1SMF16BT1, 1SMF16BT3, 1SMF16BT3G
PACKAGE DIMENSIONS
SOD−123FL
CASE 498−01
ISSUE O
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS A AND B DO NOT INCLUDE MOLD
FLASH.
B
L
E
4. DIMENSIONS D AND J ARE TO BE MEASURED
ON FLAT SECTION OF THE LEAD: BETWEEN 0.10
AND 0.25 MM FROM THE LEAD TIP.
D
A
MILLIMETERS
DIM MIN MAX
INCHES
MIN
H
MAX
0.071
0.114
0.039
0.043
0.037
0.004
0.008
0.150
8 °
POLARITY INDICATOR
OPTIONAL AS NEEDED
A
B
C
D
E
H
J
1.50
2.50
0.90
0.70
0.55
0.00
0.10
3.40
0 °
1.80 0.059
2.90 0.098
1.00 0.035
1.10 0.028
0.95 0.022
0.10 0.000
0.20 0.004
3.80 0.134
C
K
L
K
L
8 °
0 °
J
SOLDERING FOOTPRINT*
0.91
0.036
1.22
0.048
2.36
0.093
4.19
0.165
mm
inches
ǒ
Ǔ
SCALE 10:1
SOD−123
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
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4
