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NX5302SI

型号:

NX5302SI

品牌:

NEC[ NEC ]

页数:

11 页

PDF大小:

72 K

DATA SHEET  
LASER DIODE  
NX5302 Series  
1 310 nm FOR 156 Mb/s, SHORT HAUL 622 Mb/s  
InGaAsP MQW-FP LASER DIODE  
DESCRIPTION  
The NX5302 Series is a 1 310 nm Multiple Quantum Well (MQW) structured Fabry-Perot (FP) laser diodes with  
InGaAs monitor PIN-PD. These devices are ideal for Synchronous Digital Hierarchy (SDH) system, short haul and  
long haul STM-1, short haul STM-4, ITU-T recommendations.  
FEATURES  
Optical output power  
Low threshold current  
High speed  
Po = 5.0 mW  
lth = 10 mA  
tr = 0.15 ns MAX.  
tf = 0.3 ns MAX.  
Wide operating temperature range TC = 40 to +85°C  
InGaAs monitor PIN-PD  
CAN package  
φ 5.6 mm  
Based on Telcordia reliability  
The information in this document is subject to change without notice. Before using this document, please confirm that  
this is the latest version.  
Not all devices/types available in every country. Please check with local NEC Compound Semiconductor Devices  
representative for availability and additional information.  
Document No. PL10079EJ02V0DS (2nd edition)  
Date Published July 2002 CP(K)  
Printed in Japan  
The mark shows major revised points.  
NEC Corporation 2001  
NEC Compound Semiconductor Devices 2002  
NX5302 Series  
PACKAGE DIMENSIONS (UNIT: mm)  
NX5302S Series  
5.6+0.00  
φ
–0.03  
BOTTOM VIEW  
φ4.2±0.1  
φ3.55±0.05  
1.0±0.1  
1
2
4
3
PIN CONNECTIONS  
NX5302SH NX5302SI  
1 (Case)  
+0.1  
–0.0  
0.3  
1 (Case)  
φ
1.6±0.1  
φ
1.0 MIN.  
LD  
4
LD  
4
2
2
LD Chip  
Reference  
Plane  
PD  
PD  
3
3
NX5302SJ  
1 (Case)  
NX5302SK  
1 (Case)  
φ
4– 0.45  
LD  
LD  
4
2
2
4
φ
2.0  
PD  
PD  
P.C.D  
3
3
*1 n = 1.48 Bolosilicate Glass  
NX5302E Series  
5.6+0.00  
φ
–0.03  
BOTTOM VIEW  
φ4.2±0.1  
φ3.55±0.1  
1
1.0±0.1  
2
4
3
PIN CONNECTIONS  
NX5302EI  
1 (Case)  
+0.1  
–0.0  
0.3  
NX5302EH  
Focal Point*2  
x = ±300  
y = ±300  
µ
µ
m
m
1 (Case)  
φ
2.0  
LD  
4
LD  
4
2
2
PD  
3
PD  
3
Reference  
Plane  
NX5302EJ  
NX5302EK  
1 (Case)  
LD  
1 (Case)  
LD  
4– φ0.45  
4
2
2
4
φ2.0  
PD  
PD  
3
3
*2 Focal Point: A point to get maximum optical output power from fiber.  
2
Data Sheet PL10079EJ02V0DS  
NX5302 Series  
ORDERING INFORMATION  
NX5302S Series  
Part Number  
Package  
Pin Connections  
1
NX5302SH  
NX5302SI  
NX5302SJ  
4-pin CAN with flat glass cap  
LD  
4
2
PD  
3
1
LD  
4
2
PD  
3
1
LD  
4
2
PD  
3
1
NX5302SK  
LD  
2
4
PD  
3
NX5302E Series  
Part Number  
NX5302EH  
Package  
Pin Connections  
1
4-pin CAN with spherical lens cap  
LD  
4
2
PD  
3
1
NX5302EI  
NX5302EJ  
LD  
4
2
PD  
3
1
LD  
4
2
PD  
3
1
NX5302EK  
LD  
2
4
PD  
3
3
Preliminary Data Sheet PL10079EJ02V0DS  
NX5302 Series  
ABSOLUTE MAXIMUM RATINGS  
Parameter  
Optical Output Power  
Symbol  
Ratings  
10  
Unit  
mW  
mA  
V
Po  
IF  
Forward Current of LD  
150  
Reverse Voltage of LD  
Forward Current of PD  
Reverse Voltage of PD  
Operating Case Temperature  
Storage Temperature  
VR  
IF  
2.0  
10  
mA  
V
VR  
TC  
20  
40 to +85  
40 to +85  
150 (15 Hr)  
350 (3 sec.)  
85  
°C  
°C  
°C  
°C  
%
Tstg  
Tasb  
Tsld  
RH  
Assembly Temperature  
Lead Soldering Temperature  
Relative Humidity (noncondensing)  
ELECTRO-OPTICAL CHARACTERISTICS (TC = 25°C, unless otherwise specified)  
Parameter  
Operating Voltage  
Symbol  
Vop  
Conditions  
MIN.  
TYP.  
1.1  
MAX.  
1.3  
20  
Unit  
V
Po = 5.0 mW  
Threshold Current  
Ith  
10  
mA  
TC = 85°C  
25  
35  
Threshold Output Power  
Differential Efficiency  
Pth  
ηd  
TC = 40 to +85°C, IF = Ith  
100  
0.5  
200  
µW  
W/A  
dB  
0.4  
3.0  
ηd (@ 85°C)  
∆ηd = 10 log  
Temperature Dependence of  
Differential Efficiency  
∆ηd  
1.5  
ηd (@ 25°C)  
Center Wavelength  
λC  
λ/T  
σ
Po = 5.0 mW, RMS (20 dB)  
TC = 40 to +85°C  
1 263  
1 360  
0.5  
nm  
nm/°C  
nm  
Temperature Dependence of Center  
Wavelength  
TC = 40 to +85°C  
0.4  
1.0  
Spectral Width  
Po = 5.0 mW, RMS (20 dB)  
TC = 40 to +85°C  
2.5  
Vertical Beam Angle*1  
Lateral Beam Angle*1  
Rise Time  
Po = 5.0 mW, FAHM*2  
Po = 5.0 mW, FAHM*2  
10-90%  
θ
25  
20  
0.05  
0.15  
500  
0.1  
40  
35  
deg.  
deg.  
ns  
θ//  
tr  
0.15  
0.3  
800  
10  
Fall Time  
tf  
90-10%  
ns  
Monitor Current  
Monitor Dark Current  
Im  
ID  
VR = 5 V, Po = 5.0 mW  
VR = 5 V  
200  
µA  
nA  
VR = 5 V, TC = 40 to +85°C  
VR = 5 V, f = 1 MHz  
Po = Up to 6.0 mW, TC = 40 to +85°C  
500  
20  
Monitor PD Terminal Capacitance  
Ct  
kink  
γ
6
pF  
%
Kink (Refer to DEFINITIONS)  
20  
1.0  
20  
Tracking Error  
Im = const. (@ PO = 5.0 mW, TC = 25°C)  
TC = 40 to +85°C  
1.0  
dB  
(Refer to DEFINITIONS)  
*1 Applicable to only NX5302S Series  
*2 FAHM: Full Angle at Half Maximum  
4
Data Sheet PL10079EJ02V0DS  
NX5302 Series  
PARAMETER DEFINITIONS  
Kink : kink  
Po  
dP  
K
kink =  
× 100 [%]  
PK  
(mW)  
6.0  
I
F
- P  
o
dP  
K
= dP  
o
MAX.  
dP  
o
P
K
6.0 (mW)  
dP  
K
P
K
I
F
-
η
d
I
F
0
(mA)  
Tracking Error : γ  
Po  
P
5.0  
o
γ = 10 log  
[dB]  
(mW)  
T
C
= 25˚C  
5.0  
TC = –40 to +85˚C  
P
o
I
m
0
I
m
(mA)  
5
Preliminary Data Sheet PL10079EJ02V0DS  
NX5302 Series  
TYPICAL CHARACTERISTICS (TC = 40 to +85°C)  
OPTICAL OUTPUT POWER  
vs. FORWARD CURRENT  
OPERATING CURRENT AND THRESHOLD  
CURRENT vs. CASE TEMPERATURE  
10  
100  
50  
+85˚C  
Iop  
=
–40˚C  
C
7.5  
5.0  
2.5  
30  
T
Ith  
20  
10  
5
3
2
1
0
20  
40  
60  
80  
100  
–60 –40 –20  
0
20  
40  
60  
80 100  
Forward Current IF (mA)  
Case Temperature TC (˚C)  
TEMPERATURE DEPENDENCE OF  
CENTER WAVELENGTH  
1 340  
1 320  
1 300  
1 280  
–60 –40 –20  
0
20  
40  
60 80 100  
Case Temperature TC (˚C)  
Remark The graphs indicate nominal characteristics.  
6
Data Sheet PL10079EJ02V0DS  
NX5302 Series  
TYPICAL CHARACTERISTICS (TC = 25°C)  
OPTICAL OUTPUT POWER  
vs. MONITOR CURRENT  
FORWARD CURRENT vs.  
FORWARD VOLTAGE  
50  
40  
30  
20  
10  
10  
5
0
1
2
0
500  
1 000  
1 500  
Forward Voltage V  
F
(V)  
Monitor Current I ( A)  
µ
m
FAR FIELD PATTERN (θ//  
)
FAR FIELD PATTERN (θ )  
(NX5302S SERIES ONLY)  
(NX5302S SERIES ONLY)  
100  
100  
50  
50  
0
–40  
0
–40  
0
40  
0
40  
Lateral Beam Angle θ// (deg.)  
Vertical Beam Angle θ (deg.)  
TOLERANCE OF FIBER  
SPECTRUM  
COUPLING DISTANCE (Z)  
1.0  
0.8  
0.6  
0.4  
Z
P
f
SMF P =  
5omW  
0.2  
0.0  
1 300  
1 310  
1 320  
5.8  
6.0  
6.2  
6.4  
6.6  
6.8  
Wavelength λ (nm)  
Z-Axis Tolerance Z (mm)  
Remark The graphs indicate nominal characteristics.  
7
Preliminary Data Sheet PL10079EJ02V0DS  
NX5302 Series  
LD CAN PACKAGES FAMILY FOR OPTICAL FIBER COMMUNICATIONS  
Absolute Maximum Ratings  
Electro-Optical Characteristics  
@TC =  
@TC  
25°C  
Part Number  
Application  
Package  
TC  
Tstg  
Ith  
Po  
λ
(°C)  
(°C)  
(mA)  
(mW)  
(nm)  
TYP.  
10  
TYP.  
5
MIN.  
MAX.  
NX5302 Series  
40 to +85  
40 to +85  
1 263  
1 360 156 Mb/s: STM-1  
(I-1, S-1.1, L-1.1)  
CAN  
622 Mb/s: STM-4  
(I-4, S-4.1)  
NX6301 Series  
NX6504 Series  
40 to +85  
10 to +85  
40 to +85  
40 to +85  
13  
12  
5
5
1 280  
1 530  
1 335 156 Mb/s: STM-1  
622 Mb/s: STM-4  
CAN  
CAN  
1 570 156 Mb/s: STM-1  
622 Mb/s: STM-4  
8
Data Sheet PL10079EJ02V0DS  
NX5302 Series  
REFERENCE  
Document Name  
Document No.  
P12480E  
P13623E  
P12944X  
C11159E  
C11531E  
X13769E  
Optical semiconducrtor devices for fiberoptic communications Selection Guide  
Opto-Electronics Devices Pamphlet  
Opto-Electronics Devices (CD-ROM)  
NEC semiconductor device reliability/quality control system*1  
Quality grades on NEC semiconductor devices*1  
SEMICONDUCTOR SELECTION GUIDE Products and Packages*1  
*1 Published by NEC Corporation  
9
Preliminary Data Sheet PL10079EJ02V0DS  
NX5302 Series  
The information in this document is current as of July, 2002. The information is subject to change  
without notice. For actual design-in, refer to the latest publications of NEC's data sheets or data  
books, etc., for the most up-to-date specifications of NEC semiconductor products. Not all products  
and/or types are available in every country. Please check with an NEC sales representative for  
availability and additional information.  
No part of this document may be copied or reproduced in any form or by any means without prior  
written consent of NEC. NEC assumes no responsibility for any errors that may appear in this document.  
NEC does not assume any liability for infringement of patents, copyrights or other intellectual property rights of  
third parties by or arising from the use of NEC semiconductor products listed in this document or any other  
liability arising from the use of such products. No license, express, implied or otherwise, is granted under any  
patents, copyrights or other intellectual property rights of NEC or others.  
Descriptions of circuits, software and other related information in this document are provided for illustrative  
purposes in semiconductor product operation and application examples. The incorporation of these  
circuits, software and information in the design of customer's equipment shall be done under the full  
responsibility of customer. NEC assumes no responsibility for any losses incurred by customers or third  
parties arising from the use of these circuits, software and information.  
While NEC endeavours to enhance the quality, reliability and safety of NEC semiconductor products, customers  
agree and acknowledge that the possibility of defects thereof cannot be eliminated entirely. To minimize  
risks of damage to property or injury (including death) to persons arising from defects in NEC  
semiconductor products, customers must incorporate sufficient safety measures in their design, such as  
redundancy, fire-containment, and anti-failure features.  
NEC semiconductor products are classified into the following three quality grades:  
"Standard", "Special" and "Specific". The "Specific" quality grade applies only to semiconductor products  
developed based on a customer-designated "quality assurance program" for a specific application. The  
recommended applications of a semiconductor product depend on its quality grade, as indicated below.  
Customers must check the quality grade of each semiconductor product before using it in a particular  
application.  
"Standard": Computers, office equipment, communications equipment, test and measurement equipment, audio  
and visual equipment, home electronic appliances, machine tools, personal electronic equipment  
and industrial robots  
"Special": Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster  
systems, anti-crime systems, safety equipment and medical equipment (not specifically designed  
for life support)  
"Specific": Aircraft, aerospace equipment, submersible repeaters, nuclear reactor control systems, life  
support systems and medical equipment for life support, etc.  
The quality grade of NEC semiconductor products is "Standard" unless otherwise expressly specified in NEC's  
data sheets or data books, etc. If customers wish to use NEC semiconductor products in applications not  
intended by NEC, they must contact an NEC sales representative in advance to determine NEC's willingness  
to support a given application.  
(Note)  
(1) "NEC" as used in this statement means NEC Corporation, NEC Compound Semiconductor Devices, Ltd.  
and also includes its majority-owned subsidiaries.  
(2) "NEC semiconductor products" means any semiconductor product developed or manufactured by or for  
NEC (as defined above).  
M8E 00. 4-0110  
10  
Data Sheet PL10079EJ02V0DS  
NX5302 Series  
SAFETY INFORMATION ON THIS PRODUCT  
SEMICONDUCTOR LASER  
DANGER  
INVISIBLE LASER RADIATION  
AVOID DIRECT EXPOSURE TO BEAM  
AVOID EXPOSURE-Invisible  
OUTPUT POWER  
WAVELENGTH  
mW MAX  
nm  
Laser Radiation is emitted from  
this aperture  
CLASS lllb LASER PRODUCT  
A laser beam is emitted from this diode during operation.  
Warning Laser Beam  
Caution GaAs Products  
The laser beam, visible or invisible, directly or indirectly, may cause injury to the eye or loss of  
eyesight.  
• Do not look directly into the laser beam.  
• Avoid exposure to the laser beam, any reflected or collimated beam.  
The product contains gallium arsenide, GaAs.  
GaAs vapor and powder are hazardous to human health if inhaled or ingested.  
• Do not destroy or burn the product.  
• Do not cut or cleave off any part of the product.  
• Do not crush or chemically dissolve the product.  
• Do not put the product in the mouth.  
Follow related laws and ordinances for disposal. The product should be excluded from general  
industrial waste or household garbage.  
Business issue  
NEC Compound Semiconductor Devices, Ltd.  
5th Sales Group, Sales Division TEL: +81-3-3798-6372 FAX: +81-3-3798-6783 E-mail: salesinfo@csd-nec.com  
NEC Compound Semiconductor Devices Hong Kong Limited  
Hong Kong Head Office  
Taipei Branch Office  
Korea Branch Office  
TEL: +852-3107-7303  
FAX: +852-3107-7309  
TEL: +886-2-8712-0478 FAX: +886-2-2545-3859  
TEL: +82-2-528-0301  
FAX: +82-2-528-0302  
NEC Electron Devices European Operations  
http://www.nec.de/  
TEL: +49-211-6503-101 FAX: +49-211-6503-487  
California Eastern Laboratories, Inc.  
http://www.cel.com/  
TEL: +1-408-988-3500 FAX: +1-408-988-0279  
Technical issue  
NEC Compound Semiconductor Devices, Ltd.  
http://www.csd-nec.com/  
Sales Engineering Group, Sales Division  
E-mail: techinfo@csd-nec.com FAX: +81-44-435-1918  
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