Chip Resistor Networks
Safety Precautions
1. Soldering
Recommendations for soldering method.
lRecommended soldering conditions for reflow
áReflow soldering should be a maximum of two times
áPlease contact us for additional information when
used in conditions other than those specified.
áPlease measure the temperature of the terminations and
For solder (Example : Sn/Pb)
Temperature
140 ¡C to 160 ¡C
Above 200 ¡C
235 ± 5 ¡C
Time
Preheating
Main heating
Peak
60 s to 120 s
30 s to 40 s
max. 10 s
every type of the printed circuit board for solderability,
study
before actual use.
For lead-free solder (Example : Sn/Ag/Cu)
Temperature
Time
Preheating
Main heating
Peak
150 ¡C to 180 ¡C
Above 230 ¡C
max. 260 ¡C
60 s to 120 s
30 s to 40 s
max. 10 s
l Flow soldering
Cosult us for using flow soldering to EXBA series. Flow soldering is not recommended for Chip Resistor Networks:
EXBD/EXBE/EXBQ, because solder bridge may occur due to the 0.635 mm/0.8 mm/0.5 mm pitch of
EXBD/EXBE/EXBQ series.
l Iron soldering
1 Solder at 350 ¡C max. and 3 seconds max. with the soldering iron tip.
2 The soldering iron tip shall not touch the protective coating of the part.
l Use rosin type flux. Do not use high-activity flux (the chlorine content is 0.2 wt% or more).
l Allow enough preheating so that the difference of soldering temperature and surface
temperature of the part is 100 ¡C or less. This temperature difference should be controlled by immersion into solvent.
l Avoiding excessive amounts of solder. More solder causes mechanical stress to the part which may result in cracking
or impaired characteristics.
2. Cleaning
l Residual flux after board washing may cause solder migration. Carefully monitor board after washing.
Carefully select the type and amount of flux to be used when no washing is done. Study type of water-soluble flux and
cleaning agent and drying condition when water washing is done. Confirm that cleaning will not affect the device
performace.
3. Others
l Take necessary precautions to avoid any abnormal stress caused by bending of the board.
l Do not use the product in high humidity atmospheres.
Design, Specifications are subject to change without notice. Ask factory for technical specifications before purchase and/ or use.
Whenever a doubt about safety arises from this product, please inform us immediately for technical consultation without fail.
