F-212-1
QTE–014–01–F–D–DP–A
®
QTE–014–01–L–D–A–RT1
QTE–060–01–L–D–A
(0,80 mm) .0315"
QTE SERIES
HIGH SPEED GROUND PLANE HEADER
Integral metal plane
for power or ground
Board Mates:
QSE
Standard stack heights
from 5 mm to 25 mm
SPECIFICATIONS
®
For complete specifications and
recommended PCB layouts see
www.samtec.com?QTE
Cable Mates:
EQCD, EQSD, EQDP, EQRF
(See Application Specific note)
Insulator Material:
Liquid Crystal
Polymer
TM
Terminal Material:
Phosphor Bronze
Plating:
EXTENDED LIFE PRODUCT
Au or Sn over
50µ" (1,27 µm) Ni
Current Rating:
10 year Mixed Flowing Gas with 50µ" Gold
Call Samtec for maximum cycles mated with QSE
Contacts: 1.3A @ 95°C
Ground Plane: 10.1A @ 95°C
Operating Temp Range:
-55°C to +125°C
Rated @ 3dB Insertion Loss
with PCB effects* w/o PCB effects**
QTE/QSE
Type
5mm Stack Height
Voltage Rating:
Single-Ended Signaling
–D 9 GHz / 18 Gbps
9 GHz / 18 Gbps
14 GHz / 28 Gbps
Polarized
225 VAC mated with QSE
& 5 mm Stack Height
Max Cycles: 100
Unmating Force (-RT1 option):
-RT1 option increases
unmating force up to 50%
RoHS Compliant:
Yes
Differential Pair Signaling –D 8 GHz / 16 Gbps
Differential Pair Signaling –DP 8.5 GHz / 17 Gbps 13.5 GHz / 27 Gbps
*Performance data includes effects of a non-optimized PCB.
**Test board losses de-embedded from performance data.
ALSO
AVAILABLE
Board Spacing Standoffs.
See SO Series.
Performance data for other stack heights and complete test data
available at www.samtec.com?QTE or contact sig@samtec.com
Processing:
Lead–Free Solderable:
Yes
LEAD
STYLE
PINS PER ROW
NO. OF PAIRS
PLATING
OPTION
OTHER
OPTION
TYPE
QTE
A
SMT Lead Coplanarity:
(0,10 mm) .004" max (020-060)
(0,15 mm) .006" max (080)
Board Stacking:
For applications requiring
more than two connectors
per board or 4 banks or more,
contact ipg@samtec.com
Specify
LEAD
STYLE
from
–K
= (7,00 mm)
.275" DIA
Polyimide Film
Pick & Place
Pad
–F
–D
–020, –040, –060, –080
= Gold Flash
= Single-Ended
(40 total pins per bank = –D)
on Signal Pins and
Ground Plane,
Matte Tin on tails
APPLICATION
SPECIFIC OPTION
chart
–D–DP
= Differential Pair
(–01 only)
–014, –028, –042, –056
(14 pairs per bank = –D–DP)
• 14mm, 15 mm, 22 mm
and 30 mm stack height
(Caution: Some automatic
placement/inspection
machines may have
component height
restrictions. Please consult
machinery specifications.)
• 30µ" (0,76 µm) Gold
(Specify -H plating for
Data Rate cable mating
applications.)
• Edge Mount
• 100 positions per row
–TR
= Tape & Reel
Packaging
(N/A on 56 &
80 positions or
-05 & -07 lead
style)
–L
–D–DP = (No. of Positions per Row/14)
x (20,00) .7875
= 10µ" (0,25 µm)
Gold on Signal Pins
and Ground Plane,
Matte Tin on tails
–D = (No. of Positions per Row/20)
x (20,00) .7875
(20,00) .7875
01
02
–C*
(5,97)
.235
= Electro-Polished
Selective
(7,11)
.280
–RT1
= Retention
Option
50µ" (1,27 µm) min
Au over 150µ"
QTE
LEAD
STYLE
HEIGHT
WITH
QSE*
(0,80)
.0315
(0,20)
.008
(-01 Lead
A
(3,81 µm) Ni on Signal
Pins in contact area,
10µ" (0,25 µm) min Au
over 50µ" (1,27 µm) Ni
on Ground Plane
in contact area,
Matte Tin over 50µ"
(1,27 µm) min Ni on
all solder tails
Style only)
(N/A on 56 &
80 positions
or –L (latch)
option)
(4,27) (5,00)
.168 .197
–01
–02
–03
–04
–05
–07
A
(7,26) (8,00)
.286 .315
• Guide Posts, Screw Down
& Friction Lock
Call Samtec.
(10,27) (11,00)
.404 .433
(3,30)
.130
–L
(15,25) (16,00)
.600 .630
= Latching
Option
(0,76)
.030
(1,57)
.062
(18,26) (19,00)
.718 .748
(N/A on 42,
56, 60 & 80
positions or
–RT1 option)
(24,24) (25,00)
.954 .984
*Note: –C Plating passes
10 year MFG testing
(0,64)
.025
(1,57)
.062
DIA
(0,89)
.035 DIA
*Processing conditions
will affect mated height.
Note: Some lengths, styles
and options are non-standard,
non-returnable.
––L
–RT1
WWW.SAMTEC.COM
