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MXT10A-3-5SA-P

型号：

MXT10A-3-5SA-P

品牌：

BOURNS[ BOURNS ELECTRONIC SOLUTIONS ]

页数：

15 页

PDF大小：

1264 K

下载PDF手册
■ High reliability  
■ Remote on/off  
■ Remote sense  
■ Output overcurrent protection  
(non-latching)  
Features  
■ Industry standard surface mount device  
■ Output voltage programmable from  
0.75 Vdc to 3.3 Vdc via external resistor  
■ Up to 10 A output current  
■ Up to 95 % efficiency  
■ Overtemperature protection  
■ Constant switching frequency (300 kHz)  
■ Wide operating temperature range  
■ Optional sequencing function  
■ Small size, low profile, cost-efficient open  
frame design  
■ Low output ripple and noise  
MX(T)10A-3-5SA SMT Non-Isolated Power Module  
Description  
How to Order  
Bourns® MX(T)10A-3-5SA is a non-isolated DC-DC converter  
offering designers a cost and space-efficient solution with  
standard features such as remote on/off, remote sense, precisely  
regulated programmable output voltage, overcurrent and over-  
temperature protection, and optional output voltage sequencing.  
These modules deliver up to 10 A of output current with full load  
efficiency of 95 % at 3.3 V output.  
M X (T) 10A - 3-5 S A (-P)  
Configuration  
M = Surface Mount Device  
Internal Identifier  
Identifies Sequencing Pin Function (optional)  
Output Current (Amps)  
Input Voltage (V)  
Outputs  
S = Single  
Output Voltage (V)  
A = Adjustable  
Optional Positive On/Off Logic  
Please contact your Bourns sales representative for pricing, availability and optional  
features such as no “remote sense”.  
Absolute Maximum Ratings  
Stress in excess of absolute maximum ratings may cause permanent damage to the device. Device reliability may be affected if  
exposed to absolute maximum ratings for extended time periods.  
Characteristic  
Min.  
-0.3  
-40  
Max.  
5.8  
Units  
Notes & Conditions  
Continuous Input Voltage  
Operating Temperature Range  
Storage Temperature  
Sequencing Function  
V
dc  
+85  
°C  
°C  
See Thermal Considerations section  
-55  
+125  
-0.3  
V , max.  
in  
V
dc  
Electrical Specifications  
Unless otherwise specified, specifications apply over all input voltage, resistive load and temperature conditions.  
Characteristic  
Min.  
2.4  
-
Nom.  
Max.  
5.5  
Units  
Notes & Conditions  
Operating Input Voltage  
Maximum Input Current  
Input No Load Current  
V
V
≤ V - 0.5 V  
dc  
out  
in  
Over V range, I max, V  
10.0  
A
= 3.3 V  
out dc  
dc  
in  
o
V
= 5.0 V , Io = 0 A, mod. enabled,  
in  
dc  
25  
30  
mA  
mA  
-V  
-V  
= 0.75 V  
out  
out  
dc  
= 3.3 V  
dc  
Input Stand-by Current  
Inrush Transient  
1.5  
mA  
V
= 5.0 V , module disabled  
in  
dc  
2
0.1  
A s  
Input Reflected Ripple Current  
Input Ripple Rejection  
100  
30  
mAp-p  
dB  
120 Hz  
Caution: The power modules are not internally fused. An external input line time delay fuse with a maximum rating of 15 A is required.  
See the Safety Considerations section of this data sheet.  
Applications  
■ Intermediate Bus architecture  
■ Distributed power applications  
■ Workstations and servers  
■ Telecom equipment  
■ Enterprise networks including LANs/WANs  
■ Latest generation ICs (DSP, FPGA, ASIC) and microprocessor powered applications  
*RoHS Directive 2002/95/EC Jan 27 2003 including Annex.  
Specifications are subject to change without notice.  
Customers should verify device performance in their specific applications.  
1
MX(T)10A-3-5SA SMT Non-Isolated Power Module  
Electrical Specifications (Continued)  
Characteristic  
Min.  
-2.0  
-3.0  
Nom.  
Max.  
2.0  
Units  
Notes & Conditions  
Output Voltage Setpoint Accuracy  
Output Voltage Tolerance  
% V  
V
min, I max, T = 25 °C  
o,set  
o,set  
in  
o
A
3.0  
% V  
Over all rated in out voltage, load and  
temperature conditions  
Voltage Adjustment Range  
Line Regulation  
0.7525  
3.63  
V
dc  
0.3  
0.3  
0.4  
% V  
o,set  
o,set  
o,set  
Load Regulation  
% V  
% V  
A
Temperature Regulation  
Output Current  
0.0  
10.0  
dc  
Output Current Limit Inception (Hiccup Mode)  
Output Short Circuit Current  
220  
3
% I max  
o
A
V ≤ 250 mV – Hiccup Mode  
dc  
o
Output Ripple and Noise Voltage  
1 µF ceramic/10 µF tantalum capacitors  
RMS  
Peak-to-Peak  
8
25  
15  
50  
mVrms  
mVpk-pk  
5 Hz to 20 MHz bandwidth  
External Capacitance  
- ESR ≥ 1 mΩ  
- ESR ≥ 10 mΩ  
1000  
5000  
µF  
µF  
Efficiency  
82.5  
88.0  
89.5  
91.0  
93.0  
95.0  
%
%
%
%
%
%
V
V
V
V
V
V
= 0.75 V  
= 1.2 V  
dc  
o,set  
o,set  
o,set  
o,set  
o,set  
o,set  
dc  
(V = 5 V , T = 25 °C, Full Load)  
in  
dc  
A
= 1.5 V  
= 1.8 V  
= 2.5 V  
= 3.3 V  
dc  
dc  
dc  
dc  
Switching Frequency  
300  
kHz  
Dynamic Load Response  
5 A to 10 A; 10 A to 5 A;  
(∆i/∆t = 2.5 A/µs; 25 °C)  
1 µF ceramic/10 µF tantalum capacitor  
Peak Deviation  
200  
25  
mV  
µs  
Settling Time (V <10 % peak deviation)  
o
3 x 100 µF polymer capacitors  
5 A to 10 A; 10 A to 5 A;  
(∆i/∆t = 2.5 A/µs; 25 °C)  
100  
100  
mV  
µs  
Peak Deviation  
Settling Time (V <10 % peak deviation)  
o
General Specifications  
Characteristic  
Calculated MTBF  
Weight  
Nom.  
Units  
Notes & Conditions  
13,675,000  
hours  
5.0  
g
(0.18)  
(oz.)  
Specifications are subject to change without notice.  
Customers should verify device performance in their specific applications.  
2
MX(T)10A-3-5SA SMT Non-Isolated Power Module  
Feature Specifications  
Characteristic  
Min.  
Nom.  
Max.  
Units  
Notes & Conditions  
10 µA max.  
Remote Enable  
Open = On (Logic Low)  
Low = Off (Logic High)  
0.4  
5.5  
V
V
dc  
>2.5  
1 mA max.  
dc  
Turn-On Delay and Rise Times  
Case 1: On/Off Low – V Applied  
Case 2: V Applied, then On/Off Set Low  
in  
Case 3: Output Voltage Rise  
2.5  
2.5  
3.0  
msec  
msec  
msec  
in  
(10 %-90 % of V setting)  
o
Sequencing Delay Time  
10  
msec  
Delay from V , min. to application of  
in  
voltage on SEQ pin  
Tracking Accuracy  
100  
200  
200  
400  
mV  
mV  
Power Up: 2 V/ms  
Power Down: 1 V/ms  
Output Voltage Overshoot  
Remote Sense Range  
1
% V  
I
max, V =5.5, T =25 °C  
in  
o, set  
o
A
0.5  
V
dc  
°C  
Overtemperature Protection  
125  
See Thermal Consideration section  
Input Undervoltage Lockout  
-Turn-on Threshold  
-Turn-off Threshold  
2.2  
2.0  
V
V
Specifications are subject to change without notice.  
Customers should verify device performance in their specific applications.  
3
MX(T)10A-3-5SA SMT Non-Isolated Power Module  
Characteristic Curves  
The curves provided below are typical characteristics for the MX(T)10A-3-5SA modules at 25 °C. For any specific test configurations or  
any specific test requests, please contact Bourns.  
100.0  
95.0  
90.0  
100.0  
95.0  
90.0  
85.0  
80.0  
Vin=5.5 V  
Vin=5.0 V  
Vin=3.0 V  
Vin=5.5 V  
Vin=5.0 V  
Vin=3.0 V  
85.0  
80.0  
75.0  
70.0  
75.0  
70.0  
2.0 3.0 4.0 5.0  
6.0 7.0 8.0 9.0 10.0  
2.0 3.0 4.0 5.0 6.0 7.0 8.0 9.0 10.0  
Output Current (A  
Output Current (A  
)
dc  
)
dc  
Fig. 1 Efficiency vs. Output Current (V = 0.75 V  
)
out dc  
Fig. 4 Efficiency vs. Output Current (V = 1.8 V  
)
out dc  
100.0  
95.0  
90.0  
100.0  
95.0  
90.0  
85.0  
80.0  
Vin=5.5 V  
Vin=5.0 V  
Vin=3.0 V  
85.0  
80.0  
75.0  
70.0  
75.0  
70.0  
Vin=5.5 V  
Vin=5.0 V  
Vin=3.0 V  
2.0 3.0 4.0 5.0  
6.0 7.0 8.0 9.0 10.0  
2.0 3.0 4.0 5.0  
6.0 7.0 8.0 9.0 10.0  
Output Current (A  
)
Output Current (A  
)
dc  
dc  
Fig. 2 Efficiency vs. Output Current (V = 1.2 V  
)
Fig. 5 Efficiency vs. Output Current (V = 2.5 V  
)
out dc  
out dc  
100.0  
95.0  
90.0  
100.0  
95.0  
90.0  
85.0  
80.0  
Vin=5.5 V  
Vin=5.0 V  
Vin=3.0 V  
85.0  
80.0  
75.0  
70.0  
75.0  
70.0  
Vin=5.5 V  
Vin=5.0 V  
Vin=4.5 V  
2.0 3.0 4.0 5.0  
6.0 7.0 8.0 9.0 10.0  
2.0 3.0 4.0 5.0  
6.0 7.0 8.0 9.0 10.0  
Output Current (A  
)
Output Current (A  
)
dc  
dc  
Fig. 6 Efficiency vs. Output Current (V = 3.3 V  
)
out dc  
Fig. 3 Efficiency vs. Output Current (V = 1.5 V  
)
out dc  
Specifications are subject to change without notice.  
Customers should verify device performance in their specific applications.  
4
MX(T)10A-3-5SA SMT Non-Isolated Power Module  
Characteristic Curves (Continued)  
12.0  
10.0  
8.0  
6.0  
4.0  
2.0  
Iin, Adc  
Vo, Vdc  
?
?
0.0  
-0.5  
Output Voltage: 200 mVolt 5 µs  
Output Current (3.1 A/Div): 2 Volt 5 µs  
0.5  
1.5  
2.5  
3.5  
4.5 5.5  
Input Voltage (V  
)
dc  
Time (5 µs/div)  
Fig. 7 Input Voltage vs. I and V  
Fig. 10 Transient Response - 5 A - 10 A Step  
o
o
(V = 2.5 V , I = 10.0 A)  
(V = 3.3 V  
)
o
dc o  
o
dc  
No Load: 20 mVolt 2.5 µs  
Half Load: 20 mVolt 2.5 µs  
Full Load: 20 mVolt 2.5 µs  
Output Voltage: 200 mVolt 5 µs  
Output Current (3.1 A/Div): 2 Volt 5 µs  
Time (2.5 µs/div)  
Fig. 8 Typical Output Ripple and Noise  
Time (5 µs/div)  
Fig. 11 Transient Response - 10 A - 5 A Step  
(V = 5.0 V, V = 0.75 V, I = 10.0 A)  
in  
o
o
(V = 3.3 V  
dc  
)
o
No Load: 20 mVolt 2.5 µs  
Half Load: 20 mVolt 2.5 µs  
Full Load: 20 mVolt 2.5 µs  
Output Voltage: 100 mVolt 10 µs  
Output Current (3.1 A/Div): 2 Volt 10 µs  
Time (2.5 µs/div)  
Fig. 9 Typical Output Ripple and Noise  
Time (10 µs/div)  
Fig. 12 Transient Response - 5 A - 10 A Step  
(V = 5.0 V, V = 3.3 V, I = 10.0 A)  
in  
o
o
(V = 3.3 V , C = 3x100 μF Polymer Capacitors)  
dc ext  
o
Specifications are subject to change without notice.  
Customers should verify device performance in their specific applications.  
5
MX(T)10A-3-5SA SMT Non-Isolated Power Module  
Characteristic Curves (Continued)  
Output Voltage:  
500 mVolt 1 ms  
On/Off Voltage:  
2 Volt 1 ms  
Output Voltage: 100 mVolt 10 µs  
Output Current (3.1 A/Div): 2 Volt 10 µs  
Time (10 µs/div)  
Fig. 13 Transient Response - 10 A - 5 A Step  
Time (1 ms/div)  
Fig. 16 Typical Start-up with Application of V  
in  
(V = 3.3 V , C = 3x100 µF Polymer Capacitors)  
(V = 5 V , V = 3.3 V , I = 10 A)  
in dc dc  
o
dc ext  
o
o
Output Current:  
500 mVolt 1 ms  
On/Off Voltage:  
2 Volt 1 ms  
Output Voltage: 500 mVolt 1 ms  
On/Off Voltage: 2 Volt 1 ms  
Time (1 ms/div)  
Fig. 14 Typical Start-up using Remote On/Off  
Time (1 ms/div)  
Fig. 17 Typical Start-up using Remote On/Off with Prebias  
(V = 5 V , V = 1.8 V , I = 1 A, V = 1 V  
(V = 5 V , V = 3.3 V , I = 10 A)  
in dc dc o  
o
)
in dc dc bias dc  
o
o
Output Voltage:  
500 mVolt 1 ms  
On/Off Voltage:  
2 Volt 1 ms  
Output Current (4 A/div): 20 mVolt 5 ms  
Time (5 ms/div)  
Time (1 ms/div)  
Fig. 15 Typical Start-up using Remote On/Off  
with Low-ESR External Capacitors (100x100 µF Polymer)  
Fig. 18 Output Short Circuit Current  
(V = 5.0 V , V = 0.75 V  
)
in dc dc  
o
(V = 5.0 V , V = 3.3 V , I = 10.0 A, C = 1000 µF)  
in dc dc  
o
o
o
Specifications are subject to change without notice.  
Customers should verify device performance in their specific applications.  
6
MX(T)10A-3-5SA SMT Non-Isolated Power Module  
Characteristic Curves (Continued)  
12  
12  
100 LFM  
0 LFM  
100 LFM  
0 LFM  
10  
8
10  
8
6
6
3
3
2
2
0
0
15 25 35 45 55 65 75 85  
Ambient Temperature (°C)  
15 25 35 45 55 65 75 85  
Ambient Temperature (°C)  
Fig. 19 Derating Output Current vs.  
Local Ambient Temp. and Airflow  
Fig. 22 Derating Output Current vs.  
Local Ambient Temp. and Airflow  
(V = 5.0 V , V = 0.75 V  
in dc dc  
)
(V = 5.0 V , V = 3.3 V  
in dc dc  
)
o
o
12  
12  
100 LFM  
0 LFM  
10  
8
10  
8
0 LFM  
6
6
3
3
2
2
0
0
15 25 35 45 55 65 75 85  
Ambient Temperature (°C)  
15 25 35 45 55 65 75 85  
Ambient Temperature (°C)  
Fig. 20 Derating Output Current vs.  
Local Ambient Temp. and Airflow  
Fig. 23 Derating Output Current vs.  
Local Ambient Temp. and Airflow  
(V = 5.0 V , V = 1.8 V  
)
in  
dc  
o
dc  
(V = 3.3 V , V = 2.5 V )  
in dc dc  
o
12  
100 LFM  
10  
8
0 LFM  
6
3
2
0
15 25 35 45 55 65 75 85  
Ambient Temperature (°C)  
Fig. 21 Derating Output Current vs.  
Local Ambient Temp. and Airflow  
(V = 5.0 V , V = 2.5 V  
in dc dc  
)
o
Specifications are subject to change without notice.  
Customers should verify device performance in their specific applications.  
7
MX(T)10A-3-5SA SMT Non-Isolated Power Module  
Operating Information  
Remote On/Off  
The MX(T)10A-3-5SA comes standard with Active LOW Negative On/Off logic, i.e., OPEN or LOW (< 0.4 V) will turn ON the device.  
To turn the device OFF, increase the voltage level on the On/Off pin above 2.4 V, as shown in Figure 24(a), placing the part into low  
dissipation sleep mode.  
The MX(T)10A-3-5SA-P comes with Active HIGH Positive On/Off logic, i.e., OPEN or HIGH (>2.4 V) will turn on the device. To turn OFF,  
decrease the voltage level on the On/Off pin below 0.4 V.  
The signal levels of the On/Off pin input is defined with respect to ground.  
Fig. 24(a) Circuit Configuration for using  
Negative Logic On/Off  
Fig. 24(b) Circuit Configuration for using  
Positive On/Off  
Input Considerations  
The input must have a stable low impedance AC source for optimum performance. This can be accomplished with external ceramic  
capacitors, tantalum capacitors and/or polymer capacitors. Using low impedance tantalum capacitors requires about 20 µF per amp  
and an ESR of 250 mΩ per amp of output current. Tantalum capacitors with a combined value of 200 µF and less than 25mΩ ESR  
would be adequate. This can be implemented with (2) 100 µF tantalum capacitors with an ESR less than of 50mΩ. Ceramic capacitors  
are also recommended to reduce high frequency ripple on the input.  
Output Considerations  
To maintain the specified output ripple and transient response, external capacitors must be used. An external 1 µF ceramic capacitor in  
parallel with a 10 µF low ESR tantalum capacitor will usually meet the specified performance. Improved performance can be achieved  
by using more capacitance. Low ESR polymer capacitors may also be used. Two 100 µF, 9 mΩ or lower ESR capacitors are  
recommended.  
Safety Information  
In order to comply with safety requirements the user must provide a fuse in the unearthed input line. This is to prevent earth being  
disconnected in the event of a failure.  
The converter must be installed as per guidelines outlined by the various safety approvals if safety agency approval is required for the  
overall system. The positive input lead must be provided with a time-delay fuse with a maximum rating of 15 A.  
Overtemperature Protection  
The device will shut down if it becomes too hot (typically 125 °C). Once the converter cools, it automatically restarts. This feature does  
not guarantee the converter won’t be damaged by temperatures above its rating.  
Specifications are subject to change without notice.  
Customers should verify device performance in their specific applications.  
8
MX(T)10A-3-5SA SMT Non-Isolated Power Module  
Operating Information (Continued)  
Overcurrent Protection  
The device has an internally set output current limit to protect it from overloads, placing the unit in hiccup mode. Once the overload is  
removed the converter automatically resumes normal operation. No user adjustments are available. An external fuse in series with the  
input voltage is also required for complete overload protection.  
Input Undervoltage Lockout  
The device operation is disabled if the input voltage drops below the specified input range. Once the input returns to the specified  
range operation automatically resumes. No user adjustments are available.  
Output Voltage Setting  
The output voltage can be programmed to any voltage between 0.75 Vdc and 3.3 Vdc by connecting a single resistor between the trim  
pin and the GND pin of the module, as shown in Fig. 25 below.  
If left open circuit the output voltage will default to 0.75 Vdc. The correct Rtrim value for a specific voltage can be calculated using the  
following equation:  
VIN (+)  
VO (+)  
Rtrim = [21.07/(Vo-0.7525)-5.11] KΩ  
For example, to set the MX(T)10A-3-5SA to 3.3 V the following  
Rtrim resistor must be used:  
LOAD  
ON/OFF  
TRIM  
Rtrim  
Rtrim = [21.07/(3.3-0.7525)-5.11] KΩ  
GND  
Rtrim = 3.161 kΩ,  
The closest standard 1 % E96 value is 3.16 kΩ.  
Fig. 25 Circuit Configuration to Program Output  
Voltage using an External Resistor  
Table 1 provides the Rtrim values required for some common output  
voltage set points. The nearest standard E96 1 % resistor value is also given.  
MX(T)10A-3-5SA Rtrim Values  
Vo (V)  
0.75  
1.0  
Rtrim (kΩ)  
Open  
1 % Value  
Open  
80.6  
80.02  
1.2  
41.97  
42.2  
1.5  
23.08  
23.2  
1.8  
15.00  
15.0  
2.0  
11.78  
11.8  
2.5  
6.947  
6.98  
3.3  
3.161  
3.16  
Table 1  
The output voltage of the device can also be set by applying a voltage between the TRIM and GND pins. The Vtrim equation can be  
written as follows:  
Vtrim = (0.7 – 0.1698 x{Vo – 0.7225))  
To set Vo = 3.3 V, the Vtrim required would therefore be 0.2670 V.  
Table 2 provides the Vtrim values required for some common output voltage set points.  
Specifications are subject to change without notice.  
Customers should verify device performance in their specific applications.  
9
MX(T)10A-3-5SA SMT Non-Isolated Power Module  
Operating Information (Continued)  
MX(T)10A-3-5SA Vtrim Values  
Vo (V)  
0.75  
1.0  
Vtrim (V)  
Open  
0.6580  
0.6240  
0.5731  
0.5221  
0.4882  
0.4033  
0.2674  
1.2  
1.5  
1.8  
2.0  
2.5  
3.3  
Table 2  
Voltage Margining  
Output voltage margining can be implemented as follows and as shown in Figure 26.  
1) Trim-up: Connect a resistor, Rm-up, from the Trim pin to the ground pin for adjusting the voltage upwards, and  
2) Trim-down: Connect a resistor, Rm-down, from the Trim pin to the output pin for adjusting the voltage downwards.  
Please consult your local Bourns field applications engineer for more details and the calculation of the required resistor values.  
Vo  
Vo  
Vin  
R
margin-down  
Q2  
Trim  
On/Off  
R
margin-up  
R
trim  
Q1  
COM  
Fig. 26 Circuit Configuration for Margining Output Voltage  
Sequencing Function  
Bourns XT Series modules have a sequencing feature that enables users to implement various types of output voltage sequencing in  
their applications. When an analog voltage is applied to the SEQ pin, the output voltage tracks this voltage until the output reaches the  
set-point voltage. The final SEQ pin voltage must be set higher than the set-point voltage of the module. The output voltage follows the  
voltage on the SEQ pin on a one-to-one basis. By connecting multiple modules together, customers can get multiple modules to track  
their output voltages to the voltage applied on the SEQ pin.  
For proper voltage sequencing, the input voltage is applied to the module. The On/Off pin should be set so as the module is ON by  
default. An analog voltage is applied to the SEQ pin and the output voltage of the module will track this voltage on a 1:1 basis until  
output reaches the set-point voltage, as shown in Figure 27.  
To initiate simultaneous shutdown of the modules, the SEQ pin voltage is lowered in a controlled manner. Output voltage of the  
modules tracks the voltages below their set-point voltages on a one-to-one basis, as shown in Figure 28. A valid input voltage must be  
maintained until the tracking and output voltages reach ground potential to ensure a controlled shutdown of the modules.  
When not using the sequencing feature, tie the SEQ pin to V . For additional guidelines please contact your local Bourns field  
out  
applications engineer.  
Specifications are subject to change without notice.  
Customers should verify device performance in their specific applications.  
10  
MX(T)10A-3-5SA SMT Non-Isolated Power Module  
Operating Information (Continued)  
Vo: 1 Volt 1 ms  
Vseq: 1 Volt 1 ms  
Vo: 1 Volt 500 µs  
Vseq: 1 Volt 500 µs  
Time (0.5 ms/div)  
Time (0.5 ms/div)  
Fig. 28 Voltage Sequencing at Power Down  
Fig. 27 Voltage Sequencing at Power Up  
(V = 5.0 V , V = 3.3 V , I = 10.0 A)  
(V = 5.0 V , V = 3.3 V , I = 10.0 A)  
in  
dc  
o
dc o  
in  
dc  
o
dc o  
Remote Sense  
The Remote Sense feature is used to minimize the effects of distribution losses by regulating the voltage at the Remote Sense pin (See  
Figure 29). The voltage between the Sense pin and V pin must not exceed 0.5 V.  
o
When the Remote Sense feature is not being used, connect the Remote Sense pin to the output pin of the module.  
It is very important to make sure that the maximum output power (V x I ) of the module remains less than or equal to the maximum  
o
o
rated power. Using Remote Sense, the output voltage of the module can increase, which may increase the power output by the module.  
Rdistribution  
Rcontact  
Rdistribution Rcontact  
V (+) Vo  
IN  
Sense  
RLOAD  
R
Rdistribution  
Rcontact  
distribution Rcontact  
COM  
Fig. 29 Remote Sense Circuit Configuration  
Thermal Considerations  
Sufficient cooling must always be considered to ensure reliable operation, as these devices operate in a variety of thermal environments.  
Factors such as ambient temperature, airflow, power dissipation and reliability must be taken into consideration.  
The data presented in Figures 19 to 23 is based on physical test results taken in a wind tunnel test. The test set-up is shown in  
Figure 31.  
The thermal reference points are (1) T  
and T  
ref2  
as shown in Figure 30, and (2) T = temperature at controller IC. For reliable  
ref3  
ref1  
operation, none of these T points should exceed 115 °C.  
ref  
Specifications are subject to change without notice.  
Customers should verify device performance in their specific applications.  
11  
MX(T)10A-3-5SA SMT Non-Isolated Power Module  
Thermal Considerations (Continued)  
Air  
Flow  
WIND TUNNEL  
Airflow and ambient  
temp sensor probes  
location  
8.1 (0.32)  
Air Flow  
Tref1 Tref2  
76.2 (3.0)  
UNIT UNDER TEST  
PCB  
Fig. 30 T  
Temperature Measurement Location  
ref1  
Fig. 31  
Thermal Test Set-up  
25.4 (1.0)  
Product Dimensions  
BOTTOM VIEW  
SIDE VIEW  
7.57  
(0.298)  
MAX.  
33.0  
(1.30)  
DIMENSIONS:  
MM  
(INCHES)  
3.05  
(0.120)  
4.83  
(0.190)  
7.54  
(0.297)  
7.06  
(0.278)  
4 PLCS.  
SEQ* GND VOUT TRIM SENSE  
TOLERANCES:  
DECIMAL .X  
L1 (REF.)  
10.29  
(0.405) (0.53)  
13.5  
10.92  
(0.430)  
0.5  
(0.02)  
0.25  
(0.010)  
DECIMAL .XX  
ON/OFF  
VIN  
2.84  
1.57  
(0.062)  
1.91  
(0.075)  
1.57  
(0.062)  
SURFACE MOUNT  
CONTACT  
(0.112)  
1.22  
(0.048)  
7 PLCS.  
*Pin Stuffed with MXT10A option only, absent with MX10A standard  
Fig. 32 Product Dimensions  
Coplanarity  
The MX(T)10A-3-5SA device has a maximum coplanarity of 100 µm (approx. 0.004 ”), as defined by JESD22-B108.  
Pin Plating Composition  
Tin (Sn) plating over nickel (Ni).  
Specifications are subject to change without notice.  
Customers should verify device performance in their specific applications.  
12  
MX(T)10A-3-5SA SMT Non-Isolated Power Module  
Recommended Pad Layout  
7.54  
(0.297)  
4.83  
(0.190)  
4 PLCS.  
PIN  
1
2
3
4
FUNCTION  
ON/OFF  
VIN  
SENSE TRIM VOUT GND SEQ*  
10.29  
(0.405)  
10.92  
(0.430)  
0.64  
SEQ  
GND  
(0.025)  
ON/OFF  
VIN  
5
6
7
VOUT  
TRIM  
SENSE  
DIMENSIONS:  
MM  
(INCHES)  
1.22  
(0.048)  
29.90  
(1.177)  
3.56  
2.41  
RECOMMENDED PAD SIZE:  
X
MIN.  
(0.140) (0.095)  
4.19 2.79  
(0.165) (0.110)  
X
MAX.  
*Pad required with MXT10A option only,  
not required with MX10A standard  
Fig. 33 Recommended Pad Layout  
Use in Manufacturing Environment  
Pick and Place Information  
Bourns SMT devices, packaged on tape and reel, are designed (low mass) for automated assembly using standard SMT pick and  
place equipment. The centrally located inductor provides the flat surface area to be used for component pick up. Variables such as  
nozzle style, nozzle size, handling speed, and placement pressure need to be optimized for best results.  
33.0  
(1.30)  
13.5  
(0.53)  
6.73  
(0.27)  
DIMENSIONS:  
MM  
(INCHES)  
13.18  
(0.52)  
Fig. 34 Pick and Place Location  
Specifications are subject to change without notice.  
Customers should verify device performance in their specific applications.  
13  
MX(T)10A-3-5SA SMT Non-Isolated Power Module  
Use in Manufacturing Environment (Continued)  
Packaging Information  
Devices come in 44 mm tape and reel, as per EIA-481-2.  
4.00 0.05  
(.157 .002)  
0.4 0.05  
(.016 .002)  
DIA.  
2.00 0.05  
1.75 0.10  
(.069 .004)  
1.50 +0.10/-0.00  
(.049 +.004/-0.00)  
7.80 0.10  
(.307 .004)  
(.079 .002)  
B
20.20 0.10  
44.00 0.10  
(.795 .004) 1.732 .004)  
Reel Dimensions:  
Outside Diameter:  
Inside Diameter:  
330.2  
(13.00)  
177.8  
33.50 0.10  
(1.319 .004)  
A
A
40.40 0.10  
(1.591 .004)  
2.00 +0.10/-0.00  
(7.00)  
(.079 +.004/-0.00)  
44.0  
Width:  
DIA.  
(1.73)  
5 °  
24.00 0.10  
(.945 .004)  
SECTION B-B  
B
DIMENSIONS:  
MM  
(INCHES)  
5 °  
14.00 0.10  
(.551 .004)  
SECTION A-A  
Fig. 35 Packaging Tape Detail  
PCB Layout for SMT Devices  
•
•
•
•
•
•
•
Use a solder mask defined pad design.  
See specific datasheet for recommended minimum and maximum pad size.  
Interconnection to internal power planes is typically required.  
“Via-in-pad” design should be avoided in the SMT pads.  
Solder mask should be used to eliminate solder wicking into the vias.  
Low resistance and low inductance PCB layout traces should be used where possible, particularly on the output side.  
A low impedance track between the input ground and output ground is very important to achieve high efficiencies.  
Soldering Requirements  
Bourns recommends the following temperature profile for use on tin lead solder (Sn-Pb Eutectic) and lead free solder. For lead free  
solder, the maximum temperature during mounting processes will be 260 °C for no more than 5 seconds For lead free solder systems,  
typical time above 230 °C is 60 seconds.  
Solder Reflow Profile  
300  
250  
Peak Temp. (Pb-Free Solder)  
245 °C  
Peak Temp. (Pb Solder)  
210-225 °C  
200  
150  
100  
50  
Preheat Zone  
<2.5 °C/sec.  
Soaking Zone  
Reflow Zone  
(90 sec. max.)  
30-60 sec. typ.  
1.3 - 1.6 °C/sec.  
Cool Down Zone  
(2 min. max.)  
60-90 sec typical  
0.5 - 0.6 °C/sec.  
Preheating Zone  
(2 - 4 min. max.)  
Fig. 36 Suggested Reflow Profile  
0
0
15 30 45 60 75 90 105 120 135 150 165 180 195 210 225 240 255 270 285 300  
Time (Seconds)  
Specifications are subject to change without notice.  
Customers should verify device performance in their specific applications.  
14  
MX(T)10A-3-5SA SMT Non-Isolated Power Module  
Use in Manufacturing Environment (Continued)  
Water Washing  
A non-clean solder paste system should be used for solder attach onto application boards. The parts are suitable for water washing  
applications. However, the user must ensure that the drying process is sufficient to remove all water from the module after washing  
and that the module is never powered up prior to the module being fully dried.  
Inspection/Rework  
Conventional techniques may be employed when replacing a unit in the application. Using a precision dispenser or a suitable mini-  
stencil, a suitable volume of solder paste should be applied to the cleaned pads. Reflow can be achieved by standard SMT rework  
techniques such as IR or techniques developed for BGA components.  
ESD Requirements  
Bourns manufactures all models in an ESD controlled environment and all product is supplied in conductive packaging to prevent  
ESD damage from occurring before or during shipping. All products must be unpacked and handled using approved ESD control  
procedures. Failure to do so may affect the lifetime of the converter.  
Storage  
The X & XT Series have an MSL rating of 1 per IPC/JEDEC J-STD-033A.  
Reliable Electronic Solutions  
Asia-Pacific:  
Europe:  
Tel: +886-2 2562-4117 • Fax: +886-2 2562-4116  
Tel: +41-41 768 5555 • Fax: +41-41 768 5510  
The Americas: Tel: +1-951 781-5500 • Fax: +1-951 781-5700  
www.bourns.com  
LONGFORM REV. B 01/06  
Specifications are subject to change without notice.  
Customers should verify device performance in their specific applications.  
15  
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