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1SS383T1G

型号:

1SS383T1G

品牌:

ROCHESTER[ Rochester Electronics ]

页数:

3 页

PDF大小:

719 K

1SS383T1G  
Preferred Device  
Dual Schottky Diode  
Dual 40 V, 300 mA Low V Schottky Diodes in 4−lead SC−82  
F
package.  
Features  
Low Forward Voltage: V = 0.48 V (typ) @ I = 100 mA  
F
F
http://onsemi.com  
Low Reverse Current: I = 5 mA (max)  
R
This is a Pb−Free Device*  
4
3
MAXIMUM RATINGS (T = 25°C)  
A
Rating  
Symbol  
Max  
40  
Unit  
V
1
2
Continuous Reverse Voltage  
Maximum Peak Forward Current*  
V
R
I
300  
500  
mA  
mA  
FM  
I
FM(surge)  
Peak Forward Surge Current  
Pulse Width = 10 ms  
THERMAL CHARACTERISTICS  
Characteristic  
(Both Junctions Heated)  
Symbol  
Max  
Unit  
SC−82  
CASE 900AA  
Total Device Dissipation  
P
D
T = 25°C  
200  
(Note 1)  
1.6  
mW  
A
Derate above 25°C  
mW/°C  
(Note 1)  
MARKING DIAGRAM  
Thermal Resistance,  
Junction-to-Ambient  
R
625  
(Note 1)  
°C/W  
°C  
q
JA  
Junction and Storage  
Temperature  
T , T  
J
55 to +150  
stg  
G
AE  
Stresses exceeding Maximum Ratings may damage the device. Maximum  
Ratings are stress ratings only. Functional operation above the Recommended  
Operating Conditions is not implied. Extended exposure to stresses above the  
Recommended Operating Conditions may affect device reliability.  
*Both Devices Active  
G
1. FR−4 @ Minimum Pad.  
AE= Specific Device Code  
M = Date Code  
ELECTRICAL CHARACTERISTICS (T = 25°C unless otherwise noted)  
A
G
= Pb−Free Package  
Characteristic  
Symbol Min Typ Max  
Unit  
(Note: Microdot may be in either location)  
Forward Voltage  
V
F
mV  
280  
360  
540 600  
(I = 1.0 mA)  
F
(I = 10 mA)  
F
ORDERING INFORMATION  
(I = 100 mA)  
F
Device  
Package  
Shipping  
Reverse Current  
I
R
mA  
5
(V = 40 V)  
R
1SS383T1G  
SC−82  
(Pb−Free)  
3000/Tape & Reel  
Capacitance  
(V = 0, f = 1.0 MHz)  
R
C
pF  
D
25  
†For information on tape and reel specifications,  
including part orientation and tape sizes, please  
refer to our Tape and Reel Packaging Specification  
Brochure, BRD8011/D.  
*For additional information on our Pb−Free strategy and soldering details, please  
download the ON Semiconductor Soldering and Mounting Techniques  
Reference Manual, SOLDERRM/D.  
Preferred devices are recommended choices for future use  
and best overall value.  
© Semiconductor Components Industries, LLC, 2006  
1
Publication Order Number:  
March, 2006 − Rev. 2  
1SS383T1G/D  
 
1SS383T1G  
PACKAGE DIMENSIONS  
SC−82, 4 LEAD, GULL WING  
CASE 900AA−01  
ISSUE O  
NOTES:  
D
1. DIMENSIONING AND TOLERANCING PER ANSI  
Y14.5M, 1982.  
2. CONTROLLING DIMENSION: MILLIMETERS  
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD  
FINISH THICKNESS. MINIMUM LEAD THICKNESS IS  
THE MINIMUMTHICKNESS OF BASE MATERIAL.  
4. DIMENSIONS A AND B DO NOT INCLUDE MOLD  
FLASH, PROTRUSIONS, OR GATE BURRS.  
4
3
E
b
HE  
MILLIMETERS  
DIM MIN NOM MAX  
INCHES  
NOM MAX  
MIN  
1
2
A
A1  
b
C
D
E
e
HE  
L
0.80  
0
0.10  
0.10  
1.80  
1.15  
0.90  
−−−  
0.20  
0.18  
2.00  
1.25  
1.30 BSC  
2.10  
1.00 0.032 0.035  
0.10 −−− 0.004  
0.04  
0
0.30 0.004 0.008 0.012  
0.25 0.004 0.007 0.010  
2.20 0.071 0.079 0.087  
1.35 0.045 0.049 0.053  
0.051 BSC  
e
2.00  
0.10  
2.20 0.079 0.083 0.087  
0.30 0.004 0.008 0.012  
0.20  
STYLE 1:  
PIN 1. ANODE 1  
2. ANODE 2  
C
A
3. CATHODE 2  
4. CATHODE 1  
L
A1  
ON Semiconductor and  
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice  
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability  
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.  
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All  
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights  
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications  
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should  
Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates,  
and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death  
associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal  
Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.  
PUBLICATION ORDERING INFORMATION  
LITERATURE FULFILLMENT:  
N. American Technical Support: 800−282−9855 Toll Free  
USA/Canada  
ON Semiconductor Website: http://onsemi.com  
Order Literature: http://www.onsemi.com/litorder  
Literature Distribution Center for ON Semiconductor  
P.O. Box 61312, Phoenix, Arizona 85082−1312 USA  
Phone: 480−829−7710 or 800−344−3860 Toll Free USA/Canada  
Fax: 480−829−7709 or 800−344−3867 Toll Free USA/Canada  
Email: orderlit@onsemi.com  
Japan: ON Semiconductor, Japan Customer Focus Center  
2−9−1 Kamimeguro, Meguro−ku, Tokyo, Japan 153−0051  
Phone: 81−3−5773−3850  
For additional information, please contact your  
local Sales Representative.  
1SS383T1G/D  
厂商 型号 描述 页数 下载

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