CYZ2509
Pin Description
Pin
Name
REF
I/O
I
Description
24
12
13
Input reference pin.
Output feedback pin, no OE controls.
FBOUT
O
This pin is to be connected to the FBOUT pin. A timing delay may be inserted
to change the device’s actual skew.
FBIN
I
14
OEA
OEB
VDD
I
I
Output Enable for Bank A clocks (high active). See Block Diagram.
Output Enable for Bank A (high active). See Block Diagram.
3.3V supply for core logic, inputs and outputs.
11
22, 10, 15, 22
23
PWR
Power for internal analog circuitry. This supply should have separate decou-
pling. For test purposes, when VDDA’s are strapped to ground the internal
phase-locked loop (PLL) ( is bypassed and REF is buffered directly to device
outputs (see Table 4)
VDDA
PWR
21, 20, 17, 16
3, 4, 5, 8, 9
6, 7, 18, 19
1
1Y(0:3)
2Y(0:4)
VSS
O
Low skew clock outputs. Outputs enabled by OEA in high state.
Low skew clock outputs. Outputs enabled by OEB in high state.
Ground pins for core logic and I/Os.
O
PWR
VSSA
PWR
Ground pin for analog circuitry.
Table 2. Absolute Maximum Ratings[2]
Parameter
Description
Supply Voltage Range
Input Voltage Range
Commercial
–0.5 to +4.6
Unit
V
VDD, VDDA
VI[3]
–0.5 to VDD + 0.5
V
VoltageRange AppliedtoAny Outputinthe
HIGH or LOW State
[3]
VO
–0.5 to VDD + 0.5
V
I
IK (V I < 0)
Input Clamp Current
–50
mA
mA
Terminal Voltage with Respect to VSS
(inputs VIH2.5, VIL2.5)
IOK (VO < 0 or VO > VDD
±50
IO (VO = 0 to VDD
VDD or VSS
TA = 50°C (in still air)[4]
)
Continuous Output Current
Continuous Current
±50
±100
mA
mA
W
Maximum Power Dissipation
Storage Temperature Range
0.7
TSTG
–65°C to +150°C
°C
Table 3. Capacitance[5]
Parameter
Description
Input Capacitance Vj = VDD or VSS
Output Capacitance VO = m VDD or VSS
Load Capacitance
Min.
Typ.
5
Max.
Unit
pF
CIN
CO
CL
6
pF
30
pF
Table 4. Test Mode Table (VDDA = 0V)
INPUTS
OUTPUTS
OEA
LOW
LOW
LOW
HIGH
OEB
LOW
HIGH
LOW
LOW
HIGH
REF
LOW
HIGH
HIGH
HIGH
HIGH
1Y(0:3)
2Y(0:4)
LOW
FBOUT
LOW
LOW
LOW
HIGH
HIGH
LOW
HIGH
HIGH
HIGH
HIGH
HIGH
LOW
LOW
HIGH
HIGH
Notes:
2. Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stresses rating only and functional
operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to
absolute-maximum-rated conditions for extended periods may affect device reliability.
3. The input and output negative-voltage ratings may be exceeded if the input and output clamp-current ratings are observed.
4. The maximum package power dissipation is calculated using a junction temperature or 150°C and board trace length of 750 mils.
5. Unused inputs must be held high or low to prevent them from floating.
Document #: 38-07391 Rev. **
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