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QSMR-C199

型号:

QSMR-C199

品牌:

AVAGO[ AVAGO TECHNOLOGIES LIMITED ]

页数:

7 页

PDF大小:

249 K

S M T c h i p L E D s  
HIGH PERFORMANCE CHIP LED  
InGaN ChipLEDs  
QSMR-C199 ( SPECIAL PART NUMBER )  
Features  
• High Brightness  
• Small Size  
• Industrial Standard Footprint  
• Diffused Optics  
• Top Emitting  
• Compatible With IR Soldering  
• Compatible For Use With Light Piping  
• Available in 8mm Tape on 7” Diameter Reel  
• Reel Sealed in Zip Locked Moisture Barrier Bags  
Applications  
• LCD Backlighting  
• Push Button Backlighting  
• Front Panel Indicator  
• Symbol Indicator  
• Microdisplays  
• Small Message Panel Signage  
Description  
This small chip-type LEDs utilize high efficient and high brightness  
InGaN material to deliver competitively priced high performance green.  
This 470nm blue is unique hues which provide color differentiation to  
a product.  
This ChipLED comes in top emitting package with wide viewing angle  
Where it is suitable for direct backlighting application or being  
used with light pipes. In order to facilitate pick and place  
operation, this ChipLED is shipped in tape and reel with 4000 units  
per reel. The package is compatible with IR soldering and binned by  
both color and intensity.  
CAUTION: QSMR-C199 LEDs are Class 1 ESD sensitive per MIL-STD-1686. Please observe  
appropriate precautions during handling and processing. Refer to Agilent Technologies  
Application Note AN-1142 for additional details.  
Agilent reserves the right to alter prices, specification, features, capabilities, functions, release dates, and remove availability of the product  
(s) at anytime.  
ChipLEDs  
Package Dimensions  
LED DIE  
0.8  
(0.031)  
0.4 (0.016)  
1.6  
(0.063)  
POLARITY  
0.3  
1.0  
(0.039)  
(0.012)  
DIFFUSED  
EPOXY  
0.6  
(0.023)  
PC  
BOARD  
0.3  
(0.012)  
0.3 ± 0.15  
0.3 ± 0.15  
(0.012±0.006)  
(0.012±0.006)  
SOLDERING  
TERMINAL  
SOLDERING  
TERMINAL  
Notes:  
1. All dimensions in millimeters (inches)  
2. Tolerance is  
0.1 mm ( 0.004 in.) unless otherwise specified.  
Absolute Maximum Ratings at TA = 25°C  
Parameter  
DC Forward Current[1]  
Power Dissipation  
QSMR-C199  
Units  
mA  
mW  
V
20  
78  
5
Reverse Voltage (IR = 100µA)  
LED Junction Temperature  
Operating Temperature Range  
Storage Temperature Range  
95  
°C  
°C  
°C  
-30 to +85  
-40 to +85  
Soldering Temperature  
See IR soldering profile (Figure 6)  
Notes:  
1. Derate linearly as shown in Figure 4.  
Agilent reserves the right to alter prices, specification, features, capabilities, functions, release dates, and remove availability of the product  
(s) at anytime.  
2
ChipLEDs  
Electrical Characteristics at TA = 25°C  
Forward Voltage  
VF (Volts)  
Reverse Breakdown  
Capacitance C  
(pF), VF = 0,  
f = 1 MHz  
Typ.  
VR (Volts)  
Part Number  
QSMR-C199  
@ IF = 5 mA[1]  
@ IR = 100 µA  
Min.  
Max.  
Min.  
5
2.55  
3.15  
110  
Notes:  
1. Vf Tolerance : +/- 0.1V  
Optical Characteristics at TA = 25°C  
Viewing  
Angle  
Peak  
Wavelength  
Color,  
Dominant  
Luminous  
Efficacy  
Luminous  
Intensity  
Iv (mcd)  
@ 5 mA[1]  
Part  
Number  
2 θ1/2  
Degrees[3]  
Typ.  
Color  
Wavelength  
λpeak (nm)  
ηv  
[2]  
Typ.  
λd  
(nm)  
(lm/w) Typ.  
QSMR-C199  
Blue  
Bin L, M  
469  
Bin D  
140  
88  
Notes:  
1. The luminous intensity IV is measured at the peak of the spatial radiation pattern which may not  
be aligned with the mechanical axis of the lamp package.  
2. The dominant wavelength λd is derived from the CIE Chromatically Diagram and represents the  
perceived color of the device.  
3. θ1/2 is the off-axis angle where the luminous intensity is ½ the peak intensity.  
Intensity Bin [unit:mcd] (Tolerance: +/- 15 %)  
Min.  
11.2  
18.0  
Max.  
18.0  
28.5  
L
M
Color Bin [unit:nm] (Tolerance: +/- 1 nm)  
Min.  
475  
Max.  
480  
D
Agilent reserves the right to alter prices, specification, features, capabilities, functions, release dates, and remove availability of the product  
(s) at anytime.  
3
ChipLEDs  
100  
90  
80  
70  
60  
50  
40  
30  
20  
10  
0
400  
500  
Wavelength - nm  
600  
700  
Figure 1: Relative Intensity vs. Wavelength.  
100.0  
1.2  
1.0  
0.8  
0.6  
0.4  
0.2  
0.0  
10.0  
1.0  
0.1  
2.0  
2.5  
3.0  
3.5  
4.0  
0
5
10  
15  
20  
25  
VF-FORWARD VOLTAGE-V  
IF-Forward Current-mA  
Figure 2: Forward Current vs. Forward Voltage.  
Figure 3: Luminous Intensity vs. Forward Current.  
Agilent reserves the right to alter prices, specification, features, capabilities, functions, release dates, and remove availability of the product  
(s) at anytime.  
4
ChipLEDs  
25  
20  
15  
10  
5
0
0
10  
20  
30  
40  
50  
60  
70  
80  
90  
100  
TA - Ambient Temperature - o  
C
Figure 4: Maximum Forward Current vs. Ambient Temperature.  
100  
90  
80  
70  
60  
50  
40  
30  
20  
10  
0
10 SEC. MAX.  
230oC MAX.  
140-160oC  
4oC/SEC MAX.  
-3oC/SEC MAX.  
4oC/SEC MAX.  
OVER 2 MIN.  
-90 -80 -70 -60 -50 -40 -30 -20 -10  
0
10 20 30 40 50 60 70 80 90  
Angle  
TIME  
Figure 5: Relative Intensity vs. Angle  
Figure 6: Recommended Reflow Soldering Profile  
0.8  
(0.031)  
0.8  
0.7  
0.8  
(0.031)  
(0.028)  
(0.031)  
Figure 7: Recommended Soldering Pattern  
Note:  
1. All dimensions in millimeters (inches).  
Agilent reserves the right to alter prices, specification, features, capabilities, functions, release dates, and remove availability of the product  
(s) at anytime.  
5
ChipLEDs  
Figure 8: Reeling Orientation.  
Figure 9: Reel Dimensions.  
Note:  
1. All dimensions in millimeters (inches).  
Agilent reserves the right to alter prices, specification, features, capabilities, functions, release dates, and remove availability of the product  
(s) at anytime.  
6
ChipLEDs  
4.00 (0.157)  
1.50 (0.059)  
CATHODE  
DIM. C  
(SEE TABLE 1)  
0.20 0.05  
(0.008 0.002)  
1.75 (0.069)  
3.50 0.05  
(0.138 0.002)  
DIM. A (SEE  
TABLE 1)  
8.00 0.30 (0.315 0.012)  
DIM. B  
(SEE TABLE 1)  
USER FEED  
DIRECTION  
COVER TAPE  
CARRIER TAPE  
2.00 0.05  
(0.079 0.002)  
4.00 (0.157)  
TABLE 1  
DIMENSIONS IN MILIMETERS (INCHES)  
DIM. A  
0.10 ( 0.004)  
DIM. B  
0.10 ( 0.004)  
DIM. C  
0.10( 0.004)  
PART NUMBER  
QSMR-C199 SERIES  
1.80 (0.071)  
0.95 (0.037)  
0.75 (0.030)  
Figure 14: Tape Dimensions.  
Convective IR Reflow  
END  
START  
Soldering  
For more information on IR  
reflow soldering, refer to  
Application Note 1060,  
Surface Mounting SMT LED  
Indicator Components.  
MINIMUM OF  
THERE SHALL BE A MINIMUM OF  
THERE SHALL BE A MINIMUM OF  
160mm (6.3in.) OF EMPTY  
COMPONENT POCKETS SEALED  
WITH COVER TAPE.  
MOUNTED WITH  
COMPONENTS.  
230mm  
(9.05in.) MAY  
CONSIST OF  
CARRIER  
160mm (6.3in.) OF EMPTY  
COMPONENT POCKETS SEALED  
WITH COVER TAPE.  
AND/OR  
COVER TAPE  
Figure 15: Tape Leader and Trailer Dimensions.  
Notes:  
1. All dimensions in millimeters (inches).  
2. Tolerance is  
0.1 mm ( 0.004 in.) unless otherwise specified.  
Storage Condition : 5 to 30 OC @ 60%RH max.  
Baking is required under the condition :  
a) the blue silica gel indicator becoming white / transparent color  
b) the pack has been open for more than 1 week  
Baking recommended condition : 60  
5
OC for 20 hrs.  
Agilent reserves the right to alter prices, specification, features, capabilities, functions, release dates, and remove availability of the product  
(s) at anytime.  
7
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