IXBF12N300
Symbol Test Conditions
(TJ = 25°C Unless Otherwise Specified)
Characteristic Values
ISOPLUS i4-PakTM (HV) Outline
Min.
Typ.
Max.
gfS
IC = 12A, VCE = 10V, Note 1
VCE = 25V, VGE = 0V, f = 1MHz
6.5
10.8
S
Cies
Coes
Cres
1290
56
pF
pF
pF
19
Qg
62
13
nC
nC
nC
Qge
Qgc
IC = 12A, VGE = 15V, VCE = 1000V
8.5
td(on)
tr
td(off)
tf
td(on)
tr
td(off)
tf
64
140
180
540
ns
ns
ns
ns
Resistive Switching Times, TJ = 25°C
Pin 1 = Gate
IC = 12A, VGE = 15V
Pin2 = Emitter
Pin 3 = Collector
Tab 4 = Isolated
VCE = 1250V, RG = 10Ω
65
395
175
530
ns
ns
ns
ns
Resistive Switching Times, TJ = 125°C
IC = 12A, VGE = 15V
VCE = 1250V, RG = 10Ω
RthJC
RthCS
1.00 °C/W
°C/W
0.15
Reverse Diode
Symbol Test Conditions
Characteristic Values
(TJ = 25°C Unless Otherwise Specified)
Min.
Typ.
Max.
VF
trr
IF = 12A, VGE = 0V
2.1
V
μs
A
1.4
21
IF = 6A, VGE = 0V, -diF/dt = 100A/μs
VR = 100V, VGE = 0V
IRM
Notes:
1. Pulse test, t ≤ 300μs, duty cycle, d ≤ 2%.
2. Device must be heatsunk for high temperature leakage current
measurements to avoid thermal runaway.
IXYS Reserves the Right to Change Limits, Test Conditions and Dimensions.
IXYS MOSFETs and IGBTs are covered
by one or more of the following U.S. patents: 4,860,072 5,017,508
4,881,106 5,034,796
4,835,592 4,931,844
5,049,961
5,063,307
5,187,117
5,237,481
5,381,025
5,486,715
6,162,665
6,259,123 B1
6,306,728 B1
6,404,065 B1 6,683,344
6,534,343
6,583,505
6,727,585
6,710,405 B2 6,759,692
6,710,463
7,005,734 B2 7,157,338B2
7,063,975 B2
6,771,478 B2 7,071,537