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7WBD383DMUTCG

型号：

7WBD383DMUTCG

品牌：

ONSEMI[ ONSEMI ]

页数：

12 页

PDF大小：

104 K

下载PDF手册
7WBD383  
Translating Bus Exchange  
Switch  
The 7WBD383 is an advanced high−speed low−power translating  
bus exchange switch in ultra−small footprints.  
Features  
http://onsemi.com  
• High Speed: t = 0.25 ns (Max) @ V = 4.5 V  
PD  
CC  
MARKING  
DIAGRAMS  
• 3 W Switch Connection Between 2 Ports  
• Power Down Protection Provided on Inputs  
• Zero Bounce  
UDFN8  
MU SUFFIX  
CASE 517AJ  
8
ALM  
G
• TTL−Compatible Control Inputs  
• Ultra−Small Pb−Free Packages  
• These are Pb−Free Devices  
1
UDFN8  
1.95 x 1.0  
X M  
CASE 517CA  
1
8
Micro8]  
DM SUFFIX  
CASE 846A  
D383  
AYWG  
G
1
1
UQFN8  
AJ M*G  
MU SUFFIX  
CASE 523AN  
G
8
1
8
US8  
US SUFFIX  
CASE 493  
AG M*G  
G
1
A
= Assembly Location  
= Year  
= Work Week  
= Date Code  
Y
W
M
G
= Pb−Free Package  
(Note: Microdot may be in either location)  
*Date Code orientation may vary depending  
upon manufacturing location.  
ORDERING INFORMATION  
See detailed ordering and shipping information in the package  
dimensions section on page 7 of this data sheet.  
This document contains information on some products that are still under development.  
ON Semiconductor reserves the right to change or discontinue these products without  
notice.  
© Semiconductor Components Industries, LLC, 2014  
1
Publication Order Number:  
October, 2014 − Rev. 2  
7WBD383/D  
7WBD383  
OE  
A
1
2
3
4
8
7
6
5
V
CC  
A
B
OE  
7
6
5
V
CC  
OE  
A
1
2
3
4
8
7
6
5
C
C
D
8
4
V
CC  
GND  
B
B
D
1
2
3
GND  
EX  
C
D
EX  
GND  
EX  
Figure 3. US8/Micro8  
Figure 2. UQFN8  
(Top Thru−View)  
(Top View)  
Figure 1. UDFN8  
(Top Thru−View)  
A
C
B
D
EX  
OE  
Figure 4. Logic Diagram  
FUNCTION TABLE  
Input OE  
Input EX  
Function  
A = C; B = D  
A = D; B = C  
Disconnect  
L
L
L
H
X
H
http://onsemi.com  
2
7WBD383  
MAXIMUM RATINGS  
Symbol  
Parameter  
Value  
−0.5 to +7.0  
−0.5 to +7.0  
−0.5 to +7.0  
−50  
Unit  
V
V
CC  
DC Supply Voltage  
V
Control Pin Input Voltage  
Switch Input / Output Voltage  
V
IN  
I/O  
IK  
V
V
I
Control Pin DC Input Diode Current  
Switch I/O Port DC Diode Current  
ON−State Switch Current  
V
< GND  
< GND  
I/O  
mA  
mA  
mA  
mA  
mA  
mA  
°C  
IN  
I
V
−50  
OK  
I
O
$128  
Continuous Current Through V or GND  
$150  
CC  
I
DC Supply Current Per Supply Pin  
DC Ground Current per Ground Pin  
Storage Temperature Range  
$150  
CC  
I
$150  
GND  
T
STG  
−65 to +150  
260  
T
Lead Temperature, 1 mm from Case for 10 Seconds  
Junction Temperature Under Bias  
Thermal Resistance  
°C  
L
T
150  
°C  
J
q
US8 (Note 1)  
UDFN8  
251  
111  
208  
392  
°C/W  
JA  
UQFN8  
Micro8  
P
D
Power Dissipation in Still Air at 85°C  
US8  
UDFN8  
UQFN8  
Micro8  
498  
1127  
601  
mW  
319  
MSL  
Moisture Sensitivity  
Level 1  
F
R
Flammability Rating  
Oxygen Index: 28 to 34  
UL 94 V−0 @ 0.125 in  
V
ESD  
ESD Withstand Voltage  
Human Body Mode (Note 2)  
Machine Model (Note 3)  
Charged Device Model (Note 4)  
> 2000  
> 200  
N/A  
V
I
Latchup Performance Above V and Below GND at 125 °C (Note 5)  
$200  
mA  
LATCHUP  
CC  
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality  
should not be assumed, damage may occur and reliability may be affected.  
1. Measured with minimum pad spacing on an FR4 board, using 10 mm−by−1 inch, 2 ounce copper trace no air flow.  
2. Tested to EIA / JESD22−A114−A.  
3. Tested to EIA / JESD22−A115−A.  
4. Tested to JESD22−C101−A.  
5. Tested to EIA / JESD78.  
RECOMMENDED OPERATING CONDITIONS  
Symbol  
Parameter  
Min  
4.0  
0
Max  
5.5  
Unit  
V
V
CC  
Positive DC Supply Voltage  
Control Pin Input Voltage  
V
IN  
5.5  
V
V
Switch Input / Output Voltage  
Operating Free−Air Temperature  
Input Transition Rise or Fall Rate  
0
5.5  
V
I/O  
T
−55  
+125  
°C  
nS/V  
A
Dt/DV  
Control Input  
Switch I/O  
0
0
5
DC  
Functional operation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond  
the Recommended Operating Ranges limits may affect device reliability.  
http://onsemi.com  
3
 
7WBD383  
DC ELECTRICAL CHARACTERISTICS  
T
A
=
−555C to +1255C  
T
A
= 255C  
Typ  
V
(V)  
CC  
Min  
Max  
Min  
Max  
Symbol  
Parameter  
Conditions  
Unit  
V
V
Clamp Diode Voltage  
I
I/O  
= −18 mA  
4.5  
−1.2  
−1.2  
IK  
IH  
V
High−Level Input Voltage  
(Control)  
4.0 to  
5.5  
2.0  
2.0  
V
V
IL  
Low−Level Input Voltage  
(Control)  
4.0 to  
5.5  
0.8  
0.8  
V
V
I
Output Voltage High  
See Figure 5  
0 v V v 5.5 V  
OH  
Input Leakage Current  
Power Off Leakage Current  
Quiescent Supply Current  
5.5  
0
0.1  
0.1  
1.0  
1.0  
mA  
mA  
IN  
IN  
I
V
I/O  
= 0 to 5.5 V  
OFF  
I
I
O
= 0,  
5.5  
CC  
V
= V or 0 V  
IN  
CC  
OE = GND  
OE = V  
1.0  
0.1  
1.0  
1.0  
mA  
mA  
CC  
DI  
Increase in Supply Current  
(Control Pin)  
One input at 3.4 V;  
5.5  
4.5  
2.5  
mA  
CC  
Other inputs at V  
or GND  
CC  
R
Switch ON Resistance  
V
I/O  
= 0,  
W
ON  
I
I/O  
I
I/O  
= 64 mA  
= 30 mA  
3
3
7
7
7
7
V
= 2.4,  
= 15 mA  
I/O  
I
I/O  
15  
50  
50  
V
= 2.4,  
= 15 mA  
4.0  
I/O  
I
I/O  
50  
70  
70  
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product  
performance may not be indicated by the Electrical Characteristics if operated under different conditions.  
AC ELECTRICAL CHARACTERISTICS  
T
A
=
−555C to +1255C  
T
A
= 25 5C  
Typ  
V
(V)  
CC  
Min  
Max  
Min  
Max  
Symbol  
Parameter  
Test Condition  
Unit  
t
Propagation Delay, Bus to Bus  
See Figure 6  
4.0 to  
5.5  
0.25  
0.25  
ns  
PD  
t
Propagation Delay, EX to Bus  
Output Enable Time  
See Figure 6 and  
Figure 7  
4.0 to  
5.5  
4.5  
4.2  
4.5  
4.2  
ns  
ns  
PD−EX  
t
See Figure 6  
4.5 to  
5.5  
0.8  
2.5  
0.8  
EN  
4.0  
0.8  
0.8  
3.0  
3.0  
4.6  
4.8  
0.8  
0.8  
4.6  
4.8  
t
Output Disable Time  
4.5 to  
5.5  
ns  
DIS  
4.0  
5.0  
5.0  
5.0  
0.8  
2.9  
2.5  
10  
5
4.4  
0.8  
4.4  
C
Control Input Capacitance  
Switch On Capacitance  
Switch Off Capacitance  
V
= 5 or 0 V  
pF  
pF  
pF  
IN  
IN  
C
Switch ON  
IO(ON)  
C
Switch OFF  
IO(OFF)  
http://onsemi.com  
4
7WBD383  
TYPICAL DC CHARACTERISTICS  
3.75  
3.50  
3.25  
3.00  
2.75  
2.50  
2.25  
2.00  
I
=
OH  
−0.1 mA  
−6 mA  
−12 mA  
−24 mA  
T = +85°C  
A
V
IN  
= V  
CC  
4.50  
4.75  
5.00  
5.25  
5.50  
5.75  
V
CC  
, SUPPLY VOLTAGE (V)  
3.75  
3.50  
3.25  
3.00  
2.75  
2.50  
2.25  
2.00  
I
=
OH  
−0.1 mA  
−6 mA  
−12 mA  
−24 mA  
T = +25°C  
A
V
IN  
= V  
CC  
4.50  
4.75  
5.00  
5.25  
5.50  
5.75  
V
CC  
, SUPPLY VOLTAGE (V)  
3.75  
3.50  
3.25  
3.00  
2.75  
2.50  
2.25  
2.00  
I
=
OH  
−0.1 mA  
−6 mA  
−12 mA  
−24 mA  
T = −40°C  
A
V
IN  
= V  
CC  
4.50  
4.75  
5.00  
5.25  
5.50  
5.75  
V
CC  
, SUPPLY VOLTAGE (V)  
Figure 5. Output Voltage High vs Supply Voltage  
http://onsemi.com  
5
7WBD383  
AC LOADING AND WAVEFORMS  
From Output  
Under Test  
7 V  
500 W  
S1  
Test  
S1  
Open  
GND  
t
Open  
7 V  
PD  
C = 50 pF*  
L
t
/t  
PLZ PZL  
500 W  
t
/t  
Open  
PHZ PZH  
*C includes probes and jig capacitance.  
L
3 V  
0 V  
Output  
Control  
1.5 V  
1.5 V  
V
3 V  
0 V  
1.5 V  
1.5 V  
t
t
PLZ  
PZL  
Output  
Input  
Waveform 1  
3.5 V  
+ 0.3 V  
1.5 V  
S1 at 7 V  
(Note 6)  
t
OL  
PLH  
t
PHL  
V
OL  
t
PHZ  
V
OH  
t
PZH  
V
OH  
1.5 V  
1.5 V  
Output  
Waveform 2  
S1 at Open  
(Note 6)  
V
OH  
− 0.3 V  
Output  
1.5 V  
V
OL  
0 V  
Voltage Waveforms  
Propagation Delay Times  
Voltage Waveforms  
Enable and Disable Times  
6. Waveform 1 is for an output with internal conditions such that the output is low, except when disabled by the output control.  
Waveform 2 is for an output with internal conditions such that the output is high, except when disabled by the output control  
7. All input pulses are supplied by generators having the following characteristics: PRR v 10 MHz, Z = 50 W, t v 2.5 ns, t v 2.5 ns.  
O
r
f
8. The outputs are measured one at a time, with one transition per measurement.  
9. t  
10.t  
11. t  
and t  
and t  
and t  
are the same as t  
are the same as t  
are the same as t  
.
.
.
PLZ  
PZL  
PHL  
PHZ  
DIS  
PZH  
EN  
PD  
PLH  
Figure 6. tPD, tEN, tDIS Loading and Waveforms  
t 2.5 ns  
r
t 2.5 ns  
f
3 V  
Exchange  
(EX)  
90%  
1.5 V  
10%  
GND  
t
t
PHL  
PLH  
Output  
(A, B, C, D)  
1.5 V  
1.5 V  
V
V
OH  
Output  
(A, B, C, D)  
OL  
t
t
PLH  
PHL  
Figure 7. tPD−EX Waveforms  
http://onsemi.com  
6
 
7WBD383  
ORDERING INFORMATION  
Device  
†
Package  
Shipping  
7WBD383USG  
US8  
(Pb−Free)  
3000 / Tape & Reel  
3000 / Tape & Reel  
3000 / Tape & Reel  
7WBD383MUTAG  
7WBD383AMUTCG  
7WBD383DMR2G  
7WBD383DMUTCG  
UDFN8  
(Pb−Free)  
UQFN8  
(Pb−Free)  
Micro8  
(Pb−Free)  
4000 / Tape & Reel  
(In Development)  
UDFN8, 1.95 x 1.0, 0.5 mm Pitch  
(Pb−Free)  
3000 / Tape & Reel  
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging  
Specifications Brochure, BRD8011/D.  
http://onsemi.com  
7
7WBD383  
PACKAGE DIMENSIONS  
UDFN8 1.8 x 1.2, 0.4P  
CASE 517AJ  
ISSUE O  
NOTES:  
A B  
E
D
1. DIMENSIONING AND TOLERANCING PER  
ASME Y14.5M, 1994.  
0.10  
C
2. CONTROLLING DIMENSION: MILLIMETERS.  
3. DIMENSION b APPLIES TO PLATED  
TERMINAL AND IS MEASURED BETWEEN  
0.15 AND 0.30 mm FROM TERMINAL TIP.  
4. MOLD FLASH ALLOWED ON TERMINALS  
ALONG EDGE OF PACKAGE. FLASH MAY  
NOT EXCEED 0.03 ONTO BOTTOM  
SURFACE OF TERMINALS.  
L1  
PIN ONE  
REFERENCE  
DETAIL A  
NOTE 5  
0.10  
C
TOP VIEW  
(A3)  
5. DETAIL A SHOWS OPTIONAL  
CONSTRUCTION FOR TERMINALS.  
MILLIMETERS  
0.05  
C
C
DIM MIN  
0.45  
A1 0.00  
MAX  
0.55  
0.05  
A
A
0.05  
A3  
b
b2  
D
E
e
0.127 REF  
0.15  
0.25  
A1  
SEATING  
PLANE  
C
0.30 REF  
SIDE VIEW  
1.80 BSC  
1.20 BSC  
0.40 BSC  
e/2  
DETAIL A  
8X L  
L
0.45  
0.55  
0.03  
e
L1 0.00  
L2  
(b2)  
0.40 REF  
4
5
1
MOUNTING FOOTPRINT*  
SOLDERMASK DEFINED  
(L2)  
8
8X  
0.66  
8X b  
7X  
M
C A B  
0.10  
BOTTOM VIEW  
0.22  
NOTE 3  
C
M
0.05  
1.50  
1
0.32  
0.40 PITCH  
DIMENSIONS: MILLIMETERS  
*For additional information on our Pb−Free strategy and soldering  
details, please download the ON Semiconductor Soldering and  
Mounting Techniques Reference Manual, SOLDERRM/D.  
http://onsemi.com  
8
7WBD383  
PACKAGE DIMENSIONS  
UDFN8 1.95x1.0, 0.5P  
CASE 517CA  
ISSUE O  
NOTES:  
A
B
E
D
1. DIMENSIONING AND TOLERANCING PER  
ASME Y14.5M, 1994.  
2. CONTROLLING DIMENSION: MILLIMETERS.  
3. DIMENSION b APPLIES TO PLATED  
TERMINAL AND IS MEASURED BETWEEN  
0.15 AND 0.20 MM FROM TERMINAL TIP.  
4. PACKAGE DIMENSIONS EXCLUSIVE OF  
BURRS AND MOLD FLASH.  
PIN ONE  
REFERENCE  
2X  
0.10  
C
MILLIMETERS  
DIM MIN  
MAX  
0.55  
0.05  
A
A1  
A3  
b
0.45  
0.00  
0.13 REF  
2X  
0.10  
C
TOP VIEW  
0.15  
0.25  
A3  
0.05  
C
C
D
E
e
L
1.95 BSC  
1.00 BSC  
0.50 BSC  
A
0.25  
0.30  
0.35  
0.40  
L1  
0.05  
A1  
RECOMMENDED  
SOLDERING FOOTPRINT*  
SEATING  
PLANE  
C
SIDE VIEW  
7X  
0.49  
8X  
0.30  
e/2  
e
4
7X L  
1
L1  
1.24  
8
5
1
8X b  
0.54  
0.50  
PITCH  
PKG  
OUTLINE  
M
M
0.10  
0.05  
C A B  
DIMENSIONS: MILLIMETERS  
NOTE 3  
C
BOTTOM VIEW  
*For additional information on our Pb−Free strategy and soldering  
details, please download the ON Semiconductor Soldering and  
Mounting Techniques Reference Manual, SOLDERRM/D.  
http://onsemi.com  
9
7WBD383  
PACKAGE DIMENSIONS  
UQFN8, 1.6x1.6, 0.5P  
CASE 523AN  
ISSUE O  
NOTES:  
A
B
D
MOLD CMPD  
EXPOSED Cu  
1. DIMENSIONING AND TOLERANCING PER  
ASME Y14.5M, 1994.  
2. CONTROLLING DIMENSION: MILLIMETERS.  
3. DIMENSION b APPLIES TO PLATED TERMINAL  
AND IS MEASURED BETWEEN 0.15 AND  
0.30 mm FROM THE TERMINAL TIP.  
PIN ONE  
A3  
REFERENCE  
E
2X  
MILLIMETERS  
A1  
0.10  
C
DETAIL B  
DIM MIN  
0.45  
A1 0.00  
MAX  
0.60  
0.05  
OPTIONAL  
A
2X  
CONSTRUCTION  
0.10  
C
A3  
b
0.13 REF  
0.15  
0.25  
TOP VIEW  
D
1.60 BSC  
L1  
L3  
E
e
1.60 BSC  
0.50 BSC  
A
(A3)  
DETAIL B  
L
L1  
L3 0.25  
0.35  
−−−  
0.45  
0.15  
0.35  
0.05  
C
C
b
(0.15)  
0.05  
(0.10)  
SIDE VIEW  
SEATING  
PLANE  
DETAIL A  
C
SOLDERING FOOTPRINT*  
A1  
OPTIONAL  
CONSTRUCTION  
1.70  
0.50  
PITCH  
8X  
L3  
1
8X L  
e
5
3
1
0.35  
0.25  
1.70  
7
8
DETAIL A  
8X b  
0.10 C A B  
7X  
8X  
NOTE 3  
C
0.05  
BOTTOM VIEW  
0.53  
DIMENSIONS: MILLIMETERS  
*For additional information on our Pb−Free strategy and soldering  
details, please download the ON Semiconductor Soldering and  
Mounting Techniques Reference Manual, SOLDERRM/D.  
http://onsemi.com  
10  
7WBD383  
PACKAGE DIMENSIONS  
US8  
CASE 493  
ISSUE B  
NOTES:  
1. DIMENSIONING AND TOLERANCING PER  
ANSI Y14.5M, 1982.  
2. CONTROLLING DIMENSION: MILLIMETERS.  
3. DIMENSION “A” DOES NOT INCLUDE MOLD  
FLASH, PROTRUSION OR GATE BURR.  
MOLD FLASH. PROTRUSION AND GATE  
BURR SHALL NOT EXCEED 0.140 MM  
(0.0055”) PER SIDE.  
−X−  
A
J
8
5
−Y−  
4. DIMENSION “B” DOES NOT INCLUDE  
INTER−LEAD FLASH OR PROTRUSION.  
INTER−LEAD FLASH AND PROTRUSION  
SHALL NOT E3XCEED 0.140 (0.0055”) PER  
SIDE.  
5. LEAD FINISH IS SOLDER PLATING WITH  
THICKNESS OF 0.0076−0.0203 MM.  
(300−800 “).  
DETAIL E  
B
L
6. ALL TOLERANCE UNLESS OTHERWISE  
SPECIFIED 0.0508 (0.0002 “).  
1
4
R
MILLIMETERS  
INCHES  
S
DIM  
A
B
C
D
F
G
H
J
K
L
M
N
P
MIN  
1.90  
2.20  
0.60  
0.17  
0.20  
MAX  
2.10  
2.40  
0.90  
0.25  
0.35  
MIN  
MAX  
0.083  
0.094  
0.035  
0.010  
0.014  
G
P
0.075  
0.087  
0.024  
0.007  
0.008  
U
C
0.50 BSC  
0.40 REF  
0.020 BSC  
0.016 REF  
H
−T−  
0.10 (0.004)  
T
K
0.10  
0.18  
0.10  
3.20  
6
0.004  
0.007  
0.004  
0.126  
6
SEATING  
PLANE  
D
N
0.00  
3.00  
0
0.000  
0.118  
0
M
R 0.10 TYP  
M
0.10 (0.004)  
T
X Y  
_
_
_
_
5
10  
5
10  
_
_
_
_
0.23  
0.23  
0.37  
0.60  
0.34  
0.33  
0.47  
0.80  
0.010  
0.009  
0.015  
0.024  
0.013  
0.013  
0.019  
0.031  
V
R
S
U
V
0.12 BSC  
0.005 BSC  
F
DETAIL E  
SOLDERING FOOTPRINT*  
3.8  
0.15  
1.8  
0.07  
0.50  
0.0197  
0.30  
0.012  
1.0  
0.0394  
mm  
inches  
ǒ
Ǔ
SCALE 8:1  
*For additional information on our Pb−Free strategy and soldering  
details, please download the ON Semiconductor Soldering and  
Mounting Techniques Reference Manual, SOLDERRM/D.  
http://onsemi.com  
11  
7WBD383  
PACKAGE DIMENSIONS  
Micro8t  
CASE 846A  
ISSUE H  
NOTES:  
1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.  
2. CONTROLLING DIMENSION: MILLIMETER.  
D
3. DIMENSION A DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE  
BURRS. MOLD FLASH, PROTRUSIONS OR GATE BURRS SHALL NOT EXCEED  
0.15 (0.006) PER SIDE.  
4. DIMENSION B DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSION.  
INTERLEAD FLASH OR PROTRUSION SHALL NOT EXCEED 0.25 (0.010) PER SIDE.  
5. 846A-01 OBSOLETE, NEW STANDARD 846A-02.  
H
E
E
MILLIMETERS  
INCHES  
NOM  
−−  
0.003  
0.013  
0.007  
0.118  
DIM  
A
A1  
b
c
D
MIN  
−−  
NOM  
−−  
MAX  
MIN  
−−  
MAX  
0.043  
0.006  
0.016  
0.009  
0.122  
0.122  
PIN 1 ID  
1.10  
0.15  
0.40  
0.23  
3.10  
3.10  
e
0.05  
0.25  
0.13  
2.90  
2.90  
0.08  
0.002  
0.010  
0.005  
0.114  
0.114  
b 8 PL  
0.33  
M
S
S
0.08 (0.003)  
T B  
A
0.18  
3.00  
E
3.00  
0.118  
e
L
H
E
0.65 BSC  
0.55  
4.90  
0.026 BSC  
0.021  
0.193  
0.40  
4.75  
0.70  
5.05  
0.016  
0.187  
0.028  
0.199  
SEATING  
PLANE  
−T−  
A
0.038 (0.0015)  
L
A1  
c
SOLDERING FOOTPRINT*  
1.04  
0.38  
8X  
8X 0.041  
0.015  
3.20  
4.24  
5.28  
0.126  
0.167 0.208  
0.65  
6X0.0256  
SCALE 8:1  
mm  
inches  
ǒ
Ǔ
*For additional information on our Pb−Free strategy and soldering  
details, please download the ON Semiconductor Soldering and  
Mounting Techniques Reference Manual, SOLDERRM/D.  
Micro8 is a trademark of International Rectifier.  
ON Semiconductor and  
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice  
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability  
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.  
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All  
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights  
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications  
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should  
Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates,  
and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death  
associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal  
Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.  
PUBLICATION ORDERING INFORMATION  
LITERATURE FULFILLMENT:  
N. American Technical Support: 800−282−9855 Toll Free  
USA/Canada  
Europe, Middle East and Africa Technical Support:  
Phone: 421 33 790 2910  
Japan Customer Focus Center  
Phone: 81−3−5817−1050  
ON Semiconductor Website: www.onsemi.com  
Order Literature: http://www.onsemi.com/orderlit  
Literature Distribution Center for ON Semiconductor  
P.O. Box 5163, Denver, Colorado 80217 USA  
Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada  
Fax: 303−675−2176 or 800−344−3867 Toll Free USA/Canada  
Email: orderlit@onsemi.com  
For additional information, please contact your local  
Sales Representative  
7WBD383/D  
厂商 型号 描述 页数 下载

ONSEMI

 		7WB3125 2位总线开关[ 2-Bit Bus Switch ] 11 页

ONSEMI

 		7WB3125AMX1TCG 2位总线开关[ 2-Bit Bus Switch ] 11 页

ROCHESTER

 		7WB3125AMX1TCG [ CBT/FST/QS/5C/B SERIES, DUAL 1-BIT DRIVER, TRUE OUTPUT, PDSO8, 1.95 X 1.00 MM, 0.50 PITCH, LEAD FREE, ULLGA-8 ] 12 页

ONSEMI

 		7WB3125BMX1TCG 2位总线开关[ 2-Bit Bus Switch ] 11 页

ROCHESTER

 		7WB3125BMX1TCG [ CBT/FST/QS/5C/B SERIES, DUAL 1-BIT DRIVER, TRUE OUTPUT, PDSO8, 1.60 X 1.00 MM, 0.40 PITCH, LEAD FREE, ULLGA-8 ] 12 页

ONSEMI

 		7WB3125CMX1TCG 2位总线开关[ 2-Bit Bus Switch ] 11 页

ROCHESTER

 		7WB3125CMX1TCG [ CBT/FST/QS/5C/B SERIES, DUAL 1-BIT DRIVER, TRUE OUTPUT, PDSO8, 1.45 X 1.00 MM, 0.35 PITCH, LEAD FREE, ULLGA-8 ] 12 页

ONSEMI

 		7WB3125DMR2G 2位总线开关[ 2-Bit Bus Switch ] 11 页

ONSEMI

 		7WB3125DMUTCG [ 2-Bit Bus Switch ] 10 页

ONSEMI

 		7WB3125MUTAG 2位总线开关[ 2-Bit Bus Switch ] 11 页

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