F-219
QSS–075–01–F–D–A
QSS–050–01–F–D–A
®
QSS–025–01–L–D–A
(0.635 mm) .025"
QSS SERIES
HIGH-SPEED GROUND PLANE SOCKET
Board Mates:
Integral metal plane
for power or ground
10 YEAR MFG
WITH 50 µ" GOLD
SPECIFICATIONS
For complete specifications and
recommended PCB layouts see
www.samtec.com?QSS
QTS
EXTENDED LIFE
PRODUCT
Cable Mates:
SQCD
HIGH MATING
CYCLES
Standoffs:
Insulator Material:
Liquid Crystal Polymer
Contact Material:
Phosphor Bronze
Plating:
Polarized
SO
Au or Sn over
POWER/SIGNAL
APPLICATION
50 µ" (1.27 µm) Ni
Current Rating:
Contact: 1.8 A per pin
(2 pins powered)
Ground Plane:
23.1 A per ground plane
(1 ground plane powered)
Operating Temp:
-55 °C to +125 °C
Voltage Rating:
285 VAC
Blade & Beam
Design
Alignment
Pin
HIGH-SPEED CHANNEL PERFORMANCE
Max Cycles:
QSS/QTS @ 5 mm Mated Stack Height
100
Rating based on Samtec reference channel.
For full SI performance data visit Samtec.com
RoHS Compliant:
Yes
Compatible with
UMPT/UMPS for flexible
two-piece power/signal solutions
25
or contact SIG@samtec.com
G
b p s
PROCESSING
Lead–Free Solderable:
Yes
NO. OF POSITIONS
PLATING
OPTION
OTHER
OPTION
QSS
01
D
A
PER ROW
SMT Lead Coplanarity:
(0.10 mm) .004" max (025-050)
(0.15 mm) .006" max (075)*
*(.004" stencil solution
may be available; contact
IPG@samtec.com)
–GP
Board Stacking:
= Guide Holes
for mating
–F
For applications requiring more
than two connectors per board
contact ipg@samtec.com
–025, –050, –075
= Gold Flash on Signal Pins and
Ground Plane, MatteTin on tails
(50 total positions per bank)
with QTS-RA
–K
= (8.25 mm)
.325" DIA
Polyimide Film
Pick &
–L
RECOGNITIONS
= 10 µ" (0.25 µm) Gold on Signal Pins
and Ground Plane, MatteTin on tails
For complete scope of
recognitions see
www.samtec.com/quality
(No. of Positions per Row/25) x
(20.00) .7875 + (1.27) .050
(20.00) .7875
–C*
Place Pad
= Electro-Polished Selective
50 µ" (1.27 µm) min Au over
150 µ" (3.81 µm) Ni on Signal Pins
in contact area, 10 µ" (0.25 µm) min
Au over 50 µ" (1.27 µm) Ni on
Ground Plane in contact area,
Matte Tin over 50 µ" (1.27 µm) min
Ni on all solder tails
02
01
–TR
FILE NO. E111594
(7.49)
.295
= Tape & Reel
ALSO AVAILABLE
(0.635)
.025
(0.15)
.006
(MOQ Required)
• 11 mm & 16 mm
stack height
(No. of Positions per Row/25) x
(20.00) .7875 + (10.90) .429
*Note: –C Plating passes
10 year MFG testing
• 30 µ" (0.76 µm) Gold
02
01
• Differential Pair and
“Partitionable” (combine
differential & single-ended
banks in same connector)
available.
(3.56)
.140
DIA
QTS
LEAD STYLE
MATED HEIGHT
WITH QSS
(5.00) .197
(8.00) .315
(No. of Positions per Row/25) x
(20.00) .7875 + (5.72) .225
• 100 & 125 positions per row
• Edge Mount
–01
–02
(7.24)
.285
• –LS2 Locking screw hole
for QTS–RA–LS2
Processing conditions will affect
mated height. See SO Series for
board space tolerances
(0.76)
.030
(0.89)
Note:
.035
DIA
(3.63)
.143
Some lengths, styles and
options are non-standard,
non-returnable.
Due to technical progress, all designs, specifications and components are subject to change without notice.
WWW.SAMTEC.COM
All parts within this catalog are built to Samtec’s specifications.
Customer specific requirements must be approved by Samtec and identified in a Samtec customer-specific drawing to apply.
