UPS840e3
POWERMITE 3™ SURFACE MOUNT
8 AMP 40 V SCHOTTKY RECTIFIER
S C O T T S D A L E D I V I S I O N
DESCRIPTION
APPEARANCE
The UPS840e3 offers a small and powerful surface mount package that is
RoHS compliant for a 40 Volt 8 Amp rated Schottky. These ratings are found
only in much larger packages. They are ideal for surface mount applications
that operate at high frequencies with their “hot carrier” features that provide
extremely fast switching. The very low thermal resistance of the patented
Powermite 3™ package design with a full metallic bottom and unique locking
tab act as an efficient heat path to a heat sink mounting permitting cooler operating
junction temperatures for minimal reverse leakage currents and lower power
loss. It is also ideal for automatic insertion equipment.
Powermite 3™
IMPORTANT: For the most current data, consult MICROSEMI’s website: http://www.microsemi.com
FEATURES
APPLICATIONS / BENEFITS
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Low profile package (<1.1 mm)
Small footprint area of 16.51 mm2
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High current capability with low forward voltage
Guard-ring-die construction for transient protection
Plastic package has Underwriters Laboratory
Flammability classification 94V-0
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Silicon Schottky (hot carrier) rectifier for minimal t
and minimal reverse recovery voltage
rr
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Unique locking tab on bottom acts as integral efficient
heat path to heat sink (mounting substrate)
Elimination of reverse-recovery oscillations to
reduce need for EMI filtering
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Metal to silicon rectifier, majority carrier conduction
RoHS compliant with e3 suffix part number
For use in high-frequency switching power supplies,
inverters, free wheeling, charge pump circuits and
polarity protection applications
Options for screening in accordance with MIL-PRF-
19500 for JAN, JANTX, and JANTXV are available by
adding MQ, MX, or MV prefixes respectively to part
numbers. For example, designate a MXUPS840e3 for
a JANTX screen. Consult factory for Tin-Lead
plating.
Optional avionics screening available by adding MA
prefix for 100% temperature cycling, thermal
impedance testing, and 24 hours HTRB. For example,
designate a MAUPS840e3. Consult factory for Tin-
Lead plating.
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Lower forward power loss and high efficiency
Low inductive parasitics (<2nH) for minimal Ldi/dt
effects
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Robust package configuration for pick-and-place
handling
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Full-metallic bottom eliminates flux entrapment
Small foot print with 0.190 x 0.270 inches (see
mounting pad details on last page)
MAXIMUM RATINGS
MECHANICAL AND PACKAGING
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Storage temperature (TSTG): -55 oC to +150oC
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Terminals: Copper with annealed matte-Tin plating
for RoHS compliance solderable per MIL-STD-750
method 2026 (consult factory for Tin-Lead plating.)
Polarity: Two-leads on side are internally
connected together for anode and backside is
cathode
Marking: Body marked with S840•
Molded epoxy package meets UL94V-0
Weight: 0.072 grams (approximate)
Operating junction temperature (TJ ): -55 oC to +125oC
Average forward rectified current (IO) @TC=100oC: 8.0
Amps
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Forward surge current (IFSM) 8.3 ms single half-sine
waveform superimposed on rated load (JEDEC
Method): 150 Amps
Thermal resistance (RθJC): 2.5 oC/W
Thermal resistance (RθJA): 65 oC/W on PCB with FR4
using 2 oz Copper and recommended mounting pad size
(see pad layout next page)
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Tape & Reel packaging per EIA-481-2 with 16 mm
tape and 5000 units/ 13 inch reel)
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See package dimensions on last page
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Typical junction capacitance (CJ) at 1.0 MHz and VR of
4.0 Volts: 700 pF
Solder temperatures: 260 ºC for 10 s (maximum)
Copyright © 2007
6-26-07 REV B
Microsemi
Page 1
Scottsdale Division
8700 E. Thomas Rd. PO Box 1390, Scottsdale, AZ 85252 USA, (480) 941-6300, Fax: (480) 947-1503
