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TZA3052AHW

型号:

TZA3052AHW

品牌:

PHILIPS[ PHILIPS SEMICONDUCTORS ]

页数:

23 页

PDF大小:

127 K

INTEGRATED CIRCUITS  
DATA SHEET  
TZA3052AHW  
SDH/SONET, Fibre Channel and  
Gigabit Ethernet multi-rate fibre  
optic receiver  
Product specification  
2003 Nov 19  
Supersedes data of 2003 May 14  
Philips Semiconductors  
Product specification  
SDH/SONET, Fibre Channel and Gigabit  
Ethernet multi-rate fibre optic receiver  
TZA3052AHW  
FEATURES  
APPLICATIONS  
A-rateTM(1) technology supports all bit rates from the  
SDH/SONET, Gigabit Ethernet and Fibre Channel  
same reference frequency  
optical transmission systems  
Supports eight bit rates:  
Physical interface IC in receive channels  
Transponder applications  
– SDH/SONET rates at 155.52 Mbit/s, 622.08 Mbit/s,  
2488.32 Mbit/s and 2666.06 Mbit/s  
(STM16/OC48 + FEC)  
Dense Wavelength Division Multiplexing (DWDM)  
systems.  
– Fibre Channel (FC) at 1062.5 Mbit/s and 2125 Mbit/s  
– Gigabit Ethernet (GE) at 1250 Mbit/s and  
3125 Mbit/s.  
GENERAL DESCRIPTION  
The TZA3052AHW is a fully integrated optical network  
receiver containing a limiter, Data and Clock Recovery  
(DCR) core, supporting different bit rates with one single  
reference frequency and a demultiplexer with  
demultiplexing ratios of 1 : 16, 1 : 10, 1 : 8 or 1 : 4. The  
receiver supports loop modes with serial clock and data  
inputs and outputs.  
Limiting input with 12 mV sensitivity  
Received Signal Strength Indicator (RSSI)  
Loss Of Signal (LOS) indicator with threshold adjust  
Frequency lock indicator  
ITU-T compliant jitter tolerance  
1 : 16, 1 : 10, 1 : 8, or 1 : 4 demultiplexing ratio  
Low Voltage Positive Emitter Coupled Logic (LVPECL)  
demultiplexer outputs  
Frame detector for SDH/SONET and Gigabit Ethernet  
Parity bit generation  
Recovered data and clock loop mode outputs  
Loop mode inputs on demultiplexer  
Temperature alarm  
Pin compatible with TZA3012AHW  
Single 3.3 V power supply.  
(1) A-rate is a trademark of Koninklijke Philips Electronics N.V.  
ORDERING INFORMATION  
TYPE  
PACKAGE  
NUMBER  
NAME  
DESCRIPTION  
VERSION  
TZA3052AHW  
HTQFP100  
plastic, heatsink thin quad flat package; 100 leads;  
SOT638-1  
body 14 × 14 × 1.0 mm  
2003 Nov 19  
2
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 w
DMXR0  
ENBA  
CLOOP  
DLOOPQ CLOOPQ  
DLOOP ENLINQ  
DMXR1  
LOS  
5
RSSI  
6
87 88 84 85  
91  
52 30 31  
7
38  
39  
PARITY  
LOSTH  
PARITYQ  
LOS  
44, 46, 48, 53  
55, 57, 59, 61,  
64, 66, 68, 70  
72, 77, 79, 81  
RSSI  
TZA3052AHW  
c
16  
16  
D00  
to D15  
DMX  
1 : 4  
1 : 8  
1 : 10  
1 : 16  
d
16  
9
PARITY  
GENERATOR  
45, 47, 49, 54  
56, 58, 60, 62,  
65, 67, 69, 71  
73, 78, 80, 82  
IN  
PHASE  
DETECTOR  
LIM  
2
2
10  
d
c
INQ  
D00Q  
to D15Q  
41  
42  
POCLK  
4, 12, 16, 17,  
19, 20, 21  
2
7
2
POCLKQ  
LPF  
n.c.  
2
36  
37  
FP  
FPQ  
14  
FREQUENCY  
WINDOW DETECTOR  
RREF  
94  
95  
COUT  
COUTQ  
28, 29  
24  
i.c.  
97  
98  
DOUT  
DOUTQ  
DR2  
DR1  
DR0  
23  
22  
BIT-RATE  
SELECT  
92  
TEMPERATURE  
ALARM  
TEMPAL  
1, 35, 40, 43, 51  
75, 76, 83, 86,  
89, 93, 96, 99  
26, 50, 63,  
74, 100  
8, 11,  
15, 18  
13 33 34 27  
CREFQ  
2
3
90  
32  
25  
MGU704  
13  
V
4
PRSCLOQ  
PRSCLO  
V
DD  
V
V
V
EE  
CREF  
CCA  
CCD  
CCO  
WINSIZE INWINDOW  
ENLOUTQ  
LIM = Limiting amplifier.  
RSSI = Receiving Signal Strength Indicator.  
LOS = Loss Of Signal detector.  
LPF = Low-Pass filter.  
DMX = Demultiplexer.  
Fig.1 Block diagram.  
Philips Semiconductors  
Product specification  
SDH/SONET, Fibre Channel and Gigabit  
Ethernet multi-rate fibre optic receiver  
TZA3052AHW  
PINNING  
SYMBOL  
PIN  
DESCRIPTION  
SYMBOL  
VEE  
PIN  
DESCRIPTION  
CREFQ  
VCCD  
FP  
34  
35  
36  
37  
38  
39  
40  
41  
42  
43  
44  
45  
46  
47  
48  
49  
50  
51  
52  
53  
54  
55  
56  
57  
58  
59  
60  
61  
62  
63  
64  
65  
66  
67  
68  
69  
70  
71  
72  
73  
reference clock input inverted  
supply voltage (digital part)  
frame pulse output  
die pad common ground plane  
VCCD  
1
2
3
4
5
6
supply voltage (digital part)  
prescaler output  
PRSCLO  
PRSCLOQ  
n.c.  
FPQ  
frame pulse output inverted  
parity output  
prescaler output inverted  
not connected  
PARITY  
PARITYQ  
VCCD  
POCLK  
POCLKQ  
VCCD  
D00  
parity output inverted  
LOS  
LOS output of input channel  
supply voltage (digital part)  
parallel clock output  
RSSI  
received signal strength  
indicator output of input channel  
parallel clock output inverted  
supply voltage (digital part)  
parallel data output 00  
LOSTH  
7
LOS threshold input for input  
channel  
VCCA  
IN  
8
supply voltage (analog part)  
channel input  
D00Q  
D01  
parallel data output 00 inverted  
parallel data output 01  
9
INQ  
10  
11  
12  
13  
channel input inverted  
supply voltage (analog part)  
not connected  
D01Q  
D02  
parallel data output 01 inverted  
parallel data output 02  
VCCA  
n.c.  
D02Q  
VEE  
parallel data output 02 inverted  
ground  
WINSIZE  
wide and narrow frequency  
detect window select  
VCCD  
ENBA  
D03  
supply voltage (digital part)  
byte alignment enable input  
parallel data output 03  
RREF  
VCCA  
n.c.  
14  
15  
16  
17  
18  
19  
20  
21  
22  
23  
24  
25  
26  
27  
reference resistor input  
supply voltage (analog part)  
not connected  
D03Q  
D04  
parallel data output 03 inverted  
parallel data output 04  
n.c.  
not connected  
VCCA  
n.c.  
supply voltage (analog part)  
not connected  
D04Q  
D05  
parallel data output 04 inverted  
parallel data output 05  
n.c.  
not connected  
D05Q  
D06  
parallel data output 05 inverted  
parallel data output 06  
n.c.  
not connected  
DR0  
DR1  
DR2  
VDD  
data rate selection input 0  
data rate selection input 1  
data rate selection input 2  
supply voltage (digital)  
ground  
D06Q  
D07  
parallel data output 06 inverted  
parallel data output 07  
D07Q  
VEE  
parallel data output 07 inverted  
ground  
VEE  
D08  
parallel data output 08  
INWINDOW  
frequency window detector  
output  
D08Q  
D09  
parallel data output 08 inverted  
parallel data output 09  
i.c.  
28  
29  
30  
internally connected  
internally connected  
D09Q  
D10  
parallel data output 09 inverted  
parallel data output 10  
i.c.  
DMXR0  
demultiplexing ratio selection  
input 0  
D10Q  
D11  
parallel data output 10 inverted  
parallel data output 11  
DMXR1  
31  
demultiplexing ratio selection  
input 1  
D11Q  
D12  
parallel data output 11 inverted  
parallel data output 12  
VCCO  
32  
33  
supply voltage (clock generator)  
reference clock input  
CREF  
D12Q  
parallel data output 12 inverted  
2003 Nov 19  
4
Philips Semiconductors  
Product specification  
SDH/SONET, Fibre Channel and Gigabit  
Ethernet multi-rate fibre optic receiver  
TZA3052AHW  
SYMBOL  
VEE  
PIN  
74  
75  
76  
77  
78  
79  
80  
81  
82  
83  
84  
85  
86  
87  
88  
DESCRIPTION  
SYMBOL  
PIN  
DESCRIPTION  
ground  
VCCD  
89  
90  
supply voltage (digital part)  
VCCD  
supply voltage (digital part)  
supply voltage (digital part)  
parallel data output 13  
ENLOUTQ  
line loop back enable input  
(active LOW)  
VCCD  
ENLINQ  
91  
diagnostic loop back enable  
input (active LOW)  
D13  
D13Q  
D14  
parallel data output 13 inverted  
parallel data output 14  
TEMPAL  
VCCD  
92  
93  
94  
95  
96  
97  
98  
99  
100  
temperature alarm output  
supply voltage (digital part)  
recovered clock output  
recovered clock output inverted  
supply voltage (digital part)  
recovered data output  
D14Q  
D15  
parallel data output 14 inverted  
parallel data output 15  
COUT  
COUTQ  
VCCD  
D15Q  
VCCD  
parallel data output 15 inverted  
supply voltage (digital part)  
loop mode clock input  
DOUT  
DOUTQ  
VCCD  
CLOOP  
CLOOPQ  
VCCD  
recovered data output inverted  
supply voltage (digital part)  
ground  
loop mode clock input inverted  
supply voltage (digital part)  
loop mode data input  
VEE  
DLOOP  
DLOOPQ  
loop mode data input inverted  
2003 Nov 19  
5
Philips Semiconductors  
Product specification  
SDH/SONET, Fibre Channel and Gigabit  
Ethernet multi-rate fibre optic receiver  
TZA3052AHW  
V
1
2
3
4
5
6
7
8
9
V
V
75  
74  
CCD  
CCD  
EE  
PRSCLO  
PRSCLOQ  
n.c.  
73 D12Q  
D12  
72  
71  
LOS  
D11Q  
RSSI  
70 D11  
LOSTH  
D10Q  
69  
68  
67  
V
D10  
CCA  
IN  
D09Q  
INQ 10  
66 D09  
V
11  
D08Q  
65  
64  
63  
CCA  
n.c. 12  
D08  
WINSIZE 13  
RREF 14  
V
TZA3052AHW  
EE  
62 D07Q  
V
15  
D07  
61  
60  
59  
CCA  
n.c. 16  
D06Q  
D06  
n.c. 17  
V
18  
58 D05Q  
CCA  
n.c. 19  
n.c. 20  
n.c. 21  
DR0 22  
DR1 23  
DR2 24  
D05  
57  
56  
D04Q  
55 D04  
54 D03Q  
D03  
53  
52  
51  
ENBA  
V
25  
V
DD  
CCD  
MGU703  
Fig.2 Pin configuration.  
6
2003 Nov 19  
Philips Semiconductors  
Product specification  
SDH/SONET, Fibre Channel and Gigabit  
Ethernet multi-rate fibre optic receiver  
TZA3052AHW  
FUNCTIONAL DESCRIPTION  
Limiting amplifier  
The incoming bitstream is amplified by the limiting  
The TZA3052AHW receives data from an incoming bit  
stream with a bit rate of 155 Mbit/s to 3.1 Gbit/s  
(see Table 1).  
amplifier (see Fig.3).  
A Data and Clock Recovery (DCR) section synchronizes  
the internal clock generator with the incoming data. The  
recovered serial data and clock are demultiplexed with a  
ratio of 1 : 4, 1 : 8, 1 : 10 or 1 : 16.  
handbook, halfpage  
V
CCA  
IN  
Configuring the TZA3052AHW using pins DR2, DR1  
and DR0  
50  
50 Ω  
The TZA3052AHW features eight bit rates with the use of  
a 19.44 MHz reference clock connected to pins CREF and  
CREFQ.  
INQ  
The eight bit rates are selected by the standard CMOS  
input pins DR2, DR1 and DR0(see Table 1).  
V
EE  
MDB385  
Table 1 Truth table for pins DR2, DR1 and DR0  
BIT RATE  
(Mbit/s)  
Fig.3 Limiter input termination configuration.  
DR2  
DR1  
DR0  
PROTOCOL  
LOW  
LOW  
LOW  
LOW STM1/OC3  
155.52  
Received Signal Strength Indicator (RSSI)  
LOW HIGH STM4/OC12  
622.08  
The signal strength at the input is measured with a  
logarithmic detector and presented at pin RSSI. The RSSI  
reading has a sensitivity of typically 17 mV/dB for a Vi(p-p)  
range of 5 to 500 mV (see Fig.4). VRSSI can be calculated  
using the following formula:  
LOW HIGH LOW STM16/OC48  
LOW HIGH HIGH STM16 + FEC  
2488.32  
2666.06  
1250.00  
3125.00  
1062.50  
2125.00  
HIGH LOW  
LOW GE  
HIGH LOW HIGH 10GE  
HIGH HIGH LOW Fibre Channel  
HIGH HIGH HIGH Fibre Channel  
Vi(p-p)  
VRSSI = VRSSI(32mV) + SRSSI × 20log----------------  
32mV  
MBL555  
1.2  
V
RSSI  
(V)  
S
0.9  
RSSI  
0.6  
0.3  
0
5
32  
300  
500  
2
3
10  
10  
10  
V
(mV)  
i(p-p)  
Fig.4 VRSSI as a function of Vi(p-p)  
.
2003 Nov 19  
7
Philips Semiconductors  
Product specification  
SDH/SONET, Fibre Channel and Gigabit  
Ethernet multi-rate fibre optic receiver  
TZA3052AHW  
Loss Of Signal (LOS) indicator  
Instead of using resistors (R1 and R2) to set the LOS  
threshold, an accurate external voltage source can be  
used.  
Besides the analog RSSI output, a digital LOS indication is  
present on the TZA3052AHW. The RSSI level is internally  
compared with a LOS threshold, which can be set by an  
external resistor (pin LOSTH).  
If no resistor is connected to pin LOSTH, or an external  
voltage higher than 2/3VCC is applied to the pin, the LOS  
detection circuit (including the RSSI reading) is  
If the received signal strength is below the threshold value,  
pin LOS will be HIGH. A hysteresis of 2.5 dB is applied in  
the comparator.  
automatically switched off to reduce power dissipation.  
Data and Clock Recovery (DCR)  
Setting LOSTH reference level by external resistor  
The TZA3052AHW recovers the clock and data contents  
from the incoming bit stream (see Fig.6). The DCR uses a  
combined frequency and phase locking scheme, providing  
reliable and quick data acquisition.  
The reference voltage level on pin LOSTH can be set by  
connecting an external resistor (R2) between the relevant  
pin and ground (see Fig.5). The voltage on the pin is  
determined by the ratio of resistors R2 and R1. For  
resistor R1 a value of 10 to 20 kis recommended,  
yielding a current of 120 to 60 µA.  
Initially, at power-up, coarse adjustment of the free running  
VCO frequency is required. This is achieved by the  
Frequency Window Detector (FWD) circuit. The FWD is a  
conventional frequency locked PLL.  
R2  
R1  
The LOSTH voltage equals  
× V  
ref  
-------  
The FWD checks the VCO frequency, which has to be  
within a 1000 ppm (parts per million) window around the  
desired frequency. The FWD then compares the divided  
VCO frequency (also available on pins PRSCLO and  
PRSCLOQ with the reference frequency of 19.44 MHz on  
pins CREF and CREFQ.  
Voltage Vref represents a temperature stabilized, accurate  
reference voltage of 1.2 V. The minimum threshold level  
corresponds to 0 V and the maximum to 1.2 V. Hence, the  
value of R2 may not be higher than R1. The accuracy of  
the LOSTH voltage depends mainly on the matching of the  
two external resistors.  
If the VCO frequency is found to be outside this window,  
the FWD disables the Data Phase Detector (DPD) and  
forces the VCO to a frequency within the window. As soon  
as the ‘in window’ condition occurs, which is visible on  
pin INWINDOW, the DPD starts acquiring lock on the  
incoming bit stream. Since the VCO frequency is very  
close to the expected bit rate, the phase acquisition will be  
almost instantaneous, resulting in quick phase lock to the  
incoming data stream.  
V
CCA  
RSSI  
Although the VCO is now locked to the incoming bit  
stream, the FWD is still supervising the VCO frequency  
and takes over control if the VCO drifts outside the  
predefined frequency window. This might occur during a  
‘loss of signal’ situation. Due to the FWD, the VCO  
frequency is always close to the required bit rate, enabling  
rapid phase acquisition if the lost input signal state returns.  
LOS  
LOS  
compare  
1.2 V  
V
ref  
LOSTH  
R2  
V
RREF  
EE  
R1  
10 kΩ  
I
Due to the loose coupling of 1000 ppm, the reference  
frequency does not need to be highly accurate or stable.  
Any crystal-based oscillator that generates a reasonably  
accurate frequency (e.g. within 100 ppm) can be used.  
ground  
MGU705  
Fig.5 Setting the LOSTH reference level by  
external resistors.  
2003 Nov 19  
8
Philips Semiconductors  
Product specification  
SDH/SONET, Fibre Channel and Gigabit  
Ethernet multi-rate fibre optic receiver  
TZA3052AHW  
LIMITING  
recovered data  
recovered clock  
AMPLIFIER  
to  
DEMULTIPLEXER  
DATA IN  
DATA PHASE  
up  
DETECTOR  
CHARGE PUMP  
down  
VOLTAGE  
CONTROLLED  
OSCILLATOR  
(VCO)  
LOOP FILTER  
+
DR0  
DR1  
DR2  
MAIN  
DIVIDER  
up  
FREQUENCY  
WINDOW  
DETECTOR  
CHARGE PUMP  
down  
CREF(Q)  
(19.44 MHz)  
REFERENCE  
INPUT  
PRSCLO(Q)  
PRESCALER  
OUTPUT  
MGU706  
Fig.6 Block diagram of data and clock recovery.  
Prescaler outputs  
Accurate clock generation during loss of signal  
Prescaler output pins PRSCLO and PRSCLOQ are  
always a measure of the internal frequency of the DCR.  
It is the VCO frequency divided by the selected division  
factor. It can be used as an accurate reference for another  
PLL, since it corresponds to the recovered data rate.  
A zero window size is especially interesting in the absence  
of input data, since the frequency of the recovered clock  
will be equal to the selected line clock rate.  
The accuracy of the reference frequency needs to be  
better than 20 ppm if the application is to comply with  
ITU-T recommendations.  
Programming the FWD  
The default width of the window for frequency acquisition  
is 1000 ppm around the desired bit rate. A window width of  
0 ppm can be set using pin WINSIZE. This effectively  
removes the dead zone from the FWD, rendering the FWD  
into a classical PLL.  
INWINDOW signal  
The status of the FWD circuit is reflected in the state of pin  
INWINDOW; HIGH for an ‘in window’ situation and LOW  
whenever the VCO is outside the defined frequency  
window. Due to the fact that the device enters the  
frequency acquisition mode when out of window is  
detected, the INWINDOW pin will have an intermittent  
value when the input signal is not within the defined  
window boundary.  
The VCO will be locked directly to the reference signal  
instead of to the incoming bit stream.  
Table 2 Truth table for pin WINSIZE  
PIN WINSIZE  
FREQUENCY WINDOW  
Jitter performance  
LOW  
0 ppm  
The TZA3052AHW has been optimized for best jitter  
tolerance performance. For the SDH/SONET rates, the  
jitter tolerance exceeds compliance with ITU-T standard  
G.958.  
HIGH  
1000 ppm  
2003 Nov 19  
9
Philips Semiconductors  
Product specification  
SDH/SONET, Fibre Channel and Gigabit  
Ethernet multi-rate fibre optic receiver  
TZA3052AHW  
Demultiplexer  
HIGH. Boundaries are recognized on receipt of the second  
A2 byte and FP goes HIGH for one POCLK cycle.  
The demultiplexer converts the serial input bit stream to  
parallel formats of 1 : 16, 1 : 10, 1 : 8 or 1 : 4. The output  
data is available on a scalable bus with LVPECL outputs  
(see Fig.10). In addition to the deserializing function, the  
demultiplexer comprises a parity calculator and a frame  
header detection circuit. The calculated parity (EVEN) is  
output at pins PARITY and PARITYQ. A detected frame  
header pattern in the data stream results in a 1 clock cycle  
wide pulse on output pins FP and FPQ.  
The first two A2 bytes in the frame header are the first data  
word to be reported with the correct alignment on the  
outgoing data bus (D00 to D15).  
When interfacing with a section terminating device, ENBA  
must remain HIGH for a full frame after the initial frame  
pulse. This is to allow the section terminating device to  
verify internally that frame and byte alignment are correct  
(see Fig.8). Byte boundary detection is disabled on the first  
FP pulse after ENBA has gone LOW.  
The number of parallel data bus outputs that are used  
depends on the multiplexing ratio selected by pins DMXR0  
and DMXR1. Any unused parallel data bus outputs are  
disabled. The configuration settings and active outputs for  
each demultiplexing ratio are shown in Table 3.  
Figure 9 shows frame and byte boundary detection  
activated on the rising edge of ENBA, and deactivated by  
the first FP pulse after ENBA has gone LOW.  
If ENBA is LOW, no active alignment takes place.  
However, if the framing pattern happens to occur in the  
formatted data, a frame pulse will still be output on pins FP  
and FPQ.  
Table 3 Setting the demultiplexing ratio  
ACTIVE  
OUTPUTS  
LSB TO MSB  
PIN  
PIN  
DEMULTIPLEXER  
RATIO  
DMXR1 DMXR0  
Frame detection for Gigabit Ethernet  
LOW  
LOW  
HIGH  
HIGH  
LOW  
HIGH  
LOW  
HIGH  
1 : 4  
1 : 8  
D6 to D9  
D4 to D11  
D3 to D12  
D0 to D15  
For Gigabit Ethernet the frame header detection operates  
on a 10-bit pattern. The frame header pattern is  
00 1111 1010 which equals the K28.5 character plus  
alternating 010. The occurrence of this pattern generates  
a frame pulse on pins FP and FPQ.  
1 : 10  
1 : 16  
The highest supported speed for the parallel data bus is  
400 Mbit/s. Therefore, a demultiplexing ratio of 1 : 4 will  
support bit rates up to 1.6 Gbit/s. For OC3/STM1,  
OC12/STM4, GE and FC all bus widths are supported. For  
OC48/STM16, OC48+FEC/STM16+FEC, 2FC and 10GE  
the 4-bit bus width option is not supported.  
Parity generation  
Output pins PARITY and PARITYQ provide the EVEN  
parity of the byte or word that is currently available on the  
parallel bus.  
Loop mode I/Os  
Frame detection for SDH/SONET  
The IC can be used in a ‘diagnostic loop back’ mode by  
setting pin ENLINQ to LOW. In this case, the demultiplexer  
will select inputs DLOOP and DLOOPQ, CLOOP and  
CLOOPQ instead of taking the input from the DCR. The  
‘line loop back’ mode is activated by setting pin ENLOUTQ  
to LOW. Now, the recovered clock and serial data will be  
available at output pins DOUT and DOUTQ and COUT  
and COUTQ.  
Byte alignment is enabled if the Enable Byte Alignment  
(ENBA) input is HIGH. Whenever a 32-bit sequence  
matches the frame header pattern, the incoming data is  
formatted into logical bytes or words and a frame pulse is  
generated on differential outputs FP and FPQ.  
The frame header pattern is F6F62828H, corresponding to  
the middle section of the standard SDH/SONET frame  
header (the last two A1 bytes plus the first two A2 bytes).  
RF I/Os  
Figure 7 shows a typical SDH/SONET reframe sequence  
involving byte alignment.  
The RF CML outputs have an amplitude of 80 mV (p-p)  
single-ended. The termination scheme is AC coupled (see  
Fig.11).  
Frame and byte boundary detection is enabled on the  
rising edge of ENBA and remains enabled while ENBA is  
2003 Nov 19  
10  
Philips Semiconductors  
Product specification  
SDH/SONET, Fibre Channel and Gigabit  
Ethernet multi-rate fibre optic receiver  
TZA3052AHW  
CMOS control inputs  
main ground return of the chip, the connection should have  
a low DC impedance as well. The voltage supply levels  
should be in accordance with the values specified in  
Chapter “Characteristics”.  
Most CMOS control inputs have an internal pull-up  
resistor. If the input is required to be HIGH, it can be left  
open-circuit. Only the LOW state needs to be actively  
forced. This applies to pins WINSIZE, ENBA, ENLOUTQ,  
ENLINQ and DR.  
All external components should be surface mounted  
devices, preferably of size 0603 or smaller. The  
components must be mounted as closely to the IC as  
possible.  
Power supply connections  
Four separate supply domains (VDD, VCCD, VCCO  
and VCCA) provide isolation between the various functional  
blocks. Each supply domain should be connected to a  
common VCC via separate filters. All supply pins,  
including the exposed die pad, must be connected.  
The die pad should be connected with the lowest  
inductance possible. Since the die pad is also used as the  
Temperature alarm  
The TZA3052AHW features a temperature alarm. The  
temperature alarm switches the open-drain output of  
pin TEMPAL to LOW at a junction temperature above  
130 °C.  
serial clock  
ENBA  
32 bits  
serial data  
A1  
A1  
A1  
A2  
A2  
valid data  
invalid data  
1 : 16  
A2  
A2  
D00 to D15  
(1 : 16)  
28 28  
POCLK  
(1 : 16)  
FP  
(1 : 16)  
MGU707  
Fig.7 Frame and byte detection in SDH/SONET application.  
2003 Nov 19  
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Philips Semiconductors  
Product specification  
SDH/SONET, Fibre Channel and Gigabit  
Ethernet multi-rate fibre optic receiver  
TZA3052AHW  
boundary detection  
enabled  
boundary detection enabled  
handbook, halfpage  
ENBA  
handbook, halfpage  
ENBA  
FP  
FP  
MGU340  
MGU341  
Fig.8 ENBA timing with section terminating  
device.  
Fig.9 Alternate ENBA timing.  
LIMITING VALUES  
In accordance with the Absolute Maximum Rating System (IEC 60134).  
SYMBOL PARAMETER  
CCA, VCCD  
MIN.  
0.5  
MAX.  
+3.6  
UNIT  
V
,
supply voltages  
V
V
VCCO, VDD  
Vn  
DC voltage on pins  
D00 to D15, D00Q to D15Q, POCLK, POCLKQ, FP, FPQ,  
PARITY, PARITYQ, PRSCLO and PRSCLOQ  
VCC 2.5  
VCC + 0.5  
LOSTH and RREF  
0.5  
0.5  
0.5  
0.5  
0.5  
VCC + 0.5  
VCC + 0.5  
VCC + 0.5  
VCC + 0.5  
VCC + 0.5  
V
V
V
V
V
RSSI  
WINSIZE, DR, ENBA, ENLOUTQ and ENLINQ  
LOS and INWINDOW  
TEMPAL  
In  
input current on pins  
IN and INQ  
30  
20  
2  
+30  
+20  
+2  
mA  
mA  
mA  
°C  
CREF,CREFQ, CLOOP, CLOOPQ, DLOOP and DLOOPQ  
TEMPAL  
Tamb  
Tj  
ambient temperature  
junction temperature  
storage temperature  
40  
+85  
125  
+150  
°C  
Tstg  
65  
°C  
THERMAL CHARACTERISTICS  
SYMBOL  
Rth(j-a)  
Notes  
1. In compliance with JEDEC standards JESD51-5 and JESD51-7.  
PARAMETER  
CONDITIONS  
VALUE  
UNIT  
thermal resistance from junction to ambient  
notes 1 and 2  
16  
K/W  
2. Four-layer Printed-Circuit Board (PCB) in still air with 36 plated vias connected with the heatsink and the second and  
fourth layers of the PCB.  
2003 Nov 19  
12  
Philips Semiconductors  
Product specification  
SDH/SONET, Fibre Channel and Gigabit  
Ethernet multi-rate fibre optic receiver  
TZA3052AHW  
CHARACTERISTICS  
Tamb = 40 to +85 °C; VCC = 3.14 to 3.47 V; Rth(j-a) 16 K/W; all characteristics are specified for the default setting,  
see Table 4; all voltages are referenced to ground; positive currents flow into the device; unless otherwise specified.  
SYMBOL  
General  
PARAMETER  
CONDITIONS  
MIN.  
TYP.  
MAX.  
UNIT  
ICCA  
ICCD  
ICCO  
IDD  
analog supply current  
digital supply current  
oscillator supply current  
digital supply current  
total supply current  
15  
270  
20  
0
20  
27  
mA  
350  
25  
450  
33  
mA  
mA  
mA  
mA  
W
0
1
ICC(tot)  
Ptot  
305  
395  
1.3  
511  
1.77  
total power dissipation  
0.96  
CMOS input: pins DR0, DR1, DR2, WINSIZE, DMXR0, DMXR1, ENBA, ENLOUTQ and ENLINQ  
VIL  
VIH  
IIL  
LOW-level input voltage  
HIGH-level input voltage  
LOW-level input current  
HIGH-level input current  
0.2VCC  
V
0.8VCC  
200  
V
VIL = 0 V  
VIH = VCC  
µA  
µA  
IIH  
10  
CMOS output: pins LOS and INWINDOW  
VOL  
VOH  
LOW-level output voltage IOL = 1 mA  
0
0.2  
V
V
HIGH-level output voltage IOH = 0.5 mA  
V
CC 0.2  
VCC  
Open-drain output: pin TEMPAL  
VOL  
IOH  
LOW-level output voltage IOL = 1 mA  
HIGH-level output current VOH = VCC  
0
0.2  
10  
V
µA  
Serial output: pins COUT, COUTQ, DOUT and DOUTQ  
Vo(p-p)  
output voltage swing  
(peak-to-peak value)  
single-ended with 50 Ω  
external load;  
50  
80  
110  
mV  
ENLOUTQ = LOW; see  
Fig.11  
Zo  
tr  
output impedance  
rise time  
single-ended to VCC  
20 % to 80 %  
80  
100  
100  
100  
140  
120  
ps  
ps  
ps  
tf  
fall time  
80 % to 20 %  
tD-C  
data-to-clock delay  
between differential  
crossovers of COUT,  
COUTQ, DOUT and  
DOUTQ; see Fig.12  
80  
200  
δCOUT  
δCOUTQ  
,
duty cycle signals COUT  
and COUTQ  
between differential  
crossovers  
40  
50  
50  
60  
%
Serial input: pins CLOOP, CLOOPQ, DLOOP and DLOOPQ  
Vi(p-p)  
input voltage  
single-ended  
1000  
mV  
(peak-to-peak value)  
Vi  
Zi  
td  
DC input voltage  
input impedance  
clock delay  
V
CC 1  
V
CC + 0.25  
V
single-ended to VCC  
see Fig.13  
40  
260  
50  
340  
60  
ps  
400  
2003 Nov 19  
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Philips Semiconductors  
Product specification  
SDH/SONET, Fibre Channel and Gigabit  
Ethernet multi-rate fibre optic receiver  
TZA3052AHW  
SYMBOL  
tsu  
PARAMETER  
set-up  
hold time  
duty cycle signals CLOOP between differential  
and CLOOPQ crossovers  
CONDITIONS  
see Fig.13  
see Fig.13  
MIN.  
TYP.  
MAX.  
UNIT  
ps  
15  
15  
40  
30  
30  
50  
60  
60  
60  
th  
ps  
%
δCLOOP  
,
δCLOOPQ  
LVPECL mode parallel output: pins D00 to D15, D00Q to D15Q, FP, FPQ, PARITY, PARITYQ, POCLK, POCLKQ,  
PRSCLO and PRSCLOQ  
VOH  
HIGH-level output voltage 50 termination to  
CC 2 V; see Fig.10  
LOW-level output voltage 50 termination to  
CC 2 V; see Fig.10  
V
CC 1.2  
V
CC 1.0  
V
CC 0.9  
V
V
VOL  
VCC 2.0  
VCC 1.9  
V
CC 1.7  
V
V
tr  
rise time  
fall time  
20 % to 80 %  
80 % to 20 %  
300  
300  
100  
350  
350  
100  
400  
400  
250  
ps  
ps  
ps  
tf  
tD-C  
data-to-clock delay  
between differential  
crossovers of D00 to D15  
and POCLK  
see Fig.14;  
δPOCLK = 50 %  
δPOCLK  
duty cycle POCLK  
40  
50  
60  
%
skew  
channel to channel skew  
between channels  
(D00 and Dn)  
δPOCLK = 50 %  
200  
ps  
Reference input: pin RREF  
Vref reference voltage  
10 to 20 kresistor to  
VEE  
1.17  
12  
1.21  
1.26  
500  
V
RF input: pins IN and INQ  
Vi(p-p)  
input voltage swing  
(peak-to-peak value)  
single-ended; note 1  
differential  
mV  
Zi  
input impedance  
80  
100  
60  
120  
αiso  
between channel isolation  
dB  
Received Signal Strength Indicator: pin RSSI  
Vi(p-p)  
input voltage swing  
(peak-to-peak value)  
single-ended  
5
500  
mV  
SRSSI  
VRSSI  
RSSI sensitivity  
see Fig.4  
15  
17  
20  
mV/dB  
mV  
pin RSSI output voltage  
Vi(p-p) = 32 mV;  
PRBS (2311)  
580  
680  
780  
Vo(RSSI)  
output voltage variation  
input 2.5 and 2.7 Gbit/s; 50  
PRBS (2311);  
+50  
mV  
VCC = 3.14 to 3.47 V;  
Tamb = 120 °C  
Zo  
output impedance  
output source current  
output sink current  
1
10  
1
IO(source)  
IO(sink)  
mA  
mA  
0.4  
2003 Nov 19  
14  
Philips Semiconductors  
Product specification  
SDH/SONET, Fibre Channel and Gigabit  
Ethernet multi-rate fibre optic receiver  
TZA3052AHW  
SYMBOL  
PARAMETER  
CONDITIONS  
MIN.  
TYP.  
MAX.  
UNIT  
LOS detector  
hys  
ta  
hysteresis  
assert time  
de-assert time  
2
3
4
5
5
dB  
Vi(p-p) = 3 dB  
Vi(p-p) = 3 dB  
µs  
µs  
td  
Reference frequency input: pins CREF and CREFQ  
Vi(p-p)  
input voltage  
single-ended  
50  
1000  
mV  
(peak-to-peak value)  
Vi  
DC input voltage  
input impedance  
V
CC 1  
V
CC + 0.25  
V
Zi  
single-ended to VCC  
40  
50  
60  
+20  
fCREF  
reference clock frequency SDH/SONET operation, 20  
ppm  
accuracy  
fCREF = 19.44 MHz  
PLL characteristics  
tacq  
acquisition time  
200  
10  
µs  
tacq(pc)  
acquisition time at power  
cycle  
ms  
TDR  
transitionless data run  
1000  
bits  
Jitter tolerance  
Jtol(p-p)  
jitter tolerance to serial  
data input signal  
(peak-to-peak value)  
STM1/OC3 mode  
(ITU-T G.958);  
PRBS(231 1); note 2  
f = 6.5 kHz  
f = 65 kHz  
f = 1 MHz  
3
10  
1
UI  
UI  
UI  
0.3  
0.3  
0.5  
STM4/OC12 mode  
(ITU-T G.958);  
PRBS(231 1); note 3  
f = 25 kHz  
f = 250 kHz  
f = 5 MHz  
3
10  
1
UI  
UI  
UI  
0.3  
0.3  
0.5  
STM16/OC48 mode  
(ITU-T G.958);  
PRBS(231 1); note 4  
f = 100 kHz  
f = 1 MHz  
3
10  
1
UI  
UI  
UI  
0.3  
0.3  
f = 20 MHz  
0.5  
Notes  
1. The RF input is protected against a differential overvoltage; the maximum input current is 30 mA. It is assumed that  
both inputs carry a complementary signal of the specified peak-to-peak value.  
2. The Jtol(p-p) minimum value is 0.25 UI for Tamb = 40 °C to 0 °C at f = 65 kHz and 1 MHz.  
3. The Jtol(p-p) minimum value is 0.25 UI for Tamb = 40 °C to 0 °C at f = 250 kHz and 5 MHz.  
4. The Jtol(p-p) minimum value is 0.25 UI for Tamb = 40 °C to 0 °C at f = 1 MHz and 20 MHz.  
2003 Nov 19  
15  
Philips Semiconductors  
Product specification  
SDH/SONET, Fibre Channel and Gigabit  
Ethernet multi-rate fibre optic receiver  
TZA3052AHW  
Table 4 Default test settings  
PIN  
SETTING  
DESCRIPTION  
DR2  
DR1  
DR0  
LOW  
STM16/OC48  
HIGH  
LOW  
WINSIZE  
HIGH  
1000 ppm  
ENBA  
HIGH  
automatic byte alignment  
DOUT, COUT disabled  
DLOOP, CLOOP disabled  
reference frequency  
ENLOUTQ  
HIGH  
ENLINQ  
HIGH  
CREF, CREFQ  
D00 to D15,  
19.44 MHz  
not connected  
D00Q to D15Q,  
FP, FPQ,  
PARITY, PARITYQ,  
POCLK, POCLKQ,  
PRSCLO, PRSCLOQ  
SWING CONTROL  
V
CC  
V
2 V  
term  
optional  
AC coupling  
transmission  
lines  
OUT  
to high-  
impedance  
input  
50 Ω  
50 Ω  
OUTQ  
I
swing  
50 Ω  
50 Ω  
in  
on-chip  
off-chip  
MBL562  
Fig.10 Standard PECL mode.  
2003 Nov 19  
16  
Philips Semiconductors  
Product specification  
SDH/SONET, Fibre Channel and Gigabit  
Ethernet multi-rate fibre optic receiver  
TZA3052AHW  
recommended for  
serial outputs  
SWING CONTROL  
V
CC  
V
bias  
120  
100 Ω  
100 Ω  
50 Ω  
transmission  
50 Ω  
100 Ω  
100 Ω  
lines  
OUT  
to high-  
impedance  
input  
50 Ω  
50 Ω  
OUTQ  
I
swing  
in  
on-chip  
off-chip  
MBL563  
Fig.11 CML AC coupled mode.  
COUT  
DOUT  
t
D-C  
MGU345  
The timing is measured from the crossover point of the clock output signal to the crossover point of the data output (all signals are differential).  
Fig.12 Loop mode output timing.  
2003 Nov 19  
17  
Philips Semiconductors  
Product specification  
SDH/SONET, Fibre Channel and Gigabit  
Ethernet multi-rate fibre optic receiver  
TZA3052AHW  
handbook, halfpage  
CLOOP  
t
d
t
t
h
su  
DLOOP  
MBL554  
The timing is measured from the crossover point of the clock input signal to the crossover point of the data input.  
Fig.13 Loop mode input timing.  
POCLK  
t
D-C  
D00 to D15,  
FP, PARITY  
MGU343  
The timing is measured from the crossover point of the clock output signal to the crossover point of the data output (all signals are differential).  
Fig.14 Parallel bus output timing.  
2003 Nov 19  
18  
Philips Semiconductors  
Product specification  
SDH/SONET, Fibre Channel and Gigabit  
Ethernet multi-rate fibre optic receiver  
TZA3052AHW  
PACKAGE OUTLINE  
HTQFP100: plastic thermal enhanced thin quad flat package; 100 leads;  
body 14 x 14 x 1 mm; exposed die pad  
SOT638-1  
c
y
exposed die pad side  
X
D
h
A
75  
51  
50  
76  
Z
E
e
H
E
E
E
(A )  
3
A
h
2
A
A
1
w M  
p
θ
b
L
p
pin 1 index  
L
detail X  
26  
100  
1
25  
w M  
Z
v
v
M
M
A
B
D
b
p
e
D
B
H
D
0
10 mm  
scale  
DIMENSIONS (mm are the original dimensions)  
A
(1)  
(1)  
(1)  
(1)  
UNIT  
A
A
A
b
c
D
D
E
E
e
H
H
L
L
p
v
w
y
Z
Z
E
θ
1
2
3
p
h
h
D
E
D
max.  
0.15 1.05  
0.05 0.95  
0.27 0.20 14.1 7.1 14.1 7.1  
0.17 0.09 13.9 6.1 13.9 6.1  
16.15 16.15  
15.85 15.85  
0.75  
0.45  
1.15 1.15  
0.85 0.85  
7°  
0°  
mm  
1.2  
0.25  
0.5  
1
0.2 0.08 0.08  
Note  
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.  
REFERENCES  
OUTLINE  
EUROPEAN  
PROJECTION  
ISSUE DATE  
VERSION  
IEC  
JEDEC  
JEITA  
01-03-30  
03-04-07  
SOT638-1  
2003 Nov 19  
19  
Philips Semiconductors  
Product specification  
SDH/SONET, Fibre Channel and Gigabit  
Ethernet multi-rate fibre optic receiver  
TZA3052AHW  
SOLDERING  
To overcome these problems the double-wave soldering  
method was specifically developed.  
Introduction to soldering surface mount packages  
If wave soldering is used the following conditions must be  
observed for optimal results:  
This text gives a very brief insight to a complex technology.  
A more in-depth account of soldering ICs can be found in  
our “Data Handbook IC26; Integrated Circuit Packages”  
(document order number 9398 652 90011).  
Use a double-wave soldering method comprising a  
turbulent wave with high upward pressure followed by a  
smooth laminar wave.  
There is no soldering method that is ideal for all surface  
mount IC packages. Wave soldering can still be used for  
certain surface mount ICs, but it is not suitable for fine pitch  
SMDs. In these situations reflow soldering is  
recommended.  
For packages with leads on two sides and a pitch (e):  
– larger than or equal to 1.27 mm, the footprint  
longitudinal axis is preferred to be parallel to the  
transport direction of the printed-circuit board;  
– smaller than 1.27 mm, the footprint longitudinal axis  
must be parallel to the transport direction of the  
printed-circuit board.  
Reflow soldering  
Reflow soldering requires solder paste (a suspension of  
fine solder particles, flux and binding agent) to be applied  
to the printed-circuit board by screen printing, stencilling or  
pressure-syringe dispensing before package placement.  
Driven by legislation and environmental forces the  
The footprint must incorporate solder thieves at the  
downstream end.  
For packages with leads on four sides, the footprint must  
be placed at a 45° angle to the transport direction of the  
printed-circuit board. The footprint must incorporate  
solder thieves downstream and at the side corners.  
worldwide use of lead-free solder pastes is increasing.  
Several methods exist for reflowing; for example,  
convection or convection/infrared heating in a conveyor  
type oven. Throughput times (preheating, soldering and  
cooling) vary between 100 and 200 seconds depending  
on heating method.  
During placement and before soldering, the package must  
be fixed with a droplet of adhesive. The adhesive can be  
applied by screen printing, pin transfer or syringe  
dispensing. The package can be soldered after the  
adhesive is cured.  
Typical reflow peak temperatures range from  
215 to 270 °C depending on solder paste material. The  
top-surface temperature of the packages should  
preferably be kept:  
Typical dwell time of the leads in the wave ranges from  
3 to 4 seconds at 250 °C or 265 °C, depending on solder  
material applied, SnPb or Pb-free respectively.  
below 225 °C (SnPb process) or below 245 °C (Pb-free  
process)  
A mildly-activated flux will eliminate the need for removal  
of corrosive residues in most applications.  
– for all BGA, HTSSON-T and SSOP-T packages  
– for packages with a thickness 2.5 mm  
Manual soldering  
– for packages with a thickness < 2.5 mm and a  
Fix the component by first soldering two  
diagonally-opposite end leads. Use a low voltage (24 V or  
less) soldering iron applied to the flat part of the lead.  
Contact time must be limited to 10 seconds at up to  
300 °C.  
volume 350 mm3 so called thick/large packages.  
below 240 °C (SnPb process) or below 260 °C (Pb-free  
process) for packages with a thickness < 2.5 mm and a  
volume < 350 mm3 so called small/thin packages.  
When using a dedicated tool, all other leads can be  
soldered in one operation within 2 to 5 seconds between  
270 and 320 °C.  
Moisture sensitivity precautions, as indicated on packing,  
must be respected at all times.  
Wave soldering  
Conventional single wave soldering is not recommended  
for surface mount devices (SMDs) or printed-circuit boards  
with a high component density, as solder bridging and  
non-wetting can present major problems.  
2003 Nov 19  
20  
Philips Semiconductors  
Product specification  
SDH/SONET, Fibre Channel and Gigabit  
Ethernet multi-rate fibre optic receiver  
TZA3052AHW  
Suitability of surface mount IC packages for wave and reflow soldering methods  
SOLDERING METHOD  
PACKAGE(1)  
WAVE  
not suitable  
REFLOW(2)  
BGA, HTSSON..T(3), LBGA, LFBGA, SQFP, SSOP..T(3), TFBGA,  
USON, VFBGA  
suitable  
DHVQFN, HBCC, HBGA, HLQFP, HSO, HSOP, HSQFP, HSSON,  
HTQFP, HTSSOP, HVQFN, HVSON, SMS  
PLCC(5), SO, SOJ  
not suitable(4)  
suitable  
suitable  
suitable  
LQFP, QFP, TQFP  
not recommended(5)(6) suitable  
SSOP, TSSOP, VSO, VSSOP  
CWQCCN..L(8), PMFP(9), WQCCN..L(8)  
not recommended(7)  
suitable  
not suitable  
not suitable  
Notes  
1. For more detailed information on the BGA packages refer to the “(LF)BGA Application Note” (AN01026); order a copy  
from your Philips Semiconductors sales office.  
2. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum  
temperature (with respect to time) and body size of the package, there is a risk that internal or external package  
cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the  
Drypack information in the “Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods”.  
3. These transparent plastic packages are extremely sensitive to reflow soldering conditions and must on no account  
be processed through more than one soldering cycle or subjected to infrared reflow soldering with peak temperature  
exceeding 217 °C ± 10 °C measured in the atmosphere of the reflow oven. The package body peak temperature  
must be kept as low as possible.  
4. These packages are not suitable for wave soldering. On versions with the heatsink on the bottom side, the solder  
cannot penetrate between the printed-circuit board and the heatsink. On versions with the heatsink on the top side,  
the solder might be deposited on the heatsink surface.  
5. If wave soldering is considered, then the package must be placed at a 45° angle to the solder wave direction.  
The package footprint must incorporate solder thieves downstream and at the side corners.  
6. Wave soldering is suitable for LQFP, TQFP and QFP packages with a pitch (e) larger than 0.8 mm; it is definitely not  
suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.  
7. Wave soldering is suitable for SSOP, TSSOP, VSO and VSSOP packages with a pitch (e) equal to or larger than  
0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.  
8. Image sensor packages in principle should not be soldered. They are mounted in sockets or delivered pre-mounted  
on flex foil. However, the image sensor package can be mounted by the client on a flex foil by using a hot bar  
soldering process. The appropriate soldering profile can be provided on request.  
9. Hot bar or manual soldering is suitable for PMFP packages.  
2003 Nov 19  
21  
Philips Semiconductors  
Product specification  
SDH/SONET, Fibre Channel and Gigabit  
Ethernet multi-rate fibre optic receiver  
TZA3052AHW  
DATA SHEET STATUS  
DATA SHEET  
STATUS(1)  
PRODUCT  
STATUS(2)(3)  
LEVEL  
DEFINITION  
I
Objective data  
Development This data sheet contains data from the objective specification for product  
development. Philips Semiconductors reserves the right to change the  
specification in any manner without notice.  
II  
Preliminary data Qualification  
This data sheet contains data from the preliminary specification.  
Supplementary data will be published at a later date. Philips  
Semiconductors reserves the right to change the specification without  
notice, in order to improve the design and supply the best possible  
product.  
III  
Product data  
Production  
This data sheet contains data from the product specification. Philips  
Semiconductors reserves the right to make changes at any time in order  
to improve the design, manufacturing and supply. Relevant changes will  
be communicated via a Customer Product/Process Change Notification  
(CPCN).  
Notes  
1. Please consult the most recently issued data sheet before initiating or completing a design.  
2. The product status of the device(s) described in this data sheet may have changed since this data sheet was  
published. The latest information is available on the Internet at URL http://www.semiconductors.philips.com.  
3. For data sheets describing multiple type numbers, the highest-level product status determines the data sheet status.  
DEFINITIONS  
DISCLAIMERS  
Short-form specification  
The data in a short-form  
Life support applications  
These products are not  
specification is extracted from a full data sheet with the  
same type number and title. For detailed information see  
the relevant data sheet or data handbook.  
designed for use in life support appliances, devices, or  
systems where malfunction of these products can  
reasonably be expected to result in personal injury. Philips  
Semiconductors customers using or selling these products  
for use in such applications do so at their own risk and  
agree to fully indemnify Philips Semiconductors for any  
damages resulting from such application.  
Limiting values definition Limiting values given are in  
accordance with the Absolute Maximum Rating System  
(IEC 60134). Stress above one or more of the limiting  
values may cause permanent damage to the device.  
These are stress ratings only and operation of the device  
at these or at any other conditions above those given in the  
Characteristics sections of the specification is not implied.  
Exposure to limiting values for extended periods may  
affect device reliability.  
Right to make changes  
Philips Semiconductors  
reserves the right to make changes in the products -  
including circuits, standard cells, and/or software -  
described or contained herein in order to improve design  
and/or performance. When the product is in full production  
(status ‘Production’), relevant changes will be  
Application information  
Applications that are  
communicated via a Customer Product/Process Change  
Notification (CPCN). Philips Semiconductors assumes no  
responsibility or liability for the use of any of these  
products, conveys no licence or title under any patent,  
copyright, or mask work right to these products, and  
makes no representations or warranties that these  
products are free from patent, copyright, or mask work  
right infringement, unless otherwise specified.  
described herein for any of these products are for  
illustrative purposes only. Philips Semiconductors make  
no representation or warranty that such applications will be  
suitable for the specified use without further testing or  
modification.  
2003 Nov 19  
22  
Philips Semiconductors – a worldwide company  
Contact information  
For additional information please visit http://www.semiconductors.philips.com.  
Fax: +31 40 27 24825  
For sales offices addresses send e-mail to: sales.addresses@www.semiconductors.philips.com.  
© Koninklijke Philips Electronics N.V. 2003  
SCA75  
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.  
The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed  
without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license  
under patent- or other industrial or intellectual property rights.  
Printed in The Netherlands  
R56/03/pp23  
Date of release: 2003 Nov 19  
Document order number: 9397 750 12151  
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