F-211
QTE–014–01–F–D–DP–A
®
QTE–014–01–L–D–A–RT1
QTE–060–01–L–D–A
(0,80mm) .0315"
QTE SERIES
HIGH SPEED GROUND PLANE HEADER
Integral metal plane
for power or ground
Standard
Board Mates:
stack heights
from 5mm
to 25mm
SPECIFICATIONS
QSE
For complete specifications and
recommended PCB layouts see
www.samtec.com?QTE
• E.L.P.TM plating
option (–C)
Cable Mates:
EQCD, EQSD,
EQDP, EQRF
(See Application
Specific note)
®
• Retention pin option
Insulator Material:
Liquid Crystal
Polymer
Terminal Material:
Phosphor Bronze
Plating:
TM
Au or Sn over 50µ" (1,27µm) Ni
Current Rating:
Contacts: 1.3A @ 95°C
Ground Plane: 10.1A @ 95°C
Operating Temp Range:
-55°C to +125°C
EXTENDED LIFE PRODUCT
10 year Mixed Flowing Gas with 50µ" Gold
Call Samtec for maximum cycles mated with QSE
Voltage Rating:
225 VAC mated with QSE
& 5mm Stack Height
Max Cycles: 100
Unmating Force (-RT1 option):
-RT1 option increases
unmating force up to 50%
RoHS Compliant:
Yes
Polarized
5mm Stack Height
Type
–D
Rated @ 3dB Insertion Loss
9 GHz / 18 Gbps
Single-Ended Signaling
Differential Pair Signaling
Differential Pair Signaling
ALSO
AVAILABLE
–D
8 GHz / 16 Gbps
–DP
8.5 GHz / 17 Gbps
Board Spacing Standoffs.
Performance data for other stack heights and complete test data
available at www.samtec.com?QTE or contact sig@samtec.com
See SO Series.
Processing:
Lead–Free Solderable:
Yes
LEAD
STYLE
PINS PER ROW
NO. OF PAIRS
PLATING
OPTION
OTHER
OPTION
SMT Lead Coplanarity:
(0,10mm) .004" max (020-060)
(0,15mm) .006" max (080)
Board Stacking:
TYPE
QTE
A
For applications requiring
more than two connectors
per board or 4 banks or more,
contact ipg@samtec.com
Specify
LEAD
STYLE
from
–K
= (7,00mm)
.275" DIA
–F
–D
–020, –040, –060, –080
= Gold Flash
= Single-Ended
(40 total pins per bank = –D)
Polyimide Film
Pick & Place
Pad
on Signal Pins and
Ground Plane,
Matte Tin on tails
APPLICATION
SPECIFIC OPTION
chart
–D–DP
= Differential Pair
(–01 only)
–014, –028, –042, –056
(14 pairs per bank = –D–DP)
• 14mm, 15mm, 22mm
and 30mm stack height
(Caution: Some automatic
placement/inspection
machines may have
component height
restrictions. Please
consult machinery
specifications.)
• 30µ" (0,76µm) Gold
(Specify -H plating for
Data Rate cable mating
applications.)
• Edge Mount
• 100 positions per row
–TR
–L
–D–DP = (No. of Positions per Row/14)
x (20,00) .7875
= Tape & Reel
Packaging
= 10µ" (0,25µm)
Gold on Signal Pins
and Ground Plane,
Matte Tin on tails
(N/A on 56 &
80 positions)
–D = (No. of Positions per Row/20)
x (20,00) .7875
(20,00) .7875
01
02
–RT1
= Retention
Option
–C*
(5,97)
.235
= Electro-Polished
Selective
(7,11)
.280
(-01 Lead
50µ" (1,27µm) min
Au over 150µ"
Style only)
(N/A on 56 &
80 positions
or –L (latch)
option)
QTE
LEAD
STYLE
HEIGHT
WITH
QSE*
(0,80)
.0315
(0,20)
.008
A
(3,81µm) Ni on Signal
Pins in contact area,
10µ" (0,25µm) min Au
over 50µ" (1,27µm) Ni
on Ground Plane in
contact area,
Matte Tin over 50µ"
(1,27µm) min Ni on
all solder tails
(4,27) (5,00)
.168 .197
–01
–02
–03
–04
–05
–07
A
(7,26) (8,00)
.286 .315
–L
(10,27) (11,00)
.404 .433
• Guide Posts, Screw Down
& Friction Lock
Call Samtec.
= Latching
Option
(3,30)
.130
(15,25) (16,00)
.600 .630
(N/A on 42,
56, 60 & 80
positions or
–RT1 option)
(0,76)
.030
(1,57)
.062
(18,26) (19,00)
.718 .748
(24,24) (25,00)
.954 .984
*Note: –C Plating passes
10 year MFG testing
(0,64)
.025
(1,57)
.062
DIA
(0,89)
.035 DIA
*Processing conditions
will affect mated height.
Note: Some lengths, styles
and options are non-standard,
non-returnable.
––L
–RT1
WWW.SAMTEC.COM
