IXFN70N120SK
preliminary
MOSFET
Ratings
min. typ. max.
1200
Symbol Definitions
Conditions
drain source breakdown voltage
VDSS
VGS = 0 V, ID = 100 µA
V
max transient gate source voltage
continous gate source voltage
VGSM
VGS
-10
-5
+25
+20
V
V
recommended operational value
VGS = 20 V
drain current
ID25
ID80
ID100
TC = 25°C
TC = 80°C
TC = 100°C
68
55
48
A
A
A
static drain source on resistance
gate threshold voltage
RDSon
ID = 50 A; VGS = 20 V
ID = 15 mA; VGS = VDS
TVJ = 25°C
TVJ = 175°C
25
52
34
mΩ
mΩ
VGS(th)
TVJ = 25°C
TVJ = 175°C
2.0
2.6
2.1
4.0
V
V
drain source leakage current
gate source leakage current
internal gate resistance
IDSS
IGSS
RG
VDS = 1200 V; VGS = 0 V
TVJ = 25°C
TVJ = 25°C
2
100
0.6
µA
µA
Ω
VDS = 0 V; VGS = 20 V
f = 1 MHz, VAC = 25 mV, ESR of CISS
1.1
input capacitance
output capacitance
reverse transfer (Miller) capacitance
Ciss
Coss
Crss
2790
220
15
pF
pF
pF
VDS = 1000 V; VGS = 0 V; f = 1 MHz TVJ = 25°C
VDS = 800 V; ID = 50 A; VGS = -5/20 V TVJ = 25°C
total gate charge
gate source charge
gate drain (Miller) charge
Qg
Qgs
Qgd
161
46
50
nC
nC
nC
turn-on delay time
current rise time
turn-off delay time
current fall time
turn-on energy per pulse
turn-off energy per pulse
reverse recovery losses at turn-off
td(on)
tr
td(off)
tf
Eon
Eoff
Erec(off)
30
15
82
ns
ns
ns
Inductive switching
VDS = 800 V; ID = 50 A
VGS = -5 / 20 V; RG = 15 Ω (external)
Freewheeling diode is Mosfet's body diode
TVJ = 25°C
27
ns
1.35
0.76
0.13
mJ
mJ
mJ
turn-on delay time
current rise time
turn-off delay time
current fall time
turn-on energy per pulse
turn-off energy per pulse
reverse recovery losses at turn-off
td(on)
tr
td(off)
tf
Eon
Eoff
Erec(off)
28
12
125
28
1.71
0.78
0.29
ns
ns
ns
Inductive switching
VDS = 800 V; ID = 50 A
VGS = -5 / 20 V; RG = 15 Ω (external)
Freewheeling diode is Mosfet's body diode
TVJ = 150°C
ns
mJ
mJ
mJ
thermal resistance junction to case
thermal resistance junction to heatsink
RthJC
RthJH
0.45
K/W
K/W
with heatsink compound; IXYS test setup
0.6
Source-Drain Diode
Symbol Definitions
Ratings
Conditions
min. typ. max.
forward voltage drop
VSD
IF = 50 A; VGS = -5 V
TVJ = 25°C
TVJ = 150°C
4.3
3.7
V
V
reverse recovery time
trr
QRM
IRM
35
0.52
33
ns
µC
A
VGS = -5 V; IF = 50 A; VR = 800 V
Mosfet gate drive:
VGS = -5 / 20 V; RG = 15 Ω
TVJ = 25°C
reverse recovery charge (intrinsic diode)
max. reverse recovery current
current slew rate
dIF/dt
3380
A/µs
reverse recovery time
trr
QRM
IRM
30
1.23
59
ns
µC
A
VGS = -5 V; IF = 50 A; VR = 800 V
Mosfet gate drive:
VGS = -5 / 20 V; RG = 15 Ω
TVJ = 150°C
reverse recovery charge (intrinsic diode)
max. reverse recovery current
current slew rate
dIF/dt
4250
A/µs
Note:
When using SiC Body Diode the maximum recommended VGS = -5V
IXYS reserves the right to change limits, test conditions and dimensions.
20180405a
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