F-213
QSS–075–01–F–D–A
QSS–050–01–F–D–A
®
QSS–025–01–L–D–A
(0,635 mm) .025"
QSS SERIES
HIGH SPEED GROUND PLANE SOCKET
Integral metal plane
for power or ground
Board Mates:
QTS
SPECIFICATIONS
For complete specifications and
recommended PCB layouts see
www.samtec.com?QSS
Cable Mates:
SQCD
Polarized
Insulator Material:
Liquid Crystal Polymer
Contact Material:
Phosphor Bronze
Plating:
®
Au or Sn over
50µ" (1,27 µm) Ni
Current Rating:
Contact: 1.1A per contact
@ 30°C Temperature Rise
Ground Plane: 7.8A per ground
plane@ 30°C Temperature Rise
Operating Temp:
-55°C to +125°C
Voltage Rating:
285 VAC
Alignment
Pin
QSS/QTS
Type
Rated @ 3dB Insertion Loss*
5 mm Stack Height
Single-Ended Signaling
Differential Pair Signaling
–D
–D
9 GHz / 18 Gbps
8.5 GHz / 17 Gbps
8.5 GHz / 17 Gbps
TM
Blade & Beam
Design
Max Cycles:
Differential Pair Signaling –DP
*Performance data includes effects of a non-optimized PCB.
100
RoHS Compliant:
Yes
EXTENDED LIFE PRODUCT
Performance data for other stack heights and complete
test data available at www.samtec.com?QSS or contact
sig@samtec.com
10 year Mixed Flowing Gas with 50µ" Gold
Call Samtec for maximum cycles mated with QTS
Processing:
Lead–Free Solderable:
Yes
SMT Lead Coplanarity:
(0,10 mm) .004" max (025-050)
(0,15 mm) .006" max (075)
Board Stacking:
For applications requiring more
than two connectors per board
contact ipg@samtec.com
NO. OF POSITIONS
PLATING
OPTION
OTHER
OPTION
QSS
01
D
A
PER ROW
–GP
APPLICATION
= Guide Holes
for mating
–F
–025, –050, –075
SPECIFIC OPTION
= Gold Flash on Signal Pins and
Ground Plane, MatteTin on tails
(50 total positions per bank)
with QTS-RA
• 11 mm & 16 mm
stack height
–K
= (8,25 mm)
.325" DIA
Polyimide Film
Pick &
–L
(Caution: Some automatic
placement/inspection
machines may have
component height
restrictions. Please consult
machinery specifications.)
= 10µ" (0,25 µm) Gold on Signal Pins
and Ground Plane, MatteTin on tails
(No. of Positions per Row/25) x
(20,00) .7875 + (1,27) .050
(20,00) .7875
–C*
Place Pad
= Electro-Polished Selective
02
01
50µ" (1,27 µm) min Au over 150µ" (3,81 µm)
Ni on Signal Pins in contact area,
10µ" (0,25 µm) min Au over 50µ" (1,27 µm) Ni
on Ground Plane in contact area, MatteTin
over 50µ" (1,27 µm) min Ni on all solder tails
–TR
= Tape and
Reel
• 30µ" (0,76 µm) Gold
(7,49)
.295
• Differential Pair and
“Partitionable” (combine
differential & single-ended
banks in same connector)
available.
• 100 & 125 positions per row
• Edge Mount
(0,635)
.025
(0,15)
.006
(3,63)
.143
(7,24)
.285
(0,76)
.030
• –LS2 Locking screw hole
for QTS–RA–LS2
Call Samtec.
(0,89)
.035
DIA
(No. of Positions per Row/25) x
(20,00) .7875 + (10,90) .429
ALSO AVAILABLE
02
01
• Board spacing
standoffs
(See SO Series)
(3,56)
.140
DIA
*Note: –C Plating passes
10 year MFG testing
(No. of Positions per Row/25) x
(20,00) .7875 + (5,72) .225
Note: Some lengths, styles
and options are non-standard,
non-returnable.
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