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IXBT16N170AHV

型号:

IXBT16N170AHV

品牌:

IXYS[ IXYS CORPORATION ]

页数:

2 页

PDF大小:

54 K

Advanced Technical Information  
High Voltage, High Gain  
BIMOSFETTM Monolithic  
BipolarMOSTransistor  
IXBH 16N170A  
IXBT 16N170A  
VCES = 1700 V  
IC25 = 16 A  
VCE(sat) = 6.0 V  
tfi(typ)  
= 50 ns  
Symbol  
TestConditions  
MaximumRatings  
TO-268  
(IXBT)  
VCES  
VCGR  
TJ = 25°C to 150°C  
1700  
1700  
V
V
TJ = 25°C to 150°C; RGE = 1 MW  
G
E
VGES  
VGEM  
Continuous  
Transient  
±20  
±30  
V
V
IC25  
IC90  
ICM  
TC = 25°C  
16  
10  
40  
A
A
A
TO-247 AD (IXBH)  
TC = 90°C  
TC = 25°C, 1 ms  
SSOA  
(RBSOA)  
VGE = 15 V, TVJ = 125°C, RG = 33 W  
Clampedinductiveload  
ICM  
VCES  
=
=
40  
1350  
A
V
TAB)  
G
C
E
tSC  
(SCSOA)  
VGE = 15 V, VCES = 1200V, TJ = 125°C  
RG = 33 W non repetitive  
10  
ms  
G = Gate,  
E = Emitter,  
C = Collector,  
TAB = Collector  
PC  
TC = 25°C  
150  
W
TJ  
-55 ... +150  
150  
°C  
°C  
°C  
Features  
TJM  
Tstg  
• Monolithicfastreversediode  
• HighBlockingVoltage  
-55 ... +150  
• JEDEC TO-268 surface mount and  
JEDEC TO-247 AD packages  
Maximum Lead temperature for soldering  
1.6 mm (0.062 in.) from case for 10 s  
Maximum tab temperature for soldering SMD devices for 10 s  
300  
260  
°C  
°C  
• Low switching losses  
• Highcurrenthandlingcapability  
• MOS Gate turn-on  
- drive simplicity  
• Molding epoxies meet UL94V-0  
flammabilityclassification  
Md  
Mountingtorque(M3)(TO-247)  
1.13/10 Nm/lb.in.  
Weight  
TO-247  
TO-268  
6
4
g
g
Applications  
Symbol  
TestConditions  
CharacteristicValues  
(TJ = 25°C, unless otherwise specified)  
min. typ. max.  
• AC motor speed control  
• Uninterruptiblepowersupplies(UPS)  
• Switched-modeandresonant-mode  
powersupplies  
BVCES  
VGE(th)  
IC = 250 mA, VGE = 0 V  
IC = 250 mA, VCE = VGE  
1700  
2.5  
V
V
5.5  
• Capacitor discharge circuits  
ICES  
VCE = 0.8 VCES  
VGE = 0 V; Note 1  
50 mA  
1.5 mA  
Advantages  
TJ = 125°C  
• Lower conduction losses than MOSFETs  
• High power density  
IGES  
VCE = 0 V, VGE = ±20 V  
±100 nA  
• Suitableforsurfacemounting  
• Easy to mount with 1 screw,  
(isolatedmountingscrewhole)  
VCE(sat)  
IC = IC90, VGE = 15 V  
Note 2  
6.0  
V
V
TJ = 125°C  
5.0  
IXYS reserves the right to change limits, test conditions, and dimensions.  
© 2000 IXYS All rights reserved  
98707(02/23/00)  
1 - 2  
IXBH 16N170A  
IXBT 16N170A  
Symbol  
gfs  
TestConditions  
CharacteristicValues  
(TJ = 25°C, unless otherwise specified)  
min. typ. max.  
TO-247 AD Outline  
IC = IC90; VCE = 10 V,  
8
12.5  
S
Pulse test, t £ 300 ms, duty cycle £ 2 %  
Cies  
Coes  
Cres  
1400  
90  
pF  
pF  
pF  
VCE = 25 V, VGE = 0 V, f = 1 MHz  
31  
Qg  
65  
13  
22  
nC  
nC  
nC  
Qge  
Qgc  
IC = IC90, VGE = 15 V, VCE = 0.5 VCES  
Inductive load, TJ = 25°C  
Dim. Millimeter  
Inches  
td(on)  
tri  
td(off)  
tfi  
15  
25  
ns  
ns  
Min. Max. Min. Max.  
IC = IC90, VGE = 15 V  
VCE = 0.8 VCES, RG = Roff = 10 W  
A
B
19.81 20.32 0.780 0.800  
20.80 21.46 0.819 0.845  
160  
50  
250 ns  
100 ns  
2.5 mJ  
Remarks: Switching times may  
increase for VCE (Clamp) > 0.8 • VCES  
higher TJ or increased RG  
C
D
15.75 16.26 0.610 0.640  
3.55 3.65 0.140 0.144  
,
Eoff  
1.2  
E
F
4.32 5.49 0.170 0.216  
5.4  
6.2 0.212 0.244  
td(on)  
tri  
15  
28  
ns  
ns  
mJ  
ns  
G
H
1.65 2.13 0.065 0.084  
Inductive load, TJ = 125°C  
IC = IC90, VGE = 15 V  
-
4.5  
-
0.177  
J
K
1.0  
1.4 0.040 0.055  
Eon  
td(off)  
tfi  
2.0  
220  
150  
10.8 11.0 0.426 0.433  
VCE = 0.8 VCES, RG = Roff = 10 W  
L
M
4.7  
0.4  
5.3 0.185 0.209  
0.8 0.016 0.031  
Remarks: Switching times may  
increase for VCE (Clamp) > 0.8 • VCES  
higher TJ or increased RG  
ns  
,
N
1.5 2.49 0.087 0.102  
Eoff  
2.6  
mJ  
TO-268AA (D3 PAK)  
RthJC  
RthCK  
0.83 K/W  
K/W  
(TO-247)  
0.25  
ReverseDiode  
CharacteristicValues  
(TJ = 25°C, unless otherwise specified)  
Symbol  
VF  
TestConditions  
min. typ. max.  
IF = IC90, VGE = 0 V, Pulse test,  
< 300 us, duty cycle d < 2%  
5.0  
V
t
IRM  
trr  
IF = IC90, VGE = 0 V, -diF/dt = 50 A/us  
vR = 100V  
10  
360  
A
ns  
Notes:  
Dim.  
Millimeter  
Min. Max.  
Inches  
Min. Max.  
1. Device must be heatsunk for high  
temperatureleakagecurrent  
measurements to avoid thermal  
runaway.  
Min. Recommended Footprint  
A
A1  
A2  
4.9  
2.7  
.02  
5.1  
2.9  
.25  
.193 .201  
.106 .114  
.001 .010  
b
b2  
C
1.15  
1.9  
.4  
1.45  
2.1  
.65  
.045 .057  
2. Pulse test, t £ 300 ms, duty cycle £ 2 %.  
.75  
.83  
.016 .026  
D
E
E1  
13.80 14.00  
15.85 16.05  
.543 .551  
.624 .632  
.524 .535  
13.3  
5.45 BSC  
18.70 19.10  
13.6  
e
H
L
.215 BSC  
.736 .752  
.094 .106  
2.40  
2.70  
L1  
L2  
L3  
L4  
1.20  
1.00  
0.25 BSC  
1.40  
1.15  
.047 .055  
.039 .045  
.010 BSC  
3.80  
4.10  
.150 .161  
IXYS MOSFETS and IGBTs are covered by one or more of the following U.S. patents:  
© 2000 IXYS All rights reserved  
2 - 2  
4,835,592  
4,850,072  
4,881,106  
4,931,844  
5,017,508  
5,034,796  
5,049,961  
5,063,307  
5,187,117  
5,237,481  
5,486,715  
5,381,025  
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