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NWX1900P

型号：

NWX1900P

品牌：

INFINEON[ Infineon ]

页数：

16 页

PDF大小：

695 K

下载PDF手册
June 2008  
NWX1900P  
M i n i a t u r e D u p l e x e r f o r P C S B a n d  
Data Sheet  
Revision 1. 5  
Communication Solutions  
Edition 2008-02-13  
Published by  
Infineon Technologies AG  
81726 Munich, Germany  
© 2008 Infineon Technologies AG  
All Rights Reserved.  
Legal Disclaimer  
The information given in this document shall in no event be regarded as a guarantee of conditions or  
characteristics. With respect to any examples or hints given herein, any typical values stated herein and/or any  
information regarding the application of the device, Infineon Technologies hereby disclaims any and all  
warranties and liabilities of any kind, including without limitation, warranties of non-infringement of intellectual  
property rights of any third party.  
Information  
For further information on technology, delivery terms and conditions and prices, please contact the nearest  
Infineon Technologies Office (www.infineon.com).  
Warnings  
Due to technical requirements, components may contain dangerous substances. For information on the types in  
question, please contact the nearest Infineon Technologies Office.  
Infineon Technologies components may be used in life-support devices or systems only with the express written  
approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the  
failure of that life-support device or system or to affect the safety or effectiveness of that device or system. Life  
support devices or systems are intended to be implanted in the human body or to support and/or maintain and  
sustain and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other  
persons may be endangered.  
NWX1900P  
PCS Band Duplexer  
NWX1900P  
Revision History: 2008-06-10, Revision 1.5  
Previous Version: Datasheet (Version 1.4)  
Page  
Subjects (major changes since last revision)  
7
7,13  
14  
Modified order code and package name  
Modified soldermask design  
Updated solder stencil recommendation  
Trademarks of Infineon Technologies AG:  
ABM™, A-GOLD™, AOP™, BlueMoon™, ConverGate™, Converpath™, COSIC™, C166™, DUALFALC™,  
DuSLIC™, E-GOLD™, ELASTec™, Epic™, FALC™, FlexiSLIC™, GEMINAX™, GIGAFLOW™, GOLDMOS™,  
INCA™, IOM™, IPVD™, Isac™, IWE™, IWORX™, LEDFET™, M-GOLD™, MuSLIC™, OCTALFALC™,  
OCTAT™, OmniTune™, OmniVia™, OPTIVERSE™, PASi™, PROSOC™, QUADFALC™, SCEPTRE™,  
SCOUT™, SEROCCO™, S-GOLD™, SICOFI™, SIEGET™, SLIC™, SMARTI™, SMARTiPM™,  
SMARTiPM+™, SMARTiUE™, SMARTi3G™, SMARTi3G+™, SMINT™, SOCRATES™, TrueNTRY™,  
VINAX™, VINETIC™, VIONTIC™, VOIPRO™, WDCT™, WildPass™, X-GOLD™, XMM™, X-PMU™.  
Other trademarks: Microsoft®, Visio®, Windows® of Microsoft Corporation. Linux® of Linus Torvalds.  
FrameMaker® of Adobe Systems Incorporated. APOXI®, COMNEON™ of Comneon GmbH & Co. OHG.  
PrimeCell®, RealView®, ARM®, ARM® Developer Suite™ (ADS), Multi-ICE™, ARM1176JZ-S™, CoreSight™,  
Embedded Trace Macrocell™ (ETM), Thumb®, ETM9™, AMBA™, ARM7™, ARM9™, ARM7TDMI-S™,  
ARM926EJ-S™ of ARM Limited. OakDSPCore®, TeakLite® DSP Core, OCEM® of ParthusCeva Inc.  
IndoorGPS™, GL-20000™, GL-LN-22™ of Global Locate. mipi™ of MIPI Alliance. CAT-iq™ of DECT Forum.  
MIPS™, MIPS II™, 24KEc™ of MIPS Technologies, Inc. Texas Instruments®, PowerPAD™, C62x™, C55x™,  
VLYNQ™, Telogy Software™, TMS320C62x™, Code Composer Studio™, SSI™ of Texas Instruments  
Incorporated. Luxworks® of LSI Corporation. Bluetooth® of Bluetooth SIG, Inc. IrDA® of the Infrared Data  
Association. Java™, SunOS™, Solaris™ of Sun Microsystems, Inc. Philips®, I2C-Bus® of Koninklijke Philips  
Electronics N.V. Epson® of Seiko Epson Corporation. Seiko® of Kabushiki Kaisha Hattori Seiko Corporation.  
Panasonic® of Matsushita Electric Industrial Co., Ltd. Murata® of Murata Manufacturing Company. Taiyo  
Yuden™ of Taiyo Yuden Co., Ltd. TDK® of TDK Electronics Company, Ltd. Motorola® of Motorola, Inc. National  
Semiconductor®, MICROWIRE™ of National Semiconductor Corporation. IEEE® of The Institute of Electrical  
and Electronics Engineers, Inc. Samsung®, OneNAND®, UtRAM® of Samsung Corporation. Toshiba® of Toshiba  
Corporation. Dallas Semiconductor®, 1-Wire® of Dallas Semiconductor Corp. NOVeA™ of Virage Logic Corp.  
ISO® of the International Organization for Standardization. IEC™ of the International Engineering Consortium.  
EMV™ of EMVCo, LLC. Zetex® of Zetex Semiconductors. Rohm™ of Rohm Co., Ltd. Microtec® of Microtec  
Research, Inc. Verilog® of Cadence Design Systems, Inc. ANSI® of the American National Standards Institute,  
Inc. WindRiver® and VxWorks® of Wind River Systems, Inc. Nucleus™ of Mentor Graphics Corporation.  
Template: com_template_20071101.dot / 2.2 / 2007-12-01  
NWX1900P  
PCS Band Duplexer  
Table of Contents  
Table of Contents  
1
Description..........................................................................................................................................7  
Features ..............................................................................................................................................7  
Pin Definitions and Functions ..........................................................................................................7  
Absolute Maximum Ratings..............................................................................................................8  
Electrical Specifications....................................................................................................................8  
Typical Performance at Room Temperature .................................................................................10  
Package Dimensions PG-TCCN-4-5 (Bottom View)......................................................................13  
Marking Description.........................................................................................................................13  
Solder Stencil Recommendation....................................................................................................14  
Application Recommendations ......................................................................................................15  
SMD Tape Packing ...........................................................................................................................16  
Unit Orientation in Tape ..................................................................................................................16  
2
3
4
5
6
7
8
9
10  
11  
12  
Data Sheet  
4
Revision 1.5, 2008-06-10  
NWX1900P  
PCS Band Duplexer  
List of Figures  
List of Figures  
Figure 1  
Figure 2  
Figure 3  
Figure 4  
Figure 5  
Figure 6  
Figure 7  
Figure 8  
Figure 9  
Pin Configuration (Bottom View)..........................................................................................................7  
Attenuation TX-Ant.............................................................................................................................10  
Attenuation Ant RX.............................................................................................................................10  
Insertion Loss TX-Ant.........................................................................................................................11  
Insertion Loss Ant-RX ........................................................................................................................11  
Attenuation .........................................................................................................................................12  
TX -RX Isolation .................................................................................................................................12  
Package Dimensions .........................................................................................................................13  
Marking Description............................................................................................................................13  
Figure 10 Solder Stencil Recommendation........................................................................................................14  
Figure 11 Application Recommendations...........................................................................................................15  
Figure 12 SMD Tape Packing ............................................................................................................................16  
Figure 13 Unit Orientation in Tape .....................................................................................................................16  
Data Sheet  
5
Revision 1.5, 2008-06-10  
NWX1900P  
PCS Band Duplexer  
List of Tables  
List of Tables  
Table 1  
Table 2  
Table 3  
Pin Definitions and Functions...............................................................................................................7  
Absolute Maximum Ratings .................................................................................................................8  
Electrical Specifications .......................................................................................................................8  
Data Sheet  
6
Revision 1.5, 2008-06-10  
1
Description  
NWX1900P is an ultra-small and thin duplexer for US-CDMA  
PCS band based on Infineon’s Bulk-Acoustic-Wave  
technology. It provides low insertion loss (typical 2dB in TX  
band and 2.5dB in RX band) together with excellent  
attenuation and TX-RX-isolation performance.  
2
Features  
•
•
Low-loss and high-isolation Bulk-Acoustic-Wave duplexer  
Passbands:  
− Antenna to Rx 1930 – 1990 MHz  
− Tx to Antenna 1850 – 1910 MHz  
Very low temperature coefficient TCF = -18 ppm/K  
“Green” package (Lead-free, RoHS compliant,  
suitable for 260°C reflow temperature)  
Excellent ESD robustness  
•
•
•
•
•
Excellent linearity  
Footprint 3.8 x 3.8 mm², height <1.2 mm  
3
Pin Definitions and Functions  
Figure 1  
Pin Configuration (Bottom View)  
Table 1  
Pin Definitions and Functions  
Pin No.  
Symbol  
TX  
ANT  
RX  
Function  
TX output  
Antenna  
RX input  
Ground  
1
2
3
4
GND  
Type.  
Marking  
Ordering Code  
Package  
NWX1900P  
X19  
SP000442926  
PG-TCCN-4-5  
Data Sheet  
7
Revision 1.5, 2008-06-10  
4
Absolute Maximum Ratings  
Table 2  
Absolute Maximum Ratings  
Symbol  
Parameter  
Values  
Unit Note / Test Condition  
Min.  
-30  
-65  
Typ. Max.  
Operating temperature range  
Storage temperature range  
Max. Input Power TX Port  
ESD (HBM)1  
+85  
+150 °C  
2
1000  
100  
°C  
W
V
V
ESD (MM) for handling  
5
Electrical Specifications  
Operating Temperature Range: Tamb = -30 to +85°C unless otherwise specified.  
Table 3  
Electrical Specifications  
Parameters  
Symbol  
Values  
Typ.2 Max.  
Unit Note / Test Condition  
Min.  
Port Parameters  
Antenna Port Impedance  
(unbalanced)  
Z2  
50  
Ω
Tx Port Impedance (unbalanced)  
Rx Port Impedance (unbalanced)  
Z1  
50  
50  
Ω
Z3  
Ω
Return Loss at Antenna Port in Rx and Tx  
passband  
S22  
9.5  
dB  
Return Loss of Tx port in Tx passband  
S11  
S33  
9.5  
9.5  
dB  
dB  
V
Return Loss of Rx port in Rx passband  
Permissible Input/Output DC bias at any port3 Umax  
10  
Passband Ant to Rx  
Frequency Receive Band  
Insertion Loss in Frequency Receive Band  
25oC  
f
1930.5  
1989.5 MHz  
S32  
dB  
2.3  
1.0  
3.5  
3.8  
-30oC to +85 oC  
Ripple (p-p) in Receive Band  
dB  
∆S32  
25oC  
2.6  
3.0  
-30oC to +85 oC  
Stopband Ant to Rx  
Attenuation 0 to 1770 MHz  
Attenuation 1770 to 1850 MHz  
Attenuation 1850.5 to 1909.5 MHz  
S32  
S32  
S32  
30  
35  
50  
40  
50  
55  
dB  
dB  
dB  
1 At Antenna port when soldered on PWB, no external protection  
2 Typical value indicated here is average value at room temperature in given frequency band  
3 RF performance will not change  
Data Sheet  
8
Revision 1.5, 2008-06-10  
Attenuation 2070 to 2500 MHz  
Attenuation 2500 to 3860 MHz  
Attenuation 3860 to 3980 MHz  
Attenuation 3980 to 6000 MHz  
Passband Tx to Ant  
S32  
S32  
S32  
S32  
30  
20  
25  
10  
43  
45  
40  
45  
dB  
dB  
dB  
dB  
Frequency Transmit Band  
Insertion loss in Transmit Band  
25oC  
f
1850.5  
1909.5 MHz  
S21  
1.7  
1.0  
3.0  
3.5  
dB  
dB  
-30oC to +85oC  
Ripple (p-p) in Transmit Band  
∆S21  
25oC  
2.3  
2.8  
-30oC to +85 oC  
Stopband Tx to Ant  
Attenuation DC to 869 MHz  
Attenuation 869 to 894 MHz  
Attenuation 894 to 1570 MHz  
Attenuation 1570 to 1580 MHz  
Attenuation 1580 to 1700 MHz  
Attenuation 1930.6 to 1989.4 MHz  
Attenuation 1990 to 2500 MHz  
Attenuation 3690 to 3830 MHz  
Attenuation 5540 to 5740 MHz  
Isolation Tx to Rx  
S21  
S21  
S21  
S21  
S21  
S21  
S21  
S21  
S21  
35  
40  
30  
30  
25  
42  
25  
20  
15  
45  
50  
35  
35  
35  
48  
40  
30  
20  
dB  
dB  
dB  
dB  
dB  
dB  
dB  
dB  
dB  
Isolation 1850.5 to 1909.5 MHz  
S31  
S31  
S31  
53  
44  
35  
57  
50  
55  
dB  
dB  
dB  
Isolation 1930.5 to 1989.5 MHz  
Isolation 3690 to 3830 MHz  
Data Sheet  
9
Revision 1.5, 2008-06-10  
6
Typical Performance at Room Temperature  
0
-10  
-20  
-30  
-40  
-50  
-60  
0.5  
1
1.5  
2
2.5  
3
3.5  
4
4.5  
5
5.5  
6
Frequency [GHz]  
Figure 2  
Attenuation TX-Ant  
0
-10  
-20  
-30  
-40  
-50  
-60  
0.5  
1
1.5  
2
2.5  
3
3.5  
4
4.5  
5
5.5  
6
Frequency [GHz]  
Figure 3  
Attenuation Ant RX  
Data Sheet  
10  
Revision 1.5, 2008-06-10  
0
-1  
-2  
-3  
-4  
1.85  
1.86  
1.87  
1.88  
1.89  
1.9  
1.91  
Frequency [GHz]  
Figure 4  
Insertion Loss TX-Ant  
0
-1  
-2  
-3  
-4  
1.93  
1.94  
1.95  
1.96  
1.97  
1.98  
1.99  
Frequency [GHz]  
Figure 5  
Insertion Loss Ant-RX  
Data Sheet  
11  
Revision 1.5, 2008-06-10  
0
-10  
-20  
-30  
-40  
-50  
-60  
1.7  
1.75  
1.8  
1.85  
1.9  
1.95  
2
2.05  
2.1  
Frequency [GHz]  
Figure 6  
Attenuation  
-35  
-40  
-45  
-50  
-55  
-60  
-65  
-70  
-75  
-80  
1.81 1.83 1.85 1.87 1.89 1.91 1.93 1.95 1.97 1.99 2.01 2.03  
Frequency [GHz]  
Figure 7  
TX -RX Isolation  
Data Sheet  
12  
Revision 1.5, 2008-06-10  
7
Package Dimensions PG-TCCN-4-5 (Bottom View)  
Figure 8  
Package Dimensions  
Note: All dimensions are in mm.  
8
Marking Description  
Figure 9  
Marking Description  
Data Sheet  
13  
Revision 1.5, 2008-06-10  
9
Solder Stencil Recommendation  
Figure 10 Solder Stencil Recommendation  
Data Sheet  
14  
Revision 1.5, 2008-06-10  
10  
Application Recommendations  
In order to achieve the specified attenuation performance and power durability, a well grounded metal pad is  
needed on the application board. Recommendations for application board design are given in the figure below.  
Figure 11 Application Recommendations  
Data Sheet  
15  
Revision 1.5, 2008-06-10  
11  
SMD Tape Packing  
Figure 12 SMD Tape Packing  
12  
Unit Orientation in Tape  
Package Pin 1 Orientation  
Figure 13 Unit Orientation in Tape  
Data Sheet  
16  
Revision 1.5, 2008-06-10  
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