HiPerFASTTM IGBT with Diode
VCES
IC25 VCE(sat)
IXSH 24N60U1
IXSH24N60AU1
600V
600V
48 A 2.2V
48 A 2.7V
Short Circuit SOA Capability
Symbol
TestConditions
MaximumRatings
TO-247 AD
VCES
VCGR
TJ = 25°C to 150°C600
TJ = 25°C to 150°C; RGE = 1 MW
V
600
V
C (TAB)
VGES
VGEM
Continuous
Transient
±20
±30
V
V
G
C
E
G = Gate,
E = Emitter,
C = Collector,
TAB = Collector
IC25
IC90
ICM
TC = 25°C
TC = 90°C
TC = 25°C, 1 ms
48
24
96
A
A
A
SSOA
(RBSOA)
VGE= 15 V, TVJ = 125°C, RG = 10 W
Clamped inductive load, L = 100 mH
ICM = 48
@ 0.8 VCES
A
ms
W
Features
tSC
(SCSOA)
VGE= 15 V, VCE = 360 V, TJ = 125°C,
RG = 82 W, non-repetitive
10
• Internationalstandardpackage
JEDEC TO-247 AD
• HighfrequencyIGBTandanti-parallel
FRED in one package
PC
TC = 25°C
150
TJ
TJM
Tstg
-55 ... +150
150
-55 ... +150
°C
°C
°C
• 2nd generation HDMOSTM process
• Low VCE(sat)
- forminimumon-stateconduction
losses
• MOS Gate turn-on
- drive simplicity
• Fast RecoveryEpitaxial Diode (FRED)
- soft recovery with low IRM
Maximum Lead temperature for soldering
1.6 mm (0.062 in.) from case for 10 s
Maximum Tab temperature for soldering SMD devices for 10 s
300
°C
°C
260
Md
Mounting torque, TO-247
1.13/10 Nm/lb.in.
Weight
TO-247 AD
6
g
Applications
• AC motor speed control
• DC servo and robot drives
• DC choppers
• Uninterruptiblepowersupplies(UPS)
• Switch-modeandresonant-mode
powersupplies
Symbol
TestConditions
CharacteristicValues
(TJ = 25°C, unless otherwise specified)
min. typ. max.
BVCES
VGE(th)
IC = 750 mA, VGE = 0 V
IC = 1.5 mA, VCE = VGE
600
3.5
V
V
6.5
Advantages
ICES
VCE = 0.8 • VCES
VGE = 0 V
TJ = 25°C
TJ = 125°C
500
8
mA
mA
• Space savings (two devices in one
package)
• Suitableforsurfacemounting
• Easy to mount with 1 screw, TO-247
(isolatedmountingscrewhole)
• Reduces assembly time and cost
IGES
VCE = 0 V, VGE = ±20 V
±100
nA
VCE(sat)
IC = IC90, VGE = 15 V
IXSH 24N60U1
IXSH 24N60AU1
2.2
2.7
V
V
IXYS reserves the right to change limits, test conditions, and dimensions.
© 2000 IXYS All rights reserved
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