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IXFT52N30P

型号:

IXFT52N30P

品牌:

IXYS[ IXYS CORPORATION ]

页数:

5 页

PDF大小:

579 K

Advanced Technical Information  
IXFH52N30P  
IXFT52N30P  
VDSS  
ID25  
= 300 V  
= 52 A  
PolarTM HiPerFET  
Power MOSFET  
RDS(on) 66 mΩ  
trr 250 ns  
N-Channel Enhancement Mode  
Fast recovery intrinsic diode  
Symbol  
TestConditions  
Maximum Ratings  
TO-247AD (IXFH)  
VDSS  
VDGR  
T
= 25°C to 150°C  
300  
300  
V
V
TJJ = 25°C to 150°C; RGS = 1 MΩ  
VGSM  
30  
V
ID25  
IDM  
TC = 25°C  
52  
A
A
TC = 25°C, pulse width limited by TJM  
150  
G
D
S
IAR  
TC = 25°C  
52  
A
EAR  
EAS  
TC = 25°C  
TC = 25°C  
30  
mJ  
J
1.0  
TO-268 (IXFT)  
dv/dt  
PD  
IS IDM, di/dt 100 A/µs, VDD VDSS  
TJ 150°C, RG = 4 Ω  
,
10  
V/ns  
TC = 25°C  
400  
W
G
S
D (TAB)  
TJ  
TJM  
Tstg  
-55 ... +150  
150  
-55 ... +150  
°C  
°C  
°C  
G = Gate  
S = Source  
D = Drain  
TAB = Drain  
TL  
1.6 mm (0.062 in.) from case for 10 s  
300  
°C  
Md  
Mounting torque  
(TO-3P)  
1.13/10 Nm/lb.in.  
Weight  
TO-3P  
TO-268  
5.5  
5.0  
g
g
Features  
z
International standard packages  
Unclamped Inductive Switching (UIS)  
rated  
Low package inductance  
- easy to drive and to protect  
Fast intrinsic diode  
z
z
z
Symbol  
TestConditions  
Characteristic Values  
(TJ = 25°C, unless otherwise specified)  
Min. Typ.  
Max.  
VDSS  
VGS(th)  
IGSS  
VGS = 0 V, ID = 250 µA  
VDS = VGS, ID = 250µA  
VGS = 30 VDC, VDS = 0  
300  
V
V
2.5  
5.0  
Advantages  
100 nA  
z
Easy to mount  
z
IDSS  
VDS = VDSS  
VGS = 0 V  
25 µA  
250 µA  
Space savings  
z
TJ = 125°C  
High power density  
RDS(on)  
VGS = 10 V, ID = 0.5 ID25  
Pulse test, t 300 µs, duty cycle d 2 %  
57  
66 mΩ  
PolarHTTM DMOStransistors  
utilize proprietary designs and  
process. US patent is pending.  
DS99197(7/04)  
© 2004 IXYS All rights reserved  
IXFH 52N30P  
IXFT 52N30P  
Symbol  
gfs  
TestConditions  
Characteristic Values  
(TJ = 25°C, unless otherwise specified)  
Min. Typ. Max.  
TO-247 AD Outline  
VDS = 10 V; ID = 0.5 ID25, pulse test  
20  
30  
S
Ciss  
Coss  
Crss  
3490  
550  
pF  
pF  
pF  
1
2
3
VGS = 0 V, VDS = 25 V, f = 1 MHz  
130  
td(on)  
tr  
td(off)  
tf  
24  
22  
60  
20  
ns  
ns  
ns  
ns  
VGS = 10 V, VDS = 0.5 VDSS, ID = ID25  
RG = 4 (External)  
Terminals: 1 - Gate  
3 - Source  
2 - Drain  
Tab - Drain  
Dim.  
Millimeter  
Min. Max.  
Inches  
Qg(on)  
Qgs  
110  
25  
nC  
nC  
nC  
Min. Max.  
A
4.7  
2.2  
2.2  
5.3  
2.54  
2.6  
.185 .209  
.087 .102  
.059 .098  
.040 .055  
.065 .084  
.113 .123  
.016 .031  
.819 .845  
.610 .640  
VGS = 10 V, VDS = 0.5 VDSS, ID = 0.5 ID25  
A
A12  
Qgd  
53  
b
1.0  
1.65  
2.87  
1.4  
2.13  
3.12  
b
b12  
RthJC  
RthCK  
0.31  
K/W  
K/W  
(TO-247, TO-3P)  
0.21  
C
D
E
.4  
.8  
20.80 21.46  
15.75 16.26  
e
5.20  
5.72 0.205 0.225  
L
19.81 20.32  
4.50  
.780 .800  
.177  
Source-DrainDiode  
Characteristic Values  
(TJ = 25°C, unless otherwise specified)  
min. typ. max.  
L1  
P 3.55  
3.65  
.140 .144  
Q
5.89  
4.32  
6.40 0.232 0.252  
Symbol  
IS  
TestConditions  
R
S
5.49  
.170 .216  
242 BSC  
VGS = 0 V  
52  
150  
1.5  
A
6.15 BSC  
ISM  
Repetitive  
A
V
TO-268 Outline  
VSD  
IF = IS, VGS = 0 V,  
Pulse test, t 300 µs, duty cycle d 2 %  
ns  
Trr  
IF = 25A  
-di/dt = 100 A/µs  
VR = 100V  
250  
160  
800  
QRM  
nC  
IXYS reserves the right to change limits, test conditions, and dimensions.  
IXYSMOSFETs andIGBTsarecovered by  
oneormoreofthefollowingU.S.patents:  
4,835,592  
4,850,072  
4,881,106  
4,931,844  
5,017,508  
5,034,796  
5,049,961  
5,063,307  
5,187,117  
5,237,481  
5,381,025  
5,486,715  
6,162,665  
6,259,123B1  
6,306,728 B1  
6,404,065B1  
6,534,343  
6,583,505  
6,683,344  
6,710,405B2  
6,710,463  
6,727,585  
6,759,692  
IXFH 52N30P  
IXFT 52N30P  
Fig. 2. Extended Output Characteristics  
@ 25 deg. C  
Fig. 1. Output Characteristics  
@ 25 Deg. C  
150  
125  
100  
75  
55  
50  
45  
40  
35  
30  
25  
20  
15  
10  
5
VGS = 10V  
9V  
VGS = 10V  
8V  
7V  
6V  
8V  
7V  
50  
6V  
5V  
25  
5V  
0
0
0
0
0
0.5  
1
1.5  
2
2.5  
3
3.5  
4
4.5  
5
0
5
10  
15  
20  
25  
VD S - Volts  
VD S - Volts  
Fig. 3. Output Characteristics  
@ 125 Deg. C  
Fig. 4. RDS(on) Normalized to ID25 Value vs.  
Junction Temperature  
55  
50  
45  
40  
35  
30  
25  
20  
15  
10  
5
3
2.8  
2.6  
2.4  
2.2  
2
1.8  
1.6  
1.4  
1.2  
1
VGS = 10V  
VGS = 10V  
8V  
7V  
ID = 52A  
ID = 26A  
6V  
5V  
0.8  
0.6  
0.4  
0
1
2
3
4
5
6
7
8
9
10  
-50  
-25  
0
25  
50  
75  
100 125 150  
VD S - Volts  
TJ - Degrees Centigrade  
Fig. 5. RDS(on) Normalized to ID25  
Value vs. ID  
Fig. 6. Drain Current vs. Case  
Temperature  
3.8  
3.4  
3
55  
50  
45  
40  
35  
30  
25  
20  
15  
10  
5
VGS = 10V  
2.6  
2.2  
1.8  
1.4  
1
TJ = 125ºC  
TJ = 25ºC  
0.6  
0
25  
50  
75  
100  
125  
150  
-50  
-25  
0
25  
50  
75  
100 125 150  
I
D
- Amperes  
T
C
- Degrees Centigrade  
© 2004 IXYS All rights reserved  
IXFH 52N30P  
IXFT 52N30P  
Fig. 8. Transconductance  
Fig. 7. Input Admittance  
100  
90  
80  
70  
60  
50  
40  
30  
20  
10  
0
60  
50  
40  
30  
20  
10  
0
TJ = -40ºC  
25ºC  
125ºC  
TJ = 125ºC  
25ºC  
-40ºC  
4
4.5  
5
5.5  
6
6.5  
7
7.5  
8
0
10 20 30 40 50 60 70 80 90 100  
VG S - Volts  
I D - Amperes  
Fig. 9. Source Current vs.  
Source-To-Drain Voltage  
Fig. 10. Gate Charge  
10  
9
8
7
6
5
4
3
2
1
0
150  
VDS = 150V  
ID = 26A  
G = 10mA  
125  
100  
75  
50  
25  
0
I
TJ = 125ºC  
TJ = 25ºC  
0.4  
0.6  
0.8  
1
1.2  
1.4  
0
20  
40  
60  
80  
100  
120  
Q G - nanoCoulombs  
VS D - Volts  
Fig. 12. Forw ard-Bias Safe  
Operating Area  
Fig. 11. Capacitance  
10000  
1000  
f = 1MHz  
TC = 25ºC  
RDS(on) Limit  
C
iss  
25µs  
100  
10  
1
1ms  
1000  
C
C
10ms  
oss  
rss  
DC  
100  
10  
100  
VD S - Volts  
1000  
0
5
10  
15  
20  
25  
30  
35  
40  
VD S - Volts  
IXYS reserves the right to change limits, test conditions, and dimensions.  
IXFH 52N30P  
IXFT 52N30P  
Fig. 13. Maximum Transient Thermal Resistance  
1.00  
0.10  
0.01  
1
10  
100  
1000  
Pulse Width - milliseconds  
© 2004 IXYS All rights reserved  
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