
f
DRAINSOURCE DIODE CHARACTERISTICS  
Forward Diode Voltage  
V
T = 25°C  
J
0.8  
0.7  
1.2  
SD  
V
= 0 V,  
GS  
I
= 200 mA  
T = 85°C  
J
S
2. Pulse Test: pulse width 300 ms, duty cycle 2%  
3. Switching characteristics are independent of operating junction temperatures  
http://onsemi.com  
2
 
2N7002W, 2V7002W  
TYPICAL CHARACTERISTICS  
1.6  
1.2  
0.8  
1.2  
5.0 V  
4.5 V  
V
= 10 V  
GS  
9.0 V  
4.0 V  
8.0 V  
7.0 V  
6.0 V  
0.8  
3.5 V  
T = 25°C  
J
3.0 V  
2.5 V  
0.4  
0
0.4  
0
T = 125°C  
T = 55°C  
J
J
0
2
4
6
0
2
4
6
V
DS  
, DRAINTOSOURCE VOLTAGE (V)  
V
GS  
, GATETOSOURCE VOLTAGE (V)  
Figure 1. OnRegion Characteristics  
Figure 2. Transfer Characteristics  
3.2  
2.8  
2.4  
2.0  
1.6  
1.2  
0.8  
3.2  
2.8  
2.4  
2.0  
1.6  
1.2  
0.8  
V
GS  
= 4.5 V  
V
GS  
= 10 V  
T = 125°C  
J
T = 125°C  
J
T = 85°C  
J
T = 85°C  
J
T = 25°C  
J
T = 25°C  
J
T = 55°C  
J
T = 55°C  
J
0.4  
0
0.4  
0
0
0.2  
0.4  
0.6  
0.8  
1.0  
1.2  
0
0.2  
0.4  
0.6  
0.8  
1.0  
1.2  
I , DRAIN CURRENT (A)  
D
I , DRAIN CURRENT (A)  
D
Figure 3. OnResistance vs. Drain Current and  
Figure 4. OnResistance vs. Drain Current and  
Temperature  
Temperature  
2.4  
2.0  
1.6  
1.2  
2.2  
1.8  
1.4  
I
D
= 0.2 A  
I
= 500 mA  
D
V
GS  
= 4.5 V  
V
= 10 V  
GS  
I
D
= 200 mA  
1.0  
0.6  
0.8  
0.4  
2
4
6
8
10  
50 25  
0
25  
50  
75  
100  
125 150  
V
GS  
, GATETOSOURCE VOLTAGE (V)  
T , JUNCTION TEMPERATURE (°C)  
J
Figure 5. OnResistance vs. GatetoSource  
Figure 6. OnResistance Variation with  
Voltage  
Temperature  
http://onsemi.com  
3
2N7002W, 2V7002W  
TYPICAL CHARACTERISTICS  
30  
5
C
iss  
T = 25°C  
J
I
D
= 0.2 A  
4
3
2
20  
10  
0
T = 25°C  
J
V
GS  
= 0 V  
C
oss  
1
0
C
rss  
0
4
8
12  
16  
20  
0
0.2  
0.4  
0.6  
0.8  
GATETOSOURCE OR DRAINTOSOURCE VOLTAGE (V)  
Qg, TOTAL GATE CHARGE (nC)  
Figure 7. Capacitance Variation  
Figure 8. GatetoSource and  
DraintoSource Voltage vs. Total Charge  
1.0E6  
10  
1
V
GS  
= 0 V  
V
GS  
= 0 V  
T = 150°C  
J
1.0E7  
1.0E8  
1.0E9  
1.0E10  
T = 125°C  
J
T = 85°C  
J
T = 25°C  
J
T = 85°C  
J
0.1  
T = 25°C  
J
0.01  
0.4  
0.6  
0.8  
1.0  
1.2  
5
10 15 20 25 30 35 40 45 50 55 60  
, DRAINTOSOURCE VOLTAGE (V)  
V
SD  
, SOURCETODRAIN VOLTAGE (V)  
V
DS  
Figure 9. Diode Forward Voltage vs. Current  
Figure 10. DraintoSource Leakage Current  
vs. Voltage  
http://onsemi.com  
4
2N7002W, 2V7002W  
PACKAGE DIMENSIONS  
SC70 (SOT323)  
CASE 41904  
ISSUE M  
D
NOTES:  
e1  
1. DIMENSIONING AND TOLERANCING PER ANSI  
Y14.5M, 1982.  
2. CONTROLLING DIMENSION: INCH.  
3
MILLIMETERS  
INCHES  
NOM  
0.035  
0.002  
0.028 REF  
0.014  
0.007  
0.083  
0.049  
0.051  
E
H
E
DIM  
MIN  
0.80  
0.00  
NOM  
0.90  
0.05  
MAX  
1.00  
0.10  
MIN  
0.032  
0.000  
MAX  
0.040  
0.004  
1
2
A
A1  
A2  
b
c
D
0.7 REF  
0.35  
0.18  
2.10  
1.24  
0.30  
0.10  
1.80  
1.15  
1.20  
0.40  
0.25  
2.20  
1.35  
1.40  
0.012  
0.004  
0.071  
0.045  
0.047  
0.016  
0.010  
0.087  
0.053  
0.055  
b
e
E
e
1.30  
0.65 BSC  
0.425 REF  
2.10  
0.026 BSC  
0.017 REF  
0.083  
e1  
L
c
H
2.00  
2.40  
0.079  
0.095  
E
A2  
A
STYLE 8:  
PIN 1. GATE  
2. SOURCE  
3. DRAIN  
0.05 (0.002)  
L
A1  
SOLDERING FOOTPRINT*  
0.65  
0.025  
0.65  
0.025  
1.9  
0.075  
0.9  
0.035  
0.7  
0.028  
mm  
inches  
ǒ
Ǔ
SCALE 10:1  
*For additional information on our PbFree strategy and soldering  
details, please download the ON Semiconductor Soldering and  
Mounting Techniques Reference Manual, SOLDERRM/D.  
ON Semiconductor and  
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC owns the rights to a number of patents, trademarks,  
copyrights, trade secrets, and other intellectual property. A listing of SCILLC’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/PatentMarking.pdf. SCILLC  
reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any  
particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without  
limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications  
and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC  
does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for  
surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where  
personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and  
its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly,  
any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture  
of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.  
PUBLICATION ORDERING INFORMATION  
LITERATURE FULFILLMENT:  
N. American Technical Support: 8002829855 Toll Free  
USA/Canada  
Europe, Middle East and Africa Technical Support:  
Phone: 421 33 790 2910  
Japan Customer Focus Center  
Phone: 81358171050  
ON Semiconductor Website: www.onsemi.com  
Order Literature: http://www.onsemi.com/orderlit  
Literature Distribution Center for ON Semiconductor  
P.O. Box 5163, Denver, Colorado 80217 USA  
Phone: 3036752175 or 8003443860 Toll Free USA/Canada  
Fax: 3036752176 or 8003443867 Toll Free USA/Canada  
Email: orderlit@onsemi.com  
For additional information, please contact your local  
Sales Representative  
2N7002W/D  
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