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IXDD630MCI

型号：

IXDD630MCI

品牌：

LITTELFUSE[ LITTELFUSE ]

页数：

12 页

PDF大小：

289 K

下载PDF手册
IXD_630  
30-Ampere Low-Side  
Ultrafast MOSFET Drivers  
INTEGRATED  
C
IRCUITS  
D
IVISION  
Features  
Description  
• 30A Peak Source/Sink Drive Current  
• High Operating Voltage Capability: 35V  
• -40°C to +125°C Extended Operating Temperature  
Range  
• Under-Voltage Lockout Protection  
• Logic Input Withstands Negative Swing of up to 5V  
• Fast Rise and Fall Times: < 20ns  
• Low Propagation Delay Time  
The IXDD630/IXDI630/IXDN630 high-speed gate  
drivers are especially well suited for driving the latest  
IXYS power MOSFETs and IGBTs. The IXD_630  
output can source and sink 30A of peak current while  
producing voltage rise and fall times of less than 20ns.  
Internal circuitry eliminates cross conduction and  
current "shoot-through," and the driver is virtually  
immune to latch up. Under-voltage lockout (UVLO)  
circuitry holds the output LOW until sufficient supply  
voltage is applied (12.5V for the IXD_630 versions,  
and 9V for the IXD_630M versions). Low propagation  
delays and fast, matched rise and fall times make the  
IXD_630 family ideal for very high frequency and  
high-power applications.  
• Low 10A Supply Current  
• Low Output Impedance  
Applications  
• Efficient Power MOSFET and IGBT Switching  
• Switch Mode Power Supplies  
• Motor Controls  
• DC to DC Converters  
• Class-D Switching Amplifiers  
• Pulse Transformer Driver  
The IXDD630 is configured as a non-inverting driver  
with an enable. The IXDN630 is configured as a  
non-inverting driver, and the IXDI630 is configured as  
an inverting driver.  
The IXD_630 family is available in a 5-pin TO-220 (CI),  
and a 5-pin TO-263 (YI) package.  
Ordering Information  
Logic  
Configuration  
Packing  
Method  
Part Number  
UVLO  
Package Type  
Quantity  
IXDD630CI  
IXDD630MCI  
IXDD630YI  
IXDD630MYI  
IXDI630CI  
12.5V  
9V  
5-Pin TO-220  
5-Pin TO-220  
5-Pin TO-263  
5-Pin TO-263  
5-Pin TO-220  
5-Pin TO-220  
5-Pin TO-263  
5-Pin TO-263  
5-Pin TO-220  
5-Pin TO-220  
5-Pin TO-263  
5-Pin TO-263  
Tube  
Tube  
Tube  
Tube  
Tube  
Tube  
Tube  
Tube  
Tube  
Tube  
Tube  
Tube  
50  
50  
50  
50  
50  
50  
50  
50  
50  
50  
50  
50  
IN  
OUT  
12.5V  
9V  
EN  
12.5V  
9V  
IXDI630MCI  
IXDI630YI  
IN  
OUT  
OUT  
12.5V  
9V  
IXDI630MYI  
IXDN630CI  
IXDN630MCI  
IXDN630YI  
IXDN630MYI  
12.5V  
9V  
IN  
12.5V  
9V  
DS-IXD_630-R04  
www.ixysic.com  
1
IXD_630  
INTEGRATED  
C
IRCUITS  
D
IVISION  
1. Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3  
1.1 Lead Configurations. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3  
1.2 Lead Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3  
1.3 Absolute Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3  
1.4 Recommended Operating Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4  
1.5 Electrical Characteristics: T = 25°C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4  
A
1.6 Electrical Characteristics: T = - 40°C to +125°C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5  
A
1.7 Thermal Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5  
2. Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6  
2.1 IXDD630 Block Diagram & Truth Table . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6  
2.2 IXDI630 Block Diagram & Truth Table. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6  
2.3 IXDN630 Block Diagram & Truth Table . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6  
3. Typical Performance Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7  
4. Manufacturing Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10  
4.1 Moisture Sensitivity . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10  
4.2 ESD Sensitivity . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10  
4.3 Reflow Profile. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10  
4.4 Board Wash . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10  
4.5 Mechanical Dimensions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11  
2
www.ixysic.com  
R04  
IXD_630  
INTEGRATED  
C
IRCUITS  
D
IVISION  
1 Specifications  
1.1 Lead Configurations  
1.2 Lead Definitions  
IXDD630 CI / YI  
Lead Name Description  
VCC  
OUT  
GND  
IN  
1
2
3
4
5
IN  
Logic Input  
Output Enable - Drive lead low to disable  
output, and force output to a high impedance  
state  
EN  
EN  
Output - Sources or sinks current to turn-on or  
turn-off a discrete MOSFET or IGBT  
OUT  
OUT  
IXDI630 CI / YI  
Inverted Output - Sources or sinks current to  
turn-on or turn-off a discrete MOSFET or IGBT  
VCC  
OUT  
GND  
IN  
1
2
3
4
5
V
Supply Voltage - Provides power to the device  
CC  
Ground - Common ground reference for the  
device  
GND  
NC  
NC  
Not connected  
IXDN630 CI / YI  
VCC  
OUT  
GND  
IN  
1
2
3
4
5
NC  
1.3 Absolute Maximum Ratings  
Parameter  
Symbol  
Minimum  
Maximum  
Units  
V
Supply Voltage  
-0.3  
-5  
40  
V
V
CC  
V
, V  
IN EN  
Input Voltage Range  
Output Current  
VCC+0.3  
I
-
±30  
+150  
+150  
A
OUT  
T
Junction Temperature  
Storage Temperature  
°C  
-55  
-65  
J
T
°C  
STG  
Unless stated otherwise, absolute maximum electrical ratings are at 25°C  
Absolute maximum ratings are stress ratings. Stresses in excess of these ratings can cause permanent damage to the device.  
Functional operation of the device at conditions beyond those indicated in the operational sections of this data sheet is not  
implied.  
R04  
www.ixysic.com  
3
IXD_630  
INTEGRATED  
C
IRCUITS  
D
IVISION  
1.4 Recommended Operating Conditions  
Parameter  
Symbol  
Range  
Units  
V
Supply Voltage  
UVLO to 35  
-40 to +125  
V
CC  
T
Operating Temperature Range  
°C  
A
1.5 Electrical Characteristics: T = 25°C  
A
Test Conditions: UVLO < V < 35V (unless otherwise noted).  
CC  
Parameter  
Conditions  
Symbol  
Minimum  
Typical Maximum Units  
UVLO < V < 18V  
CC  
Input Voltage, High  
Input Voltage, Low  
VIH  
VIL  
3.5  
-
-
-
V
UVLO < V < 18V  
CC  
-
0.8  
±10  
0V < V < V  
IN  
Input Current  
IIN  
CC  
-
-
A  
EN Input Voltage, High  
EN Input Voltage, Low  
Output Voltage, High  
Output Voltage, Low  
Output Resistance, High State  
Output Resistance, Low State  
IXDD630 only  
VENH  
VENL  
VOH  
VOL  
ROH  
ROL  
2/3VCC  
-
-
V
IXDD630 only  
1/3VCC  
-
-
-
-
-
VCC-0.025  
-
V
-
-
-
-
0.025  
0.4  
V
=18V, I = -100mA  
OUT  
CC  
0.17  
0.16  
V
=18V, I =100mA  
OUT  
CC  
0.3  
Limited by package power  
dissipation  
Output Current, Continuous  
IDC  
-
-
±8  
A
C
C
C
C
=5.6nF, V =18V  
Rise Time  
tr  
tf  
LOAD  
LOAD  
LOAD  
LOAD  
CC  
-
-
-
-
-
-
11  
11  
46  
46  
34  
65  
20  
18  
=5.6nF, V =18V  
Fall Time  
CC  
=5.6nF, V =18V  
On-Time Propagation Delay  
Off-Time Propagation Delay  
Output Enable Time  
Output Disable Time  
Enable Pull-Up Resistor  
tondly  
CC  
65  
ns  
=5.6nF, V =18V  
toffdly  
CC  
65  
IXDD630 only  
IXDD630 only  
IXDD630 only  
=18V, V =3.5V  
tPZL, tPZH  
tPLZ, tPHZ  
REN  
65  
125  
-
-
400  
2.5  
-
-
4
k  
V
mA  
CC  
IN  
V
=18V, V =0V  
IN  
Power Supply Current  
ICC  
-
0.75  
0.75  
9.9  
13.5  
-
CC  
mA  
V
V
=18V, V =V  
IN CC  
-
-
CC  
V
Rising, IXD_630M  
Rising, IXD_630  
7
10  
-
9
CC  
Under-Voltage Lockout Threshold  
Under-Voltage Lockout Hysteresis  
UVLO  
-
V
12.5  
1
CC  
IXD_630M  
IXD_630  
V
-
1.5  
-
4
www.ixysic.com  
R04  
IXD_630  
INTEGRATED  
C
IRCUITS  
D
IVISION  
1.6 Electrical Characteristics: T = - 40°C to +125°C  
A
Test Conditions: UVLO < V < 35V, T <150°C.  
CC  
J
Parameter  
Input Voltage, High  
Conditions  
Symbol  
VIH  
Minimum Maximum Units  
UVLO < V < 18V  
CC  
4
-
-
-
-
-
-
-
-
V
UVLO < V < 18V  
CC  
Input Voltage, Low  
VIL  
0.8  
0.6  
0.45  
35  
V
=18V, I = -100mA  
OUT  
Output Resistance, High State  
Output Resistance, Low State  
Rise Time  
ROH  
ROL  
tr  
CC  
V
=18V, I =100mA  
OUT  
CC  
C
C
C
C
=5.6nF, V =18V  
CC  
LOAD  
LOAD  
LOAD  
LOAD  
=5.6nF, V =18V  
CC  
Fall Time  
tf  
35  
ns  
=5.6nF, V =18V  
CC  
On-Time Propagation Delay  
Off-Time Propagation Delay  
tondly  
toffdly  
100  
100  
=5.6nF, V =18V  
CC  
1.7 Thermal Characteristics  
Package  
Parameter  
Symbol  
Rating  
Units  
IXD_630CI (5-Lead TO-220)  
IXD_630YI (5-Lead TO-263)  
IXD_630CI (5-Lead TO-220)  
IXD_630YI (5-Lead TO-263)  
36  
46  
3
Thermal Impedance, Junction-to-Ambient  
Thermal Impedance, Junction-to-Case  
°C/W  
JA  
°C/W  
JC  
2
R04  
www.ixysic.com  
5
IXD_630  
INTEGRATED  
C
IRCUITS  
D
IVISION  
2 Functional Description  
2.1 IXDD630 Block Diagram & Truth Table  
2.3 IXDN630 Block Diagram & Truth Table  
IXDD630  
IXDN630  
VCC  
VCC  
IN  
IN  
OUT  
UVLO  
OUT  
UVLO  
GND  
GND  
EN  
IN  
OUT  
IN  
EN  
OUT  
0
1
0
1
0
1
1 or open  
0
1
0
1
Z
Z
1 or open  
0
0
2.2 IXDI630 Block Diagram & Truth Table  
IXDI630  
VCC  
IN  
OUT  
UVLO  
GND  
IN  
OUT  
0
1
1
0
6
www.ixysic.com  
R04  
IXD_630  
INTEGRATED  
C
IRCUITS  
D
IVISION  
3 Typical Performance Characteristics  
Rise & Fall Times vs.Temperature  
(VIN=0-5V, VCC=18V, CLOAD=25nF)  
Rise Time vs. Supply Voltage  
(VIN=0-5V, f=10kHz,TA=25ºC)  
Fall Time vs. Supply Voltage  
(VIN=0-5V, f=10kHz,TA=25ºC)  
110  
100  
90  
80  
70  
60  
50  
40  
30  
20  
10  
0
110  
100  
90  
80  
70  
60  
50  
40  
30  
20  
10  
0
28  
27  
26  
25  
24  
23  
22  
21  
20  
C
=200nF  
CLLOOAADD=100nF  
C
=200nF  
CLLOOAADD=100nF  
C
=50nF  
CLLOOAADD=25nF  
t
f
C
=50nF  
CLLOOAADD=25nF  
t
r
CLOAD=10nF  
CLOAD=10nF  
-50 -30 -10 10 30 50 70 90 110 130  
10  
15  
20  
25  
30  
35  
10  
15  
20  
25  
30  
35  
Temperature (ºC)  
Supply Voltage (V)  
Supply Voltage (V)  
Rise Time vs. Load Capacitance  
Fall Time vs. Load Capacitance  
100  
V
100  
80  
60  
40  
20  
0
VCC=10V  
VCC=10V  
CC=12V,18V,25V,30V,35V  
V
CC=12V  
CC=18V  
80  
V
VCC=25V  
60  
40  
20  
V
CC=30V  
CC=35V  
V
0
0
50  
100  
150  
200  
0
50  
100  
150  
200  
Load Capacitance (nF)  
Load Capacitance (nF)  
Propagation Delay  
vs. Junction Temperature  
Propagation Delay vs. Supply Voltage  
Propagation Delay vs. Input Voltage  
(VIN=0-5V, CLOAD=5.6nF, f=1KHz)  
(VCC=25V, CLOAD=5.6nF, f=1kHz)  
(VIN=0-5V, CLOAD= 5.6nF, VCC=18V, f=1kHz)  
90  
80  
70  
60  
50  
40  
30  
20  
100  
80  
60  
40  
20  
0
70  
60  
50  
40  
30  
20  
t
t
ondly  
t
t
offdly  
ondly  
offdly  
t
ondly  
t
offdly  
5
10  
15  
20  
25  
30  
35  
0
5
10  
15  
20  
25  
30  
-50 -30 -10 10 30 50 70 90 110 130  
Temperature (ºC)  
Input Voltage (V)  
Supply Voltage (V)  
Input Threshold  
vs. Supply Voltage  
Enable Thresholds  
vs. Supply Voltage  
Input Threshold vs.Temperature  
(VCC=18V, CLOAD=5.6nF)  
3.4  
3.2  
3.0  
2.8  
2.6  
2.4  
2.2  
2.0  
1.8  
4.0  
3.5  
3.0  
2.5  
2.0  
22  
20  
18  
16  
14  
12  
10  
8
VENH  
Min VIH  
Max VIL  
Min VIH  
VENL  
Max VIL  
6
4
10  
15  
20  
25  
30  
35  
-50 -30 -10 10 30 50 70 90 110 130  
10 12 14 16 18 20 22 24 26 28 30 32 34 36  
Supply Voltage (V)  
Temperature (ºC)  
Supply Voltage (V)  
R04  
www.ixysic.com  
7
IXD_630  
INTEGRATED  
C
IRCUITS  
D
IVISION  
Supply Current vs. Load Capacitance  
(VCC=12V)  
Supply Current vs. Load Capacitance  
(VCC=35V)  
Supply Current vs. Load Capacitance  
(VCC=18V)  
1000  
100  
10  
1000  
100  
10  
1000  
100  
10  
f=1MHz  
f=500kHz  
f=1MHz  
f=500kHz  
f=100kHz  
f=50kHz  
f=10kHz  
f=1MHz  
f=500kHz  
f=100kHz  
f=50kHz  
f=10kHz  
f=100kHz  
f=50kHz  
f=10kHz  
1
1
1
5.0 7.5 10.0 12.5 15.0 17.5 20.0 22.5 25.0 27.5  
5.0 7.5 10.0 12.5 15.0 17.5 20.0 22.5 25.0 27.5  
5000  
10000  
15000  
20000  
25000  
Load Capacitance (nF)  
Load Capacitance (nF)  
Load Capacitance (pF)  
Supply Current vs. Load Capacitance  
(VCC=10V)  
Supply Current vs. Frequency  
(VCC=35V)  
Supply Current vs. Frequency  
(VCC=18V)  
1000  
100  
10  
1000  
100  
10  
1000  
100  
10  
f=1MHz  
f=500kHz  
f=100kHz  
f=50kHz  
CLOAD=25nF  
CLOAD=10nF  
CLOAD=25nF  
LOAD=10nF  
LOAD=5.6nF  
C
C
LOAD=5.6nF  
C
1
1
0.1  
0.01  
0.1  
0.01  
f=10kHz  
1
5000  
1
10  
100  
1000  
1000  
35  
1
10  
100  
1000  
10000  
Load Capacitance (pF)  
15000  
20000  
25000  
Frequency (kHz)  
Frequency (kHz)  
Quiesent Supply Current  
vs.Temperature  
(VCC=18V)  
Supply Current vs. Frequency  
(VCC=12V)  
Supply Current vs. Frequency  
(VCC=10V)  
1000  
100  
10  
1000  
100  
10  
3.0  
2.5  
2.0  
1.5  
1.0  
0.5  
0.0  
V
=3.5V  
VIN=5V  
VIN=10V  
CLOAD=25nF  
LOAD=10nF  
LOAD=5.6nF  
CLOAD=25nF  
LOAD=10nF  
LOAD=5.6nF  
C
C
C
VIINN=0V & 18V  
C
1
1
0.1  
0.01  
0.1  
0.01  
1
10  
100  
1000  
1
10  
100  
-50 -30 -10 10 30 50 70 90 110 130  
Frequency (kHz)  
Frequency (kHz)  
Temperature (ºC)  
Dynamic Supply Current  
vs.Temperature  
(VCC=18V, VIN=0-5V, f =1kHz, CLOAD=5.6nF)  
Output Source Current  
vs. Supply Voltage  
(VIN=7V, CLOAD=1μF)  
Output Sink Current  
vs. Supply Voltage  
(VIN=7V, CLOAD=1μF)  
1.4  
-65  
-60  
-55  
-50  
-45  
-40  
-35  
-30  
-25  
-20  
-15  
-10  
65  
60  
55  
50  
45  
40  
35  
30  
25  
20  
15  
10  
1.2  
1.0  
0.8  
0.6  
0.4  
0.2  
0.0  
-50 -30 -10 10 30 50 70 90 110 130  
10  
15  
20  
25  
30  
10  
15  
20  
25  
30  
35  
Supply Voltage (V)  
Supply Voltage (V)  
Temperature (ºC)  
8
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INTEGRATED  
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IRCUITS  
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IVISION  
Output Source Current  
vs.Temperature  
Output Sink Current  
vs.Temperature  
High-State Output Resistance  
(VCC=18V, CLOAD=1μF)  
(VCC=18V, CLOAD=1μF)  
vs. Supply Voltage  
-36  
-34  
-32  
-30  
-28  
-26  
-24  
36  
34  
32  
30  
28  
26  
0.22  
0.20  
0.18  
0.16  
0.14  
0.12  
0.10  
ROH @ -100mA  
-50 -30 -10 10 30 50 70 90 110 130  
-50 -30 -10 10 30 50 70 90 110 130  
5
10  
15  
20  
25  
30  
35  
Temperature (ºC)  
Temperature (ºC)  
Supply Voltage (V)  
Low-State Output Resistance  
Under Voltage Lockout Threshold  
Under-Voltage Lockout Threshold  
vs. Supply Voltage  
vs. Temperature - IXD_630M  
vs. Temperature - IXD_630  
0.22  
0.20  
0.18  
0.16  
0.14  
0.12  
0.10  
9.0  
8.5  
8.0  
7.5  
7.0  
13.0  
12.5  
12.0  
11.5  
11.0  
10.5  
10.0  
VCC Rising  
VCC Rising  
VCC Falling  
VCC Falling  
ROL @ +100mA  
-50 -30 -10 10 30 50 70 90 110 130  
5
10  
15  
20  
25  
30  
35  
-50 -30 -10 10 30 50 70 90 110 130  
Temperature (ºC)  
Supply Voltage (V)  
Temperature (ºC)  
R04  
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9
IXD_630  
INTEGRATED  
C
IRCUITS  
D
IVISION  
4 Manufacturing Information  
4.1 Moisture Sensitivity  
All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated  
Circuits Division classifies its plastic encapsulated devices for moisture sensitivity according to the latest  
version of the joint industry standard, IPC/JEDEC J-STD-020, in force at the time of product evaluation.  
We test all of our products to the maximum conditions set forth in the standard, and guarantee proper  
operation of our devices when handled according to the limitations and information in that standard as well as to any  
limitations set forth in the information or standards referenced below.  
Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced  
product performance, reduction of operable life, and/or reduction of overall reliability.  
This product carries a Moisture Sensitivity Level (MSL) classification as shown below, and should be handled  
according to the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033.  
Device  
Moisture Sensitivity Level (MSL) Classification  
IXD_630YI / IXD_630MYI  
IXD_630CI / IXD_630MCI  
MSL 3  
MSL 1  
4.2 ESD Sensitivity  
This product is ESD Sensitive, and should be handled according to the industry standard JESD-625.  
4.3 Reflow Profile  
Provided in the table below is the Classification Temperature (T ) of this product and the maximum dwell time the  
C
body temperature of this device may be (T - 5)ºC or greater. The classification temperature sets the Maximum Body  
C
Temperature allowed for this device during lead-free reflow processes. For through-hole devices, and any other  
processes, the guidelines of J-STD-020 must be observed.  
Classification Temperature (TC)  
Dwell Time (tp)  
Device  
Max Reflow Cycles  
IXD_630YI / IXD_630MYI  
IXD_630CI / IXD_630MCI  
245°C  
245°C  
30 seconds  
30 seconds  
3
1
4.4 Board Wash  
IXYS Integrated Circuits Division recommends the use of no-clean flux formulations. Board washing to reduce or  
remove flux residue following the solder reflow process is acceptable provided proper precautions are taken to  
prevent damage to the device. These precautions include but are not limited to: using a low pressure wash and  
providing a follow up bake cycle sufficient to remove any moisture trapped within the device due to the washing  
process. Due to the variability of the wash parameters used to clean the board, determination of the bake temperature  
and duration necessary to remove the moisture trapped within the package is the responsibility of the user  
(assembler). Cleaning or drying methods that employ ultrasonic energy may damage the device and should not be  
used. Additionally, the device must not be exposed to flux or solvents that are Chlorine- or Fluorine-based.  
10  
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IRCUITS  
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IVISION  
4.5 Mechanical Dimensions  
4.5.1 IXD_630YI & IXD_630MYI (5-Lead TO-263)  
E
(Note 2)  
MM  
INCH  
MIN  
SYMBOL  
MIN  
MAX  
4.826  
0.254  
0.991  
0.889  
0.737  
0.584  
1.651  
9.652  
7.700  
1.562  
MAX  
0.190  
0.010  
0.039  
0.035  
0.029  
0.023  
0.065  
0.380  
0.303  
0.062  
0.420  
0.315  
0.270  
E1  
E3  
Recommended PCB Pattern  
A
A1  
b
b1  
c
c1  
c2  
D
D1  
D2  
E
E1  
E3  
e
H
L
4.064  
0.000  
0.508  
0.508  
0.381  
0.381  
1.143  
8.382  
6.858  
1.358  
0.160  
0.000  
0.020  
0.020  
0.015  
0.015  
0.045  
0.330  
0.270  
0.053  
10.75  
(0.423)  
L1  
D2  
D1  
D
(Note 2)  
2.20  
(0.087)  
8.40  
(0.331)  
H
*
9.652 10.668 0.380  
8.000  
6.869  
1.702 BSC  
14.605 15.875 0.575  
8.05  
(0.317)  
Pin 1  
Indicator  
6.223  
5.092  
0.245  
0.200  
0.067 BSC  
10.50  
(0.413)  
C
C
3.80  
(0.150)  
0.625  
0.110  
0.066  
e ~4x  
b ~5x  
1.778  
1.000  
2.794  
1.676  
0.070  
0.039  
L1  
L3  
R
R1  
θ
*
Circular feature will be  
present on devices  
with the  
1.05  
(0.041)  
1.702  
(0.067)  
0.254 BSC  
0.460 TYP  
0.506 TYP  
0.010 BSC  
0.018 TYP  
0.02 TYP  
-
A
Optional Tip Lead Form.  
Dimensions  
mm  
(inches)  
c2  
-
8º  
8º  
SECTION: C-C  
PLATING  
(Note 3)  
JEDEC TO-263  
Optional Tip Lead Form  
b1  
c
BASE METAL c1  
A1  
A1  
b
NOTES:  
1. Reference JEDEC TO-263 Type “BA”.  
L
L
R1  
L3  
R1  
R
R
2. Dimension does not include mold flash; mold flash  
shall not exceed 0.127mm (0.005 inch) per side.  
3. Minimum plating: 1000 microinches.  
L3  
θ
θ
4. Controlling dimension: millimeters.  
4.5.2 IXD_630CI & IXD_630MCI(5-Lead TO-220)  
A
B
3.810 - 3.860  
(0.150 - 0.152)  
9.652 - 10.668  
3.556 - 4.826  
(0.140 - 0.190)  
9.652 - 10.668  
(0.380 - 0.420)  
(0.380 - 0.420)  
0.127 BSC  
0.355 M B A M  
(0.005 BSC)  
0.508 - 1.397  
(0.020 - 0.055)  
2.540 - 3.048  
(0.100 - 0.120)  
5.842 - 6.858  
(0.230 - 0.270)  
5.842 - 6.858  
(0.230 - 0.270)  
7.550 - 8.100  
(0.297 - 0.319)  
4.826 - 5.334  
(0.190 - 0.210)  
14.224 - 16.510  
(0.560 - 0.650)  
12.192 - 12.878  
(0.480 - 0.507)  
6.300 - 6.700  
(0.248 - 0.264)  
8.382 - 9.017  
(0.330 - 0.355)  
6.858 - 8.890  
(0.270 - 0.350)  
THERMAL PAD  
2.032 - 2.921  
(0.080 - 0.115)  
C
C
12.700 - 14.732  
(0.500 - 0.580)  
0.356 - 0.610  
(0.014 - 0.024)  
0.381 - 1.016 5x  
(0.015 - 0.040 5x)  
SECTION C-C  
1.702 4x BSC  
(0.067 4x BSC)  
BASE METAL  
0.381 - 1.016  
(0.015 - 0.040)  
PLATING  
0.381 M B A M  
Dimensions  
mm  
(inches)  
0.356 - 0.559  
(0.014 - 0.022)  
0.356 - 0.610  
(0.014 - 0.024)  
LEAD TIP  
0.381 - 0.965  
(0.015 - 0.038)  
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11  
IXD_630  
INTEGRATED  
C
IRCUITS  
D
IVISION  
For additional information please visit our website at: www.ixysic.com  
IXYS Integrated Circuits Division makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make  
changes to specifications and product descriptions at any time without notice. Neither circuit patent licenses nor indemnity are expressed or implied. Except as set forth in IXYS Integrated  
Circuits Division’s Standard Terms and Conditions of Sale, IXYS Integrated Circuits Division assumes no liability whatsoever, and disclaims any express or implied warranty, relating to its  
products including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringement of any intellectual property right.  
The products described in this document are not designed, intended, authorized or warranted for use as components in systems intended for surgical implant into the body, or in other  
applications intended to support or sustain life, or where malfunction of IXYS Integrated Circuits Division’s product may result in direct physical harm, injury, or death to a person or severe  
property or environmental damage. IXYS Integrated Circuits Division reserves the right to discontinue or make changes to its products at any time without notice.  
Specification: DS-IXD_630-R04  
©Copyright 2017, IXYS Integrated Circuits Division  
All rights reserved. Printed in USA.  
4/5/2017  
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