IXSH 20N60B2D1
Symbol
gfs
TestConditions
Characteristic Values
TO-247 Outline
(TJ = 25°C, unless otherwise specified)
min.
typ.
max.
IC = 16A; VCE = 10 V, Note 1
3.5
7.0
S
Cies
Coes
Cres
800
110
28
pF
pF
pF
1
2
3
VCE = 25 V, VGE = 0 V
f = 1 MHz
Qg
33
12
12
nC
nC
nC
Qge
Qgc
IC = 16A, VGE = 15 V, VCE = 0.5 VCES
Terminals: 1 - Gate
3 - Source
2 - Drain
Tab - Drain
Inductive load, TJ = 25°C
td(on)
tri
td(off)
tfi
30
30
ns
ns
ns
ns
Dim.
Millimeter
Min. Max.
Inches
Min. Max.
IC = 16A, VGE = 15 V
V
= 0.8 V , RG = 10 Ω
SCwEitching tiCmESes may increase for VCE
(Clamp) > 0.8 • VCES, higher TJ or
increased RG
A
A12
4.7
2.2
2.2
5.3
2.54
2.6
.185 .209
.087 .102
.059 .098
.040 .055
.065 .084
.113 .123
116
126
380
A
b
b12
1.0
1.65
2.87
1.4
2.13
3.12
Eoff
600 µJ
b
td(on)
tri
30
30
ns
ns
mJ
ns
ns
µJ
C
D
E
.4
.8
.016 .031
.819 .845
.610 .640
Inductive load, TJ = 125°C
20.80 21.46
15.75 16.26
IC = 16 A, VGE = 15 V
e
5.20
19.81 20.32
4.50
5.72 0.205 0.225
Eon
td(off)
tfi
0.52
180
210
970
VCE = 0.8 VCES, RG = 10 Ω
Switching times may increase for
L
.780 .800
.177
.140 .144
L1
V
CE (Clamp) > 0.8 • VCES, higher TJ
∅P 3.55
Q
R
S
3.65
or increased RG
5.89
4.32
6.15 BSC
6.40 0.232 0.252
Eoff
5.49
.170 .216
242 BSC
RthJC
RthCS
0.66 K/W
K/W
0.25
Reverse Diode (FRED)
Characteristic Values
(TJ = 25°C, unless otherwise specified)
min. typ. max.
Symbol
VF
TestConditions
IF = 15A, VGE = 0 V
TJ =150°C
1.35
2.10
V
V
IRM
trr
IF = 25A, VGE = 0 V, -diF/dt = 100 A/µs
TJ = 100°C 4.5
TJ = 100°C 110
A
VR = 100 V
ns
trr
IF = 1 A; -di/dt = 100 A/µs; VR = 30 V
30
ns
RthJC
1.6 K/W
Note 1: Pulse test, t ≤ 300 µs, duty cycle d ≤ 2 %
IXYSMOSFETs andIGBTsarecovered by
oneormoreofthefollowingU.S.patents:
4,835,592
4,850,072
4,881,106
4,931,844
5,017,508
5,034,796
5,049,961
5,063,307
5,187,117
5,237,481
5,381,025
5,486,715
6,162,665
6,259,123B1
6,306,728 B1
6,404,065B1
6,534,343
6,583,505
6,683,344
6,710,405B2
6,710,463
6,727,585
6,759,692