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NVSL219AT-H3

型号:

NVSL219AT-H3

品牌:

NICHIA[ NICHIA CORPORATION ]

页数:

18 页

PDF大小:

320 K

NICHIA STS-DA1-1314D <Cat.No.110413>  
SPECIFICATIONS FOR WARM WHITE LED  
NICHIA CORPORATION  
NVSL219AT-H3  
Pb-free Reflow Soldering Application  
Built-in ESD Protection Device  
RoHS Compliant  
NICHIA STS-DA1-1314D <Cat.No.110413>  
SPECIFICATIONS  
(1) Absolute Maximum Ratings  
Item  
Symbol  
Absolute Maximum Rating  
Unit  
Forward Current  
IF  
IFP  
IR  
1500  
2000  
mA  
mA  
mA  
W
Pulse Forward Current  
Allowable Reverse Current  
Power Dissipation  
85  
PD  
5.25  
Operating Temperature  
Storage Temperature  
Junction Temperature  
Topr  
Tstg  
TJ  
-40~100  
-40~100  
150  
°C  
°C  
°C  
* Absolute Maximum Ratings at TS=25°C.  
* IFP conditions with pulse width 10ms and duty cycle 10%.  
(2) Initial Electrical/Optical Characteristics  
Item  
Symbol  
VF  
Condition  
IF=350mA  
IF=350mA  
IF=350mA  
IF=350mA  
IF=350mA  
IF=350mA  
-
Typ  
3
Max  
Unit  
Forward Voltage  
R8000  
-
-
V
Φv  
Luminous Flux  
113  
37  
lm  
Luminous Intensity  
Iv  
Ra  
-
-
cd  
Color Rendering  
83  
-
-
x
y
0.41  
0.39  
7
-
-
-
Chromaticity Coordinate  
-
-
Thermal Resistance  
RθJS  
12  
°C/W  
* Characteristics at TS=25°C.  
* Luminous Flux value is traceable to the CIE 127:2007-compliant national standards.  
* The Chromaticity Coordinates are derived from the CIE 1931 Chromaticity Diagram.  
* RθJS is Thermal Resistance from junction to TS measuring point.  
1
NICHIA STS-DA1-1314D <Cat.No.110413>  
RANKS  
Item  
Rank  
Min.  
3.1  
2.7  
120  
110  
100  
90  
Max.  
3.5  
3.1  
130  
120  
110  
100  
-
Unit  
V
M
Forward Voltage  
Luminous Flux  
L
B12  
B11  
B10  
B09  
lm  
Ra  
R9  
80  
-
-
Color Rendering  
Color Ranks  
R8000  
0
-
Rank sw27  
Rank sw30  
x
y
0.4373  
0.3893  
0.4562  
0.4813  
0.4319  
0.4593  
0.3944  
x
y
0.4147  
0.3814  
0.4299  
0.4165  
0.4562  
0.4260  
0.4373  
0.3893  
0.4260  
Rank sw35  
Rank sw40  
x
y
0.3898  
0.3716  
0.3996  
0.4015  
0.4299  
0.4165  
0.4147  
0.3814  
x
y
0.3670  
0.3578  
0.3736  
0.3874  
0.3996  
0.4015  
0.3898  
0.3716  
Rank sw45  
x
y
0.3515  
0.3487  
0.3548  
0.3736  
0.3736  
0.3874  
0.3670  
0.3578  
* Ranking at TS=25°C.  
* Tolerance of measurements of the Forward Voltage is ±0.05V.  
* Tolerance of measurements of the Luminous Flux is ±7%.  
* Tolerance of measurements of the Color Rendering Ra is ±2.  
* Tolerance of measurements of the Color Rendering R9 is ±6.5.  
* The R9 value for the above rank shall be greater than 0.  
* Tolerance of measurements of the Chromaticity Coordinate is ±0.005.  
* Basically, a shipment shall consist of the LEDs of a combination of the above ranks.  
The percentage of each rank in the shipment shall be determined by Nichia.  
Correspondence table of Color Coordinates, Color Rendering - Luminous Flux ranks  
Ranking by  
Luminous Flux  
B09  
B10  
B11  
B12  
Ranking by  
Color Coordinates, Color Rendering  
sw27,sw30,sw35  
sw40,sw45  
R8000  
R8000  
2
NICHIA STS-DA1-1314D <Cat.No.110413>  
CHROMATICITY DIAGRAM  
0.50  
0.45  
0.40  
0.35  
0.30  
0.25  
sw27  
sw30  
sw35  
sw40  
sw45  
0.30  
0.35  
0.40  
0.45  
0.50  
0.55  
x
3
NICHIA STS-DA1-1314D <Cat.No.110413>  
NVSx219A-Hx  
OUTLINE DIMENSIONS  
*
本製品はRoHS指令に適合しております。  
管理番号 No.  
STS-DA7-0065  
This product complies with RoHS Directive.  
(単位 Unit: mm, 公差 Tolerance:±0.2)  
3.5  
2.6  
0.45  
Cathode Mark  
項目 Item  
内容 Description  
パッケージ材質  
Package Materials  
セラミックス  
Ceramics  
封止樹脂材質  
Encapsulating Resin  
Materials  
3.17  
0.5  
シリコーン樹脂 (蛍光体入り)  
Silicone Resin (with phosphor)  
0.435  
1.3  
電極材質  
Electrodes Materials  
金メッキ  
Au-plated  
レンズ材質  
Lens Materials  
シリコーン樹脂  
Silicone Resin  
ダイヒートシンク材質  
Die Heat Sink  
Materials  
金メッキ  
Au-plated  
質量  
Weight  
0.034g (TYP)  
Cathode  
Anode  
ダイヒートシンク  
Die Heat Sink  
保護素子  
Protection Device  
K
A
4
NICHIA STS-DA1-1314D <Cat.No.110413>  
SOLDERING  
• Recommended Reflow Soldering Condition(Lead-free Solder)  
1 to 5°C per sec  
260°C Max  
10sec Max  
Pre-heat  
180 to 200°C  
60sec Max  
Above 220°C  
120sec Max  
Recommended Soldering Pad Pattern  
0.5  
0.4  
1.3  
(単位 Unit: mm)  
0.5  
4.1  
* The product is designed to be reflow soldered to a PCB. If you use dip soldering or manual soldering for the products,  
Nichia cannot guarantee its reliability.  
* Reflow soldering must not be performed more than twice.  
* Care should be taken to avoid cooling at a rapid rate and ensure the peak temperature ramps down slowly.  
* Customer is advised to use nitrogen reflow soldering as air flow process can cause optical degradation  
due to the heat and atmosphere of reflow soldering.  
* Since silicone used as encapsulating resin in this product is a soft material, do not press on the encapsulant.  
Failure to comply might lead to nicks, chip-outs, delamination and deformation of the encapsulant, bump breakage  
and an adverse effect on product reliability.  
When using automatic pick and place machine, use a pick up nozzle which does not directly apply stress  
to the encapsulation of the LEDs.  
Recommended conditions:  
It is recommended to use a pick up nozzle designed for the LEDs. (See Figure below.)  
* Avoid direct contact to the resin lens  
with the picking up nozzle.  
Failure to comply might result in catastrophic failure  
of the LEDs due to bump damage or breakage.  
3
(単位 Unit: mm)  
3.8  
* Repairing should not be done after the LEDs have been soldered. When repairing is unavoidable,  
a hot plate should be used.  
It should be confirmed beforehand whether the characteristics of the LEDs will or will not be damaged by repairing.  
* The Die Heat Sink should be soldered to customer PCB.  
If it is difficult or impossible, use high heat-dissipating adhesive.  
* When soldering, avoid applying any stress to the LED package while heated.  
5
NICHIA STS-DA1-1314D <Cat.No.110413>  
TAPE AND REEL DIMENSIONS  
Nxxx219x  
管理番号 No. STS-DA7-0053B  
テーピング部 Tape  
(単位 Unit: mm)  
2±0.054±0.1  
+0.1  
8±0.1  
Φ1.5  
0.25±0.05  
-0  
Cathode Mark  
2.25±0.1  
+0.2  
- 0  
Φ 1.5  
3.7±0.1  
エンボスキャリアテープ  
Embossed Carrier Tape  
トレーラ部/リーダ部 Trailer and Leader  
トップカバーテープ  
Top Cover Tape  
引き出し方向  
Feed  
Direction  
トレーラ部最小160mm(空部)  
Trailer 160mm MIN(Empty Pockets)  
LED装着部  
Loaded Pockets  
引き出し部最小100mm(空部)  
Leader with Top Cover Tape  
100mm MIN(Empty Pocket)  
リーダ部最小400mm  
Leader without Top Cover Tape 400mm MIN  
17.5±1  
13.5±1  
リール部 Reel  
330±2  
数量は1リールにつき 3500個入りです。  
Quantity per reel=3500pcs  
*
*
JIS C 0806電子部品テーピングに準拠しています。  
The tape packing method complies with JIS C 0806  
(Packaging of Electronic Components on Continuous Tapes).  
ラベル  
Label  
6
NICHIA STS-DA1-1314D <Cat.No.110413>  
PACKAGING - TAPE & REEL  
Nxxxxxxx  
管理番号 No. STS-DA7-0006A  
シリカゲルとともにリールをアルミ防湿袋に入れ、熱シールにより封をします。  
The reel is placed in the moisture proof bag with a moisture absorbent  
material. The bag is heat sealed.  
ラベル Label  
リール  
Reel  
シリカゲル  
Moisture Absorbent Material  
XXXX LED  
TYPE Nxxxxxxx  
*******  
LOT YMxxxx-RRR  
QTY.  
PCS  
RoHS  
NICHIA CORPORATION 491 OKA, KAMINAKA, ANAN, TOKUSHIMA, JAPAN  
熱シール  
Seal  
アルミ防湿袋  
Moisture Proof Foil Bag  
アルミ防湿袋を並べて入れ、ダンボールで仕切ります。  
The moisture proof foil bags are packed in a cardboard box  
with corrugated partition.  
ラベル Label  
XXXX LED  
TYPE Nxxxxxxx  
*******  
RANK RRR  
QTY.  
PCS  
RoHS  
NICHIA CORPORATION  
491 OKA, KAMINAKA, ANAN, TOKUSHIMA, JAPAN  
*
*
*
客先型名を*******で示します。  
客先型名が設定されていない場合は空白です。  
******* is the customer part number.  
If not provided, it is not indicated on the label.  
Nichia LED  
ロット表記方法についてはロット番号の項を  
参照して下さい。  
For details, see "LOT NUMBERING SCHEME"  
in this document.  
ランク分けがない場合はランク表記はありません。  
The label does not have the RANK field for  
un-ranked products.  
*
本製品はテーピングしたのち、輸送の衝撃から保護するためダンボールで梱包します。  
The products are taped and reeled, and then packed in moisture-proof bags.  
The moisture-proof bags are packed in cardboard boxes to prevent damage during shipment.  
*
*
*
取り扱いに際して、落下させたり、強い衝撃を与えたりしますと、製品を損傷させる原因になりますので注意して下さい。  
Do not drop the cardboard box or expose it to shock. If the box falls, the products could be damaged.  
ダンボールには防水加工がされておりませんので、梱包箱が水に濡れないよう注意して下さい。  
The cardboard box is not water-resistant. Do not expose to water.  
輸送、運搬に際して弊社よりの梱包状態あるいは同等の梱包を行って下さい。  
Customer is advised to pack the products in the original packaging or equivalent in transit.  
7
NICHIA STS-DA1-1314D <Cat.No.110413>  
LOT NUMBERING SCHEME  
Lot Number is presented by using the following alphanumeric code.  
YMxxxx - RRR  
Y - Year  
Year  
2009  
2010  
2011  
2012  
2013  
2014  
Y
9
A
B
C
D
E
M - Month  
Month  
M
1
2
3
4
5
6
Month  
7
M
7
8
9
A
B
C
1
2
3
4
5
6
8
9
10  
11  
12  
xxxx-Nichia's Product Number  
RRR-Ranking by Color Coordinates, Ranking by Luminous Flux, Ranking by Forward Voltage, Ranking by Color Rendering  
8
NICHIA STS-DA1-1314D <Cat.No.110413>  
NVSx219A-Hx  
DERATING CHARACTERISTICS  
No. STS-DA7-0081  
管理番号  
周囲温度 - 許容順電流特性  
カソード側はんだ接合部温度 - 許容順電流特性  
RθJA =15 °C/W  
=25 °C/W  
Solder Temperature (Cathode Side) vs  
Derating2  
Allowable Forward Current  
Ambient Temperature vs  
Allowable Forward Current  
R
DeratiθJA  
RθJA =35 °C/W  
2000  
2000  
1500  
1000  
500  
0
(91, 1500)  
(18, 1500)  
1500  
(71, 1500)  
(100, 1280)  
1000  
(100, 952)  
(0, 1220)  
(100, 571)  
(100, 408)  
500  
0
0
20  
40  
60  
80  
100  
120  
0
20  
40  
60  
80  
100  
120  
周囲温度  
Ambient Temperature (°C)  
カソードんだ接合部温度  
Solder Temperature (Cathode Side) (°C)  
デューティー比 - 許容順電流特性  
Duty Ratio vs  
Allowable Forward Current  
Duty  
TA = 25°C  
10000  
2000  
1500  
1000  
100  
1
10  
100  
デューティー比  
Duty Ratio (%)  
9
NICHIA STS-DA1-1314D <Cat.No.110413>  
NVSL219A-H3  
OPTICAL CHARACTERISTICS  
本特性は参考です。  
*
No. STS-DA7-0190B  
番号  
All characteristics shown are for reference only and are not guaranteed.  
スペクトル  
Spectrum  
TA=25°C  
IFP  
=
350mA  
Spectrum  
1.0  
0.8  
0.6  
0.4  
0.2  
0.0  
400  
450  
500  
550  
600  
650  
700  
750  
800  
波長  
Wavelength(nm)  
Directivity1  
特性  
Directivity  
TA=25°C  
IFP  
=
350mA  
0°  
-10°  
10°  
-20°  
20°  
30°  
-30°  
40°  
-40°  
50°  
-50°  
-60°  
60°  
-70°  
70°  
80°  
-80°  
-90°  
90°  
1
0.5  
0
0.5  
1
相対照度  
Relative Illuminance(a.u.)  
10  
NICHIA STS-DA1-1314D <Cat.No.110413>  
FORWARD CURRENT CHARACTERISTICS / TEMPERATURE CHARACTERISTICS  
NVSL219A-H3  
No. STS-DA7-0191  
は参考です。  
*
番号  
TaVf  
All characteristics shown are for reference only and are not guaranteed.  
順電圧 - 順電流特性  
Forward Voltage vs  
Forward Current  
周囲度 - 特性  
Ambient Temperature vs  
Forward Voltage  
VfIf  
IFP = 350 mA  
TA = 25°C  
10000  
4.5  
4.0  
3.5  
3.0  
2.5  
2.0  
2000  
1000  
350  
100  
10  
2.0  
2.5  
3.0  
順電圧  
3.5  
4.0  
4.5  
-60 -40 -20  
0
20 40 60 80 100 120  
周囲温度  
Forward Voltage (V)  
Ambient Temperature (°C)  
周囲度 - 束特性  
順電流 - 相対光束特性  
Forward Current vs  
Relative Luminous Flux  
Ambient Temperature vs  
Relative Luminous Flux  
TaIv  
IfIv  
IFP  
=
350 mA  
TA = 25°C  
1.4  
1.2  
1.0  
0.8  
0.6  
5
4
3
2
1
0
-60 -40 -20  
0
20 40 60 80 100 120  
0
500  
1000  
1500  
2000  
2500  
順電流  
Forward Current (mA)  
周囲温度  
Ambient Temperature (°C)  
11  
NICHIA STS-DA1-1314D <Cat.No.110413>  
FORWARD CURRENT CHARACTERISTICS / TEMPERATURE CHARACTERISTICS  
NVSL219A-H3  
No. STS-DA7-0193  
は参です。  
*
番号  
All characteristics shown are for reference only and are not guaranteed.  
流 - 度特性  
Forward Current vs  
Chromaticity Coordinate  
Ifxy  
TA = 25°C  
0.39  
0.38  
0.37  
350mA  
20mA  
2000mA  
0.36  
0.35  
0.34  
0.35  
0.36  
x
0.37  
0.38  
度 - 色度特性  
Ambient Temperature vs  
Chromaticity Coordinate  
Taxy  
IFP  
=
350 mA  
0.39  
0.38  
0.37  
0.36  
0.35  
-40°C  
0°C  
25°C  
50°C  
100°C  
0.34  
0.35  
0.36  
0.37  
0.38  
x
本特性は色度ランク  
を含む に対応しています。  
sw40, sw45(  
*
)
The graphs above show the characteristics for sw40 and sw45 LEDs, including sub-bins, of this product.  
12  
NICHIA STS-DA1-1314D <Cat.No.110413>  
FORWARD CURRENT CHARACTERISTICS / TEMPERATURE CHARACTERISTICS  
NVSL219A-H3  
No. STS-DA7-0192  
は参です。  
*
番号  
All characteristics shown are for reference only and are not guaranteed.  
流 - 度特性  
Forward Current vs  
Chromaticity Coordinate  
Ifxy  
TA = 25°C  
0.41  
0.40  
350 mA  
20 mA  
2000 mA  
0.39  
0.38  
0.37  
0.38  
0.39  
0.40  
0.41  
0.42  
x
度 - 色度特性  
Ambient Temperature vs  
Chromaticity Coordinate  
Taxy  
IFP  
=
350 mA  
0.41  
0.40  
0.39  
0.38  
0.37  
-40°C  
0°C  
25°C  
50°C  
100°C  
0.38  
0.39  
0.40  
x
0.41  
0.42  
本特性は色度ランク  
ラン囲内の特別ランクを含む に対応しています。  
)
*
sw27, sw30, sw35(  
The graphs above show the characteristics for sw27, sw30 and sw35 LEDs, including sub-bins, of this product.  
13  
NICHIA STS-DA1-1314D <Cat.No.110413>  
RELIABILITY  
(1) Tests and Results  
Test  
Failure  
Reference  
Standard  
Test  
Units  
Test Conditions  
Criteria  
#
Duration  
Failed/Tested  
Resistance to  
JEITA ED-4701  
300 301  
Tsld=260°C, 10sec, 2reflows,  
Soldering Heat  
(Reflow Soldering)  
Solderability  
#1  
0/22  
Precondition: 30°C, 70%RH, 168hr  
JEITA ED-4701  
303 303A  
Tsld=245±5°C, 5sec,  
#2  
#1  
#1  
#1  
#1  
#1  
#1  
#1  
#1  
#1  
#1  
#1  
0/22  
0/22  
0/22  
0/22  
0/22  
0/22  
0/22  
0/22  
0/22  
0/22  
0/10  
0/22  
(Reflow Soldering)  
Lead-free Solder(Sn-3.0Ag-0.5Cu)  
-40°C(30min)~25°C(5min)~  
100°C(30min)~25°C(5min)  
25°C~65°C~-10°C, 90%RH,  
24hr per cycle  
JEITA ED-4701  
100 105  
Temperature Cycle  
100cycles  
10cycles  
Moisture Resistance  
(Cyclic)  
JEITA ED-4701  
200 203  
High Temperature  
Storage  
JEITA ED-4701  
200 201  
TA=100°C  
1000hours  
1000hours  
1000hours  
1000hours  
1000hours  
500hours  
1000hours  
48minutes  
Temperature Humidity  
Storage  
JEITA ED-4701  
100 103  
TA=60°C, RH=90%  
TA=-40°C  
Low Temperature  
Storage  
JEITA ED-4701  
200 202  
Room Temperature  
Operating Life  
High Temperature  
Operating Life  
Temperature Humidity  
Operating Life  
Low Temperature  
Operating Life  
TA=25°C, IF=1000mA  
Test board: See NOTES below  
TA=100°C, IF=400mA  
Test board: See NOTES below  
60°C, RH=90%, IF=700mA  
Test board: See NOTES below  
TA=-40°C, IF=350mA  
Test board: See NOTES below  
200m/s2, 100~2000~100Hz,  
4cycles, 4min, each X, Y, Z  
HBM, 2kV, 1.5k, 100pF, 3pulses,  
alternately positive or negative  
JEITA ED-4701  
400 403  
Vibration  
JEITA ED-4701  
300 304  
Electrostatic Discharges  
NOTES:  
1) Test board: FR4 board thickness=1.6mm, copper layer thickness=0.07mm, RθJA35°C/W  
2) Measurements are performed after allowing the LEDs to return to room temperature.  
(2) Failure Criteria  
Criteria #  
Items  
Conditions  
IF=350mA  
Failure Criteria  
>Initial value×1.1  
Forward Voltage(VF)  
Luminous Flux(ΦV)  
Solderability  
#1  
#2  
IF=350mA  
-
<Initial value×0.7  
Less than 95% solder coverage  
14  
NICHIA STS-DA1-1314D <Cat.No.110413>  
CAUTIONS  
(1) Storage  
Conditions  
Temperature  
30°C  
Humidity  
90%RH  
Time  
Within 1 Year from Delivery Date  
168hours  
Before Opening Aluminum Bag  
After Opening Aluminum Bag  
Storage  
Baking  
30°C  
70%RH  
65±5°C  
-
24hours  
This product is compliant to JEDEC MSL 3 or equivalent. See IPC/JEDEC STD-020 for the details of the moisture sensitivity levels.  
Interface delamination can occur due to vaporization and expansion of absorbed moisture  
in the LED packages caused by soldering heat, which may result in degradation in optical performance.  
To minimize moisture absorption into the products during the transportation and storage, the products are packed  
in a moisture-proof aluminum bag. Desiccants (silica gel) inside the packing turn from blue to red as it absorbs moisture.  
After opening the moisture-proof aluminum bag, the products should be completed soldering process  
within the range of the conditions above. If unused LEDs remain, they should be stored with desiccants (silica gel)  
in hermetically sealed container. Nichia recommends using the original moisture-proof bag for storage.  
After the "Period After Opening" specified above, or if the desiccants (silica gel) are no longer blue, the products need to be baked.  
Note that baking must only be done once.  
Although the leads or electrode pads (anode and cathode) of the product are plated with gold,  
prolonged exposure to a corrosive environment might cause the gold plated the leads or electrode pads to tarnish,  
and thus leading to difficulties in soldering. If unused LEDs remain, they must be stored in a hermetically sealed container.  
Nichia recommends using the original moisture-proof bag for storage.  
Do not use sulfur-containing materials in commercial products. Some materials, such as seals and adhesives, may contain sulfur.  
The contaminated plating of LEDs might cause an open circuit. Silicone rubber is recommended as a material for seals.  
Bear in mind, the use of silicones may lead to silicone contamination of electrical contacts inside the products,  
caused by low molecular weight volatile siloxane.  
To avoid condensation, the products must not be stored in the areas where temperature and humidity fluctuate greatly.  
(2) Directions for Use  
In designing a circuit, the current through each LED must not exceed the Absolute Maximum Rating specified for each LED.  
It is recommended to use Circuit B which regulates the current flowing through each LED. In the meanwhile,  
when driving LEDs with a constant voltage in Circuit A, the current through the LEDs may vary due to the variation  
in Forward Voltage characteristics of the LEDs.  
(A)  
(B)  
This product should be operated in forward bias. A driving circuit must be designed  
so that the product is not subjected to either forward or reverse voltage while it is off. In particular,  
if a reverse voltage is continuously applied to the product, such operation can cause migration resulting in LED damage.  
For stabilizing the LED characteristics, it is recommended to operate at 10% of the rated current or higher.  
For outdoor use, necessary measures should be taken to prevent water, moisture and salt air damage.  
(3) Handling Precautions  
When handling the product, do not touch it directly with bare hands as it may contaminate the surface  
and affect on optical characteristics. In the worst cases, excessive force to the product might result in catastrophic failure  
due to package damage and/or bump breakage.  
When handling the product with tweezers, make sure that excessive force is not applied to the resin portion of the product.  
Failure to comply can cause the resin portion of the product to be cut, chipped, delaminated and/or deformed,  
and bump to be broken, and thus resulting in catastrophic failure.  
If the product is dropped, it might be damaged.  
Do not stack assembled PCBs together. Failure to comply can cause the resin portion of the product to be cut, chipped,  
delaminated and/or deformed, and bump to be broken, and thus resulting in catastrophic failure.  
15  
NICHIA STS-DA1-1314D <Cat.No.110413>  
(4) Design Consideration  
PCB warpage after mounting the products onto a PCB can cause the package to break.  
The LEDs should be placed so as to minimize the stress on the LEDs due to PCB bow and twist.  
The position and orientation of the LEDs affect how much mechanical stress is exerted on the LEDs placed near the score lines.  
The LEDs should be placed so as to minimize the stress on the LEDs due to board flexing.  
Board separation must be performed using special jigs, not with hands.  
If an aluminum PCB is used, customer is advised to verity the PCB with the products before use.  
Thermal stress during use can cause the solder joints to crack.  
(5) Electrostatic Discharge (ESD)  
The products are sensitive to static electricity or surge voltage. An ESD event may damage its die  
or reduce its reliability performance. When handling the products, measures against electro static discharge,  
including the followings, are strongly recommended.  
Eliminating the charge;  
Wrist strap, ESD footwear and garments, ESD floors  
Grounding the equipment and tools at workstation  
ESD table/shelf mat (conductive materials)  
Proper grounding techniques are required for all devices, equipment and machinery used in the assembly of the products.  
Also note that surge protection should be considered in the design of customer products.  
If tools or equipment contain insulating materials, such as glass or plastic, proper measures against electro static discharge,  
including the followings, are strongly recommended.  
Dissipating the charge with conductive materials  
Preventing the charge generation with moisture  
Neutralizing the charge with ionizers  
When performing the characteristics inspection of the LEDs in your application, customer is advised to check on the LEDs  
whether or not they are damaged by ESD. Such damage can be detected during forward voltage measurement or light up test  
at low current. (the recommended current is 1mA or lower)  
ESD-damaged LEDs may have a current flow at low voltage, or no longer light up at low current.  
Failure Criteria: VF<2.0V at IF=0.5mA  
(6) Thermal Management  
Thermal management is an important factor when designing your product by using the LEDs.  
The rise in LED die temperature can be affected by PCB thermal resistance or/and LED spacing as mounted on the board.  
Customer is advised to design the product to ensure that the LED die temperature  
does not exceed the required maximum Junction Temperature (TJ).  
Drive current should be determined for the surrounding ambient temperature (TA) to dissipate the heat from the product.  
The following equations can be used to calculate the junction temperature of the products.  
1) TJ=TA+RθJAW  
2) TJ=TS+RθJSW  
*TJ=LED junction temperature: °C  
TA=Ambient temperature: °C  
TS=Soldering temperature (cathode side): °C  
RθJA=Thermal resistance from junction to ambient: °C/W  
RθJS=Thermal resistance from junction to TS measuring point: °C/W  
W=Input power(IF×VF): W  
Ts Point  
16  
NICHIA STS-DA1-1314D <Cat.No.110413>  
(7) Cleaning  
If required, isopropyl alcohol (IPA) should be used. Other solvents may cause premature failure to the LEDs  
due to the damage to the resin portion. The effects of such solvents should be verified prior to use.  
In addition, the use of CFCs such as Freon is heavily regulated.  
Ultrasonic cleaning is not recommended for the LEDs since it may adversely effect on the LEDs  
by the ultrasonic power and LED assembled condition.  
If it is unavoidable, customer is advised to check prior to use that the cleaning will not damage the LEDs.  
(8) Eye Safety  
The International Electrical Commission (IEC) published in 2006, IEC 62471:2006 Photobiological safety of lamps  
and lamp systems which includes LEDs within its scope. Meanwhile LEDs were removed from the scope  
of the IEC 60825-1:2007 laser safety standard, the 2001 edition of which included LED sources within its scope.  
However, keep it mind that some countries and regions have adopted standards based on the IEC laser safety standard  
IEC 60825-1:2001 which includes LEDs within its scope. Following IEC 62471:2006, most of Nichia LEDs can be classified  
as belonging to either Exempt Group or Risk Group 1. Especially a high-power LED, that emits light containing blue wavelengths,  
may be in Risk Group 2. Great care should be taken when viewing directly the LED driven at high current or the LED  
with optical instruments, which greatly increase the hazard to your eyes.  
Viewing a flashing light may cause eye discomfort. When incorporating the LED into your product,  
precaution should be taken to avoid adverse effect on human body caused by the light stimulus.  
(9) Others  
The LEDs described in this brochure are intended to be used for ordinary electronic equipment (such as office equipment,  
communications equipment, measurement instruments and household appliances).  
Consult Nichia's sales staff in advance for information on the applications in which exceptional quality  
and reliability are required, particularly when the failure or malfunction of the LEDs may directly jeopardize life or  
health (such as for airplanes, aerospace, submersible repeaters, nuclear reactor control system, automobiles,  
traffic control equipment, life support systems and safety devices).  
The customer shall not reverse engineer by disassembling or analysis of the LEDs without having prior written consent  
from Nichia. When defective LEDs are found, the customer shall inform Nichia directly before disassembling or analysis.  
Customer and Nichia shall agree the official specification of supplied products prior to the start of a customer’s volume production.  
The appearance and specifications of the product may be modified for improvement without notice.  
17  
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