QTE-XXX-01-XXX-D-EMX-XX
REVISION AE
OPTION
DO NOT
SCALE FROM
THIS PRINT
-GP: GUIDE POST
(USE QTE-20-01-D-EMX-XX-GP,
No OF POSITIONS
SEE FIG 2, SHEET 2)
-020, -040, -060,
**-080, **-100
(PER ROW)
-TY: TRAY PACKAGING
* = SEE NOTE 13
EDGE MOUNT THICKNESS
-EM2: .064[1.63] +/-.004 PCB
(USE QTE-20-01-D-EM2-XX & T-1S42-01-X)
-EM3:
**SEE NOTE 14
(No OF POSITIONS/20 x .7875 [20.003]) + .3900 [9.906] REF
LEAD STYLE
-01: .1680[4.267]
C
(USE QTE-20-01-D-EM3-XX & T-1S42-02-X)
No OF POSITIONS/20 x .7875 [20.003] REF
SEE NOTE 13
.7875 20.003 REF
ROW SPECIFICATION
01
-D: DOUBLE (USE QTE-20-XX-D-EMX-XX)
PLATING SPECIFICATION
No OF BANKS
.2350 5.97
.1550 3.937 REF
-F: 3µ" SELECTIVE GOLD IN CONTACT AREA, MATTE TIN ON TAILS
REF
(USE T-1S42-XX-F & T-1G1-01-F) (SEE NOTE 11)
-L: 10µ" SELECTIVE GOLD IN CONTACT AREA, MATTE TIN ON TAILS
(USE T-1S42-XX-L & T-1G1-01-L)
02
-H: 30µ" GOLD IN CONTACT AREA, 3µ" GOLD ON TAIL
(USE T-1S42-XX-H & T-1G1-01-G)
.645 16.38
REF
.0333 0.84 REF
-C: 50µ" GOLD IN CONTACT AREA, 3µ" GOLD ON TAIL
(USE T-1S42-XX-C & T-1G1-01-L)
QTE-20-01-D-EMX-XX
19 EQ SPACES
@ .0315 [.800]
-STL: 30µ" SELECTIVE GOLD IN CONTACT AREA, TIN/LEAD (90%/10 +/-5%) TAIL
(USE T-1S42-XX-STL & T-1G1-01-STL)
-FTL: 3µ" SELECTIVE GOLD IN CONTACT AREA, TIN/LEAD (90%/10 +/-5%) TAIL
(USE T-1S42-XX-FTL & T-1G1-01-FTL)
C
T-1G1-01-XXX
.1600 4.064 REF
.155±.003 3.94±0.08
"A"
"A"
C
C
.118 3.00
.168 4.27 (SEE NOTE 10)
.2782 7.067
REF
T-1S42-XX-X
.1750 4.45 REF
"C" REF
SEE TABLE 1
.7450 18.92
REF
C
C
.0080 0.203 REF
"A" REF
"B"±.0030 "B"±0.08
(INSIDE TO
INSIDE OF PIN)
.1275 3.24 REF
.0400 1.016 REF
2 MAX SWAY
(TYP)
C
.0150 0.381 REF
.1420 3.607 REF
FIG 1
SECTION "A"-"A"
QTE-060-01-XXX-D-EM2 SHOWN
.0300 0.762 REF
.1200 3.048 REF
NOTES:
1. C REPRESENTS A CRITICAL DIMENSION.
2. NOTE DELETED.
3. BURR ALLOWANCE: .0015 [.03] MAX.
4. MINIMUM TERMINAL RETENTION: 6 OZ.
5. MINIMUM GROUND PLANE RETENTION: 1 LB.
6. PARTS TO BE MOLD-TO-POSITION.
7. NOTE DELETED.
8. NOTE DELETED.
9. NOTE DELETED.
10. MAX VARIANCE: .002 [.05].
11. -L PLATING CAN BE SUBSTITUTED FOR -F PLATING.
UNLESS OTHERWISE SPECIFIED,
DIMENSIONS ARE IN INCHES.
PROPRIETARY NOTE
THIS DOCUMENT CONTAINS INFORMATION
CONFIDENTIAL AND PROPRIETARY TO
TOLERANCES ARE:
SAMTEC, INC. AND SHALL NOT BE REPRODUCED
OR TRANSFERRED TO OTHER DOCUMENTS OR
DISCLOSED TO OTHERS OR USED FOR ANY
PURPOSE OTHER THAN THAT WHICH IT WAS
OBTAINED WITHOUT THE EXPRESSED WRITTEN
CONSENT OF SAMTEC, INC.
DECIMALS
ANGLES
2
.XX: .01 [.3]
.XXX: .005 [.13]
520 PARK EAST BLVD, NEW ALBANY, IN 47150
PHONE: 812-944-6733 FAX: 812-948-5047
e-Mail: info@SAMTEC.com code: 55322
DESCRIPTION:
.XXXX: .0020 [.051]
12. SEE http://www.samtec.com/processing/edgemt_tectalk/index.htm FOR INFORMATION ON
PROCESSING EDGE MOUNT PARTS TO BOARDS.
SHEET SCALE: 1:0.8
MATERIAL:
DO NOT SCALE DRAWING
.8mm EDGEMOUNT HS TERMINAL ASSEMBLY
INSULATOR: LCP COLOR: BLACK
TERMINAL & GROUND PLANE: PHOS BRONZE
13. -EM3 IS NOT A STANDARD OFFERING; AVAILABLE AS AN ASP ONLY. PLEASE CONTACT SAMTEC
INTERCONNECT PROCESSING GROUP WITH ORDER INQUIRIES
DWG. NO.
14. FOR NEW APPLICATIONS REQUIRING THESE POSITIONS, PLEASE CONTACT SAMTEC INTERCONNECT
PROCESSING GROUP.
QTE-XXX-01-XXX-D-EMX-XX
15. PARTS WITHOUT -TY OPTION SHALL BE PACKAGED IN TRAYS.
SHEET 1 OF 2
BY:
DEAN P
9/2/1999
F:\DWG\MISC\MKTG\QTE-XXX-01-X-D-EMX-XX-MKT.SLDDRW
7
