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HYS64D128021EBDL-6-B

型号:

HYS64D128021EBDL-6-B

品牌:

QIMONDA[ QIMONDA AG ]

页数:

28 页

PDF大小:

781 K

Data Sheet, Rev. 1.0, Jul. 2004  
HYS64D128021[G/H/E]BDL–5–B  
HYS64D128021[G/H/E]BDL–6–B  
200-Pin Small Outline Dual-In-Line Memory Modules  
SO-DIMM  
DDR SDRAM  
Memory Products  
N e v e r s t o p t h i n k i n g .  
Edition 2004-07  
Published by Infineon Technologies AG,  
St.-Martin-Strasse 53,  
81669 München, Germany  
© Infineon Technologies AG 2004.  
All Rights Reserved.  
Attention please!  
The information herein is given to describe certain components and shall not be considered as a guarantee of  
characteristics.  
Terms of delivery and rights to technical change reserved.  
We hereby disclaim any and all warranties, including but not limited to warranties of non-infringement, regarding  
circuits, descriptions and charts stated herein.  
Information  
For further information on technology, delivery terms and conditions and prices please contact your nearest  
Infineon Technologies Office (www.infineon.com).  
Warnings  
Due to technical requirements components may contain dangerous substances. For information on the types in  
question please contact your nearest Infineon Technologies Office.  
Infineon Technologies Components may only be used in life-support devices or systems with the express written  
approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure  
of that life-support device or system, or to affect the safety or effectiveness of that device or system. Life support  
devices or systems are intended to be implanted in the human body, or to support and/or maintain and sustain  
and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may  
be endangered.  
Data Sheet, Rev. 1.0, Jul. 2004  
HYS64D128021[G/H/E]BDL–5–B  
HYS64D128021[G/H/E]BDL–6–B  
200-Pin Small Outline Dual-In-Line Memory Modules  
SO-DIMM  
DDR SDRAM  
Memory Products  
N e v e r s t o p t h i n k i n g .  
HYS64D128021[G/H/E]BDL–5–B, HYS64D128021[G/H/E]BDL–6–B  
Revision History:  
Rev. 1.0  
2004-07  
Previous Version:  
Rev. 0.5  
2003-12  
Page  
8,13,7,27  
17  
Subjects (major changes since last revision)  
editorial change  
Update IDD Values  
We Listen to Your Comments  
Any information within this document that you feel is wrong, unclear or missing at all?  
Your feedback will help us to continuously improve the quality of this document.  
Please send your proposal (including a reference to this document) to:  
techdoc.mp@infineon.com  
Template: mp_a4_v2.0_2003-06-06.fm  
HYS64D128021[G/H/E]BDL–[5/6]–B  
Small Outline DDR SDRAM Modules  
Table of Contents  
1
1.1  
1.2  
Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6  
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6  
Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6  
2
Pin Configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8  
3
Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14  
Operating Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14  
Current Specification and Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16  
AC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18  
3.1  
3.2  
3.3  
4
5
SPD Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21  
Package Outlines . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27  
Data Sheet  
5
Rev. 1.0, 2004-07  
200-Pin Small Outline Dual-In-Line Memory Modules  
SO-DIMM  
HYS64D128021[G/H/E]BDL–5–B  
HYS64D128021[G/H/E]BDL–6–B  
1
Overview  
1.1  
Features  
Non-parity 200-Pin Small Outline Dual-In-Line Memory Modules  
Two ranks 128M × 64 organization  
Built with 512 Mbit DDR SDRAMs dies in P–TFBGA–60 package  
JEDEC standard Double Data Rate Synchronous DRAMs (DDR SDRAM)  
Single +2.5 V (± 0.2 V) power supply and +2.6 V (± 0.1 V) power supply for DDR400  
Programmable CAS Latency, Burst Length, and Wrap Sequence (Sequential & Interleave)  
Auto Refresh (CBR) and Self Refresh  
All inputs and outputs SSTL_2 compatible  
Serial Presence Detect with E2PROM  
Jedec standard form factor: 67.60 mm × 31.75 mm × 3.80 mm  
Gold plated contacts  
Table 1  
Performance  
Part Number Speed Code  
–5  
6  
Unit  
Speed Grade  
Component  
Module  
@CL3  
DDR400B  
PC3200–3033  
200  
DDR333B  
PC2700–2533  
166  
max. Clock Frequency  
fCK3  
MHz  
MHz  
MHz  
@CL2.5  
@CL2  
fCK2.5  
fCK2  
166  
166  
133  
133  
1.2  
Description  
The HYS64D128021[G/H/E]BDL–5–B and HYS64D128021[G/H/E]BDL–6–B are industry standard 200-Pin Small  
Outline Dual-In-Line Memory Modules (SO-DIMMs) organized as 128M × 64. The memory array is designed with  
Double Data Rate Synchronous DRAMs (DDR SDRAM). A variety of decoupling capacitors are mounted on the  
PC board. The DIMMs feature serial presence detect based on a serial E2PROM device using the 2-pin I2C  
protocol. The first 128 bytes are programmed with configuration data and the second 128 bytes are available to  
the customer  
Data Sheet  
6
Rev. 1.0, 2004-07  
HYS64D128021[G/H/E]BDL–[5/6]–B  
Small Outline DDR SDRAM Modules  
Overview  
Table 2  
Ordering Information for Lead-Free Products  
Product Type2)  
Compliance Code  
PC3200S–3033–1–Z  
PC2700S–2533–0–Z  
Description  
SDRAM Technology  
512 MBit (×8)  
PC3200 (CL=3.0)  
HYS64D128021GBDL–5–B  
PC2700 (CL=2.5)  
two ranks 1 GB SO-DIMM  
two ranks 1 GB SO-DIMM  
HYS64D128021GBDL–6–B  
512 MBit (×8)  
Table 3  
Odering Information for Lead-Free(RoHS1) Compliant Products)  
Product Type2)  
Compliance Code  
Description  
SDRAM Technology  
PC3200 (CL=3.0)  
HYS64D128021HBDL–5–B  
HYS64D128021EBDL–5–B  
PC2700 (CL=2.5)  
PC3200S–3033–1–Z  
PC3200S–3033–1–Z  
two ranks 1 GB SO-DIMM  
two ranks 1 GB SO-DIMM  
512 MBit (×8)  
512 MBit (×8)  
HYS64D128021HBDL–6–B  
HYS64D128021EBDL–6–B  
PC2700S–2533–0–Z  
PC2700S–2533–0–Z  
two ranks 1 GB SO-DIMM  
two ranks 1 GB SO-DIMM  
512 MBit (×8)  
512 MBit (×8)  
1) RoHS: Restriction of the use of certain hazardous substances in electrical and electronic equipment as defined in the  
directive 2002/95/EC issued by the European Parliament and of the Council of 27 January 2003. These substances include  
mercury, lead, cadmium, hexavalent chromium, polybrominated biphenyls and polybrominated biphenyl ethers.  
2) All product types end with a place code designating the silicon-die revision. Reference information available on request.  
Example: HYS64D128021GBDL–5–B, indicating Rev.B die are used for SDRAM components.The Compliance Code is  
printed on the module labels and describes the speed sort (for example “PC3200”), the latencies (for example “30330”  
means CAS latency of 3.0 clocks, Row-Column-Delay (RCD) latency of 3 clocks and Row Precharge latency of 3 clocks),  
JEDEC SPD code definition version 0, and the Raw Card used for this module.  
Data Sheet  
7
Rev. 1.0, 2004-07  
HYS64D128021[G/H/E]BDL–[5/6]–B  
Small Outline DDR SDRAM Modules  
Pin Configuration  
2
Pin Configuration  
The pin configuration of the Unbuffered Small Outline Table 4  
DDR SDRAM DIMM is listed by function in Table 4  
(200 pins). The abbreviations used in columns Pin and  
Buffer Type are explained in Table 5 and Table 6  
Pin Configuration of SO-DIMM (cont’d)  
Pin# Name Pin  
Buffer Function  
Type Type  
112  
111  
110  
109  
108  
107  
106  
105  
102  
101  
115  
A0  
I
I
I
I
I
I
I
I
I
I
I
I
I
I
SSTL Address Bus 11:0  
respectively. The pin numbering is depicted in  
Figure 1.  
A1  
SSTL  
A2  
SSTL  
Table 4  
Pin Configuration of SO-DIMM  
A3  
SSTL  
Pin# Name Pin  
Buffer Function  
A4  
SSTL  
Type Type  
A5  
SSTL  
Clock Signals  
A6  
SSTL  
35  
CK0  
CK1  
CK2  
I
I
I
SSTL Clock Signal  
SSTL Clock Signal  
SSTL Clock Signal  
A7  
SSTL  
160  
89  
A8  
SSTL  
A9  
SSTL  
Note:ECC  
module  
type  
A10  
AP  
A11  
A12  
SSTL  
SSTL  
NC  
NC  
Note:non-ECC type  
module  
100  
99  
SSTL  
SSTL Address Signal 12  
37  
CK0  
CK1  
CK2  
I
I
I
SSTL Complement Clock  
SSTL Complement Clock  
SSTL Complement Clock  
Note:Module based  
on 256 Mbit or  
larger dies  
158  
91  
Note:ECC  
module  
type  
NC  
NC  
I
Note:128 Mbit based  
module  
NC  
NC  
Note:non-ECC type  
module  
123  
A13  
SSTL Address Signal 13  
Note:1 Gbit  
module  
based  
96  
95  
CKE0  
CKE1  
I
I
SSTL Clock Enable Rank 0  
SSTL Clock Enable Rank 1  
Note:2-rank module  
NC  
NC  
Note:Module based  
on 512 Mbit or  
smaller dies  
NC  
NC  
Note:1-rank module  
Data Signals  
Control Signals  
5
DQ0  
DQ1  
DQ2  
DQ3  
DQ4  
DQ5  
DQ6  
DQ7  
DQ8  
DQ9  
I/O  
I/O  
I/O  
I/O  
I/O  
I/O  
I/O  
I/O  
I/O  
I/O  
SSTL Data Bus 63:0  
121  
122  
S0  
S1  
I
I
SSTL Chip Select Rank 0  
SSTL Chip Select Rank 1  
Note:2-ranks module  
7
SSTL  
SSTL  
SSTL  
SSTL  
SSTL  
SSTL  
SSTL  
SSTL  
SSTL  
SSTL  
SSTL  
SSTL  
SSTL  
13  
17  
6
NC  
NC  
I
Note:1-rank module  
118  
120  
119  
RAS  
SSTL Row Address  
Strobe  
8
CAS  
I
SSTL Column Address  
14  
18  
19  
23  
29  
31  
20  
24  
Strobe  
WE  
I
SSTL Write Enable  
Address Signals  
117  
116  
BA0  
BA1  
I
I
SSTL Bank Address Bus  
DQ10 I/O  
DQ11 I/O  
DQ12 I/O  
DQ13 I/O  
1:0  
SSTL  
Data Sheet  
8
Rev. 1.0, 2004-07  
HYS64D128021[G/H/E]BDL–[5/6]–B  
Small Outline DDR SDRAM Modules  
Pin Configuration  
Table 4  
Pin# Name Pin  
Type Type  
Pin Configuration of SO-DIMM (cont’d)  
Table 4  
Pin Configuration of SO-DIMM (cont’d)  
Buffer Function  
Pin# Name Pin  
Buffer Function  
Type Type  
30  
DQ14 I/O  
DQ15 I/O  
DQ16 I/O  
DQ17 I/O  
DQ18 I/O  
DQ19 I/O  
DQ20 I/O  
DQ21 I/O  
DQ22 I/O  
DQ23 I/O  
DQ24 I/O  
DQ25 I/O  
DQ26 I/O  
DQ27 I/O  
DQ28 I/O  
DQ29 I/O  
DQ30 I/O  
DQ31 I/O  
DQ32 I/O  
DQ33 I/O  
DQ34 I/O  
DQ35 I/O  
DQ36 I/O  
DQ37 I/O  
DQ38 I/O  
DQ39 I/O  
DQ40 I/O  
DQ41 I/O  
DQ42 I/O  
DQ43 I/O  
DQ44 I/O  
DQ45 I/O  
DQ46 I/O  
DQ47 I/O  
DQ48 I/O  
DQ49 I/O  
DQ50 I/O  
DQ51 I/O  
DQ52 I/O  
DQ53 I/O  
SSTL Data Bus 63:0  
SSTL  
SSTL  
SSTL  
SSTL  
SSTL  
SSTL  
SSTL  
SSTL  
SSTL  
SSTL  
SSTL  
SSTL  
SSTL  
SSTL  
SSTL  
SSTL  
SSTL  
SSTL  
SSTL  
SSTL  
SSTL  
SSTL  
SSTL  
SSTL  
SSTL  
SSTL  
SSTL  
SSTL  
SSTL  
SSTL  
SSTL  
SSTL  
SSTL  
SSTL  
SSTL  
SSTL  
SSTL  
SSTL  
SSTL  
172  
176  
177  
181  
187  
189  
178  
182  
188  
190  
71  
DQ54 I/O  
DQ55 I/O  
DQ56 I/O  
DQ57 I/O  
DQ58 I/O  
DQ59 I/O  
DQ60 I/O  
DQ61 I/O  
DQ62 I/O  
DQ63 I/O  
SSTL Data Bus 63:0  
32  
SSTL  
41  
SSTL  
43  
SSTL  
49  
SSTL  
53  
SSTL  
42  
SSTL  
44  
SSTL  
50  
SSTL  
54  
SSTL  
55  
CB0  
I/O  
SSTL Check Bit 0  
Note:ECC  
module  
type  
type  
type  
type  
type  
type  
59  
65  
NC  
NC  
I/O  
Note:Non-ECC  
module  
67  
56  
73  
79  
83  
72  
74  
CB1  
SSTL Check Bit 1  
60  
Note:ECC  
module  
66  
68  
NC  
NC  
I/O  
Note:Non-ECC  
module  
127  
129  
135  
139  
128  
130  
136  
140  
141  
145  
151  
153  
142  
146  
152  
154  
163  
165  
171  
175  
164  
166  
CB2  
SSTL Check Bit 2  
Note:ECC  
module  
NC  
NC  
I/O  
Note:Non-ECC  
module  
CB3  
SSTL Check Bit 3  
Note:ECC  
module  
NC  
NC  
I/O  
Note:Non-ECC  
module  
CB4  
SSTL Check Bit 4  
Note:ECC  
module  
NC  
NC  
I/O  
Note:Non-ECC  
module  
CB5  
SSTL Check Bit 5  
Note:ECC  
module  
NC  
NC  
Note:Non-ECC  
module  
Data Sheet  
9
Rev. 1.0, 2004-07  
HYS64D128021[G/H/E]BDL–[5/6]–B  
Small Outline DDR SDRAM Modules  
Pin Configuration  
Table 4  
Pin# Name Pin  
Type Type  
Pin Configuration of SO-DIMM (cont’d)  
Table 4  
Pin Configuration of SO-DIMM (cont’d)  
Buffer Function  
Pin# Name Pin  
Type Type  
Power Supplies  
Buffer Function  
80  
CB6  
I/O  
SSTL Check Bit 6  
Note:ECC  
module  
type  
type  
1,2  
VREF  
AI  
I/O Reference  
Voltage  
NC  
NC  
I/O  
Note:Non-ECC  
module  
197  
VDDSPD PWR –  
EEPROM Power  
Supply  
84  
CB7  
SSTL Check Bit 7  
9,10, VDD  
21,  
22,  
33,  
34,  
PWR –  
Power Supply  
Note:ECC  
module  
NC  
NC  
Note:Non-ECC  
module  
36,  
45,  
11  
DQS0 I/O  
DQS1 I/O  
DQS2 I/O  
DQS3 I/O  
DQS4 I/O  
DQS5 I/O  
DQS6 I/O  
DQS7 I/O  
DQS8 I/O  
SSTL Data Strobes 7:0  
46,  
57,  
58,  
69,  
70,  
81,  
82,  
92,  
Note:See  
diagram  
block  
for  
25  
SSTL  
SSTL  
SSTL  
SSTL  
SSTL  
SSTL  
SSTL  
47  
corresponding  
DQ signals  
61  
133  
147  
169  
183  
77  
93,  
94,  
SSTL Data Strobe 8  
113,  
114,  
131,  
132,  
143,  
144,  
155,  
156,  
157,  
167,  
168,  
179,  
180,  
191,  
192  
Note:ECC  
module  
type  
NC  
NC  
Note:Non-ECC  
module  
12  
DM0  
DM1  
DM2  
DM3  
DM4  
DM5  
DM6  
DM7  
DM8  
I
I
I
I
I
I
I
I
I
SSTL Data Mask 7:0  
26  
SSTL  
48  
SSTL  
62  
SSTL  
134  
148  
170  
184  
78  
SSTL  
SSTL  
SSTL  
SSTL  
SSTL Data Mask 8  
Note:ECC  
module  
type  
NC  
NC  
Note:Non-ECC  
module  
EEPROM  
195  
193  
194  
196  
198  
SCL  
I
CMOS Serial Bus Clock  
OD Serial Bus Data  
SDA  
SA0  
SA1  
SA2  
I/O  
I
I
I
CMOS Slave Address  
Select Bus 2:0  
CMOS  
CMOS  
Data Sheet  
10  
Rev. 1.0, 2004-07  
HYS64D128021[G/H/E]BDL–[5/6]–B  
Small Outline DDR SDRAM Modules  
Pin Configuration  
Table 4  
Pin Configuration of SO-DIMM (cont’d)  
Table 4  
Pin Configuration of SO-DIMM (cont’d)  
Pin# Name Pin Buffer Function  
Type Type  
Pin# Name Pin Buffer Function  
Type Type  
3,4, VSS  
15,  
16,  
27,  
28,  
GND  
Ground Plane  
85,  
86,  
97,  
98,  
124,  
200  
NC  
NC  
Not connected  
Note:Pins  
not  
connected on  
Infineon  
DIMMs  
SO  
38,  
39,  
40,  
51,  
52,  
63,  
64,  
Table 5  
Abbreviations for Pin Type  
Abbreviation Description  
I
Standard input-only pin. Digital levels.  
75,  
76,  
87,  
88,  
O
Output. Digital levels.  
I/O is a bidirectional input/output signal.  
Input. Analog levels.  
Power  
I/O  
AI  
PWR  
GND  
NC  
90,  
Ground  
103,  
104,  
125,  
126,  
137,  
138,  
149,  
150,  
159,  
161,  
162,  
173,  
174,  
185,  
186  
Not Connected  
Table 6  
Abbreviations for Buffer Type  
Abbreviation Description  
SSTL  
Serial Stub Terminated Logic (SSTL2)  
LV-CMOS  
CMOS  
OD  
Low Voltage CMOS  
CMOS Levels  
Open Drain. The corresponding pin has 2  
operational states, active low and tristate,  
and allows multiple devices to share as a  
wire-OR.  
Other Pins  
199 VDDID  
O
OD  
VDD Identification  
Note:Pin in tristate,  
indicating VDD  
and VDDQ nets  
connected on  
PCB  
Data Sheet  
11  
Rev. 1.0, 2004-07  
HYS64D128021[G/H/E]BDL–[5/6]–B  
Small Outline DDR SDRAM Modules  
Pin Configuration  
VREF - Pin 001  
DQ0 - Pin 005  
Pin 002 -  
Pin 006 -  
Pin 010 -  
Pin 014 -  
Pin 018 -  
Pin 022 -  
Pin 026 -  
Pin 030 -  
Pin 034 -  
VREF  
DQ4  
VDD  
DQ6  
DQ7  
VDD  
DM1  
DQ14  
VDD  
VSS  
V
SS  
- Pin 003  
Pin 004 -  
DQ1 - Pin 007  
DQS0 - Pin 011  
VSS  
Pin 008 - DQ6  
Pin 012 - DM0  
VDD - Pin 009  
DQ2 - Pin 013  
DQ3 - Pin 017  
V
- Pin 015  
Pin 016 -  
SS  
DQ8 - Pin 019  
DQ09 - Pin 023  
Pin 020 - DQ12  
Pin 024 - DQ13  
VDD - Pin 021  
DQS1 - Pin 025  
DQ10 - Pin 029  
V
V
SS - Pin 027  
Pin 028 -  
SS  
DQ11 - Pin 031  
CK0 - Pin 035  
Pin 032 - DQ15  
VDD - Pin 033  
V
Pin 036 -  
Pin 040 -  
V
VDD  
CK0 - Pin 037  
Pin 038 - VSS  
SS - Pin 039  
SS  
DQ16 - Pin 041  
VDD - Pin 045  
DQ18 - Pin 049  
DQ19 - Pin 053  
Pin 042 - DQ20  
Pin 046 -  
Pin 050 - DQ22  
Pin 054 - DQ23  
Pin 058 - VDD  
Pin 062 - DM3  
Pin 066 - DQ30  
VDD  
Pin 070 -  
Pin 074 - CB5/NC  
Pin 078 - DM8/NC  
Pin 082 - VDD  
Pin 086 - NC  
Pin 090 - VSS  
Pin 094 - VDD  
Pin 098 - NC  
Pin 102 - A8  
DQ17 - Pin 043  
DQS2 - Pin 047  
Pin 044 - DQ21  
Pin 048 - DM2  
VDD  
V
VSS  
Pin 052 -  
SS - Pin 051  
DQ33 - Pin 055  
DQ25 - Pin 059  
Pin 056 - DQ28  
Pin 060 - DQ29  
VSS  
Pin 064 -  
Pin 068 - DQ31  
Pin 072 - CB4/NC  
VSS  
Pin 076 -  
VDD - Pin 057  
DQS3 - Pin 061  
DQ26 - Pin 065  
V
SS - Pin 063  
DQ27 - Pin 067  
VDD - Pin 069  
CB0/NC - Pin 071  
CB1/NC - Pin 073  
DQS8/NC - Pin 077  
V
SS - Pin 075  
CB2/NC - Pin 079  
CB3/NC - Pin 083  
Pin 080 - CB6/NC  
Pin 084 - CB7/NC  
VDD - Pin 081  
NC - Pin 085  
CK2/NC - Pin 089  
V
VSS  
VDD  
SS - Pin 087  
Pin 088 -  
Pin 092 -  
CK2/NC - Pin 091  
CKE1/NC - Pin 095  
A12/NC - Pin 099  
VDD - Pin 093  
Pin 096 - CKE0  
Pin 100 - A11  
VSS  
Pin 104 -  
NC - Pin 097  
A9 - Pin 101  
A7 - Pin 105  
A3 - Pin 109  
V
SS - Pin 103  
Pin 106 - A6  
Pin 110 - A2  
A5 - Pin 107  
A1 - Pin 111  
A10/AP - Pin 115  
WE - Pin 119  
Pin 108 - A4  
Pin 112 - A0  
Pin 116 - BA1  
Pin 120 - CAS  
Pin 124 - NC  
Pin 128 - DQ36  
V
DD - Pin 113  
BA0 - Pin 117  
S0 - Pin 121  
Pin 114 - VDD  
Pin 118 - RAS  
Pin 122 - S1/NC  
A13/NC - Pin 123  
DQ32 - Pin 127  
V
VSS  
Pin 126 -  
SS - Pin 125  
DQ33 - Pin 129  
DQS4 - Pin 133  
Pin 130 - DQ37  
Pin 134 - DM4  
VSS  
Pin 138 -  
Pin 142 - DQ44  
Pin 146 - DQ45  
VSS  
Pin 150 -  
Pin 154 - DQ47  
Pin 158 - CK1  
Pin 162 - VSS  
Pin 166 - DQ53  
Pin 170 - DM6  
Pin 174 - VSS  
Pin 178 - DQ60  
Pin 182 - DQ61  
Pin 186 - VSS  
Pin 190 - DQ63  
Pin 194 - SA0  
Pin 198 - SA2  
VDD  
VDD  
Pin 132 -  
- Pin 131  
DQ34 - Pin 135  
DQ35 - Pin 139  
Pin 136 - DQ38  
Pin 140 - DQ39  
VDD  
Pin 144 -  
Pin 148 - DM5  
Pin 152 - DQ46  
VDD  
Pin 156 -  
Pin 160 - CK1  
Pin 164 - DQ52  
VDD  
Pin 168 -  
V
SS - Pin 137  
DQ40 - Pin 141  
DQ41 - Pin 145  
V
DD - Pin 143  
DQS5 - Pin 147  
DQ42 - Pin 151  
V
SS - Pin 149  
DQ43 - Pin 153  
DD - Pin 157  
SS - Pin 161  
V
V
DD - Pin 155  
SS - Pin 159  
V
V
DQ48 - Pin 163  
DQ49 - Pin 165  
DQS6 - Pin 169  
V
DD - Pin 167  
DQ50 - Pin 171  
DQ51 - Pin 175  
Pin 172 - DQ54  
Pin 176 - DQ55  
VDD  
Pin 180 -  
V
SS - Pin 173  
DQ56 - Pin 177  
DQ57 - Pin 181  
VDD  
- Pin 179  
DQS7 - Pin 183  
DQ58 - Pin 187  
Pin 184 - DM7  
Pin 188 - DQ62  
VSS - Pin 185  
DQ59 - Pin 189  
SDA - Pin 193  
V
VDD  
Pin 192 -  
DD - Pin 191  
SCL - Pin 195  
DDID - Pin 199  
Pin 196 - SA1  
Pin 200 - NC  
VDDSPD - Pin 197  
V
MPPD0040  
Figure 1  
Table 7  
Pin Configuration Diagram 200-Pin SO-DIMM  
Address Format  
Density Organization Memory SDRAMs # of  
# of row/bank/ Refresh Period Interval  
SDRAMs columns bits  
16 13/2/11  
Ranks  
1GB  
128M ×64  
2
64M ×8  
8K  
64 ms 7.8 µs  
Data Sheet  
12  
Rev. 1.0, 2004-07  
HYS64D128021[G/H/E]BDL–[5/6]–B  
Small Outline DDR SDRAM Modules  
Pin Configuration  
ꢃꢃꢈꢁꢃ  
ꢃꢃꢃꢃꢉ  
ꢗꢖꢛ  
ꢂꢘꢇꢐꢚꢐꢂꢘꢄ  
ꢘꢇꢐꢚꢐꢘ&  
ꢗꢘꢈ  
ꢂꢘꢇꢐꢚꢐꢂꢘꢄꢕꢐꢈꢃꢗꢘꢀꢙꢐꢃꢇꢐꢚꢐꢃꢄꢍ  
ꢘꢇꢐꢚꢐꢘ&ꢕꢐꢈꢃꢗꢘꢀꢙꢐꢃꢇꢐꢚꢐꢃꢄꢍ  
ꢗꢘꢈꢕꢐꢈꢃꢗꢘꢀꢙꢐꢃꢇꢐꢚꢐꢃꢄꢍ  
ꢑꢘꢈꢕꢐꢈꢃꢗꢘꢀꢙꢐꢃꢇꢐꢚꢐꢃꢄꢍ  
%ꢖꢕꢐꢈꢃꢗꢘꢀꢙꢐꢃꢇꢐꢚꢐꢃꢄꢍ  
ꢑ'ꢖꢕꢐꢈꢃꢗꢘꢀꢙꢐꢃꢇꢐꢚꢐꢃꢏ  
ꢑ'ꢖꢕꢈꢃꢗꢘꢀꢙꢐꢃꢊꢐꢚꢐꢃꢄꢍ  
ꢃꢃꢕꢐꢈꢁꢃꢐꢖꢖꢁꢗꢔꢀꢐꢖꢇ  
ꢃꢃꢃꢃꢉꢕꢐꢈꢃꢗꢘꢀꢙꢐꢃꢇꢐꢚꢐꢃꢄꢍ  
ꢗꢖꢛꢕꢐꢈꢃꢗꢘꢀꢙꢐꢃꢇꢐꢚꢐꢃꢄꢍ  
ꢈꢈꢕꢐꢈꢃꢗꢘꢀꢙꢐꢃꢇꢐꢚꢐꢃꢄꢍ  
ꢑꢘꢈ  
%ꢖ  
ꢑ'ꢖꢇ  
ꢑ'ꢖꢄ  
ꢈꢈ  
ꢃꢃꢒꢃ  
ꢈꢜꢝꢞ ꢕꢐꢙ!!ꢐ"#ꢜ!ꢐꢄ  
ꢈꢇ  
ꢈꢄ  
ꢃꢄꢋ  
ꢃꢄꢆ  
ꢃꢄꢌ  
ꢃꢄꢍ  
ꢃꢌ  
ꢃꢍ  
ꢃꢎ  
ꢃꢏ  
ꢃꢇ  
ꢃꢄ  
ꢃꢋ  
ꢃꢆ  
ꢃꢊ  
ꢃꢀꢇ  
ꢃꢉꢈꢇ  
ꢃꢉꢇ  
ꢃꢉꢄ  
ꢃꢉꢋ  
ꢃꢉꢆ  
ꢃꢉꢌ  
ꢃꢉꢍ  
ꢃꢉꢎ  
ꢃꢉꢏ  
ꢐꢃꢀꢐꢐꢐꢐꢐꢑꢈ  
ꢐꢃꢉꢈ  
ꢐꢒꢓꢔꢐꢇ  
ꢐꢒꢓꢔꢐꢄ  
ꢐꢒꢓꢔꢐꢋ  
ꢐꢒꢓꢔꢐꢆ  
ꢐꢒꢓꢔꢐꢌ  
ꢐꢒꢓꢔꢐꢍ  
ꢐꢒꢓꢔꢐꢎ  
ꢐꢒꢓꢔꢐꢏ  
ꢐꢃꢀꢐꢐꢐꢐꢐꢑꢈ  
ꢐꢃꢉꢈ  
ꢐꢒꢓꢔꢐꢇ  
ꢐꢒꢓꢔꢐꢄ  
ꢐꢒꢓꢔꢐꢋ  
ꢐꢒꢓꢔꢐꢆ  
ꢐꢒꢓꢔꢐꢌ  
ꢐꢒꢓꢔꢐꢍ  
ꢐꢒꢓꢔꢐꢎ  
ꢐꢒꢓꢔꢐꢏ  
ꢃꢀꢌ  
ꢐꢃꢀꢐꢐꢐꢐꢐꢑꢈ  
ꢐꢃꢉꢈ  
ꢐꢒꢓꢔꢐꢇ  
ꢐꢒꢓꢔꢐꢄ  
ꢐꢒꢓꢔꢐꢋ  
ꢐꢒꢓꢔꢐꢆ  
ꢐꢒꢓꢔꢐꢌ  
ꢐꢒꢓꢔꢐꢍ  
ꢐꢒꢓꢔꢐꢎ  
ꢐꢒꢓꢔꢐꢏ  
ꢐꢃꢀꢐꢐꢐꢐꢐꢑꢈ  
ꢐꢃꢉꢈ  
ꢐꢒꢓꢔꢐꢇ  
ꢐꢒꢓꢔꢐꢄ  
ꢐꢒꢓꢔꢐꢋ  
ꢐꢒꢓꢔꢐꢆ  
ꢐꢒꢓꢔꢐꢌ  
ꢐꢒꢓꢔꢐꢍ  
ꢐꢒꢓꢔꢐꢎ  
ꢐꢒꢓꢔꢐꢏ  
ꢃꢉꢈꢌ  
ꢃꢉꢆꢋ  
ꢃꢉꢆꢆ  
ꢃꢉꢆꢌ  
ꢃꢉꢆꢍ  
ꢃꢉꢆꢎ  
ꢃꢉꢆꢏ  
ꢃꢉꢆꢊ  
ꢃꢉꢆꢅ  
ꢃꢅ  
ꢃꢀꢄ  
ꢃꢉꢈꢄ  
ꢃꢉꢊ  
ꢐꢃꢀꢐꢐꢐꢐꢐꢑꢈ  
ꢐꢃꢉꢈ  
ꢐꢒꢓꢔꢐꢇ  
ꢐꢒꢓꢔꢐꢄ  
ꢐꢒꢓꢔꢐꢋ  
ꢐꢒꢓꢔꢐꢆ  
ꢐꢒꢓꢔꢐꢌ  
ꢐꢒꢓꢔꢐꢍ  
ꢐꢒꢓꢔꢐꢎ  
ꢐꢒꢓꢔꢐꢏ  
ꢐꢃꢀꢐꢐꢐꢐꢐꢑꢈ  
ꢐꢃꢉꢈ  
ꢐꢒꢓꢔꢐꢇ  
ꢐꢒꢓꢔꢐꢄ  
ꢐꢒꢓꢔꢐꢋ  
ꢐꢒꢓꢔꢐꢆ  
ꢐꢒꢓꢔꢐꢌ  
ꢐꢒꢓꢔꢐꢍ  
ꢐꢒꢓꢔꢐꢎ  
ꢐꢒꢓꢔꢐꢏ  
ꢃꢀꢍ  
ꢃꢉꢈꢍ  
ꢃꢉꢌꢇ  
ꢃꢉꢌꢄ  
ꢃꢉꢌꢋ  
ꢃꢉꢌꢆ  
ꢃꢉꢌꢌ  
ꢃꢉꢌꢍ  
ꢃꢉꢌꢎ  
ꢃꢉꢌꢏ  
ꢐꢃꢀꢐꢐꢐꢐꢐꢑꢈ  
ꢐꢃꢉꢈ  
ꢐꢒꢓꢔꢐꢇ  
ꢐꢒꢓꢔꢐꢄ  
ꢐꢒꢓꢔꢐꢋ  
ꢐꢒꢓꢔꢐꢆ  
ꢐꢒꢓꢔꢐꢌ  
ꢐꢒꢓꢔꢐꢍ  
ꢐꢒꢓꢔꢐꢎ  
ꢐꢒꢓꢔꢐꢏ  
ꢐꢃꢀꢐꢐꢐꢐꢐꢑꢈ  
ꢐꢃꢉꢈ  
ꢐꢒꢓꢔꢐꢇ  
ꢐꢒꢓꢔꢐꢄ  
ꢐꢒꢓꢔꢐꢋ  
ꢐꢒꢓꢔꢐꢆ  
ꢐꢒꢓꢔꢐꢌ  
ꢐꢒꢓꢔꢐꢍ  
ꢐꢒꢓꢔꢐꢎ  
ꢐꢒꢓꢔꢐꢏ  
ꢃꢉꢅ  
ꢃꢉꢄꢇ  
ꢃꢉꢄꢄ  
ꢃꢉꢄꢋ  
ꢃꢉꢄꢆ  
ꢃꢉꢄꢌ  
ꢃꢉꢄꢍ  
ꢃꢄꢇ  
ꢃꢀꢋ  
ꢃꢉꢈꢋ  
ꢃꢉꢄꢎ  
ꢃꢉꢄꢏ  
ꢃꢉꢄꢊ  
ꢃꢉꢄꢅ  
ꢃꢉꢋꢇ  
ꢃꢉꢋꢄ  
ꢃꢉꢋꢋ  
ꢃꢉꢋꢆ  
ꢐꢃꢀꢐꢐꢐꢐꢐꢑꢈ  
ꢐꢃꢉꢈ  
ꢐꢒꢓꢔꢐꢇ  
ꢐꢒꢓꢔꢐꢄ  
ꢐꢒꢓꢔꢐꢋ  
ꢐꢒꢓꢔꢐꢆ  
ꢐꢒꢓꢔꢐꢌ  
ꢐꢒꢓꢔꢐꢍ  
ꢐꢒꢓꢔꢐꢎ  
ꢐꢒꢓꢔꢐꢏ  
ꢐꢃꢀꢐꢐꢐꢐꢐꢑꢈ  
ꢐꢃꢉꢈ  
ꢐꢒꢓꢔꢐꢇ  
ꢐꢒꢓꢔꢐꢄ  
ꢐꢒꢓꢔꢐꢋ  
ꢐꢒꢓꢔꢐꢆ  
ꢐꢒꢓꢔꢐꢌ  
ꢐꢒꢓꢔꢐꢍ  
ꢐꢒꢓꢔꢐꢎ  
ꢐꢒꢓꢔꢐꢏ  
ꢃꢀꢎ  
ꢃꢉꢈꢎ  
ꢃꢉꢌꢊ  
ꢃꢉꢌꢅ  
ꢃꢉꢍꢇ  
ꢃꢉꢍꢄ  
ꢃꢉꢍꢋ  
ꢃꢉꢍꢆ  
ꢃꢉꢍꢌ  
ꢃꢉꢍꢍ  
ꢐꢃꢀꢐꢐꢐꢐꢐꢑꢈ  
ꢐꢃꢉꢈ  
ꢐꢒꢓꢔꢐꢇ  
ꢐꢒꢓꢔꢐꢄ  
ꢐꢒꢓꢔꢐꢋ  
ꢐꢒꢓꢔꢐꢆ  
ꢐꢒꢓꢔꢐꢌ  
ꢐꢒꢓꢔꢐꢍ  
ꢐꢒꢓꢔꢐꢎ  
ꢐꢒꢓꢔꢐꢏ  
ꢐꢃꢀꢐꢐꢐꢐꢐꢑꢈ  
ꢐꢃꢉꢈ  
ꢐꢒꢓꢔꢐꢇ  
ꢐꢒꢓꢔꢐꢄ  
ꢐꢒꢓꢔꢐꢋ  
ꢐꢒꢓꢔꢐꢆ  
ꢐꢒꢓꢔꢐꢌ  
ꢐꢒꢓꢔꢐꢍ  
ꢐꢒꢓꢔꢐꢎ  
ꢐꢒꢓꢔꢐꢏ  
ꢃꢄꢄ  
ꢃꢀꢆ  
ꢃꢉꢈꢆ  
ꢃꢉꢋꢌ  
ꢃꢉꢋꢍ  
ꢃꢉꢋꢎ  
ꢃꢉꢋꢏ  
ꢃꢉꢋꢊ  
ꢃꢉꢋꢅ  
ꢃꢉꢆꢇ  
ꢃꢉꢆꢄ  
ꢐꢃꢀꢐꢐꢐꢐꢐꢑꢈ  
ꢐꢃꢉꢈ  
ꢐꢒꢓꢔꢐꢇ  
ꢐꢒꢓꢔꢐꢄ  
ꢐꢒꢓꢔꢐꢋ  
ꢐꢒꢓꢔꢐꢆ  
ꢐꢒꢓꢔꢐꢌ  
ꢐꢒꢓꢔꢐꢍ  
ꢐꢒꢓꢔꢐꢎ  
ꢐꢒꢓꢔꢐꢏ  
ꢐꢃꢀꢐꢐꢐꢐꢐꢑꢈ  
ꢐꢃꢉꢈ  
ꢐꢒꢓꢔꢐꢇ  
ꢐꢒꢓꢔꢐꢄ  
ꢐꢒꢓꢔꢐꢋ  
ꢐꢒꢓꢔꢐꢆ  
ꢐꢒꢓꢔꢐꢌ  
ꢐꢒꢓꢔꢐꢍ  
ꢐꢒꢓꢔꢐꢎ  
ꢐꢒꢓꢔꢐꢏ  
ꢃꢀꢏ  
ꢃꢉꢈꢏ  
ꢃꢉꢍꢎ  
ꢃꢉꢍꢏ  
ꢃꢉꢍꢊ  
ꢃꢉꢍꢅ  
ꢃꢉꢎꢇ  
ꢃꢉꢎꢄ  
ꢃꢉꢎꢋ  
ꢃꢉꢎꢆ  
ꢐꢃꢀꢐꢐꢐꢐꢐꢑꢈ  
ꢐꢃꢉꢈ  
ꢐꢒꢓꢔꢐꢇ  
ꢐꢒꢓꢔꢐꢄ  
ꢐꢒꢓꢔꢐꢋ  
ꢐꢒꢓꢔꢐꢆ  
ꢐꢒꢓꢔꢐꢌ  
ꢐꢒꢓꢔꢐꢍ  
ꢐꢒꢓꢔꢐꢎ  
ꢐꢒꢓꢔꢐꢏ  
ꢐꢃꢀꢐꢐꢐꢐꢐꢑꢈ  
ꢐꢃꢉꢈ  
ꢐꢒꢓꢔꢐꢇ  
ꢐꢒꢓꢔꢐꢄ  
ꢐꢒꢓꢔꢐꢋ  
ꢐꢒꢓꢔꢐꢆ  
ꢐꢒꢓꢔꢐꢌ  
ꢐꢒꢓꢔꢐꢍ  
ꢐꢒꢓꢔꢐꢎ  
ꢐꢒꢓꢔꢐꢏ  
ꢖꢇ  
ꢈꢑ$  
ꢈꢘꢃ  
ꢈꢘꢇ  
ꢈꢘꢄ  
ꢈꢘꢋ  
ꢈꢈ  
ꢐꢈꢑ$  
ꢐꢈꢘꢃ  
ꢐꢘꢇ  
ꢐꢘꢄ  
ꢐꢘꢋ  
ꢐ%ꢁ  
ꢀꢁꢂꢃꢄꢅꢆꢇ  
Figure 2  
Block Diagram SO-DIMM Raw Card Z (×64, 2 Ranks, ×8)  
Note:  
Table 8  
Clock Signal Loads  
Number of SDRAMs  
8 SDRAMs  
1. VDD = VDDQ, therefore VDDID strap open  
2. DQ, DQS, DM resistors are 22 Ω ±5 %  
Clock Input  
CK0, CK0  
CK1, CK1  
CK2, CK2  
Note  
8 SDRAMs  
0 SDRAMs  
Data Sheet  
13  
Rev. 1.0, 2004-07  
HYS64D128021[G/H/E]BDL–[5/6]–B  
Small Outline DDR SDRAM Modules  
Electrical Characteristics  
3
Electrical Characteristics  
3.1  
Operating Conditions  
Absolute Maximum Ratings  
Parameter  
Symbol  
Values  
Unit Note/ Test Condition  
min. typ. max.  
Voltage on I/O pins relative to VSS  
Voltage on inputs relative to VSS  
Voltage on VDD supply relative to VSS  
Voltage on VDDQ supply relative to VSS  
Operating temperature (ambient)  
Storage temperature (plastic)  
VIN, VOUT –0.5 –  
VDDQ +0.5 V  
VIN  
–1  
–1  
–1  
0
+3.6  
+3.6  
+3.6  
+70  
+150  
V
VDD  
VDDQ  
TA  
V
V
°C  
°C  
W
mA  
TSTG  
PD  
-55  
Power dissipation (per SDRAM component)  
Short circuit output current  
1
IOUT  
50  
Attention: Permanent damage to the device may occur if “Absolute Maximum Ratings” are exceeded. This  
is a stress rating only, and functional operation should be restricted to recommended operation  
conditions. Exposure to absolute maximum rating conditions for extended periods of time may  
affect device reliability and exceeding only one of the values may cause irreversible damage to  
the integrated circuit.  
Table 9  
Electrical Characteristics and DC Operating Conditions  
1)  
Parameter  
Symbol  
Values  
Typ.  
Unit Note/Test Condition  
Min.  
2.3  
2.5  
2.3  
2.5  
Max.  
2.7  
2.7  
2.7  
2.7  
3.6  
0
Device Supply Voltage  
Device Supply Voltage  
Output Supply Voltage  
Output Supply Voltage  
EEPROM supply voltage  
VDD  
2.5  
2.6  
2.5  
2.6  
2.5  
V
V
V
V
V
V
fCK 166 MHz  
fCK > 166 MHz  
fCK 166 MHz  
fCK > 166 MHz  
2)  
VDD  
3)  
VDDQ  
VDDQ  
2)3)  
VDDSPD 2.3  
Supply Voltage, I/O Supply VSS  
,
0
Voltage  
VSSQ  
4)  
5)  
Input Reference Voltage  
VREF  
0.49 ×  
VDDQ  
0.5 ×  
VDDQ  
0.51 ×  
VDDQ  
V
I/O Termination Voltage  
(System)  
VTT  
VREF – 0.04  
VREF + 0.04 V  
8)  
8)  
8)  
Input High (Logic1) Voltage VIH(DC) VREF + 0.15  
Input Low (Logic0) Voltage VIL(DC) –0.3  
VDDQ + 0.3 V  
VREF – 0.15 V  
VDDQ + 0.3 V  
Input Voltage Level,  
CK and CK Inputs  
VIN(DC) –0.3  
8)6)  
7)  
Input Differential Voltage, VID(DC) 0.36  
CK and CK Inputs  
VDDQ + 0.6 V  
VI-Matching Pull-up  
Current to Pull-down  
Current  
VI  
0.71  
1.4  
Ratio  
Data Sheet  
14  
Rev. 1.0, 2004-07  
HYS64D128021[G/H/E]BDL–[5/6]–B  
Small Outline DDR SDRAM Modules  
Electrical Characteristics  
Table 9  
Electrical Characteristics and DC Operating Conditions (cont’d)  
1)  
Parameter  
Symbol  
Values  
Typ.  
Unit Note/Test Condition  
Min.  
Max.  
Input Leakage Current  
Output Leakage Current  
II  
–2  
2
µA Any input 0 V VIN VDD;  
All other pins not under test  
8)9)  
= 0 V  
IOZ  
IOH  
IOL  
–5  
5
µA DQs are disabled;  
0 V VOUT VDDQ  
Output High Current,  
Normal Strength Driver  
–16.2  
mA VOUT = 1.95 V  
Output Low  
16.2  
mA VOUT = 0.35 V  
Current, Normal Strength  
Driver  
1) 0 °C TA 70 °C  
2) DDR400 conditions apply for all clock frequencies above 166 MHz  
3) Under all conditions, VDDQ must be less than or equal to VDD  
4) Peak to peak AC noise on VREF may not exceed ± 2% VREF (DC). VREF is also expected to track noise variations in VDDQ  
5) VTT is not applied directly to the device. VTT is a system supply for signal termination resistors, is expected to be set equal  
to VREF, and must track variations in the DC level of VREF  
.
.
.
6) VID is the magnitude of the difference between the input level on CK and the input level on CK.  
7) The ratio of the pull-up current to the pull-down current is specified for the same temperature and voltage, over the entire  
temperature and voltage range, for device drain to source voltage from 0.25 to 1.0 V. For a given output, it represents the  
maximum difference between pull-up and pull-down drivers due to process variation.  
8) Inputs are not recognized as valid until VREF stabilizes.  
9) Values are shown per component  
Data Sheet  
15  
Rev. 1.0, 2004-07  
HYS64D128021[G/H/E]BDL–[5/6]–B  
Small Outline DDR SDRAM Modules  
Electrical Characteristics  
3.2  
Current Specification and Conditions  
IDD Conditions  
Parameter  
Symbol  
Operating Current 0  
IDD0  
one bank; active/ precharge; DQ, DM, and DQS inputs changing once per clock cycle;  
address and control inputs changing once every two clock cycles.  
Operating Current 1  
IDD1  
one bank; active/read/precharge; Burst Length = 4; see component data sheet.  
Precharge Power-Down Standby Current  
all banks idle; power-down mode; CKE VIL,MAX  
IDD2P  
IDD2F  
Precharge Floating Standby Current  
CS VIH,,MIN, all banks idle; CKE VIH,MIN  
;
address and other control inputs changing once per clock cycle; VIN = VREF for DQ, DQS and DM.  
Precharge Quiet Standby Current  
IDD2Q  
CS VIHMIN, all banks idle; CKE VIH,MIN; VIN = VREF for DQ, DQS and DM;  
address and other control inputs stable at VIH,MIN or VIL,MAX  
.
Active Power-Down Standby Current  
one bank active; power-down mode; CKE VILMAX; VIN = VREF for DQ, DQS and DM.  
IDD3P  
IDD3N  
Active Standby Current  
one bank active; CS VIH,MIN; CKE VIH,MIN; tRC = tRAS,MAX  
DQ, DM and DQS inputs changing twice per clock cycle;  
address and control inputs changing once per clock cycle.  
;
Operating Current Read  
IDD4R  
one bank active; Burst Length = 2; reads; continuous burst;  
address and control inputs changing once per clock cycle;  
50% of data outputs changing on every clock edge;  
CL = 2 for DDR266(A), CL = 3 for DDR333 and DDR400B; IOUT = 0 mA  
Operating Current Write  
IDD4W  
one bank active; Burst Length = 2; writes; continuous burst;  
address and control inputs changing once per clock cycle;  
50% of data outputs changing on every clock edge;  
CL = 2 for DDR266(A), CL = 3 for DDR333 and DDR400B  
Auto-Refresh Current  
tRC = tRFCMIN, burst refresh  
IDD5  
IDD6  
IDD7  
Self-Refresh Current  
CKE 0.2 V; external clock on  
Operating Current 7  
four bank interleaving with Burst Length = 4; see component data sheet.  
Data Sheet  
16  
Rev. 1.0, 2004-07  
HYS64D128021[G/H/E]BDL–[5/6]–B  
Small Outline DDR SDRAM Modules  
Electrical Characteristics  
Table 10  
IDD Specification for HYS64D128021[G/H/E]BDL–[5/6]–B  
1)2)  
Product Type  
HYS64D128021GBDL-5-B HYS64D128021GBDL-6-B Unit  
HYS64D128021HBDL-5-B HYS64D128021HBDL-6-B  
HYS64D128021EBDL-5-B HYS64D128021EBDL-6-B  
Note  
1GB  
×64  
1GB  
×64  
2 Ranks  
–6  
2 Ranks  
–5  
Symbol  
IDD0  
Typ.  
950  
Max.  
1180  
1260  
60  
Typ.  
880  
960  
30  
Max.  
1050  
1130  
60  
3)  
mA  
mA  
mA  
mA  
mA  
mA  
mA  
mA  
mA  
mA  
mA  
mA  
3)4)  
5)  
IDD1  
1030  
30  
IDD2P  
IDD2F  
IDD2Q  
IDD3P  
IDD3N  
IDD4R  
IDD4W  
IDD5  
5)  
480  
576  
400  
270  
180  
560  
900  
930  
1760  
43  
480  
5)  
300  
416  
384  
5)  
190  
256  
240  
5)  
620  
752  
656  
3)4)  
3)  
990  
1176  
1216  
2336  
62  
1048  
1088  
2088  
61  
1030  
1950  
45  
3)  
IDD6  
3)4)  
IDD7  
2390  
2860  
2150  
2560  
1) Module IDD values are calculated on the basis of component IDD and can be measured differently according to DQ loading  
capacity.  
2) Test condition for maximum values: VDD = 2.7 V, TA = 10 °C  
3) The module IDDx values are calculated from the IDDx values of the component data sheet as follows:  
m × IDDx[component] + n × IDD3N[component] with m and n number of components of rank 1 and 2; n=0 for 1 rank  
modules  
4) DQ I/O (IDDQ) currents are not included in the calculations  
5) The module IDDx values are calculated from the corrponent IDDx data sheet values as: (m + n) × IDDx[component]  
Data Sheet  
17  
Rev. 1.0, 2004-07  
HYS64D128021[G/H/E]BDL–[5/6]–B  
Small Outline DDR SDRAM Modules  
Electrical Characteristics  
3.3  
AC Characteristics  
AC Timing - Absolute Specifications for PC3200 and PC2700  
Parameter  
Symbol –5  
DDR400B  
–6  
Unit Note/ Test  
Condition  
1)  
DDR333  
Min.  
Min.  
Max.  
Max.  
2)3)4)5)  
DQ output access time from  
CK/CK  
tAC  
–0.5  
+0.5  
–0.7  
+0.7  
ns  
2)3)4)5)  
CK high-level width  
Clock cycle time  
tCH  
tCK  
0.45  
5
0.55  
8
0.45  
6
0.55  
12  
tCK  
ns  
ns  
ns  
CL = 3.0  
2)3)4)5)  
6
12  
6
12  
CL = 2.5  
2)3)4)5)  
7.5  
12  
7.5  
0.45  
12  
CL = 2.0  
2)3)4)5)  
2)3)4)5)  
CK low-level width  
tCL  
0.45  
0.55  
0.55  
tCK  
tCK  
2)3)4)5)6)  
Auto precharge write recovery tDAL  
(tWR/tCK)+(tRP/tCK)  
+ precharge time  
2)3)4)5)  
DQ and DM input hold time  
tDH  
0.4  
0.45  
1.75  
ns  
ns  
2)3)4)5)6)  
DQ and DM input pulse width tDIPW  
1.75  
(each input)  
2)3)4)5)  
2)3)4)5)  
DQS output access time from tDQSCK –0.6  
CK/CK  
+0.6  
–0.6  
0.35  
+0.6  
ns  
DQS input low (high) pulse  
width (write cycle)  
tDQSL,H 0.35  
tCK  
DQS-DQ skew (DQS and  
associated DQ signals)  
tDQSQ  
tDQSS  
+0.40  
1.25  
+0.40 ns  
TFBGA  
2)3)4)5)  
st  
2)3)4)5)  
Write command to 1 DQS  
0.72  
0.75  
1.25  
tCK  
latching transition  
2)3)4)5)  
2)3)4)5)  
DQ and DM input setup time  
tDS  
0.4  
0.2  
0.45  
0.2  
ns  
DQS falling edge hold time  
from CK (write cycle)  
tDSH  
tCK  
2)3)4)5)  
DQS falling edge to CK setup tDSS  
0.2  
0.2  
tCK  
time (write cycle)  
2)3)4)5)  
Clock Half Period  
tHP  
min. (tCL, tCH  
)
min. (tCL, tCH  
)
ns  
ns  
2)3)4)5)7)  
Data-out high-impedance time tHZ  
from CK/CK  
+0.7  
–0.7  
+0.7  
Address and control input hold tIH  
time  
0.6  
0.7  
2.2  
0.6  
0.7  
0.75  
0.8  
ns  
ns  
ns  
ns  
ns  
fast slew rate  
3)4)5)6)8)  
slow slew  
3)4)5)6)8)  
rate  
2)3)4)5)9)  
Control and Addr. input pulse tIPW  
width (each input)  
2.2  
Address and control input  
setup time  
tIS  
0.75  
0.8  
fast slew rate  
3)4)5)6)8)  
slow slew  
3)4)5)6)8)  
rate  
Data Sheet  
18  
Rev. 1.0, 2004-07  
HYS64D128021[G/H/E]BDL–[5/6]–B  
Small Outline DDR SDRAM Modules  
Electrical Characteristics  
AC Timing - Absolute Specifications for PC3200 and PC2700  
Parameter  
Symbol –5  
DDR400B  
–6  
Unit Note/ Test  
Condition  
1)  
DDR333  
Min.  
Min.  
Max.  
Max.  
2)3)4)5)7)  
Data-out low-impedance time tLZ  
–0.7  
+0.7  
–0.7  
+0.7  
ns  
from CK/CK  
2)3)4)5)  
Mode register set command  
cycle time  
tMRD  
2
2
tCK  
2)3)4)5)  
DQ/DQS output hold time  
Data hold skew factor  
tQH  
tHP tQHS  
tHP tQHS  
ns  
tQHS  
+0.50  
+0.50 ns  
TFBGA  
2)3)4)5)  
2)3)4)5)  
Active to Autoprecharge delay tRAP  
tRCD or  
tRCD or  
ns  
tRASmin  
tRASmin  
2)3)4)5)  
2)3)4)5)  
Active to Precharge command tRAS  
40  
55  
70E+3 42  
70E+3 ns  
Active to Active/Auto-refresh  
command period  
tRC  
60  
ns  
2)3)4)5)  
Active to Read or Write delay tRCD  
15  
18  
ns  
2)3)4)5)10)  
Average Periodic Refresh  
Interval  
tREFI  
7.8  
7.8  
µs  
2)3)4)5)  
Auto-refresh to Active/Auto-  
refresh command period  
tRFC  
70  
72  
ns  
2)3)4)5)  
2)3)4)5)  
2)3)4)5)  
2)3)4)5)  
Precharge command period  
Read preamble  
tRP  
15  
18  
ns  
tRPRE  
tRPST  
0.9  
0.40  
10  
1.1  
0.60  
0.9  
0.40  
12  
1.1  
0.60  
tCK  
tCK  
ns  
Read postamble  
Active bank A to Active bank B tRRD  
command  
2)3)4)5)  
Write preamble  
tWPRE  
tWPRES  
tWPST  
tWR  
0.25  
0
0.25  
0
tCK  
ns  
2)3)4)5)11)  
2)3)4)5)12)  
2)3)4)5)  
Write preamble setup time  
Write postamble  
0.40  
15  
2
0.60  
0.40  
15  
1
0.60  
tCK  
ns  
Write recovery time  
2)3)4)5)  
Internal write to read command tWTR  
tCK  
delay  
2)3)4)5)  
2)3)4)5)  
Exit self-refresh to non-read  
command  
tXSNR  
tXSRD  
75  
75  
ns  
Exit self-refresh to read  
command  
200  
200  
tCK  
1) 0 °C TA 70 °C; VDDQ = 2.5 V ± 0.2 V, VDD = +2.5 V ± 0.2 V (DDR333); VDDQ = 2.6 V ± 0.1 V, VDD = +2.6 V ± 0.1 V  
(DDR400)  
2) Input slew rate 1 V/ns for DDR400, DDR333  
3) The CK/CK input reference level (for timing reference to CK/CK) is the point at which CK and CK cross: the input reference  
level for signals other than CK/CK, is VREF. CK/CK slew rate are 1.0 V/ns.  
4) Inputs are not recognized as valid until VREF stabilizes.  
5) The Output timing reference level, as measured at the timing reference point indicated in AC Characteristics (note 3) is VTT  
.
6) For each of the terms, if not already an integer, round to the next highest integer. tCK is equal to the actual system clock  
cycle time.  
Data Sheet  
19  
Rev. 1.0, 2004-07  
HYS64D128021[G/H/E]BDL–[5/6]–B  
Small Outline DDR SDRAM Modules  
Electrical Characteristics  
7) tHZ and tLZ transitions occur in the same access time windows as valid data transitions. These parameters are not referred  
to a specific voltage level, but specify when the device is no longer driving (HZ), or begins driving (LZ).  
8) Fast slew rate 1.0 V/ns , slow slew rate 0.5 V/ns and < 1 V/ns for command/address and CK & CK slew rate > 1.0 V/  
ns, measured between VIH(ac) and VIL(ac)  
.
9) These parameters guarantee device timing, but they are not necessarily tested on each device.  
10) A maximum of eight Autorefresh commands can be posted to any given DDR SDRAM device.  
11) The specific requirement is that DQS be valid (HIGH,LOW, or some point on a valid transition) on or before this CK edge.  
A valid transition is defined as monotonic and meeting the input slew rate specificationsof the device. When no writes were  
previously in progress on the bus, DQS will be transitioning from Hi-Z to logic LOW. If a previous write was in progress,  
DQS could be HIGH, LOW at this time, depending on tDQSS  
.
12) The maximum limit for this parameter is not a device limit. The device operates with a greater value for this parameter, but  
system performance (bus turnaround) degrades accordingly.  
Data Sheet  
20  
Rev. 1.0, 2004-07  
HYS64D128021[G/H/E]BDL–[5/6]–B  
Small Outline DDR SDRAM Modules  
SPD Contents  
4
SPD Contents  
Table 11  
SPD Codes for HYS64D128021[H/G]BDL–5–B  
1 GByte  
×64  
1 GByte  
×64  
1 GByte  
×64  
2 Ranks  
2 Ranks  
2 Ranks  
Label Code  
PC3200S–3033–1 PC3200S–3033–1 PC3200S–3033–1  
Jedec SPD Revision  
Description  
Rev 1.0  
HEX  
Rev 1.0  
HEX  
80  
Rev 1.0  
HEX  
80  
Byte#  
0
Programmed SPD Bytes in E2PROM 80  
1
Total number of Bytes in E2PROM  
Memory Type (DDR = 07h)  
Number of Row Addresses  
Number of Column Addresses  
Number of DIMM Ranks  
Data Width (LSB)  
08  
07  
0D  
0B  
02  
40  
00  
04  
50  
50  
00  
82  
08  
00  
01  
0E  
08  
08  
2
07  
07  
3
0D  
0B  
02  
0D  
0B  
02  
4
5
6
40  
40  
7
Data Width (MSB)  
00  
00  
8
Interface Voltage Levels  
04  
04  
9
t
t
CK @ CLmax (Byte 18) [ns]  
50  
50  
10  
11  
12  
13  
14  
15  
16  
17  
18  
19  
20  
21  
22  
23  
24  
25  
AC SDRAM @ CLmax (Byte 18) [ns]  
50  
50  
Error Correction Support  
Refresh Rate  
00  
00  
82  
82  
Primary SDRAM Width  
Error Checking SDRAM Width  
08  
08  
00  
00  
t
CCD [cycles]  
Burst Length Supported  
Number of Banks on SDRAM Device 04  
01  
01  
0E  
04  
0E  
04  
CAS Latency  
1C  
01  
02  
20  
C1  
60  
50  
75  
1C  
01  
1C  
01  
CS Latency  
Write Latency  
02  
02  
DIMM Attributes  
Component Attributes  
20  
20  
C1  
60  
C1  
60  
t
t
t
CK @ CLmax -0.5 (Byte 18) [ns]  
AC SDRAM @ CLmax -0.5 [ns]  
CK @ CLmax -1 (Byte 18) [ns]  
50  
50  
75  
75  
Data Sheet  
21  
Rev. 1.0, 2004-07  
08262003-Y0OJ-UPC6  
HYS64D128021[G/H/E]BDL–[5/6]–B  
Small Outline DDR SDRAM Modules  
SPD Contents  
Table 11  
SPD Codes for HYS64D128021[H/G]BDL–5–B  
1 GByte  
×64  
1 GByte  
×64  
1 GByte  
×64  
2 Ranks  
2 Ranks  
2 Ranks  
Label Code  
PC3200S–3033–1 PC3200S–3033–1 PC3200S–3033–1  
Jedec SPD Revision  
Description  
Rev 1.0  
HEX  
50  
Rev 1.0  
HEX  
50  
Rev 1.0  
HEX  
50  
Byte#  
26  
t
t
t
t
t
AC SDRAM @ CLmax -1 [ns]  
RPmin [ns]  
27  
3C  
28  
3C  
28  
3C  
28  
28  
RRDmin [ns]  
29  
RCDmin [ns]  
3C  
28  
3C  
28  
3C  
28  
30  
RASmin [ns]  
31  
Module Density per Rank  
tAS, tCS [ns]  
80  
80  
80  
32  
60  
60  
60  
33  
tAH, TCH [ns]  
60  
60  
60  
34  
t
t
DS [ns]  
DH [ns]  
40  
40  
40  
35  
40  
40  
40  
36 – 40  
41  
not used  
00  
00  
00  
t
t
t
t
t
RCmin [ns]  
37  
37  
37  
42  
RFCmin [ns]  
CKmax [ns]  
DQSQmax [ns]  
QHSmax [ns]  
41  
41  
41  
43  
28  
28  
28  
44  
28  
28  
28  
45  
50  
50  
50  
46  
not used  
00  
00  
00  
47  
DIMM PCB Height  
01  
01  
01  
48 – 61  
62  
not used  
00  
00  
00  
SPD Revision  
10  
10  
10  
63  
Checksum of Byte 0-62  
JEDEC ID Code of Infineon (1)  
JEDEC ID Code of Infineon (2 – 8)  
Module Manufacturer Location  
Part Number, Char 1  
Part Number, Char 2  
Part Number, Char 3  
50  
50  
50  
64  
C1  
00  
C1  
00  
C1  
00  
65 – 71  
72  
xx  
xx  
xx  
73  
36  
36  
36  
74  
34  
34  
34  
75  
44  
44  
44  
Data Sheet  
22  
Rev. 1.0, 2004-07  
08262003-Y0OJ-UPC6  
HYS64D128021[G/H/E]BDL–[5/6]–B  
Small Outline DDR SDRAM Modules  
SPD Contents  
Table 11  
SPD Codes for HYS64D128021[H/G]BDL–5–B  
1 GByte  
×64  
1 GByte  
×64  
1 GByte  
×64  
2 Ranks  
2 Ranks  
2 Ranks  
Label Code  
PC3200S–3033–1 PC3200S–3033–1 PC3200S–3033–1  
Jedec SPD Revision  
Description  
Rev 1.0  
HEX  
31  
Rev 1.0  
HEX  
31  
Rev 1.0  
HEX  
31  
Byte#  
76  
Part Number, Char 4  
Part Number, Char 5  
Part Number, Char 6  
Part Number, Char 7  
Part Number, Char 8  
Part Number, Char 9  
Part Number, Char 10  
Part Number, Char 11  
Part Number, Char 12  
Part Number, Char 13  
Part Number, Char 14  
Part Number, Char 15  
Part Number, Char 16  
Part Number, Char 17  
Part Number, Char 18  
Module Revision Code  
Test Program Revision Code  
Module Manufacturing Date Year  
Module Manufacturing Date Week  
Module Serial Number (1 – 4)  
77  
32  
32  
32  
78  
38  
38  
38  
79  
30  
30  
30  
80  
32  
32  
32  
81  
31  
31  
31  
82  
48  
45  
47  
83  
42  
42  
42  
84  
44  
44  
44  
85  
4C  
35  
4C  
35  
4C  
35  
86  
87  
42  
42  
42  
88  
20  
20  
20  
89  
20  
20  
20  
90  
20  
20  
20  
91  
xx  
xx  
xx  
92  
xx  
xx  
xx  
93  
xx  
xx  
xx  
94  
xx  
xx  
xx  
95 – 98  
xx  
xx  
xx  
99 – 127 not used  
00  
00  
00  
Data Sheet  
23  
Rev. 1.0, 2004-07  
08262003-Y0OJ-UPC6  
HYS64D128021[G/H/E]BDL–[5/6]–B  
Small Outline DDR SDRAM Modules  
SPD Contents  
Table 12  
SPD Codes for HYS64D128021[H/G]BDL–6–B  
1 GByte  
×64  
1 GByte  
×64  
1 GByte  
×64  
2 Ranks  
2 Ranks  
2 Ranks  
Label Code  
PC2700S–2533–0 PC2700S–2533–0 PC2700S–2533–0  
Jedec SPD Revision  
Description  
Rev 0.0  
HEX  
Rev 0.0  
HEX  
80  
Rev 0.0  
HEX  
80  
Byte#  
0
Programmed SPD Bytes in E2PROM 80  
1
Total number of Bytes in E2PROM  
Memory Type (DDR = 07h)  
Number of Row Addresses  
Number of Column Addresses  
Number of DIMM Ranks  
Data Width (LSB)  
08  
07  
0D  
0B  
02  
40  
00  
04  
60  
70  
00  
82  
08  
00  
01  
0E  
08  
08  
2
07  
07  
3
0D  
0B  
02  
0D  
0B  
02  
4
5
6
40  
40  
7
Data Width (MSB)  
00  
00  
8
Interface Voltage Levels  
04  
04  
9
t
t
CK @ CLmax (Byte 18) [ns]  
60  
60  
10  
11  
12  
13  
14  
15  
16  
17  
18  
19  
20  
21  
22  
23  
24  
25  
26  
AC SDRAM @ CLmax (Byte 18) [ns]  
70  
70  
Error Correction Support  
Refresh Rate  
00  
00  
82  
82  
Primary SDRAM Width  
Error Checking SDRAM Width  
08  
08  
00  
00  
t
CCD [cycles]  
Burst Length Supported  
Number of Banks on SDRAM Device 04  
01  
01  
0E  
04  
0E  
04  
CAS Latency  
0C  
01  
02  
20  
C1  
75  
70  
00  
00  
0C  
01  
0C  
01  
CS Latency  
Write Latency  
02  
02  
DIMM Attributes  
Component Attributes  
20  
20  
C1  
75  
C1  
75  
t
t
t
t
CK @ CLmax -0.5 (Byte 18) [ns]  
AC SDRAM @ CLmax -0.5 [ns]  
CK @ CLmax -1 (Byte 18) [ns]  
AC SDRAM @ CLmax -1 [ns]  
70  
70  
00  
00  
00  
00  
Data Sheet  
24  
Rev. 1.0, 2004-07  
08262003-Y0OJ-UPC6  
HYS64D128021[G/H/E]BDL–[5/6]–B  
Small Outline DDR SDRAM Modules  
SPD Contents  
Table 12  
SPD Codes for HYS64D128021[H/G]BDL–6–B (cont’d)  
1 GByte  
×64  
1 GByte  
×64  
1 GByte  
×64  
2 Ranks  
2 Ranks  
2 Ranks  
Label Code  
PC2700S–2533–0 PC2700S–2533–0 PC2700S–2533–0  
Jedec SPD Revision  
Description  
Rev 0.0  
HEX  
48  
Rev 0.0  
HEX  
48  
Rev 0.0  
HEX  
48  
Byte#  
27  
t
t
t
t
RPmin [ns]  
RRDmin [ns]  
RCDmin [ns]  
RASmin [ns]  
28  
30  
30  
30  
29  
48  
48  
48  
30  
2A  
80  
2A  
80  
2A  
80  
31  
Module Density per Rank  
tAS, tCS [ns]  
32  
75  
75  
75  
33  
tAH, TCH [ns]  
75  
75  
75  
34  
t
t
DS [ns]  
DH [ns]  
45  
45  
45  
35  
45  
45  
45  
36 – 40  
41  
not used  
00  
00  
00  
t
t
t
t
t
RCmin [ns]  
3C  
48  
3C  
48  
3C  
48  
42  
RFCmin [ns]  
CKmax [ns]  
DQSQmax [ns]  
QHSmax [ns]  
43  
30  
30  
30  
44  
28  
28  
28  
45  
50  
50  
50  
46  
not used  
00  
00  
00  
47  
DIMM PCB Height  
00  
00  
00  
48 – 61  
62  
not used  
00  
00  
00  
SPD Revision  
00  
00  
00  
63  
Checksum of Byte 0-62  
JEDEC ID Code of Infineon (1)  
JEDEC ID Code of Infineon (2 – 8)  
Module Manufacturer Location  
Part Number, Char 1  
Part Number, Char 2  
Part Number, Char 3  
Part Number, Char 4  
39  
39  
39  
64  
C1  
00  
C1  
00  
C1  
00  
65 – 71  
72  
xx  
xx  
xx  
73  
36  
36  
36  
74  
34  
34  
34  
75  
44  
44  
44  
76  
31  
31  
31  
Data Sheet  
25  
Rev. 1.0, 2004-07  
08262003-Y0OJ-UPC6  
HYS64D128021[G/H/E]BDL–[5/6]–B  
Small Outline DDR SDRAM Modules  
SPD Contents  
Table 12  
SPD Codes for HYS64D128021[H/G]BDL–6–B (cont’d)  
1 GByte  
×64  
1 GByte  
×64  
1 GByte  
×64  
2 Ranks  
2 Ranks  
2 Ranks  
Label Code  
PC2700S–2533–0 PC2700S–2533–0 PC2700S–2533–0  
Jedec SPD Revision  
Description  
Rev 0.0  
HEX  
32  
Rev 0.0  
HEX  
32  
Rev 0.0  
HEX  
32  
Byte#  
77  
Part Number, Char 5  
Part Number, Char 6  
Part Number, Char 7  
Part Number, Char 8  
Part Number, Char 9  
Part Number, Char 10  
Part Number, Char 11  
Part Number, Char 12  
Part Number, Char 13  
Part Number, Char 14  
Part Number, Char 15  
Part Number, Char 16  
Part Number, Char 17  
Part Number, Char 18  
Module Revision Code  
Test Program Revision Code  
Module Manufacturing Date Year  
Module Manufacturing Date Week  
Module Serial Number (1 – 4)  
78  
38  
38  
38  
79  
30  
30  
30  
80  
32  
32  
32  
81  
31  
31  
31  
82  
48  
45  
47  
83  
42  
42  
42  
84  
44  
44  
44  
85  
4C  
36  
4C  
36  
4C  
36  
86  
87  
42  
42  
42  
88  
20  
20  
20  
89  
20  
20  
20  
90  
20  
20  
20  
91  
xx  
xx  
xx  
92  
xx  
xx  
xx  
93  
xx  
xx  
xx  
94  
xx  
xx  
xx  
95 – 98  
xx  
xx  
xx  
99 – 127 not used  
00  
00  
00  
Data Sheet  
26  
Rev. 1.0, 2004-07  
08262003-Y0OJ-UPC6  
HYS64D128021[G/H/E]BDL–[5/6]–B  
Small Outline DDR SDRAM Modules  
Package Outlines  
5
Package Outlines  
67.6  
3.8 MAX.  
±0.1  
63.6  
1
199  
±0.1  
(2.15)  
(2.45)  
1
±0.1  
18.45  
0.15  
±0.1  
1.8  
(2.4)  
±0.1  
11.4  
±0.1  
47.4  
(2.7)  
(2.15)  
200  
(2.45)  
±0.1  
1.5  
±0.1  
1
2
2 MIN.  
Detail of contacts  
±0.03  
0.45  
±0.1  
0.6  
Burnished, no burr allowed  
GLD09573  
Figure 3  
Package Outline SO-DIMM L-DIM-200-22  
Data Sheet  
27  
Rev. 1.0, 2004-07  
w w w . i n f i n e o n . c o m  
Published by Infineon Technologies AG  
厂商 型号 描述 页数 下载

INFINEON

HYS64-72V2200GU-8 3.3V 2M ×64 /72- 1位BANK SDRAM模块3.3V 4M ×64 /72- 2位BANK SDRAM模块[ 3.3V 2M x 64/72-Bit 1 BANK SDRAM Module 3.3V 4M x 64/72-Bit 2 BANK SDRAM Module ] 17 页

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HYS64-74V8200GU 3.3 V 8M ×64 /72- 1位银行SDRAM模块3.3 V 16M ×64 /72- 2位银行SDRAM模块[ 3.3 V 8M x 64/72-Bit 1 Bank SDRAM Module 3.3 V 16M x 64/72-Bit 2 Bank SDRAM Module ] 17 页

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HYS6472V16200GU 3.3 V 16M ×64 /72-位SDRAM模块3.3 V 32M ×64 /72-位SDRAM模块3.3 V 64M ×64 /72-位SDRAM模块[ 3.3 V 16M x 64/72-Bit SDRAM Modules 3.3 V 32M x 64/72-Bit SDRAM Modules 3.3 V 64M x 64/72-Bit SDRAM Modules ] 17 页

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HYS64D128020GBDL-7-A ? 1GB ( 1024Mx64 ) PC2100 2银行?\n[ ?1GB (1024Mx64) PC2100 2-bank? ] 11 页

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HYS64D128020GU-7-A 2.5 V 184针无缓冲DDR- SDRAM我模块[ 2.5 V 184-pin Unbuffered DDR-I SDRAM Modules ] 18 页

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