REVISION R
QSS-XXX-01-XXX-D-EMX
((No OF POSITIONS / 25) x .7875[20.003] + .440[11.18] REF
C1
No OF POSITIONS
((No OF POSITIONS / 25) x .7875[20.003]) + .0100[.254] REF
.7875 20.003
-025, -050, -075,
*-100, *-125
(PER ROW)
02
01
* SEE NOTE 11
EDGE MOUNT THICKNESS
-EM2: .064[1.63] .004 PCB
(USE QSS-25-01-D-EM2-XX & C-162-01-X)
-EM3: (USE QSS-25-01-D-EM3-XX
& C-162-02-X)
LEAD STYLE
-01: .1530[3.886]
.285 7.24
REF
DO NOT
SCALE FROM
THIS PRINT
PLATING SPECIFICATION
-F: FLASH SELECTIVE GOLD, MATTE TIN TAIL
(USE C-162-XX-F & T-1G13-01-F)
-L: LIGHT SELECTIVE GOLD, MATTE TIN TAIL
(USE C-162-XX-L & T-1G13-01-L)
-H: HEAVY GOLD
(USE C-162-XX-H & T-1G13-01-G)
-STL: SELECTIVE GOLD, TIN/LEAD
(USE C-162-XX-STL & T-1G13-01-STL)
-FTL: FLASH SELECTIVE GOLD, TIN/LEAD
(USE C-162-XX-FTL & T-1G13-01-FTL)
'A'
SEE NOTE 10
.6250 15.875
.0255 0.647 REF
REF
ROW SPECIFICATION
-D: DOUBLE (USE QSS-25-01-D-EMX-XX)
24 EQ SPACES
@ .0250[.635]
No OF BANKS
C2
+.0040
-.0000
T-1G13-01-XXX
.1180
2.997+0.10
0.00
QSS-25-01-D-EM3-XX
.1530±.0030 3.886±0.076
(SEE NOTE 5)
QSS-25-01-D-EM2-XX
C-162-01-XXX
.175 4.45
REF
C-162-02-XXX
"A"
.2530 6.426
REF
SEE TABLE 1
.135 3.43 REF
"A"
C5
.725 18.42 REF
.120 3.05
REF
.0920±.0030 2.338±0.08
C4
R
.0660±.0030 1.676±0.08
SECTION "A-A"
EDGE MOUNT THICKNESS
-EM3:
.1738 4.413 REF
.0060 0.152 REF
R
SECTION "A-A"
C3
EDGE MOUNT THICKNESS
-EM2: .064[1.63] .004 PCB
2
MAX SWAY
(TYP)
SEE NOTE 10
(DIFFERENT AS SHOWN, OTHERWISE
SAME AS -EM2 PCB THICKNESS)
NOTES:
1. C REPRESENTS A CRITICAL DIMENSION.
2. CONTACT RETENTION: 6 OZ MIN.
3. GROUND PLANE RETENTION: 8 OZ MIN.
4. PARTS ARE MOLD TO POSITION.
.040 1.02 REF
5. MAX VARIANCE OF .002[.05].
.009 0.229
REF
6. -L PLATING CAN BE SUBSTITUTED FOR -F PLATING.
7. NOTE DELETED.
8. BOARD THICKNESS TO BE MEASURED FROM SOLDER
PAD TO SOLDER PAD.
9. SEE http://www.samtec.com/processing/edgemt_tectalk/index.htm
FOR INFORMATION ON PROCESSING EDGE MOUNT PARTS TO BOARDS.
10. -EM3 & IS NOT A STANDARD OFFERING; AVAILABLE AS AN
ASP ONLY. PLEASE CONTACT SAMTEC INTERCONNECT PROCESSING
GROUP WITH ORDER INQUIRIES.
11. FOR NEW APPLICATIONS REQUIRING THESE POSITIONS,
PLEASE CONTACT SAMTEC INTERCONNECT PROCESSING GROUP.
.100 2.54
REF
.140 3.56 REF
PROPRIETARY NOTE
UNLESS OTHERWISE SPECIFIED,
DIMENSIONS ARE IN INCHES.
TOLERANCES ARE:
THIS DOCUMENT CONTAINS INFORMATION
CONFIDENTIAL AND PROPRIETARY TO
SAMTEC, INC. AND SHALL NOT BE REPRODUCED
OR TRANSFERRED TO OTHER DOCUMENTS OR
DISCLOSED TO OTHERS OR USED FOR ANY
PURPOSE OTHER THAN THAT WHICH IT WAS
OBTAINED WITHOUT THE EXPRESSED WRITTEN
CONSENT OF SAMTEC, INC.
DECIMALS
ANGLES
2
.XX: .01[.3]
520 PARK EAST BLVD, NEW ALBANY, IN 47150
.XXX: .005[.13]
PHONE: 812-944-6733
FAX: 812-948-5047
code: 55322
.XXXX: .0020[.051]
e-Mail: info@SAMTEC.com
SHEET SCALE: 1.375:1
MATERIAL:
DO NOT SCALE DRAWING
DESCRIPTION:
INSULATOR: LCP, COLOR: BLACK
CONTACT: PHOS BRONZE
GROUND PLANE: PHOS BRONZE
.635mm EDGE MOUNT HS SOCKET ASSEMBLY
NO. QSS-XXX-01-XXX-D-EMX
DWG.
SHEET 1 OF 2
BY:
DEAN P
5/26/2000
F:\DWG\MISC\MKTG\QSS-XXX-01-XXX-D-EMX-MKT.SLDDRW
