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LYT6073C-TL

型号:

LYT6073C-TL

品牌:

POWERINT[ Power Integrations ]

页数:

32 页

PDF大小:

2405 K

LYTSwitch-6 Family  
Flyback CV/CC LED Driver IC with Integrated  
650 V / 725 V MOSFET and FluxLink Feedback  
Product Highlights  
Highly Integrated, Compact Footprint  
Up to 94% efficiency across full load range  
Sꢄ FET  
Incorporates a multi-mode Quasi-Resonant (QR) / CCM / DCM flyback  
controller, 650 V or 725 V MOSFET, secondary-side control and  
synchronous rectification driver  
Integrated FluxLink™, HIPOT-isolated, feedback link  
Exceptional CV/CC accuracy, independent of transformer design or  
external components  
D
S
V
LYTSwitch-6  
Adjustable accurate output current sense using external sense resistor  
Optional  
Current  
Sense  
VOUT  
Priꢅary FET  
and Controller  
EcoSmart™ – Energy Efficient  
BPP  
IS  
Secondary  
Control IC  
Less than 15 mW no-load including line sense (without PF front end)  
Designs using LYTSwitch-6 easily meet Energy Star and all global  
lighting energy efficiency regulations  
PIꢀꢁꢂ75ꢀ072ꢁꢃ7  
Low heat dissipation  
Figure 1. Typical Application/Performance.  
Advanced Protection / Safety Features  
Input line OV with auto-restart  
Output fault OVP/UVP with auto-restart  
Open SR FET gate detection  
Input voltage monitor with accurate brown-in  
Thermal foldback ensures that power continues to be delivered  
(lower level) at elevated temperatures  
Full Safety and Regulatory Compliance  
Reinforced insulation  
Isolation voltage >4000 VAC  
Figure 2. High Creepage, Safety-Compliant InSOP-24D Package.  
100% production HIPOT compliance testing  
UL1577 and TUV (EN60950) safety approved  
Green Package  
Output Power Table  
Halogen free and RoHS compliant  
380 VDC /  
450 VDC2  
Applications  
277 VAC ± 15% 85-305 VAC  
Product3  
Isolated off-line LED driver  
Smart LED lighting  
Open Frame1 Open Frame1 Open Frame1  
High-voltage flyback post regulator  
LYT6063C/6073C  
LYT6065C/6075C  
LYT6067C/6077C  
LYT6068C  
15 W  
30 W  
50 W  
65 W  
12 W  
25 W  
45 W  
55 W  
25 W  
40 W  
60 W  
Description  
The LYTSwitch™-6 series family of ICs dramatically simplifies the  
development and manufacturing of off-line LED drivers, particularly  
those in compact enclosures or with high efficiency requirements.  
The LYTSwitch-6 architecture is revolutionary in that the devices  
incorporate both primary and secondary controllers, with sense  
elements and a safety-rated feedback mechanism into a single IC.  
Table 1. Output Power Table.  
Notes:  
1. Minimum continuous power in a typical non-ventilated and PCB size measured  
at 40 °C ambient. Max output power is dependent on the design. With  
condition that package temperature must be < 125 °C.  
2. With 725 V FET only.  
Close component proximity and innovative use of the integrated  
communication link, FluxLink, permit accurate control of a secondary-  
side synchronous rectification MOSFET with Quasi-Resonant switching  
of primary integrated high-voltage MOSFET to maintain high efficiency  
across the entire load range.  
3. Package: InSOP-24D.  
www.power.com  
June 2018  
This Product is Covered by Patents and/or Pending Patent Applications.  
LYTSwitch-6  
ꢆꢂꢄꢋꢉ  
ꢘꢆꢚ  
ꢋꢉꢏꢅT  
ꢇꢍꢁꢂꢍꢇLTꢄꢖꢁ ꢘꢍꢚ  
ꢏꢂꢋꢃꢄꢂY ꢎYꢏꢄSS  
ꢘꢎꢏꢏꢚ  
ꢏꢂꢋꢃꢄꢂY ꢎYꢏꢄSS  
ꢂꢁꢖꢅLꢄTꢇꢂ  
ꢁꢉꢄꢎLꢁ  
ꢔꢄꢅLT  
ꢁꢉꢄꢎLꢁ  
ꢎꢏꢏꢌꢅꢍ  
ꢄꢅTꢇ-ꢂꢁSTꢄꢂT  
ꢊꢇꢅꢉTꢁꢂ  
ꢂꢁSꢁT  
ꢏꢂꢋꢃꢄꢂY  
Lꢋꢉꢁ  
ꢋꢉTꢁꢂꢔꢄꢊꢁ  
ꢖꢄTꢁ  
ꢎYꢏꢄSS ꢏꢋꢉ  
ꢎꢏꢏꢌꢅꢍ  
ꢅꢉꢆꢁꢂꢍꢇLTꢄꢖꢁ  
ꢏꢂꢋꢃꢄꢂY  
ꢎYꢏꢄSS ꢏꢋꢉ  
ꢊꢄꢏꢄꢊꢋTꢇꢂ  
SꢁLꢁꢊT ꢄꢉꢆ  
ꢊꢅꢂꢂꢁꢉT  
LꢋꢃꢋT  
ꢏꢂꢋꢃ-ꢊLꢕ  
ꢗꢋTTꢁꢂ  
+
-
ꢇꢍ  
SꢀꢅꢉT  
ꢎꢏꢞ  
ꢇSꢊꢋLLꢄTꢇꢂꢌ  
TꢋꢃꢁꢂS  
ꢋLꢋꢃ  
ꢖꢄTꢁ  
tꢇꢉꢘꢃꢄꢙꢚ  
tꢇꢔꢔꢘꢎLꢇꢊꢕꢚ  
ꢖꢄTꢁ  
TꢀꢁꢂꢃꢄL  
SꢀꢅTꢆꢇꢈꢉ  
ꢖꢄTꢁ  
ꢎꢏꢏ  
ꢇꢍ  
ꢏꢂꢋꢃꢌSꢁꢊ  
ꢔꢄꢅLT  
Sꢐcꢂꢁꢟ  
ꢔꢝꢜꢠ  
ꢄꢅTꢇ-ꢂꢁSTꢄꢂT  
Sꢐcꢏꢑꢒꢓꢐ  
Sꢐcꢜꢛꢡꢢꢝꢣ  
ꢊꢜꢛtꢝꢜꢒꢒꢐꢝ  
SꢐꢛꢓꢐꢔꢁT  
ꢏꢂꢋꢃꢌSꢁꢊ  
ꢏꢜwꢐꢝ  
ꢃꢇSꢔꢁT  
S
Sꢐc-  
ꢔꢄꢅLT  
ꢂꢁꢊꢁꢋꢍꢁꢂ  
ꢊꢇꢉTꢂꢇLLꢁꢂ  
ꢆꢂꢋꢍꢁꢂ  
ꢎꢏꢏꢌꢅꢍ  
tꢇꢔꢔꢘꢎLꢇꢊꢕꢚ  
Lꢁꢎ  
S  
ꢏꢂꢋꢃ-ꢊLꢕ  
ꢋLꢋꢃ  
+
-
ꢄꢅTꢇ-ꢂꢁSTꢄꢂT  
ꢏꢂꢋꢃꢄꢂY ꢇꢍꢏ  
ꢋLꢋꢃ  
tꢇꢉꢘꢃꢄꢙꢚ  
PI-8388-020618  
Sꢇꢅꢂꢊꢁ  
ꢘSꢚ  
Figure 3. Primary Controller Block Diagram.  
ꢈꢃꢄꢉꢆꢄꢀ  
ꢊꢈꢉꢀꢋ  
SYꢅꢂꢄꢃꢅꢃꢏS ꢄꢁꢂTꢐꢈꢐꢁꢄ ꢀꢄꢐꢘꢁ  
ꢊSꢄꢋ  
ꢃꢏTꢍꢏT ꢘꢃLTꢆꢎꢁ  
ꢊꢘꢃꢏTꢋ  
Sꢄ ꢂꢃꢅTꢄꢃL  
ꢄꢁꢎꢏLꢆTꢃꢄ  
ꢞꢟꢞ ꢘ  
ꢈꢃꢄꢉꢆꢄꢀ  
ꢇꢍSꢏꢘ  
ꢐꢅꢚ  
ꢁꢅꢆꢇLꢁ  
Sꢄ  
SꢁꢂꢃꢅꢀꢆꢄY  
ꢇYꢍꢆSS  
ꢊꢇꢍSꢋ  
ꢘꢃꢏT  
-
ꢞꢟꢞ ꢘ  
ꢠꢟꢡ ꢘ  
ꢀꢁTꢁꢂTꢃꢄ  
ꢛꢄ  
S
Sꢄ  
TꢚꢄꢁSꢚꢃLꢀ  
ꢚꢆꢅꢀSꢚꢆꢌꢁꢢ  
ꢈꢆꢏLT ꢀꢁTꢁꢂTꢐꢃꢅ  
SꢁꢂꢃꢅꢀꢆꢄY  
ꢃꢘꢍ  
ꢐꢅꢚ  
ꢀꢂꢙ  
ꢂꢃꢅTꢄꢃL  
Tꢑ  
ꢍꢒiꢓꢔꢒꢕ  
ꢄꢖcꢖiꢗꢖꢒ  
ꢈꢁꢁꢀꢇꢆꢂꢌ  
ꢊꢈꢇꢋ  
ꢐꢅꢚ  
ꢈꢁꢁꢀꢇꢆꢂꢌ  
ꢀꢄꢐꢘꢁꢄ  
-
ꢘꢄꢁꢈ  
ꢛꢄ  
ꢈꢁꢁꢀꢇꢆꢂꢌ  
ꢂꢃꢙꢍꢁꢅSꢆTꢐꢃꢅ  
Tꢜꢙꢆꢝ  
-
TꢚꢁꢄꢙꢆL  
ꢈꢃLꢀꢇꢆꢂꢌ  
tꢃꢈꢈꢊꢙꢐꢅꢋ  
tSꢁꢂꢐꢅꢚꢊꢙꢆꢝꢋ  
ꢃSꢂꢐLLꢆTꢃꢄꢢ  
Tꢐꢙꢁꢄ  
tSSꢊꢄꢆꢙꢍꢋ  
SꢁꢂꢃꢅꢀꢆꢄY ꢐSꢁꢅSꢁ  
ꢎꢄꢃꢏꢅꢀ  
ꢊꢎꢅꢀꢋ  
ꢊꢐSꢋ  
ꢀꢁꢂ80ꢃꢄeꢂ0ꢅ0618  
Figure 4. Secondary Controller Block Diagram.  
2
Rev. E 06/18  
www.power.com  
LYTSwitch-6  
Pin Functional Description  
ISENSE (IS) Pin (Pin 1)  
Connection to the power supply output terminals. An external  
current sense resistor should be connected between this and the  
GND pin. If current regulation is not required, this pin should be tied  
to the GND pin.  
ꢀ ꢁꢂ  
ꢆꢇꢇ ꢁꢈ  
ꢄꢅ ꢁꢉ  
ꢁꢃ ꢄꢅ  
ꢁꢁ ꢄꢅ  
ꢁꢊ ꢄꢅ  
ꢋ ꢄꢅ  
SECONDARY GROUND (GND) (Pin 2)  
ꢍ ꢄꢅ  
GND for the secondary IC. Note this is not the power supply output  
GND due to the presence of the sense resistor between this and the  
ISENSE pin.  
S ꢁ6-ꢁꢋ  
ꢎ ꢏꢐꢌ  
6 ꢀꢑꢒT  
ꢉ Sꢓ  
ꢈ ꢆꢇS  
ꢂ ꢏꢆ  
FEEDBACK (FB) Pin (Pin 3)  
Connection to an external resistor divider to set the power supply  
output voltage.  
ꢃ ꢔꢄꢌ  
ꢁ ꢕS  
ꢌ ꢃꢈ  
SECONDARY BYPASS (BPS) Pin (Pin 4)  
Connection point for an external bypass capacitor for the secondary  
IC supply.  
ꢀꢁꢂꢃ8ꢃꢃꢂ0ꢄꢄꢄ16  
SYNCHRONOUS RECTIFIER DRIVE (SR) Pin (Pin 5)  
Figure 5. Pin Configuration.  
Gate driver for external SR FET.  
OUTPUT VOLTAGE (VOUT) Pin (Pin 6)  
Connected directly to the output voltage to provide current for the  
controller on the secondary-side.  
LYTSwitch-6 Functional Description  
The LYTSwitch-6 combines a high-voltage power MOSFET switch,  
along with both primary-side and secondary-side controllers in one  
device.  
FORWARD (FWD) Pin (Pin 7)  
The connection point to the switching node of the transformer output  
winding providing information on the primary switch timing. Provides  
power for the secondary-side controller when VOUT is below a threshold.  
The architecture incorporates a novel inductive coupling feedback  
scheme using the package lead frame and bond wires to provide a  
safe, reliable, and low-cost means to communicate accurate direct  
sensing of the output voltage and output current on the secondary  
controller to the primary controller.  
NC Pin (Pin 8-12)  
Leave open. Should not be connected to any other pins.  
The primary controller on LYTSwitch-6 is a Quasi-Resonant (QR)  
flyback controller that has the ability to operate in continuous  
conduction mode (CCM). The controller uses both variable frequency  
and variable current control schemes. The primary controller consists  
of a frequency jitter oscillator; a receiver circuit magnetically coupled  
to the secondary controller, a current limit controller, 5 V regulator on  
the PRIMARY BYPASS pin, audible noise reduction engine for light load  
operation, bypass overvoltage detection circuit, a lossless input line  
sensing circuit, current limit selection circuitry, over-temperature  
protection, leading edge blanking, and a 650 V / 725 V power MOSFET.  
Input Overvoltage (V) Pin (Pin 13)  
A high-voltage pin connected to the AC or DC side of the input bridge  
for detecting overvoltage conditions at the power supply input. This  
pin should be tied to Source to disable OV protection.  
PRIMARY BYPASS (BPP) Pin (Pin 14)  
The connection point for an external bypass capacitor for the  
primary-side supply. This is also the ILIM selection pin for choosing  
standard ILIM or ILIM+1.  
NC Pin (Pin 15)  
Leave open. Should not be connected to any other pins.  
The LYTSwitch-6 secondary controller consists of a transmitter circuit  
that is magnetically coupled to the primary receiver, a constant  
voltage (CV) and a constant current (CC) control circuit, a 4.4 V  
regulator on the secondary SECONDARY BYPASS pin, synchronous  
rectifier MOSFET driver, QR mode circuit, oscillator and timing  
functions, thermal foldback control and a host of integrated  
protection features.  
SOURCE (S) Pin (Pin 16-19)  
These pins are the power MOSFET source connection. It is also  
ground reference for primary BYPASS pin.  
DRAIN (D) Pin (Pin 24)  
Power MOSFET drain connection.  
Figure 3 and Figure 4 show the functional block diagrams of the  
primary and secondary controller with the most important features.  
3
Rev. E 06/18  
www.power.com  
LYTSwitch-6  
Primary Controller  
1.0ꢂ  
1.0  
The LYTSwitch-6 features variable frequency QR controller + CCM  
operation for enhanced efficiency and extended output power  
capability.  
0.ꢄꢂ  
0.ꢄ  
PRIMARY BYPASS Pin Regulator  
The PRIMARY BYPASS pin has an internal regulator that charges the  
PRIMARY BYPASS pin capacitor to VBPP by drawing current from the  
voltage on the DRAIN pin whenever the power MOSFET is off. The  
PRIMARY BYPASS pin is the internal supply voltage node. When the  
power MOSFET is on, the device operates from the energy stored in  
the PRIMARY BYPASS pin capacitor.  
0.8ꢂ  
0.8  
In addition, there is a shunt regulator clamping the PRIMARY BYPASS  
pin voltage to VSHUNT when the current is provided to the PRIMARY  
BYPASS pin through an external resistor. This facilitates powering the  
LYTSwitch-6 externally through a bias winding to decrease the  
no-load consumption to less than 15 mW.  
0.ꢃꢂ  
ꢀ0  
ꢁ0  
ꢂ0  
60  
ꢃ0  
80  
ꢄ0  
100  
Stꢀꢁꢂꢃ-Stꢁtꢀ Switchiꢄꢅ ꢆꢇꢀꢈꢉꢀꢄcꢃ ꢊꢋꢌꢍꢎ  
Primary Bypass ILIM Programming  
Figure 6. Normalized Primary Current vs. Frequency.  
LYTSwitch-6 has user programmable current limit (ILIM) settings  
through the selection of PRIMARY BYPASS pin capacitor value. The  
PRIMARY BYPASS pin can use a ceramic capacitor for decoupling the  
internal supply of the device.  
Current Limit Operation  
The primary-side controller has a current limit threshold ramp that is  
inversely proportional to time from the end of the last primary  
switching cycle (i.e. from the time the primary FET turns off at the  
end of a switching cycle).  
There are (2) programmable settings using 0.47 mF and 4.7 mF for  
standard and increased ILIM settings respectively.  
Primary Bypass Undervoltage Threshold  
The characteristic produces a primary current limit that increases as  
the load increases (Figure 6).  
The PRIMARY BYPASS pin undervoltage circuitry disables the power  
MOSFET when the PRIMARY BYPASS pin voltage drops below ~4.5 V  
(VBPP - VBP(H)) in steady-state operation. Once the PRIMARY BYPASS  
pin voltage falls below this threshold, it must rise back to VSHUNT to  
re-enable turn-on of the power MOSFET.  
This algorithm enables the most efficient use of the primary switch  
with immediate response when a feedback switching cycle request is  
received.  
Primary Bypass Output Overvoltage Auto-Restart Function  
The PRIMARY BYPASS pin has an OV protection non-latching feature.  
A Zener diode in parallel to the resistor in series with the PRIMARY  
BYPASS pin capacitor is typically used to detect an overvoltage on the  
primary bias winding to activate this protection mechanism. In the  
event the current into the PRIMARY BYPASS pin exceeds ISD, the  
At high load, switching cycle have a maximum current approaching  
100% ILIM gradually reduced to 30% of the full current limit as the  
load reduces. Once 30% current limit is reached, there is no further  
reduction in current limit (since this is low enough to avoid audible  
noise) but the time between switching cycles will continue to reduce  
as load reduces.  
device will disable the power MOSFET switching for a time tAR(OFF)  
.
Jitter  
After this time the controller will restart operation and attempt to  
return to regulation.  
The normalized current limit is modulated between 100% and 95% at  
a modulation frequency of fM this results in a frequency jitter of ~7 kHz  
with average frequency of ~100 kHz.  
This VOUT OV protection is also available as an integrated feature on  
the secondary controller.  
Auto-Restart  
In the event a fault condition occurs such as an output overload,  
output short-circuit, or external component/pin fault, the LYTSwitch-6  
enters into auto-restart (AR) operation. In auto-restart the power  
MOSFET switching is disabled for tAR(OFF). There are 2 ways to enter  
auto-restart:  
Over-Temperature Protection  
The thermal shutdown circuitry senses the primary MOSFET die  
temperature. The threshold is typically set to TSD with TSD(H)  
hysteresis. When the die temperature rises above this threshold the  
power MOSFET is disabled and remains disabled until the die  
temperature falls by TSD(H) at which point it is re-enabled. A large  
hysteresis of TSD(H) is provided to prevent over-heating of the PCB due  
to continuous fault condition.  
1. Continuous secondary requests at above the overload detection  
frequency (~110 kHz) for longer than 80 ms.  
2. No requests for switching cycles from the secondary for > tAR(SK)  
.
4
Rev. E 06/18  
www.power.com  
LYTSwitch-6  
The second was included to ensure that if communication is lost, the  
primary tries to restart again. Although this should never be the case  
in normal operation, this can be useful in the case of system ESD  
events for example where a loss of communication due to noise  
disturbing the secondary controller, the issue is resolved when the  
primary restarts after an auto-restart off time.  
ꢕꢈ ꢕꢍꢐꢄꢊꢍꢟ ꢛꢒꢐꢋ  
ꢇꢈ ꢇeꢖꢆꢓꢎꢊꢍꢟ ꢛꢒꢐꢋ  
ꢇꢑꢊꢍꢑ  
ꢕꢈ ꢕꢆꢌeꢍeꢎ ꢦꢋꢝ ꢇꢌꢐꢑꢖꢒꢐꢓꢘ  
ꢇꢈ ꢕꢆꢌeꢍꢐꢓꢘ ꢦꢋ  
The very first auto-restart off-time is short. This short auto-restart  
timer is to provide a quick recovery under fast reset conditions. The  
short auto-restart off-time allows the controller to quickly check to  
determine whether the auto-restart condition is maintained beyond  
tAR(OFF)SH. If so will resort to full auto-restart off timing.  
ꢕꢈ ꢔꢏꢑꢆꢣReꢁꢑꢊꢍꢑ  
ꢇꢈ ꢕꢆꢌeꢍꢐꢓꢘ ꢦꢋ  
ꢂꢁ  
The auto-restart is reset as soon as an AC reset occurs.  
ꢇꢈ ꢉꢊꢁ ꢋꢆꢌeꢍeꢎ  
ꢏꢋ ꢌꢐꢑꢒꢐꢓ ꢑꢔR  
ꢅꢆ  
ꢅꢆ  
ꢅꢆ  
ꢕꢈ ꢢꢆeꢁ ꢑꢆ ꢔꢏꢑꢆꢣReꢁꢑꢊꢍꢑ ꢞꢤꢤ  
ꢇꢈ ꢥꢟꢋꢊꢁꢁ ꢠꢐꢁꢖꢒꢊꢍꢘꢐꢓꢘ  
SOA Protection  
In the event there are two consecutive cycles where the ILIM is  
reached within the blanking time and current limit delay time  
(~500 ns), the controller will skip approximately 2.5 cycles or ~25 ms  
(based on full frequency of 100 kHz). This provides sufficient time for  
reset of the transformer during start-up into large capacitive loads  
without extending the start-up time.  
ꢀeꢁ  
6ꢃ ꢄꢁ  
ꢕꢈ ꢇꢌꢐꢑꢖꢒꢐꢓꢘ  
ꢇꢈ ꢇeꢓꢎꢁ ꢉꢊꢓꢎꢁꢒꢊꢗꢐꢓꢘ ꢕꢏꢙꢁeꢁ  
Input Line Voltage Monitoring  
The INPUT OVERVOLTAGE pin is used for input overvoltage sensing  
and protection.  
ꢕꢈ ꢉꢊꢁ Reꢖeꢐveꢎ  
ꢉꢊꢓꢎꢁꢒꢊꢗꢐꢓꢘ  
ꢕꢏꢙꢁeꢁ  
ꢕꢈ ꢛꢆꢓꢑꢐꢓꢏꢆꢏꢁ ꢇꢌꢐꢑꢖꢒꢐꢓꢘ  
ꢇꢈ ꢠꢆeꢁꢓꢡꢑ ꢗe ꢛꢆꢓꢑꢍꢆꢙ  
A 4 Mresistor is tied between the high-voltage DC bulk capacitor  
after the bridge (or to the AC side of the bridge rectifier for fast AC  
reset) and the INPUT OVERVOLTAGE pin to enable this functionality.  
This pin functionality can be disabled by shorting INPUT  
OVERVOLTAGE pin to primary Source.  
ꢀeꢁ  
ꢕꢈ ꢇꢑꢆꢋꢁ ꢇꢌꢐꢑꢖꢒꢐꢓꢘꢝ ꢉꢊꢓꢎꢁ  
ꢞveꢍ ꢛꢆꢓꢑꢍꢆꢙ ꢑꢆ ꢇeꢖꢆꢓꢎꢊꢍꢟ  
Primary/Secondary-Side Handshake  
At start-up, the primary-side initially switches without any feedback  
information (this is very similar to the operation of a standard  
TOPSwitch™, TinySwitch™ or LinkSwitch™ controllers).  
ꢇꢈ ꢉꢊꢁ ꢗeꢓ  
ꢛꢆꢓꢑꢍꢆꢙꢜ  
ꢕꢈ ꢅꢆꢑ ꢇꢌꢐꢑꢖꢒꢐꢓꢘ  
ꢇꢈ ꢠꢆeꢁꢓꢡꢑ ꢗe ꢛꢆꢓꢑꢍꢆꢙ  
If no feedback signals are received during the auto-restart on-time  
(tAR), the primary goes into auto-restart mode. Under normal  
conditions, the secondary controller will power-up via the FORWARD  
pin or from OUTPUT VOLTAGE pin and take over control. From this  
point onwards the secondary controls switching.  
ꢀeꢁ  
Eꢓꢎ ꢆꢤ ꢉꢊꢓꢎꢁꢒꢊꢗꢐꢓꢘꢝ  
ꢇeꢖꢆꢓꢎꢊꢍꢟ ꢛꢆꢓꢑꢍꢆꢙ ꢧꢆꢎe  
If the primary stops switching or does not respond to cycle requests  
from the secondary during normal operation (when the secondary  
has control), the handshake protocol is initiated to ensure that the  
secondary is ready to assume control once the primary begins to  
switch again. An additional handshake is also triggered if the  
secondary detects that the primary is providing more cycles than  
were requested.  
ꢕꢨꢣ8ꢃꢩꢪꢣ0ꢫꢂ01ꢪ  
Figure 7. Primary-Secondary Handshake Flow Chart.  
second handshake sequence. This provides additional protection  
against cross-conduction of SF FET while the primary is switching.  
This protection mode also prevents an output overvoltage condition  
in the event that the primary is reset while the secondary is still in  
control.  
The most likely event that could require an additional handshake is  
when the primary stops switching as the result of a momentary line  
brown-out event. When the primary resumes operation, it will default  
into a start-up condition and attempt to detect handshake pulses  
from the secondary.  
Wait and Listen  
When the primary resumes switching after initial power-up recovery  
from input line voltage fault or an auto-restart event, it will assume  
control and require a successful handshake to relinquish control to  
the secondary controller.  
If the secondary does not detect that the primary responds to  
switching requests for 8 consecutive cycles, or if the secondary  
detects that the primary is switching without cycle requests for 4  
or more consecutive cycles, the secondary controller will initiate a  
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LYTSwitch-6  
As an additional safety measure the primary will pause for an  
auto-restart on-time, tAR (~82 ms), before switching. During this  
“wait” time, the primary will “listen” for secondary requests. If it sees  
two consecutive secondary requests, separated by 30 ms, the primary  
will enter secondary control and begins switching in slave mode. If  
no such pulses occur during the tAR “wait” period, the primary will  
begin switching under primary control until handshake pulses are  
received.  
The secondary controller temporarily inhibits the FEEDBACK short  
protection threshold (VFB(OFF)) until the end of the soft-start (tSS(RAMP)  
timer. After hand-shake is completed the secondary controller  
linearly ramps up the switching frequency from fSW to fSREQ over the  
tSS(RAMP) time period.  
)
In the event of a short-circuit or overload at start-up, the device will  
regulate directly into CC (constant-current mode). The device will go  
into auto-restart (AR), if the output voltage does not rise above the  
Audible Noise Reduction Engine  
VO(AR) threshold before the expiration of the soft start timer (tSS(RAMP)  
)
The LYTSwitch-6 features and active audible noise reduction mode  
wherein the controller (via a “frequency skipping” mode of operation)  
avoids the resonant band (where the mechanical structure of the  
power supply is most likely to resonate - increasing noise amplitude)  
between 7 kHz and 12 kHz ‒ 142 ms and 83 ms. If a secondary  
controller request occur within this window from the last conduction  
cycle, the gate drive of the power MOSFET is inhibited.  
after handshake has occurred.  
The secondary controller enables the FEEDBACK pin short protection  
mode (VFB(OFF)) at the end of the tSS(RAMP) time period. If the output  
short maintains the FEEDBACK pin to be below short-circuit threshold  
the secondary will stop requesting pulses to trigger an auto-restart  
cycle.  
If output voltage reaches regulation within the tSS(RAMP) time period,  
the frequency ramp is immediately aborted and the secondary  
controller is permitted to go full frequency. This will allow the  
controller to maintain regulation in the event of a sudden transient  
loading soon after regulation is achieved. The frequency ramp will  
only be aborted if quasi-resonant detection programming has already  
occurred.  
Secondary Controller  
As shown in the block diagram in Figure 4, the IC is powered through  
regulator 4.4 V (VBPS) by either VOUT or FW. The SECONDARY  
BYPASS pin is connected to an external decoupling capacitor and fed  
internally from the regulator block.  
The FORWARD pin also connects to the negative edge detection  
block used for both handshaking and timing to turn on the SF FET  
connected to the SYNCHRONOUS RECTIFIER DRIVE pin. The  
FORWARD pin voltage is used to determine when to turn off the  
SF FET in discontinuous mode operation. This is when the voltage  
across the RDS(ON) of the SR FET drops below zero volts.  
Maximum Secondary Inhibit Period  
Secondary-cycle requests to initiate primary switching are inhibited to  
maintain operation below maximum frequency and ensure minimum  
off-time. Besides these constraints, secondary-cycle requests are  
also inhibited during the “ON” time cycle of the primary switch (time  
between the cycle request and detection of FORWARD pin falling  
edge). The maximum time-out in the event a FORWARD pin falling  
edge is not detected after a cycle requested is ~30 ms.  
In continuous conduction mode (CCM) the SR FET is turned off when  
the feedback pulse is sent to the primary to demand the next  
switching cycle, providing excellent synchronous operation, free of  
the any overlap for the FET turn-off.  
Thermal Foldback  
When the secondary controller die temperature reaches 124 °C, the  
output power is reduced by reducing the constant current reference  
threshold (see Figure 8).  
The mid-point of an external resistor divider network between the  
OUTPUT VOLTAGE and SECONDARY GROUND pins is tied to the  
FEEDBACK pin to regulate the output voltage. The internal voltage  
comparator reference voltage is VREF (1.265 V).  
The external current sense resistor connected between ISENSE and  
SECONDARY GROUND pins to regulate the output current in constant  
current regulator mode.  
100  
6ꢅ  
Minimum Off-Time  
The secondary controller initiates cycle request using the inductive  
connection to the primary. The maximum frequency of the  
secondary-cycle requests is limited by a minimum cycle off-time of  
t
OFF(MIN). This is in order to ensure that there is sufficient reset time  
after the primary conduction to deliver energy to the load.  
Maximum Switching Frequency  
The maximum switch request frequency of the secondary controller  
10ꢆ  
1ꢇꢈ  
is fSREQ  
.
Sꢀcꢁꢂꢃꢄꢅꢆ ꢇꢁꢂtꢅꢁꢈꢈꢀꢅ ꢉiꢀ  
Tꢀꢊꢋꢀꢅꢄtꢌꢅꢀ ꢍꢎꢇꢏ  
Frequency Soft-Start  
At start-up the primary controller is limited to a maximum switching  
frequency of fSW and 75% of the maximum programmed current limit  
at the switch-request frequency of 100 kHz.  
ꢀꢁꢂ8ꢃꢄ6ꢂ010ꢃ18  
Figure 8 Normalized Primary Current vs. Secondary die Template.  
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LYTSwitch-6  
Output Voltage Protection  
SR Static Pull-Down  
In the event the sensed voltage on the FEEDBACK pin is 2% higher  
than the regulation threshold, a bleed current of ~2.5 mA (3 mA max)  
is applied on the OUTPUT VOLTAGE pin (weak bleed). This bleed  
current increases to ~200 mA in the event the FEEDBACK pin voltage  
is raised to beyond ~10% (strong bleed) of the internal FEEDBACK  
pin reference voltage. The current sink on the OUTPUT VOLTAGE pin  
is intended to discharge the output voltage for momentary overshoot  
events. The secondary does not relinquish control to the primary  
during this mode of operation.  
To ensure that the SR gate is held low when the secondary is not in  
control, the SYNCHRONOUS RECTIFIER DRIVE pin has a nominally  
“ON” device to pull the pin low and discharge any voltage  
accumulation on the SR gate due to capacitive coupling from the  
FORWARD pin.  
Open SR Protection  
The secondary controller has a protection mode to ensure the  
SYNCHRONOUS RECTIFIER DRIVE pin is connected to an external  
MOSFET to protect against an open SYNCHRONOUS RECTIFIER  
DRIVE pin system fault. At start-up the controller will sink a current  
from the SYNCHRONOUS RECTIFIER DRIVE pin; an internal threshold  
will correlate to a capacitance of 100 pF. If the capacitance on the  
SYNCHRONOUS RECTIFIER DRIVE pin is below 100 pF (the resulting  
voltage is below the reference voltage), the device will assume the  
SYNCHRONOUS RECTIFIER DRIVE pin is “open” and there is no FET  
to drive. If the pin capacitance detected to be above 100 pF (the  
resulting voltage is above the reference voltage), the controller will  
assume an SR FET is populated.  
If the voltage on the FEEDBACK pin is sensed to be 20% higher than  
the regulation threshold, a command is sent to the primary to begin  
an auto-restart sequence. This integrated VOUT OVP can be used  
independently from the primary sensed OVP or in conjunction.  
FEEDBACK Pin Short Detection  
If the sensed FEEDBACK pin voltage is below VFB(OFF) at start-up, the  
secondary controller will complete the handshake to take control of  
the primary complete tSS(RAMP) and will stop requesting cycles to initiate  
auto-restart (no cycle requests made to primary for longer than tAR(SK)  
second triggers auto-restart).  
In the event the SYNCHRONOUS RECTIFIER DRIVE pin is detected to  
be open, the secondary controller will stop requesting pulses to the  
primary to initiate auto-restart.  
During normal operation, the secondary will stop requesting pulses  
from the primary to initiate an auto-restart cycle when the FEEDBACK  
pin voltage falls below VFB(OFF) threshold. The deglitch filter on the  
protection mode is less than 10 ms. By this mechanism, the secondary  
will relinquish control after detecting the FEEDBACK pin is shorted to  
ground.  
If the SYNCHRONOUS RECTIFIER DRIVE pin is tied to ground at  
start-up, the SR drive function is disabled and the open  
SYNCHRONOUS RECTIFIER DRIVE pin protection mode is also  
disabled.  
Auto-Restart Thresholds  
Intelligent Quasi-Resonant Mode Switching  
The OUTPUT VOLTAGE pin includes a comparator to detect when the  
output voltage falls below VVO(AR) of VVO, for a duration exceeding  
tVOUT(AR). The secondary controller will relinquish control when this  
fault condition is sensed. This threshold is meant to limit the range of  
constant current (CC) operation.  
In order to improve conversion efficiency and reduce switching  
losses, the LYTSwitch-6 features a means to force switching when the  
voltage across the primary switch is near its minimum voltage when  
the converter operates in discontinuous conduction mode (DCM).  
This mode of operation automatically engages in DCM and disabled  
once the converter moves to continuous-conduction mode (CCM).  
SECONDARY BYPASS Overvoltage Protection  
The LYTSwitch-6 secondary controller features SECONDARY BYPASS  
pin OV feature similar to PRIMARY BYPASS pin OV feature. When the  
secondary is in control: in the event the SECONDARY BYPASS pin  
current exceeds IBPS(SD) (~7 mA) the secondary will send a command  
to the primary to initiate an auto-restart off-time (tAR(OFF)) event.  
Rather than detecting the magnetizing ring valley on the primary-  
side, the peak voltage of the FORWARD pin voltage as it rises above  
the output voltage level is used to gate secondary request to initiate  
the switch “ON” cycle in the primary controller.  
The secondary controller detects when the controller enters in  
discontinuous-mode and opens secondary cycle request windows  
corresponding to minimum switching voltage across the primary  
power MOSFET.  
Output Constant Current  
The LYTSwitch-6 regulates the output current through an external  
current sense resistor between the ISENSE and SECONDARY  
GROUND pins where the voltage generated across the resistor is  
compared to internal of ISV(TH) (~35 mV). If constant current  
regulation is not required, the ISENSE pin must be tied to  
SECONDARY GROUND pin.  
Quasi-Resonant (QR) mode is enabled for 20 msec after DCM is  
detected or ring amplitude (pk-pk) >2 V. Afterward QR switching is  
disabled, at which point switching may occur at any time a secondary  
request is initiated.  
The secondary controller includes blanking of ~1 ms to prevent false  
detection of primary “ON” cycle when the FORWARD pin rings below  
ground.  
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LYTSwitch-6  
Reꢏꢇeꢐꢈ ꢑꢒꢓꢔꢋꢕ  
ꢆꢇꢈꢉꢇꢈ ꢊꢋꢌꢈꢍꢎe  
Tiꢀꢁ  
Tiꢀꢁ  
Figure 9. Intelligent Quasi-Resonant Mode Switching.  
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LYTSwitch-6  
Application Example  
ꢆ1ꢅ  
ꢋ.ꢋ ꢇꢈ  
ꢅꢃ0 ꢊꢍꢆ  
ꢆ16  
ꢆ18  
ꢎꢋ  
ꢃ60 µꢏ  
ꢌ16  
ꢘ1ꢙꢂ1ꢋꢂꢈ  
100 µꢈ 100 µꢈ  
ꢔꢅ  
Rꢕ10  
100 ꢊ  
100 ꢊ  
ꢀꢁ ꢂꢃ ꢄꢀꢁ ꢅꢆ  
Tꢇꢈ  
1
ꢈꢎ1  
Rꢉ8  
ꢆ1ꢉ  
100 100 ꢒꢈ  
ꢆꢑ  
1000 ꢒꢈ  
6ꢋ0 ꢊ  
Rꢅꢑ  
10ꢅ ꢓΩ  
1ꢖ  
R1ꢄ  
ꢃ10 ꢓΩ  
ꢌ1  
Eꢘꢅꢜꢙꢜꢎꢔꢀ  
1/ꢅ ꢗ 1 ꢓꢊ  
ꢆꢋꢄ  
1.ꢃ ꢇꢈ  
ꢅ00 ꢊ  
1/8 ꢗ  
ꢌ10  
ꢘꢔꢔꢏꢋR06ꢘ  
600 ꢊ  
ꢊR1  
ꢚꢛꢌꢅꢄꢆꢅ00ꢀ  
ꢅ00 ꢊ  
Rꢉ  
ꢅ.0 ꢕΩ  
ꢈꢎꢅ  
ꢈꢎꢉ  
ꢔ1  
Rꢉ6  
ꢅ0 Ω  
EE1ꢋ  
ꢊRꢅ  
ꢚꢛꢌꢅꢄꢆꢅ00ꢀ  
ꢅ00 ꢊ  
ꢆ1ꢃ  
10 µꢈ  
ꢅꢃ ꢊ  
ꢌ8  
ꢌꢈꢎR1600ꢂꢄ  
600 ꢊ  
ꢈꢎꢋ  
Rꢋ0  
ꢌ11  
1.6ꢅ ꢓΩ  
1ꢖ  
ꢌꢈꢎꢝ1ꢉ00ꢂꢄ  
ꢚR1  
ꢝꢌꢉꢞꢚ100  
1000 ꢊ  
ꢌ1ꢄ  
Eꢘꢅꢙꢂꢎꢔꢀ  
1/16 ꢗ  
Rꢅꢅ  
ꢉꢄ Ω  
Tꢇꢕ  
ꢎꢅ  
ꢅ0 ꢐꢏ  
ꢆꢅ  
ꢅꢅ0 ꢇꢈ  
ꢉꢃ0 ꢊ  
ꢆꢋ  
ꢋꢋ0 ꢇꢈ  
ꢉꢃ0 ꢊ  
1
ꢆ1  
100 ꢇꢈ  
6ꢋ0 ꢊꢌꢆ  
ꢗꢁ - ꢖ6ꢄ  
ꢂꢆꢌ  
Rꢊ1  
ꢅꢄꢃ ꢊꢍꢆ  
ꢆ1ꢑ  
ꢋꢋ0 ꢒꢈ  
ꢃ0 ꢊ  
ꢈ1  
ꢋ.1ꢃ ꢍ  
Tꢇꢖ  
ꢆ1ꢋ  
ꢅ.ꢅ µꢈ  
ꢅꢃ ꢊ  
ꢆꢉ  
68 µꢈ  
ꢉꢃ0 ꢊ  
Rꢉꢄ  
ꢉ.ꢄ ꢓΩ  
Rꢉꢃ  
ꢅ.00 ꢕΩ  
1ꢖ  
Rꢅꢉ  
6.ꢅ Ω  
1ꢖ  
ꢌꢄ  
ꢌꢈꢎR1ꢅ00ꢂꢄ  
ꢅ00 ꢊ  
S
ꢌꢍꢊTꢉꢍL  
Rꢉꢋ  
0.06ꢅ Ω  
1ꢖ  
ꢂꢍꢐT  
1/ꢅ ꢗ  
R18  
10 ꢓΩ  
ꢑꢇꢇ  
ꢏS  
LYTSwitch-6  
ꢝꢉ  
ꢎꢟꢔ6068ꢆ  
ꢆ10  
ꢅꢅ µꢈ  
16 ꢊ  
ꢆ11  
ꢉ.ꢄ µꢈ  
ꢃ0 ꢊ  
ꢌ1ꢋ  
ꢝꢘ1ꢚ  
ꢉTꢊ  
Tꢇꢋ  
ꢀꢁꢂ8ꢃꢄ6ꢂ01ꢅ618  
Figure 10. Schematic DER-657, 46.4 W, 80 V, 0.58 A for Universal External LED Driver Application.  
The circuit shown on Figure 10 is a 46 W isolated flyback power  
supply with a single-stage power factor correction circuit for LED  
lighting applications. It provides an accurately regulated 80 V, 580 mA  
output for multi-LED-string applications where a post regulator is  
used − such as in RGBW smart-lighting fixtures. The design is also  
ideal for single string applications as it also provides a constant  
580 mA output current with accurate regulation and no line-induced  
ripple across a load-voltage range of 80 V to 20 V. The circuit is  
highly efficient offering accurate load regulation and is stable over  
line (90 VAC to 265 VAC). The circuit also delivers a PF of greater  
than 0.9 with less than 20% A-THD (measured at 230 VAC).  
caused by the transformer leakage inductance. The RCD primary  
clamp also reduces radiated and conducted EMI.  
In order to provide line overvoltage detection, the bulk capacitor  
voltage is sensed and converted into a current by the INPUT  
VOLTAGE pin resistors R4 and R45. The INPUT VOLTAGE pin line  
overvoltage threshold current (IOV-) determines the input overvoltage  
shutdown point.  
The LYTSwitch-6 IC is self-starting, using an internal high-voltage  
current source to charge the PRIMARY BYPASS pin capacitor (C11)  
when AC is first applied. During normal operation the primary-side  
circuitry is powered from an auxiliary winding on transformer T2.  
A value of 4.7 mF was selected for the BPP capacitor (C11) to select  
increased-current-limit operation. During normal operation the  
output of the auxiliary (bias) winding is rectified using diode D7 and  
filtered using capacitor C10. Resistor R18 limits the current being  
supplied to the PRIMARY BYPASS pin.  
Input Stage  
Fuse F1 provides open-circuit protection which isolates the circuit  
from the input line in the event of catastrophic component failures.  
Varistor RV1 clamps any voltage spikes to protect the circuitry located  
after the fuse from damage due to overvoltage caused by a line  
transient or surge. Bridge diode BR1 rectifies the AC line voltage and  
provides a full-wave rectified DC voltage across the input film capacitors  
C2 and C3. The EMI filter is a 2-stage LC circuit comprising C1, L2,  
C2, L3, and C3 and suppress differential and common mode noise  
generated from the PFC and flyback switching stages.  
Power Factor Correction Stage  
The Power Factor Correction circuit comprises an inductor (T1) in  
series with blocking diodes (D1 and D17) and is connected to the  
DRAIN pin of the LYTSwitch-6 IC. High PF is achieved using a  
Switched Valley-Fill Single Stage PFC (SVF S2PFC) circuit operating in  
discontinuous conduction mode (DCM). In DCM the switched current  
from inductor T1 shapes the input current waveform to create a  
quasi-sinusoid when the rectified voltage on C3 is less than the DC  
voltage on C4, this results in a high power factor.  
Primary Flyback Stage  
The bulk capacitor C4 completes the input stage. It filters the line  
ripple voltage and provides energy storage. This component also  
filters differential current, further reducing conducted EMI. The input  
stage provides a DC voltage to the flyback converter. One end of the  
primary winding of transformer (T2) is connected to the positive  
terminal of the bulk capacitor (C4) while the other is connected to the  
DRAIN pin of the integrated 650 V power MOSFET in the LYTSwitch-6  
IC (U1). A low-cost RCD primary clamp made up of D8, R46, R17 and  
C9 limits the voltage spike developed across the MOSFET that is  
During MOSFET on-time, energy is stored in the PFC inductor (T1)  
and the leakage inductance of the flyback transformer (T2). During  
MOSFET off-time, the energy from both the PFC and flyback inductors  
is transferred to the secondary-side through the flyback transformer  
T2. Diode D16 isolates the rectified AC input on C3 from C4 and  
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Rev. E 06/18  
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LYTSwitch-6  
provides current path for the charging of the bulk capacitor C4 −  
especially at low-line, which improves efficiency. Free-wheel diodes  
D1 and D17 provide a current path for the energy stored in the PFC  
inductor that must be transferred to the secondary-side during  
MOSFET off-time. The series connection of D1 and D17 are able to  
withstand the resonant voltage ring from the PFC inductor when the  
MOSFET turns off.  
2. Efficiency assumptions depend on power level. Smallest device-  
power levels assume efficiency >84% increasing to >89% for the  
largest device.  
3. Transformer primary inductance tolerance is ±10%.  
4. Reflected output voltage (VOR) is set to maintain KP = 0.8 at  
minimum input voltage for universal line, and KP = 1 for high  
input line (only) designs.  
5. Maximum conduction loss for adapters is limited to 0.6 W and to  
During a no-load or light load condition (<10% load) the energy  
stored in the PFC inductor is greater than required by the secondary  
load. The excess energy from the PFC inductor is therefore recycled  
to the bulk capacitor C4 boosting the voltage level. A Zener-resistor  
clamp comprising of VR1 and VR2 in series with R47 is connected  
across the bulk capacitor C4 to clamp this voltage below the  
voltage-rating of C4. This Zener clamp voltage should be ≤450 V  
(the maximum voltage rating of bulk capacitor C4). In the event of  
an input line surge or transient event, the primary switching MOSFET  
is protected from overvoltage by the INPUT VOLTAGE pin sense  
resistors which trigger a line overvoltage shutdown at 460 V.  
0.8 W for open frame designs.  
6. Increased current limit is selected for peak and open-frame power  
columns, while standard current limit is used for adapter columns.  
7. The part is board-mounted with SOURCE pins soldered to a  
sufficient area of copper and/or a heat sink to keep the SOURCE-  
pin temperature ≤110 °C.  
8. Ambient temperature limit is 50 °C for open frame designs and  
40 °C for sealed adapters.  
9. Below a value of 1, KP is the ratio of ripple to peak primary  
current. To prevent reduced power delivery, due to premature  
termination of switching cycles, a transient KP limit of ≥0.6 is  
specified. This prevents the initial current limit (IINT) from being  
exceeded at MOSFET turn-on.  
10.LYTSwitch-6 parts are unique in that the designer can set the  
switching frequency between 25 kHz to 95 kHz by adjusting  
transformer design. One way to lower device temperature is to  
design the transformer to reduce switching frequency; a good  
starting point is 50 kHz.  
Secondary Stage  
The secondary-side control of the LYTSwitch-6 IC provides constant  
output voltage and constant output current. The voltage produced  
on the secondary winding of transformer T2 is rectified by D10 and  
filtered by the output capacitors C16 and C18. Adding an RC snubber  
(R48 and C14) across the output diode reduces voltage stress. In this  
design, the SYNCHRONOUS RECTIFIER DRIVE pin is connected to  
the SECONDARY GROUND pin to allow the use of a low-cost ultrafast  
output diode instead of an SR FET.  
Primary-Side Overvoltage Protection  
Primary-side output overvoltage protection provided by the  
LYTSwitch-6 IC uses an internal latch that is triggered by a threshold  
current of ISD into the PRIMARY BYPASS pin. For the bypass capacitor  
to be effective as a high frequency filter, the capacitor should be  
located as close as possible to the SOURCE and PRIMARY BYPASS  
pins of the device.  
The IC secondary is self-powered from either the secondary winding  
forward voltage via the FORWARD pin, or the output voltage via the  
OUTPUT VOLTAGE pin. Decoupling capacitor C13 is connected to the  
SECONDARY BYPASS pin. In order to meet the maximum voltage  
limits of OUTPUT VOLTAGE pin in this design, the secondary-side of  
the IC needs to be powered from a low voltage auxiliary supply  
(winding FL3 and FL4). The FORWARD pin has to be connected to  
the same output to insure good regulation and high efficiency. This  
auxiliary supply is rectified and filtered by D11 and C15 respectively.  
The primary sensed OVP function can be realized by connecting a  
series combination of a Zener diode, a resistor and a blocking diode  
from the rectified and filtered bias-winding-voltage supply to the  
PRIMARY BYPASS pin (see Figure 11-a). The rectified and filtered bias  
winding output voltage may be higher than anticipated (up to  
2 times the desired value) and is dependent on the coupling of the  
bias winding to the output winding and the resultant ringing of the  
bias winding voltage waveform. It is recommended that the rectified  
bias winding voltage be measured. Ideally this measurement should  
be made at the lowest input voltage and with maximum load applied  
the output. This measured voltage should be used to select the  
components required to achieve primary sensed OVP. It is  
During constant voltage operation, output voltage regulation is  
achieved by sensing the output voltage via a resistor network  
comprising R29 and R30. The voltage across R30 is monitored at  
the FEEDBACK pin and compared to an internal reference voltage  
threshold of 1.265 V. Bypass capacitor C19 is placed across the  
FEEDBACK and SECONDARY GROUND pins to attenuate high  
frequency noise that would otherwise couple to the feedback signal  
and cause unwanted behavior such as pulse bunching.  
recommended that a Zener diode is selected with a clamping voltage  
approximately 6 V lower than the rectified bias winding voltage at  
which OVP is expected to be triggered. A forward voltage drop of 1 V  
can be assumed for the blocking diode. A small-signal standard  
recovery diode is recommended for this task. The blocking diode  
prevents any reverse current from charging the bias capacitor during  
start-up. Finally, the value of the series resistor required can be  
calculated such that a current higher than ISD will flow into the  
PRIMARY BYPASS pin during an output overvoltage event.  
During constant current operation, the maximum output current is set  
by the sense resistors R43 and R24. The voltage across the sense  
resistor is applied to the ISENSE pin internal reference threshold  
of 35 mV to maintain constant current regulation. Diode D13 in  
parallel with the current sense resistors clamps the voltage across the  
ISENSE and SECONDARY GROUND pin. This shunts the high current  
surge from the output capacitor seen during an output short-circuit  
and prevents damage.  
Key Applications Design Considerations  
Secondary-Side Overvoltage Protection  
Output Power Table  
Secondary-side output overvoltage protection is provided by the  
LYTSwitch-6 IC which uses an internal auto-restart circuit triggered  
by an input current into the SECONDARY BYPASS pin exceeding a  
threshold of IBPS(SD). The direct sensed output OVP function can  
be realized by connecting a Zener diode from the output to the  
SECONDARY BYPASS pin. The Zener diode voltage needs to be the  
absolute value of (1.25 x VOUT) – (4.4 V − SECONDARY BYPASS pin  
The output power table (Table 1) represents the maximum  
continuous output power level that can be obtained under the  
following conditions:  
1. Minimum DC input voltage is ≥90 V for 85 VAC input and ≥220 V  
for 230 VAC input (or 115 VAC with a voltage doubler). The  
voltage rating of the input capacitor should be set to meet these  
criteria.  
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LYTSwitch-6  
ꢆeꢈeꢉ  
ꢊꢇꢀ  
ꢀꢁꢂꢃLꢄ  
ꢔꢁꢕꢖ  
ꢔ  
ꢂꢃT  
Rꢆ  
ꢔꢁꢕꢖ  
ꢈꢆ  
ꢆ  
ꢕ  
ꢆꢇS  
ꢁꢗ  
Rꢙ  
S
LYTSwitch-6  
ꢚRꢙ  
ꢔ  
Rꢔꢀ  
LYTSwitch-6  
ꢀꢇꢈꢉꢊꢇꢋ ꢌEꢍ  
ꢊꢎꢏ ꢐꢑꢎꢒꢇꢑꢓꢓeꢇ  
ꢋeꢌꢍꢈꢎꢏꢉꢐ  
ꢑꢍꢈꢒꢉꢍꢓ ꢁꢑ  
ꢂꢆꢆ  
ꢀS  
ꢀꢁꢂ8ꢃꢄꢅꢂ011ꢆ18  
ꢄTꢅ  
ꢀꢁꢂ8ꢃ80ꢂ01ꢄꢅ18  
a. Primary-side OVP with High Current Pushed into BPP via Zener VZ.  
b. Secondary-side OVP with High Current Pushed into BPS via Zener VZ and  
Resistor RZ.  
Figure 11. Output Overvoltage Protection Circuits.  
ꢠ  
RꢓꢔꢕꢖꢀꢀERꢗ  
ꢁꢂT  
ꢃꢀꢄꢂLꢅ  
ꢀꢘ  
Rꢀꢘ  
ꢓꢔ  
Rꢆꢒ  
ꢆꢒ  
Rꢆ  
ꢆR  
ꢙꢖꢚ  
RꢆR  
ꢆꢒ  
Rꢑꢆ1  
RꢓꢔꢕꢑꢙꢛERꢗ  
ꢆR ꢓEꢚ  
ꢔꢁꢝꢆ  
ꢔꢁꢝꢆ  
ꢔꢀꢆ  
Rꢓꢛꢜ  
ꢎꢄ  
Rꢑꢆ  
S
LYTSwitch-6  
ꢀꢌꢞꢟꢋꢌꢍ ꢓEꢚ  
ꢋꢉꢊ ꢎꢈꢉꢏꢌꢈꢐꢐeꢌ  
ꢀꢁꢂT  
Rꢁꢆ  
ꢄꢌꢌ  
ꢋS  
ꢆeꢇꢈꢉꢊꢋꢌꢍ  
ꢎꢈꢉꢏꢌꢈꢐ ꢁꢎ  
Rꢔꢀ  
ꢔꢀꢀ  
ꢆ-ꢇ  
ꢈTꢉ  
ꢀꢁꢂ8ꢃ81ꢂ01ꢄꢅ18  
Figure 12. Typical Schematic of LYTSwitch-6 Flyback Power Supply (DC-DC Stage)  
voltage). It is necessary to add a low value resistor, in series with the  
OVP Zener diode to limit the maximum current into the SECONDARY  
BYPASS pin (see Figure 11-b.  
Selecting Critical External Components  
The schematic in Figure 12 shows the essential external components  
required for a working single output LYTSwitch-6 based power supply.  
The selection criteria for these components is as follows:  
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LYTSwitch-6  
To ensure minimum no-load input power and high full load efficiency,  
resistor RBP (Figure 12) should be selected such that the current  
through this resistor is higher than the PRIMARY BYPASS pin supply  
current.  
Primary-Side Components  
PRIMARY BYPASS Pin Capacitor (CBPP  
)
This capacitor works as the supply decoupling capacitor for the  
internal primary-side controller and also determines current limit for  
the internal MOSFET. 4.7 mF or 0.47 mF capacitance will select  
INCREASED or STANDARD current limits respectively. Though  
electrolytic capacitors can be used, often surface mount multi-layer  
ceramic capacitors are preferred for use on double-sided boards as  
they allow the capacitors to be placed close to the IC. A surface  
mount multi-layer ceramic X7R capacitor rated for 25 V is therefore  
recommended.  
The PRIMARY BYPASS pin supply can be calculated as shown below;  
fSW  
132 K  
b
l
^
h
ISSW  
=
# IS2 - IS1 + IS1  
Where;  
ISSW: PRIMARY BYPASS pin supply current at operating switching  
frequency  
fSW: Operating switching frequency (kHz)  
IS1: Non-switching PRIMARY BYPASS pin supply current (refer to  
data sheet specification tables)  
IS2: PRIMARY BYPASS pin supply current at 132 kHz (refer to  
data specification sheet)  
Line Overvoltage / Brown-In Sense Resistor (RLS)  
Both line overvoltage and brown-in voltage are sensed by the INPUT  
VOLTAGE pin. The current from the DC input bus is monitored via  
resistor RLS and compared to an internal current threshold.  
Typical value range for RLS is in the range of 3.8 Mto 4 M. RLS is  
The PRIMARY BYPASS pin voltage will be ~5.3 V if the bias current is  
higher than PRIMARY BYPASS pin supply current. A PRIMARY  
BYPASS pin voltage of ~5.0 V, indicates that the current through  
RBP is less than the PRIMARY BYPASS pin supply current and the IC is  
drawing current from the DRAIN pin. Ensure that the voltage on the  
PRIMARY BYPASS pin never falls below 5.3 V − except during start-up.  
approximately equal to VLOV × 1.414 / IOV-  
LOV is the input line voltage at which the power supply will stop  
switching because the overvoltage threshold (IOV-) is exceeded.  
Switching will be re-enabled when line overvoltage hysteresis (IOV(H)  
is reached. Line OV (VLOV) is approximately equal to IOV- × RLS / 1.414.  
.
V
)
The power supply will turn on once the brown-in threshold (IUV+) is  
To determine maximum value of RBP;  
exceeded. Brown-in voltage is approximately equal to IUV+ x RLS  
/
1.414.  
6
@
RBP = VBIAS  
h - VBPP /ISSW;  
^
NO-LOAD  
External Bias Supply Components (DBIAS, CBIAS, RBP)  
The LYTSwitch-6 IC has an internal bypass regulator from the  
where VBPP = 5.3 V.  
DRAIN pin of the primary-side MOSFET to the PRIMARY BYPASS pin.  
This internal regulator is active during the MOSFET off-time and  
keeps the PRIMARY BYPASS pin voltage from dropping below 5 V.  
This ensures that the IC will operate normally especially during  
start-up time. During start-up, the IC is powered from the internal  
regulator. When the output voltage has risen sufficiently, the primary  
controller will draw power from the external bias supply via the  
auxiliary winding rather than from the internal tap. This will reduce  
energy consumption as the auxiliary supply is at much lower voltage  
than the tap (which is driven by the high-voltage of the DRAIN pin).  
If the coupling between the bias winding and secondary winding is  
poor, the bias supply voltage may can drop significantly during  
no-load operation and may not be able to supply current to the  
PRIMARY BYPASS pin and keep the internal regulator off. If this  
condition causes the internal tap to turn on, no-load power  
Clamp Network Across Primary Winding  
(DSN, RS, RSN, and CSN  
)
Figure 13, shows the low cost R2CD clamp which is used in most low  
power circuits. For higher power designs, a Zener clamp or an R2CD  
plus Zener clamp can be used to achieve better efficiency. It is  
advisable to limit the peak Drain voltage to 90% of BVDSS under worst-  
case conditions (maximum input voltage, maximum overload power or  
output short-circuit). The clamp diode, DSN shown in Figure 13 must  
be either a standard recovery glass passivated diode or a fast  
recovery type with a reverse recovery time of less than 500 ns. Use  
of standard recovery glass passivated diodes allows the recovery of  
some of the clamp energy from each cycle and improves average  
efficiency. The diode momentarily conducts each time the primary  
switching MOSFET inside the LYTSwitch-6 IC turns off and energy  
consumption will increase. It is therefore recommended that the bias  
voltage be set close to the maximum of 12 V. Higher voltage may  
also increase no-load power consumption. For the bias supply, there  
is a trade-off between using a standard-recovery diode and a fast  
signal diode for the bias winding rectifier diode, DBIAS. The standard  
recovery diode will tend to give lower radiated EMI while the fast  
diode will reduce no-load power consumption. Since LYTSwitch-6 ICs  
inherently use very little power, it is recommended that the standard  
recovery diode is used for the bias supply, trading a small increase in  
power dissipation for improved EMI performance.  
from the leakage reactance is transferred to the clamp capacitor CSN  
Resistor RS, which is in the series path, acts as a damper preventing  
excessive ringing due to resonance between the leakage reactance  
.
and the clamp capacitor CSN. Resistor RS dissipates the energy stored  
in capacitor CSN. Designs employing different sized LYTSwitch-6  
devices will have different peak primary currents and leakage  
inductances and will therefore result in different amounts of leakage  
energy. Capacitor CSN, RSN and RS must therefore be optimized for  
each design. As a general rule the value of capacitor CSN should be  
minimized and the value of resistors RSN and RS maximized, while still  
meeting the 90% derating of the BVDSS limit. RS should be  
sufficiently large to damp the ring, but small enough to prevent the  
drain voltage from rising too far. A ceramic capacitor that uses a  
dielectric such as Z5U if used as the CSN capacitor in the clamp circuit  
may generate audible noise, so the use of a polyester film type  
capacitor is preferred.  
A 22 mF 50 V low ESR aluminum electrolytic capacitor is recommended  
for the bias supply filter, CBIAS. A low ESR electrolytic capacitor  
reduces no-load power consumption. Use of a ceramic surface mount  
capacitor is not recommended as this may cause audible noise due to  
piezoelectric excitation of the ceramic capacitors mechanical  
structure.  
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LYTSwitch-6  
Common Primary Clamp Configurations  
R2CD  
Zener  
R2CD + Zener  
Rꢆꢇ  
ꢆꢇ  
Rꢁꢂ  
ꢀRꢁꢂꢃꢄꢅ  
ꢀRꢁꢂꢃꢄꢅ  
ꢁꢂ  
ꢁꢂꢃꢄꢅ  
ꢁꢂꢃꢄꢅ  
Rꢃ  
ꢀꢅꢆꢇꢈ  
Rꢆ  
Rꢆ  
ꢈꢉꢊ8ꢋ8ꢌꢊ011ꢌ18  
ꢅꢈꢉ8ꢊ8ꢋꢉ011ꢌ18  
ꢅꢉꢊ8ꢋ8ꢌꢊ011ꢍ18  
Figure 13. Recommended Primary Clamp Components.  
Primary Clamp Circuit  
Benefits  
R2CD  
Zener  
R2CD + Zener  
Component Cost  
Low  
High  
Low  
High  
Medium  
Low  
High  
No-Load Input Power  
Light-Load Efficiency  
EMI Suppression  
Medium  
Medium  
Medium  
High  
Low  
Table 2.  
Benefits of Primary Clamp Circuits.  
not be used. Care must be taken to ensure that the voltage at the  
FORWARD pin never exceeds its absolute maximum voltage rating.  
If the FORWARD pin voltage exceeds the FORWARD pin absolute  
maximum voltage, the IC will be damaged.  
Secondary-Side Components Driving LYTSwitch-6  
SECONDARY BYPASS Pin Capacitor (CBPS  
)
This capacitor works as a voltage supply decoupling capacitor for the  
integrated secondary-side controller. A surface mount, 2.2 mF, 25 V,  
multi-layer ceramic capacitor is recommended for this application.  
The SECONDARY BYPASS pin voltage needs to reach 4.4 V before the  
output voltage reaches its target voltage. A significantly higher value  
of SECONDARY BYPASS pin capacitor may prevent this from occurring  
and induce an output voltage overshoot during start-up. Values lower  
than 1.5 mF may not be provide sufficient energy storage, leading to  
unpredictable device operation. The capacitor must be located  
adjacent to the IC pins. The capacitance of ceramic capacitors drops  
with applied voltage and the 25 V rating is therefore necessary to  
guarantee sufficient minimum capacitance during operation. For this  
reason capacitors rated for 10 V are not recommended. Capacitors  
with X5R or X7R dielectrics provide the best results.  
FEEDBACK Pin Divider Network (RFB(UPPER), RFB(LOWER)  
)
A suitable resistive voltage divider should be connected from the  
output of the power supply to the FEEDBACK pin of the LYTSwitch-6  
IC and sized such that at the desired output voltage, the FEEDBACK  
pin will be at 1.265 V. A decoupling capacitor (CFB) of 330 pF is  
recommended and should be connected from the FEEDBACK pin to  
SECONDARY GROUND pin. CFB acts as a decoupling capacitor for the  
FEEDBACK pin to prevent switching noise from affecting IC operation.  
SR MOSFET Operation and Selection  
Although a simple diode rectifier and snubber is effective, the use  
of a SR FET significantly improves efficiency. The secondary-side  
controller turns the SR FET on at the beginning of the flyback cycle.  
The gate of the SR FET should be tied directly to the SYNCHRONOUS  
RECTIFIER DRIVE pin of the LYTSwitch-6 IC (no additional resistors  
should be connected to the gate drive of the SR FET). The SR FET is  
turned off when its VDS reaches 0 V. The SR FET driver uses the  
SECONDARY BYPASS pin as its supply rail; this voltage is typically 4.4 V.  
A FET with a high gate threshold voltage is not therefore appropriate  
for this application; FETs with a threshold voltage of 1.5 − 2.5 V are  
ideal. MOSFETs with a threshold voltage as high as 4 V may also be  
used provided that the data sheet specifies RDS(ON) across temperature  
for a gate voltage of 4.5 V.  
FORWARD Pin Resistor (RFWD  
)
The FORWARD pin is connected to the drain terminal of the  
synchronous rectifier MOSFET (SR FET). This pin is used to monitor  
the Drain voltage of the SR FET to precisely control turn-on and  
turn-off of the device. This pin is also used to charge the SECONDARY  
BYPASS pin capacitor whenever the output voltage falls below the  
SECONDARY BYPASS pin voltage. The use of a 47 , 5% resistor is  
recommended to ensure sufficient IC supply current and works well  
across a wide range of output voltages. A different resistor value will  
interfere with the timing of the synchronous rectifier drive and should  
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LYTSwitch-6  
There is a short delay between the start of the flyback cycle and the  
turn-on of the SR FET. During this time, the body diode of the  
SR FET will conduct. If an external Schottky diode is connected in  
parallel, current flows mostly through the Schottky diode. A parallel  
Schottky diode will therefore increase efficiency. A 1 A surface-  
mount Schottky diode is usually adequate for this task; however the  
gains are modest, for a 5 V, 2 A design the external diode adds  
~0.1% to full load efficiency at 85 VAC and ~0.2% at 230 VAC.  
PCB Layout Recommendations  
Single-Point Grounding  
Use a single-point ground connection from the input filter capacitor to  
the area of copper connected to the SOURCE pin. See Figure 14.  
Bypass Capacitors  
The PRIMARY BYPASS (CBPP) pin, SECONDARY BYPASS (CBPS) pin and  
feedback decoupling capacitors must be located adjacent to and  
between those pins and their respective returns with short traces.  
The voltage rating of the Schottky diode and the SR FET should be at  
least 1.3 times the expected peak inverse voltage (PIV) calculated  
from the turns ratio of the transformer.  
PRIMARY BYPASS pin - SOURCE pin.  
SECONDARY BYPASS pin - SECONDARY GROUND pin.  
FEEDBACK pin - SECONDARY GROUND pin.  
The interaction between the leakage reactance of the output winding(s)  
and the output capacitance (COSS) of the SR FET leads to voltage  
ringing at the instance of winding voltage reversal when the primary  
MOSFET turns on. This ringing can be suppressed using a RC  
snubber connected across the SR FET. A snubber resistor in the  
range of 10 to 47 should be used (higher resistance values lead  
to a noticeable drop in efficiency). A capacitor value of 1 nF to 2.2 nF  
is adequate for most designs.  
Signal Components  
Resistors RLS, RBP, RFB(UPPER), RFB(LOWER) and RIS which provide feedback  
information must be placed as close as possible to the IC pin with  
short traces.  
Critical Loop Area  
Loops for circuits with high dv/dt or di/dt should be kept as small as  
possible. The area of the primary loop − input filter capacitor to  
transformer primary winding to IC should be kept small. Ideally, no  
loop should be inside another loop (see Figure 14). This will minimize  
cross-talk between circuits.  
Output Filter Capacitance (COUT  
)
Aluminium electrolytic capacitors with low ESR and high RMS ripple  
current rating are suitable for use with most high frequency flyback  
switching power supplies intended for ballast applications. Typically,  
300 mF to 400 mF capacitance per ampere of output current is  
appropriate. This value may be adjusted to reflect the amount of  
output current ripple required. Ensure that capacitors with a voltage  
rating higher than the highest output voltage (plus sufficient margin)  
are used.  
Primary Clamp Circuit  
A clamp is used to limit the peak voltage on the DRAIN pin at  
turn-off. This can be achieved by placing an RCD or Zener diode  
clamp across the primary winding. Positioning the the clamp  
components close to the transformer and IC will minimize the size of  
this loop and reduce EMI.  
Output Current Sense Resistor (RIS)  
Y Capacitor  
For output constant current (CC) operation, external current sense  
resistor RIS should be connected between the ISENSE pin and the  
SECONDARY GROUND pin of the IC as shown in Figure 14. If  
constant current (CC) regulation is not required, this pin should be  
connected to the SECONDARY GROUND pin of the IC.  
The Y capacitor should be connected directly between the positive  
terminal of the primary input filter capacitor and the output positive  
or return of the transformer main secondary winding. This will route  
high magnitude common mode surge currents away from the IC. If  
an input π filter (C1, LF and C2) is used, the filter inductor should be  
placed between the negative terminals of the filter capacitors.  
The voltage generated across the resistor is compared to an internal  
reference the Current Limit Voltage Threshold (ISV(TH)) which is  
approximately 35 mV. The size of RIS can be calculated ;  
Output Rectifier Diode  
For best performance, the area of the loop connecting the secondary  
winding, the output rectifier diode, and the output filter capacitor  
should be minimized. Sufficient copper area should be provided at  
the terminals of the rectifier diode for heat sinking.  
RIS = ISV h/I  
^
^
h
TH  
OUT CC  
The RIS resistor must be placed close to the ISENSE and SECONDARY  
GROUND pins with short traces. This prevents ground impedance  
noise interference that may cause instability which would be most  
apparent during constant current operation.  
ESD Immunity  
Sufficient clearance should be maintained (>8 mm) between the  
primary-side and secondary-side circuits to enable easy compliance  
with any ESD or hi-pot test requirements. A spark gap is best placed  
between the output return (and/or positive terminals) and one of the  
AC inputs after the fuse. In this configuration a 6.4 mm (5.5 mm may  
be acceptable in some applications) spark gap is suitable to meet  
creepage and clearance requirements of the applicable safety  
standards. This is less than the typical primary to secondary spacing  
because the voltage across a spark gap does not exceed the peak of  
the AC input.  
Output Post Filter Components (LPF, CPF)  
If necessary a post filter (LPF and CPF) can be added to attenuate high  
frequency switching noise and ripple. Inductor LPF should be in the  
range of 1 mH – 3.3 mH with a current rating greater than peak  
output current. Capacitor CPF should be in the range of 100 mF to  
330 mF with a voltage rating ≥ 1.25 × VOUT. If a post filter is used  
then the output voltage sense resistor should be connected before  
the post filter inductor.  
Drain Node  
The drain switching node is the dominant noise generator. As such  
components connected the drain node should be placed close to  
the IC and away from sensitive feedback circuits. The clamp circuit  
components should be located away from the PRIMARY BYPASS pin, and  
employ minimum trace width and length.  
14  
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LYTSwitch-6  
PCB Layout Example  
ꢫꢃꢄꢂꢃꢄ ꢒꢘꢘꢂ ꢑꢘꢇꢜeꢏ ꢟꢛ  
ꢔꢫꢧꢥ ꢔꢗꢪ//ꢔ1ꢬꢊ ꢙeꢁꢙe  
ꢇeꢙꢆꢙꢄꢘꢇꢙ Rꢖꢡ//Rꢡꢗ ꢎꢁꢏ  
ꢕꢤꢥꢦꢚꢆꢄꢅꢝꢓ6 ꢀꢦꢓꢭꢢꢨ ꢂꢆꢁ  
ꢏꢘeꢙ ꢁꢘꢄ ꢙꢝꢎꢇe ꢞꢇꢘꢃꢁꢏ ꢂꢎꢄꢝ  
ꢚꢆꢄꢝ ꢙeꢅꢘꢁꢏꢎꢇꢛ ꢒꢘꢘꢂ ꢈꢡꢍ.  
ꢀꢁꢂꢃꢄ ꢅꢆꢇꢅꢃꢆꢄ ꢈꢉ1ꢊ Rꢋ1ꢊ ꢌR1ꢍ  
ꢎꢁꢏ Eꢐꢀ ꢑꢆꢒꢄeꢇꢓ ꢔ1ꢊ ꢕꢖꢊ ꢔꢖꢊ  
ꢎꢁꢏ ꢕꢗ ꢎꢇe ꢂꢘꢙꢆꢄꢆꢘꢁeꢏ ꢎꢚꢎꢛ  
ꢑꢇꢘꢜ ꢎꢁꢛ ꢙꢚꢆꢄꢅꢝꢆꢁꢞ ꢁꢘꢏeꢙ  
ꢚꢆꢄꢝ ꢝꢆꢞꢝ ꢏꢆ/ꢏꢄ ꢘꢇ ꢏv/ꢏꢄ.  
ꢉꢒꢛꢟꢎꢅꢠ ꢂꢇꢆꢜꢎꢇꢛ ꢒꢘꢘꢂ  
ꢉeeꢏꢟꢎꢅꢠ ꢅꢘꢜꢂꢘꢁeꢁꢄꢙ  
Rꢖꢩꢊ Rꢗ0ꢊ ꢔ1ꢩ ꢎꢁꢏ ꢭꢢꢨ ꢂꢆꢁ  
ꢙꢝꢎꢇe ꢘꢁe ꢞꢇꢘꢃꢁꢏ ꢂꢎꢄꢝ ꢄꢝꢎꢄ  
ꢆꢙ ꢙꢄꢎꢇꢓꢅꢘꢁꢁeꢅꢄeꢏ ꢄꢘ ꢙeꢁꢙe  
ꢇeꢙꢆꢙꢄꢘꢇ Rꢖꢡ//Rꢡꢗ.  
ꢣꢇꢆꢜꢎꢇꢛ ꢅꢒꢎꢜꢂ ꢒꢘꢘꢂ  
ꢎꢇeꢎ ꢑꢘꢇꢜeꢏ ꢟꢛ ꢨ8ꢊ  
Rꢡ6ꢊ ꢔꢩ//R1ꢪ ꢎꢁꢏ ꢢꢣ  
ꢆꢙ ꢄꢆꢞꢝꢄ ꢎꢁꢏ ꢙꢜꢎꢒꢒ.  
ꢑꢘꢇꢜeꢏ ꢟꢛ ꢟꢃꢒꢠ ꢅꢎꢂꢎꢅꢆꢄꢘꢇ ꢔꢡꢊ  
ꢂꢇꢆꢜꢎꢇꢛꢓꢚꢆꢁꢏꢆꢁꢞ ꢢꢣ ꢎꢁꢏ  
ꢕꢤꢥꢦꢚꢆꢄꢅꢝꢓ6 ꢧꢡ ꢨꢓꢦ ꢂꢆꢁ ꢆꢙ  
ꢄꢆꢞꢝꢄ ꢎꢁꢏ ꢙꢜꢎꢒꢒ.  
ꢣꢉꢔ ꢒꢘꢘꢂ ꢑꢘꢇꢜeꢏ ꢟꢛ  
ꢑꢆꢒꢄeꢇ ꢔꢗꢊ ꢑꢇeeꢓꢚꢝeeꢒ ꢏꢆꢘꢏe  
ꢨ1ꢰꢨ1ꢪꢊ ꢥ1ꢊ ꢂꢇꢆꢜꢎꢇꢛ ꢚꢆꢁꢏꢆꢁꢞ ꢚꢆꢁꢏꢆꢁꢞ ꢢꢌꢊ ꢨꢪ ꢎꢁꢏ  
ꢢꢣ ꢎꢁꢏ ꢟꢃꢒꢠ ꢅꢎꢂꢎꢅꢆꢄꢘꢇ ꢔꢡ ꢆꢙ  
ꢄꢆꢞꢝꢄ ꢎꢁꢏ ꢙꢜꢎꢒꢒ.  
ꢌꢆꢎꢙ ꢙꢃꢂꢂꢒꢛ ꢒꢘꢘꢂ  
ꢑꢘꢇꢜeꢏ ꢟꢛ ꢎꢃꢯꢆꢒꢆꢎꢇꢛ  
ꢣꢇꢆꢜꢎꢇꢛ ꢙꢆꢞꢁꢎꢒ  
ꢅꢘꢜꢂꢘꢁeꢁꢄꢙ ꢔ11ꢊ R18ꢊ  
Rꢡꢬ ꢎꢁꢏ Rꢡ ꢎꢇe ꢂꢒꢎꢅeꢏ  
ꢎꢙ ꢅꢒꢘꢙe ꢎꢙ ꢂꢘꢙꢙꢆꢟꢒe ꢄꢘ ꢀꢔ  
ꢂꢆꢁ ꢄꢘ ꢚꢝꢆꢅꢝ ꢄꢝeꢛ ꢎꢇe  
ꢅꢘꢁꢁeꢅꢄeꢏ ꢄꢘ ꢚꢆꢄꢝ  
ꢙꢝꢘꢇꢄ ꢄꢇꢎꢅeꢙ.  
ꢦeꢅꢘꢁꢏꢎꢇꢛ ꢙꢆꢞꢁꢎꢒ  
ꢅꢘꢜꢂꢘꢁeꢁꢄꢙ ꢎꢇe ꢂꢒꢎꢅeꢏ  
ꢎꢙ ꢅꢒꢘꢙe ꢎꢙ ꢂꢘꢙꢙꢆꢟꢒe ꢄꢘ  
ꢀꢔ ꢂꢆꢁ ꢄꢘ ꢚꢝꢆꢅꢝ ꢄꢝeꢛ ꢎꢇe  
ꢅꢘꢁꢁeꢅꢄeꢏ ꢚꢆꢄꢝ ꢙꢝꢘꢇꢄ  
ꢄꢇꢎꢅeꢙ. ꢮꢃꢯꢆꢒꢆꢎꢇꢛ ꢚꢆꢁꢏꢆꢁꢞ  
ꢉꢕꢗꢓꢉꢕꢡꢊ ꢨ11 ꢎꢁꢏ ꢔꢗ8  
ꢆꢙ ꢄꢆꢞꢝꢄ ꢎꢁꢏ ꢙꢜꢎꢒꢒ.  
ꢦeꢅꢘꢁꢏꢎꢇꢛ ꢒꢘꢘꢂ  
ꢑꢘꢇꢜeꢏ ꢟꢛ  
ꢙeꢅꢘꢁꢏꢎꢇꢛ ꢚꢆꢁꢏꢆꢁꢞ  
ꢉꢕ1ꢓꢉꢕꢖꢊ ꢔꢫꢧꢥ  
ꢔ1ꢬ//ꢔꢗꢪ ꢎꢁꢏ  
ꢇeꢅꢄꢆꢑꢆeꢇ ꢨ10 ꢆꢙ ꢄꢆꢞꢝꢄ  
ꢎꢁꢏ ꢙꢜꢎꢒꢒ.  
ꢔ10 ꢆꢙ ꢄꢆꢞꢝꢄ ꢎꢁꢏ ꢙꢜꢎꢒꢒ.  
ꢕꢘTꢏꢘT  
ꢏꢂꢀ  
ꢆꢇꢈꢉctꢊꢅ  
ꢆꢇꢈꢉctꢊꢅ  
ꢂiꢃtꢄꢅ  
ꢀꢁꢀ  
ꢂiꢃtꢄꢅ  
ꢂꢃꢐꢑꢍcꢌ  
Tꢅꢍꢇꢒꢓꢊꢅꢔꢄꢅ  
ꢕꢉtꢎꢉt  
ꢀꢍꢎꢍcitꢊꢅ  
ꢋꢉꢃꢌ  
ꢀꢍꢎꢍcitꢊꢅ  
ꢁꢕꢙ  
ꢖꢀ ꢆꢗꢏꢘT  
ꢔꢘꢂꢂeꢇ ꢝeꢎꢄ ꢙꢆꢁꢠ ꢑꢘꢇ  
ꢦꢫꢧRꢔE ꢂꢆꢁ ꢆꢙ ꢜꢎꢯꢆꢜꢆꢱeꢏ.  
ꢤ ꢅꢎꢂꢎꢅꢆꢄꢘꢇ ꢅꢘꢁꢁeꢅꢄeꢏ  
ꢄꢘ Rꢥꢢ ꢎꢁꢏ ꢔꢡ ꢈꢓꢍ.  
Sꢎꢄciꢍꢃ ꢗꢊtꢄꢒ  
ꢲ ꢮꢒꢒ ꢒꢘꢘꢂꢙ ꢎꢇe ꢙeꢂꢎꢇꢎꢄeꢏꢳ ꢁꢘ ꢒꢘꢘꢂ ꢆꢙ ꢆꢁꢙꢆꢏe ꢎ ꢒꢘꢘꢂ. ꢥꢝꢆꢙ ꢚꢆꢒꢒ ꢎvꢘꢆꢏ ꢞꢇꢘꢃꢁꢏ ꢆꢜꢂeꢏꢎꢁꢅe ꢁꢘꢆꢙe ꢅꢘꢃꢂꢒꢆꢁꢞ.  
ꢲ ꢐꢎꢆꢁꢄꢎꢆꢁ ꢄꢇꢎꢅe ꢙꢃꢇꢑꢎꢅe ꢎꢇeꢎ ꢎꢁꢏ ꢒeꢁꢞꢄꢝ ꢘꢑ ꢝꢆꢞꢝ ꢏv/ꢏꢄ ꢁꢘꢏeꢙ ꢙꢃꢅꢝ ꢎꢙ ꢨRꢮꢀꢢꢊ ꢎꢙ ꢙꢜꢎꢒꢒ ꢎꢁꢏ ꢙꢝꢘꢇꢄ ꢎꢙ ꢂꢘꢙꢙꢆꢟꢒe ꢄꢘ ꢜꢆꢁꢆꢜꢆꢱeꢏ Rꢉꢀ ꢞeꢁeꢇꢎꢄꢆꢘꢁ.  
ꢲ ꢢꢘ ꢙꢆꢞꢁꢎꢒ ꢄꢇꢎꢅe ꢈꢴꢃꢆeꢄ ꢄꢇꢎꢅeꢍ ꢙꢃꢅꢝ ꢎꢙ ꢤ ꢅꢎꢂꢎꢅꢆꢄꢘꢇ ꢎꢁꢏ ꢑeeꢏꢟꢎꢅꢠ ꢇeꢄꢃꢇꢁ ꢜꢃꢙꢄ ꢟe ꢇꢘꢃꢄeꢏ ꢁeꢎꢇ ꢘꢇ ꢎꢅꢇꢘꢙꢙ ꢁꢘꢆꢙꢛ ꢁꢘꢏeꢙ ꢈꢝꢆꢞꢝ ꢏv/ꢏꢄ ꢘꢇ ꢏꢆ/ꢏꢄꢍ ꢙꢃꢅꢝ ꢎꢙ ꢨRꢮꢀꢢꢊ  
ꢃꢁꢏeꢇꢁeꢎꢄꢝ ꢄꢇꢎꢁꢙꢑꢘꢇꢜeꢇ ꢟeꢒꢒꢛꢊ ꢙꢚꢆꢄꢅꢝꢆꢁꢞ ꢙꢆꢏe ꢘꢑ ꢎꢁꢛ ꢚꢆꢁꢏꢆꢁꢞ ꢘꢇ ꢘꢃꢄꢂꢃꢄ ꢇeꢅꢄꢆꢑꢆeꢇ ꢏꢆꢘꢏe ꢄꢘ ꢎvꢘꢆꢏ ꢅꢎꢂꢎꢅꢄꢆveꢒꢛ ꢘꢇ ꢜꢎꢞꢁeꢄꢆꢅꢎꢒꢒꢛ ꢅꢘꢃꢂꢒeꢏ ꢁꢘꢆꢙe.  
ꢲ ꢢꢘ ꢙꢆꢞꢁꢎꢒ ꢄꢇꢎꢅe ꢜꢃꢙꢄ ꢙꢝꢎꢇe ꢂꢎꢄꢝ ꢚꢆꢄꢝ ꢄꢇꢎꢅeꢙ ꢝꢎvꢆꢁꢞ ꢎꢁ ꢮꢔ ꢙꢚꢆꢄꢅꢝꢆꢁꢞ ꢅꢃꢇꢇeꢁꢄ ꢙꢃꢅꢝ ꢎꢙ ꢘꢃꢄꢂꢃꢄ ꢅꢎꢂꢎꢅꢆꢄꢘ. ꢘꢁꢁeꢅꢄꢆꢘꢁ ꢜꢃꢙꢄ ꢟe ꢙꢄꢎꢇꢓꢅꢘꢁꢁeꢅꢄeꢏ ꢄꢘ  
ꢅꢎꢂꢎꢅꢆꢄꢘꢇ ꢂꢎꢏ ꢆꢁ ꢘꢇꢏeꢇ ꢄꢘ ꢎvꢘꢆꢏ ꢞꢇꢘꢃꢁꢏ ꢆꢜꢂeꢏꢎꢁꢅe ꢅꢘꢃꢂꢒeꢏ ꢁꢘꢆꢙe.  
ꢣꢀꢓ8ꢬ8ꢬꢓ0ꢖ0ꢩ18  
Figure 14. TOP and BOTTOM Sides – Ideal Layout Example Showing Tight Loop Areas for Circuit with High dv/dt and di/dt, Component Placement.  
15  
Rev. E 06/18  
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LYTSwitch-6  
Recommendations in Reducing No-load Consumption  
The LYTSwitch-6 IC can start in self-powered mode, drawing energy  
from the BYPASS pin capacitor charged through an internal current  
source. Use of a bias winding is used to provide supply current to the  
PRIMARY BYPASS pin once the LYTSwitch-6 IC has started switching.  
An auxiliary (bias) winding from the switching transformer serves this  
purpose. The bias-winding-derived supply to the PRIMARY BYPASS  
pin enables designs with no-load consumption of less than 100 mW.  
Resistor RBP (shown in Figure 12) can be adjusted to achieve lowest  
no-load input power.  
5. Common mode chokes are typically required at the input of a  
power supply to attenuate common mode noise. However, the  
same effect can be achieved by using shield windings on the  
transformer. Shield windings can be used in conjunction with  
common mode filter inductors at the input to reduce conducted  
and radiated EMI.  
6. Adjusting the values of the SR FET RC snubber components  
reduces high frequency radiated and conducted EMI.  
7. A π filter comprising differential inductors and capacitors can be  
used in the input rectifier circuit to reduce low frequency  
differential EMI. A ferrite bead (Figure 14) can be added to  
further improve EMI.  
8. A resistor across a differential inductor reduces the Q factor and  
reduce EMI above 10 MHz; however this may increase the EMI  
below 5 MHz.  
9. A 1 mF ceramic capacitor connected across the output of the  
power supply reduces radiated EMI.  
Other components that that may further reduce no-load consumption  
are;  
1. Low value of primary clamp capacitor, CSN  
2. Schottky or ultrafast diode for bias supply rectifier, DBIAS  
3. Low ESR capacitor for bias supply filter capacitor, CBIAS  
4. Low value SR FET RC snubber capacitor, CSR  
.
.
.
.
10. A slow bias rectifier-diode (250 ns < tRR < 500 ns) reduces  
conducted EMI above 20 MHz and radiated EMI above 30 MHz.  
5. Transformer construction: Tape between primary winding layers,  
and multi-layers of tape between primary and secondary windings  
reduces inter-winding capacitance.  
Thermal Management Considerations  
The SOURCE pin is internally connected to the IC lead frame and  
provides the main heat removal path for the device. The SOURCE pin  
should therefore be connected to a copper area underneath the IC to  
act not only as a single point ground, but also as a heat sink. As this  
area is connected to the quiet source node, this area can be maximized  
for good heat sinking without increasing EMI. Similarly for the output  
SR FET, maximize the PCB area connected to the pins of the SR FET.  
Recommendations for EMI Reduction  
1. Appropriate component placement and small loop areas for the  
primary and secondary power circuits minimizes radiated and  
conducted EMI. Care should be taken to achieve a compact loop  
area. (See Figure 14)  
2. A small capacitor in parallel to the primary-side-clamp diode can  
reduce radiated EMI.  
3. A resistor (2 – 47 ) in series with the bias winding helps  
reduce radiated EMI.  
4. A series connection of a small resistor and ceramic capacitor  
(<22 pf) across the primary (Figure 19) or across the secondary  
winding (<100 pf) reduces conducted and radiated EMI. Larger  
capacitor values may increase no-load consumption.  
Sufficient copper area should be provided on the board to keep the  
IC temperature safely below the absolute maximum limits. It is  
recommended that the copper area provided for the copper plane on  
which the SOURCE pin of the IC is soldered be sufficiently large to  
keep the IC temperature below 90 °C when operating the power  
supply at full rated load and at the lowest rated input AC supply voltage.  
16  
Rev. E 06/18  
www.power.com  
LYTSwitch-6  
Unless a ceramic insulator material is used as a heat sink, care should  
be taken to avoid compromising the isolation barrier. Typically the  
heat spreader is formed by the combination of heat spreader material  
(copper or aluminum) a 0.4 mm mylar pad for reinforced isolation and  
a thermally conductive pad to better transfer heat from the device to  
the heat-spreader. Figure 15 suggests a simple method to attach a  
heat spreader to an InSOP-24D package while maintaining appropriate  
creepage and clearance.  
Heat Spreader  
For enclosed power supplies such as LED ballast that experience  
high ambient conditions, using the PCB alone as a heat sink may not  
be sufficient to keep IC within temperature limits. The addition of a  
metal heat spreader may be required to limit the maximum IC  
temperature.  
ꢗ ꢘ ꢌ.ꢅ ꢍꢍ  
ꢗ ꢙ 6.6 ꢍꢍ  
Thꢀꢅꢊꢄꢈ ꢉꢄꢃ  
ꢗ ꢙ 6.6 ꢍꢍ  
ꢍꢂSꢏꢉ-ꢐꢑꢒ  
ꢓꢀꢄt Siꢂꢔ  
ꢗ ꢙ 6.6 ꢍꢍ  
ꢕꢆꢈꢄꢅ ꢖꢗꢑ ꢊꢊ  
ꢎeꢊꢏ ꢐꢑꢒꢓ  
0.ꢔ ꢍꢍ  
ꢕꢖeꢋꢍꢊꢉ ꢀꢊꢗ  
0.ꢌ ꢍꢍ  
ꢍꢂSꢏꢉ-ꢐꢑꢒ  
ꢇꢈꢉꢊꢋ 0.ꢌ ꢍꢍ  
6.6 ꢍꢍ  
ꢉꢁwꢀꢅ  
ꢋꢌT  
Sꢀcꢁꢂꢃꢄꢅꢆ  
ꢇꢁꢂtꢅꢁꢈ  
ꢉꢅiꢊꢄꢅꢆ  
ꢇꢁꢂtꢅꢁꢈ  
ꢍꢂꢂꢁSwitchꢎ  
ꢍꢂSꢏꢉ-ꢐꢑꢒ  
ꢌ.ꢅ ꢍꢍ  
ꢀꢁꢂ8ꢃꢄꢄꢂ0ꢅ0ꢆ18  
Figure 15. Simplified Diagram of Heat spreader Attachment to an InSOP-24D Package.  
17  
Rev. E 06/18  
www.power.com  
LYTSwitch-6  
package. Cutting a slot in the PCB that runs near-to or underneath  
the InSOP package is not generally recommended as this weakens  
the PCB. For long PCBs, the use of a mechanical support or post in  
the middle of the board or located near to the InSOP package is  
recommended.  
Recommended Position of InSOP-24D Package  
with Respect to Transformer  
The PCB underneath the transformer and InSOP-24D should be rigid.  
If large transformers are used together with a thin PCB (<1.5 mm), it  
is recommended that the transformer be moved away from the InSOP  
ꢀꢁꢂcꢃ  
Slot not  
recommended  
ꢕꢄꢉꢇꢖꢍꢃꢄꢗeꢄ  
ꢏꢇꢀꢌꢎꢋꢑꢓꢔ  
ꢀꢁꢂꢂꢃꢄꢅꢆꢇꢈ  
ꢀꢅꢉꢇꢊꢋꢌꢍꢍ  
ꢀꢁꢂꢂꢃꢄꢅꢆꢇꢈ  
ꢀꢅꢉꢇꢊꢋꢌꢍꢍ  
ꢎꢏꢋ8ꢐꢑꢒꢋ0ꢑ0618  
(23-a)  
(23-b)  
ꢀꢁꢂcꢃ  
ꢀꢁꢂcꢃ  
ꢔꢄꢉꢇꢕꢍꢃꢄꢖeꢄ  
ꢏꢇꢀꢌꢎꢋꢑꢒꢓ  
ꢔꢄꢉꢇꢕꢍꢃꢄꢖeꢄ  
ꢀꢁꢂꢂꢃꢄꢅꢆꢇꢈ  
ꢀꢅꢉꢇꢊꢋꢌꢍꢍ  
ꢀꢁꢂꢂꢃꢄꢅꢆꢇꢈ  
ꢀꢅꢉꢇꢊꢋꢌꢍꢍ  
ꢀꢁꢂꢂꢃꢄꢅꢆꢇꢈ  
ꢀꢅꢉꢇꢊꢋꢌꢍꢍ  
ꢎꢇꢀꢌꢏꢋꢐꢑꢒ  
ꢀꢁꢂꢂꢃꢄꢅꢆꢇꢈ  
ꢀꢅꢉꢇꢊꢋꢌꢍꢍ  
ꢎꢏꢋ8ꢐꢑꢒꢋ0ꢑ0618  
ꢏꢎꢋ8ꢓꢐꢓꢋ0ꢐ1ꢑ18  
(23-c)  
(23-d)  
Figure 16. Recommended Position of InSOP-24D Package Shown with Check Mark.  
18  
Rev. E 06/18  
www.power.com  
LYTSwitch-6  
excessive leading-edge current spikes at start-up. Repeat tests under  
steady-state conditions and verify that the leading-edge current spike  
is below ILIMIT(MIN) at the end of tLEB(MIN). Under all conditions, the  
maximum Drain current for the primary MOSFET should be below the  
specified absolute maximum ratings.  
Quick Design Checklist  
As with any power supply, the performance of all LYTSwitch-6 designs  
should be measured on the bench to make sure that component  
limits are not exceeded under worst-case conditions. As a minimum,  
the following tests are strongly recommended:  
Thermal Check – At specified maximum output power, minimum input  
voltage and maximum ambient temperature, verify that temperature  
meets specified limits for the LYTSwitch-6 IC, transformer, output  
SR FET, and output capacitors. There should be sufficient thermal  
margin to account for part-to-part variation in the RDS(ON) of the  
LYTSwitch-6 IC. At low-line and full load it is recommended that the  
LYTSwitch-6 SOURCE pin temperature is limited to 110 °C to allow for  
these variations.  
Maximum Drain Voltage – Verify that the VDS of the LYTSwitch-6 IC  
and the SR FET do not exceed 90% of their respective breakdown  
voltages at the highest input voltage and peak (overload) output  
power both during normal operation and at start-up.  
Maximum Drain Current – At maximum ambient temperature,  
maximum input voltage and peak output (overload) power. Review  
drain current waveforms for any signs of transformer saturation or  
19  
Rev. E 06/18  
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LYTSwitch-6  
Second Applications Design Example  
ꢆ8  
ꢄ.ꢄ ꢇꢈ  
ꢃ00 ꢉꢍꢆ  
R8  
ꢆ16  
1000 µꢈ 1000 µꢈ  
16 ꢉ 16 ꢉ  
ꢆ10  
10ꢄ ꢢꢆ1ꢌ  
ꢎꢄ  
1.ꢃ ꢏꢐ  
ꢋꢄ  
1ꢡ  
100 ꢇꢈ  
ꢟ1  
Rꢠ8  
ꢦ1ꢧꢂ1ꢅꢂꢈ  
1/16 ꢣ ꢃ0 ꢉ  
ꢀꢁ ꢂꢃ ꢁꢄꢅꢁ ꢆ  
ꢇꢂ  
1ꢄ  
11  
10  
ꢈꢎ1  
ꢆꢊ  
ꢉRꢄ  
ꢙꢨꢥ0ꢅꢆꢄꢌ0ꢟR  
ꢄꢌ0 ꢉ  
Rꢊ  
ꢋ1  
Eꢦꢄꢂꢧꢂꢎꢟꢀ  
Rꢅ  
ꢆ1ꢊ  
ꢅ.ꢅ ꢇꢈ  
ꢄ00 ꢉ  
ꢅ.ꢅ ꢇꢈ  
ꢄ00 ꢉ  
ꢆꢑ  
ꢌꢊ0 ꢒꢈ  
ꢄ00 ꢉ  
1ꢃ  
1ꢄ0 ꢢΩ  
1ꢡ  
0.ꢊꢃ ꢣ  
R1ꢌ  
ꢄ0 ꢢΩ  
1ꢡ  
1
ꢉR1  
ꢨꢌE1ꢌ0ꢍꢂEꢅ/ꢃꢌ  
1ꢌ0 ꢉ  
1/16 ꢣ  
ꢉRꢅ  
ꢙꢨꢥ0ꢅꢆꢄꢌ0ꢟR  
ꢄꢌ0 ꢉ  
Rꢌ  
1.6 ꢠΩ  
1ꢡ  
ꢆꢌ  
68 µꢈ  
ꢃ00 ꢉ  
ꢈꢎꢄ  
ꢎꢅ  
ꢓ1  
ꢍꢔꢕ6ꢄꢃ0  
Rꢄ  
R1ꢃ  
ꢈeꢖꢖꢗꢘe ꢙeꢚꢛ  
ꢜꢅ.ꢃ ꢝ ꢌ.ꢌꢃ ꢏꢏꢞ  
ꢟꢄ  
EE1ꢅ  
ꢄ0  
ꢄ0 Ω  
1ꢡ  
1/ꢄ ꢣ  
1ꢡ  
1/ꢄ ꢣ  
R1ꢄ  
1.ꢅꢅ ꢠΩ  
1ꢡ  
R1ꢑ  
1 ꢢΩ  
ꢋꢌ  
ꢥꢦ1ꢠꢂꢎꢟꢀ  
6
10  
Rꢑ  
ꢆ11  
11.8 ꢢΩ  
1ꢡ  
ꢅꢅ0 ꢒꢈ  
ꢃ0 ꢉ  
ꢙR1  
ꢤꢋꢌꢩꢙ100  
1000 ꢉ  
R16  
ꢅ6 ꢢΩ  
ꢋꢃ  
Eꢦꢄꢧꢂꢎꢟꢀ  
1
1/16 ꢣ  
ꢈ1  
Rꢉ1  
ꢅ.1ꢃ ꢍ ꢅꢃ0 ꢉꢍꢆ  
L
ꢎ1  
8.8 ꢏꢐ  
ꢆꢅ  
ꢄꢄ0 ꢇꢈ  
6ꢅ0 ꢉ  
R6  
ꢌꢊ  
ꢆ1  
ꢆꢄ  
ꢀꢔꢕ - ꢖꢁꢕ  
ꢂꢆꢊ  
68 ꢇꢈ  
68 ꢇꢈ  
ꢊ60 ꢉꢋꢆ  
ꢊ60 ꢉꢋꢆ  
ꢆ1ꢅ  
10 µꢈ  
ꢆ1ꢄ  
16 ꢉ  
ꢄ.ꢄ µꢈ  
R1ꢊ  
ꢅ6 ꢢΩ  
ꢄꢃ ꢉ  
Rꢃ  
1.ꢅ0 ꢠΩ  
1ꢡ  
ꢋꢅ  
ꢋꢈꢤ1ꢄ00ꢂꢊ  
S
ꢊꢋꢉTꢈꢋL  
ꢋ6  
ꢙꢅꢌ0ꢍꢂ1ꢅꢂꢈ  
ꢂꢋꢎT  
R1  
10 ꢢΩ  
1ꢡ  
R18  
1/8 ꢣ  
ꢏꢐꢐ  
ꢍS  
0.01ꢄ  
1ꢡ  
LYTSwitch-6  
ꢤ1  
ꢎꢪꢟ6068ꢆ  
ꢆꢃ  
ꢄꢄ µꢈ  
ꢅꢅ ꢉ  
ꢆ6  
ꢌꢊ0 ꢇꢈ  
ꢃ0 ꢉ  
1 ꢣ  
ꢈTꢉ  
ꢀꢁꢂ8ꢃ86ꢂ01ꢄꢅ18  
Figure 17. Schematic of DER-637, 35 W, 12 V, 2.92 A, 140 VAC – 320 VAC using LYSwitch-6 LYT6068C with Synchronous Rectification.  
A High Efficiency, 35 W, 12 V Universal Input LED Ballast  
– with Synchronous Rectification  
One end of the transformer (T1) primary winding is connected to the  
positive terminal of the bulk capacitor (C4) while the other side is  
connected to the Drain of the LYTSwitch-6 (U1) IC’s the integrated  
650 V power MOSFET. A low cost RCD primary clamp, D4, R2, R15,  
R3 and C7 limits the voltage spike seen by the switching MOSFET.  
The spike is caused by transformer leakage inductance. The RCD  
primary clamp also reduces radiated and conducted EMI. Clamping  
Zener VR1 limits the drain voltage spike during start-up into full load  
at 320 VAC.  
The circuit shown on Figure 17 is a 35 W isolated flyback power  
supply with a single-stage power factor correction circuit for LED  
lighting applications. It provides a constant voltage output of 12 V  
with accurate voltage regulation and an output current of up to  
2.92 A. The power supply is intended for for applications where a  
post regulators are used to independently regulate multiple LED  
strings design such as in RGBW smart lighting. The power supply is  
also ideal for single-LED string applications as it delivers the same  
maximum constant output current with accurate regulation and no  
line-induced ripple from 12 V to 3 V output. The circuit is highly  
efficient and provides excellent line and load regulation across an  
input voltage range of 140 VAC to 320 VAC. The power supply also  
provides a PF of greater than 0.9 PF and less than 20% A-THD at  
230 VAC.  
The LYTSwitch-6 IC is self-starting, using an internal high-voltage  
current source to charge the PRIMARY BYPASS pin capacitor (C6)  
when line voltage is first applied. During normal operation the  
primary-side is powered from an auxiliary winding on transformer T1.  
Output of the auxiliary winding is rectified by diode D3 and filtered by  
capacitor C5. Resistor R1 limits the current supplied to the PRIMARY  
BYPASS pin. The value of the PRIMARY BYPASS pin capacitor C6  
used is 470 nF which sets normal current limit.  
Input Stage  
Fuse F1 provides protection, and isolates the circuit from the input  
line in the event of catastrophic component failure. Varistor RV1 is  
connected after the fuse and acts as a voltage clamp – limiting the  
voltage to a safe level in the event of a line transient or surge. Bridge  
diode BR1 rectifies the AC line voltage to provide a full-wave rectified  
DC voltage to the input film capacitors C3 and C4. The circuit  
employs a 2-stage EMI filter consisting of C1, L1, C2, L2, and C3.  
Power Factor Correction Stage  
The PFC stage comprises inductor (T2) in series with blocking diode  
(D1 and D5) and is connected to the DRAIN pin of the LYTSwitch-6  
IC. High power factor correction is achieved using a Switched  
Valley-Fill Single Stage PFC (SVF S2PFC) technique, operating in  
discontinuous conduction mode (DCM). The DCM switched current  
from inductor T2 shapes the input current into a quasi-sinusoid when  
the rectified voltage on C3 is less than the DC voltage on C4 resulting  
in a high power factor.  
Primary Flyback Stage  
The bulk capacitor C4 filters the line ripple voltage and provides  
A DC voltage to the flyback stage. Capacitor C4 also filters  
differential current which reduces conducted EMI noise. The voltage  
across the bulk capacitor (C4) monitored via the INPUT OVERVOLTAGE pin  
resistors (R4 and R12) to provide line overvoltage and brown-in  
protection. The overvoltage threshold (IOV+) determines the  
overvoltage threshold, while (IUV+) determines the line turn-on  
voltage. In the event of a line surge or transient, an input overvoltage  
shutdown will be triggered by a line voltage exceeding 490 VPK.  
During MOSFET on-time, energy is stored in the PFC inductor (T2)  
and flyback transformer (T1). During MOSFET off-time, the energy  
from both the PFC and flyback inductors is transferred to the  
secondary-side through the flyback transformer.  
Diode D2 isolates capacitor C3 from the rectified AC input. It also  
provides a current path for charging of the bulk capacitor C4,  
especially at low-line which improves efficiency. Free-wheel diodes  
20  
Rev. E 06/18  
www.power.com  
LYTSwitch-6  
D1 and D5 provide a path for the energy stored in the PFC inductor to  
transfer to the secondary-side during MOSFET off-time. Diode D1  
and D5 are connected in series to withstand the resonant ring  
induced on the PFC inductor when the MOSFET turns off.  
output voltage via the OUTPUT VOLTAGE pin. Capacitor C13  
connected to the SECONDARY BYPASS pin of LYTSwitch-6 IC (U1)  
provides decoupling for the internal circuitry.  
During constant voltage operation, output voltage regulation is  
achieved by sensing the output voltage via a potential divider formed  
by resistors R8 and R9. The voltage across R9 is monitored by the  
FEEDBACK pin and compared to an internal reference voltage  
Of 1.265 V to maintain accurate regulation. Bypass capacitor C11 is  
placed across FEEDBACK and SECONDARY GROUND pins to filter high  
frequency noise preventing interference with the feedback signal.  
During no-load or under light load (<10% load) the energy stored in  
the PFC inductor (T2) may be more than the secondary load requires,  
the excess energy from the PFC inductor is recycled to the bulk  
capacitor C4 and boosts the bulk voltage. A Zener-resistor clamp,  
(VR2 and VR3 in series with R19) is connected across the bulk capacitor  
C4 to limit the voltage rise to safe levels. The Zener clamp voltage is  
restricted to less than the 500 V rating of the bulk capacitor C4.  
During constant current operation, the output current is set by the  
sense resistor R18. The voltage across the sense resistor is  
compared to the ISENSE pin’s internal reference threshold of 35 mV  
in order to maintain constant current regulation. Diode D6 in parallel  
with the current sense resistor R18 clamps the voltage across the  
ISENSE pin and SECONDARY GROUND pin to protect the IC from the  
high current surge from the output capacitor induced by an output  
short-circuit.  
Secondary Stage  
The secondary-side control provided by the LYTSwitch-6 IC provides  
constant output voltage and constant output current. The output  
from the secondary winding of the transformer is rectified by SR FET  
Q1 and filtered by output capacitors C10 and C16. Adding an RC  
snubber (R7 and C9) across the SR FET reduces voltage stress.  
The secondary-side of the IC is self-powered using either the  
secondary winding forward voltage via the FORWARD pin or the  
21  
Rev. E 06/18  
www.power.com  
LYTSwitch-6  
Absolute Maximum Ratings1,2  
DRAIN Pin Voltage: ...................................... -0.3 V to 650 V / 725 V Notes:  
DRAIN Pin Peak Current: LYT60x3C.......................... 1.04 A (1.95 A)3 1. All voltages referenced to SOURCE and Secondary  
LYT60x5C ..................... 1.84 A (3.45 A)3  
GROUND, TA = 25 °C.  
LYT60x7C...................... 2.64 A (4.95 A)3 2. Maximum ratings specified may be applied one at a time without  
LYT6068C ..................... 2.96 A (5.55 A)3  
BPP/BPS Pin Voltage .......................................................-0.3 to 6 V  
BPP/BPS Current .................................................................100 mA  
causing permanent damage to the product. Exposure to Absolute  
Maximum Ratings conditions for extended periods of time may  
affect product reliability.  
FW Pin Voltage ........................................................ -1.5 V to 150 V 3. Higher peak Drain current is allowed while the Drain voltage is  
FB Pin Voltage .............................................................-0.3 V to 6 V simultaneously less than 400 V.  
SR Pin Voltage .............................................................-0.3 V to 6 V 4. Normally limited by internal circuitry.  
V Pin Voltage (LYT606xC)..........................................-0.3 V to 650 V 5. 1/16” from case for 5 seconds.  
V Pin Voltage (LYT607xC)..........................................-0.3 V to 725 V  
VOUT Pin Voltage ......................................................-0.3 V to 27 V  
Storage Temperature ..................................................-65 to 150 °C  
Operating Junction Temperature4 ............................... -40 to 150 °C  
Ambient Temperature .................................................-40 to 105 °C  
Lead Temperature5 .............................................................. 260 °C  
Thermal Resistance  
Thermal Resistance:  
Notes:  
(qJA).................................... 76 °C/W1, 65 °C/W2 1. Soldered to 0.36 sq. inch (232 mm2) 2 oz. (610 g/m2) copper clad.  
(qJC).....................................................8 °C/W3 2. Soldered to 1 sq. inch (645 mm2), 2 oz. (610 g/m2) copper clad.  
3. The case temperature is measured on the top of the package.  
Parameter  
Conditions  
Rating  
Units  
Ratings for UL1577  
Primary-Side  
Current Rating  
Current from pin (16-19) to pin 24  
1.5  
1.35  
0.125  
A
Primary-Side  
Power Rating  
TAMB = 25 °C  
W
W
(device mounted in socket resulting in TCASE = 120 °C)  
Secondary-Side  
Power Rating  
TAMB = 25 °C  
(device mounted in socket)  
Conditions  
SOURCE = 0 V  
TJ = -40 °C to 125 °C  
Parameter  
Symbol  
Min  
Typ  
Max  
Units  
(Unless Otherwise Specified)  
Control Functions  
Start-Up Switching  
Frequency  
fSW  
TJ = 25 °C  
22  
25  
27  
kHz  
Jitter Frequency  
fM  
TJ = 25 °C, fSW = 100 kHz  
TJ = 25 °C  
0.8  
1.25  
14.6  
1.70  
16.9  
kHz  
Maximum On-Time  
tON(MAX)  
12.4  
ms  
Minimum Primary  
Feedback Block-Out  
Timer  
tBLOCK  
tOFF(MIN)  
ms  
22  
Rev. E 06/18  
www.power.com  
LYTSwitch-6  
Conditions  
SOURCE = 0 V  
TJ = -40 °C to 125 °C  
(Unless Otherwise Specified)  
Parameter  
Symbol  
Min  
Typ  
Max  
Units  
Control Functions (cont.)  
VBPP = VBPP + 0.1 V  
(MOSFET not Switching)  
TJ = 25 °C  
IS1  
145  
200  
425  
mA  
LYT6063C  
0.32  
0.49  
0.77  
0.90  
0.36  
0.59  
0.77  
-1.75  
-5.98  
4.65  
0.43  
0.65  
1.03  
1.20  
0.48  
0.79  
1.20  
-1.35  
-4.65  
4.9  
0.61  
1.03  
1.38  
1.75  
0.65  
1.10  
1.73  
-0.88  
-3.32  
5.15  
LYT6065C  
LYT6067C  
LYT6068C  
LYT6073C  
LYT6075C  
LYT6077C  
BPP Supply Current  
VBPP = VBPP + 0.1 V  
(MOSFET Switching at fSW  
TJ = 25 °C  
IS2  
)
mA  
mA  
ICH1  
ICH2  
VBPP  
VBP = 0 V, TJ = 25 °C  
VBP = 4 V, TJ = 25 °C  
TJ = 25 °C  
BPP Pin Charge Current  
BPP Pin Voltage  
V
V
V
V
BPP Pin Voltage  
Hysteresis  
VBPP(H)  
VSHUNT  
0.22  
5.15  
2.8  
0.39  
5.36  
3.15  
0.55  
5.65  
3.5  
BPP Shunt Voltage  
IBPP = 2 mA  
BPP Power-Up Reset  
Threshold Voltage  
VBPP(RESET)  
TJ = 25 °C  
OV Pin Line  
Overvoltage Threshold  
IOV-  
TJ = 25 °C  
TJ = 25 °C  
106  
6
115  
7
118  
8
mA  
mA  
OV Pin Line  
Overvoltage Hysteresis  
IOV(H)  
OV Pin Line  
Overvoltage Deglitch  
Filter  
tOV+  
TJ = 25 °C  
TJ = 25 °C  
3
ms  
UV Pin Brown-In  
Threshold  
IUV+  
23.95  
26.06  
28.18  
mA  
Line Fault Protection  
VOLTAGE Pin  
Voltage Rating  
VV  
TJ = 25 °C  
1000  
V
23  
Rev. E 06/18  
www.power.com  
LYTSwitch-6  
Conditions  
SOURCE = 0 V  
TJ = -40 °C to 125 °C  
(Unless Otherwise Specified)  
Parameter  
Symbol  
Min  
Typ  
Max  
Units  
Circuit Protection  
di/dt = 162.5 mA/ms  
LYT60x3C  
511  
883  
550  
950  
589  
1017  
1552  
1766  
709  
TJ = 25 °C  
di/dt = 212.5 mA/ms  
LYT60x5C  
LYT60x7C  
LYT6068C  
LYT60x3C  
LYT60x5C  
LYT60x7C  
LYT6068C  
Standard Current Limit  
(BPP) Capacitor =  
0.47 mF  
TJ = 25 °C  
ILIMIT  
mA  
di/dt = 300 mA/ms  
1348  
1534  
591  
1450  
1650  
650  
TJ = 25 °C  
di/dt = 375 mA/ms  
TJ = 25 °C  
di/dt = 162.5 mA/ms  
TJ = 25 °C  
di/dt = 212.5 mA/ms  
1046  
1501  
1683  
1150  
1650  
1850  
1254  
1799  
2017  
Increased Current Limit  
(BPP) Capacitor =  
4.7 mF  
TJ = 25 °C  
ILIMIT+1  
mA  
di/dt = 300 mA/ms  
TJ = 25 °C  
di/dt = 375 mA/ms  
TJ = 25 °C  
Overload Detection  
Frequency  
TJ = 25 °C  
See Note A  
fOVL  
tAR  
102  
110  
82  
118  
89  
kHz  
ms  
Auto-Restart On-Time  
TJ = 25 °C  
fs = 100 kHz  
75  
BYPASS Pin Fault  
Detection Threshold  
Current  
ISD  
TJ = 25 °C  
6.0  
8.9  
11.3  
mA  
Auto-Restart Trigger  
Skip Time  
TJ = 25 °C  
See Note A  
tAR(SK)  
tAR(OFF)  
1.3  
sec  
sec  
sec  
Auto-Restart Off-Time  
TJ = 25 °C  
TJ = 25 °C  
1.7  
2.1  
Short Auto-Restart  
Off-Time  
tAR(OFF)SH  
0.17  
0.20  
0.23  
24  
Rev. E 06/18  
www.power.com  
LYTSwitch-6  
Conditions  
SOURCE = 0 V  
TJ = -40 °C to 125 °C  
(Unless Otherwise Specified)  
Parameter  
Symbol  
Min  
Typ  
Max  
Units  
Output  
TJ = 25 °C  
4.90  
7.60  
1.95  
3.02  
1.02  
1.58  
0.86  
1.33  
4.42  
6.85  
1.95  
3.02  
1.20  
1.86  
5.64  
8.74  
2.24  
3.47  
1.17  
1.82  
0.99  
1.53  
5.08  
7.88  
2.24  
3.47  
1.38  
2.14  
LYT6063C  
ID = ILIMIT+1  
TJ = 100 °C  
TJ = 25 °C  
TJ = 100 °C  
TJ = 25 °C  
TJ = 100 °C  
TJ = 25 °C  
TJ = 100 °C  
TJ = 25 °C  
TJ = 100 °C  
TJ = 25 °C  
TJ = 100 °C  
TJ = 25 °C  
TJ = 100 °C  
LYT6065C  
ID = ILIMIT+1  
LYT6067C  
ID = ILIMIT+1  
LYT6068C  
ID = ILIMIT+1  
ON-State Resistance  
RDS(ON)  
LYT6073C  
ID = ILIMIT+1  
LYT6075C  
ID = ILIMIT+1  
LYT6077C  
ID = ILIMIT+1  
VBPP = VBPP + 0.1 V  
IDSS1  
VDS = 150 V  
TJ = 25 °C  
15  
mA  
mA  
V
OFF-State Drain  
Leakage Current  
VBPP = VBPP + 0.1 V  
VDS = 325 V  
IDSS2  
200  
TJ = 25 °C  
LYT606xC  
LYT607xC  
650  
725  
50  
VBPP = VBPP + 0.1 V  
TJ = 25 °C  
Breakdown Voltage  
BVDSS  
Drain Supply Voltage  
Thermal Shutdown  
V
TSD  
135  
142  
150  
°C  
Thermal Shutdown  
Hysteresis  
TSD(H)  
70  
°C  
25  
Rev. E 06/18  
www.power.com  
LYTSwitch-6  
Conditions  
SOURCE = 0 V  
TJ = -40 °C to 125 °C  
(Unless Otherwise Specified)  
Parameter  
Symbol  
Min  
Typ  
Max  
Units  
Secondary  
FEEDBACK Pin Voltage  
VFB  
TJ = 25 °C  
TJ = 25 °C  
1.250  
1.265  
132  
1.280  
V
Maximum Switching  
Frequency  
fSREQ  
118  
145  
kHz  
OUTPUT VOLTAGE Pin  
Auto-Restart Threshold  
VVO(AR)  
3.45  
49.5  
V
OUTPUT VOLTAGE Pin  
Auto-Restart Timer  
tVOUT(AR)  
ms  
BPS Pin Current  
at No-Load  
ISNL  
VBPS  
TJ = 25 °C  
325  
4.40  
3.80  
485  
4.60  
4.00  
mA  
V
BPS Pin Voltage  
4.20  
BPS Pin Undervoltage  
Threshold  
VBPS(UVLO)(TH)  
3.60  
V
BPS Pin Undervoltage  
Hysteresis  
VBPS(UVLO)(H)  
0.6  
V
Current Limit  
Voltage Threshold  
ISV(TH)  
External Resistor  
33.94  
35.90  
37.74  
mV  
FWD Pin Voltage  
VFWD  
150  
V
Minimum Off-Time  
tOFF(MIN)  
2.48  
3.38  
4.37  
16  
ms  
Soft-Start Frequency  
Ramp Time  
tSS(RAMP)  
TJ = 25 °C  
7.5  
5.2  
11.8  
ms  
BPS Pin Fault Detection  
Threshold Current  
IBPS(SD)  
8.9  
mA  
FEEDBACK Pin  
Short-Circuit  
VFB(OFF)  
TƒB  
112  
124  
15  
135  
mV  
°C  
Thermal Foldback  
Thermal Foldback  
Hysteresis  
TƒB(H)  
°C  
26  
Rev. E 06/18  
www.power.com  
LYTSwitch-6  
Conditions  
SOURCE = 0 V  
TJ = -40 °C to 125 °C  
(Unless Otherwise Specified)  
Parameter  
Symbol  
Min  
Typ  
Max  
Units  
Synchronous Rectifier @ TJ = 25 °C  
SR Pin Drive Voltage  
VSR  
4.4  
V
SR Pin Voltage  
Threshold  
VSR(TH)  
0
mV  
TJ = 25 °C  
CLOAD = 2 nF, fSW = 100 kHz  
SR Pin Pull-Up Current  
ISR(PU)  
135  
87  
165  
97  
195  
107  
mA  
mA  
SR Pin Pull-Down  
Current  
TJ = 25 °C  
CLOAD = 2 nF, fSW = 100 kHz  
ISR(PD)  
0-100%  
71  
40  
32  
15  
TJ = 25 °C  
CLOAD = 2 nF  
Rise Time  
Fall Time  
tR  
tF  
ns  
ns  
10-90%  
0-100%  
TJ = 25 °C  
CLOAD = 2 nF  
10-90%  
TJ = 25 °C  
VBPS = 4.4 V  
ISR = 10 mA  
Output Pull-Up  
Resistance  
RPU  
7.2  
8.3  
9.4  
TJ = 25 °C  
VBPS = 4.4 V  
ISR = 10 mA  
Output Pull-Down  
Resistance  
RPD  
10.8  
12.1  
13.4  
Notes:  
A. This parameter is derived from characterization.  
27  
Rev. E 06/18  
www.power.com  
LYTSwitch-6  
Typical Performance Curves  
1.ꢁ  
1.ꢀ  
1.0  
0.8  
0.6  
0.ꢁ  
0.ꢀ  
ꢁ.0  
ꢅꢍꢎꢏꢐꢑꢒ ꢓꢎꢍꢔꢕꢖꢗꢘ  
ꢉꢊꢂ606ꢋꢃ 1.ꢁ0  
ꢉꢊꢂ606ꢇꢃ ꢋ.ꢀ0  
ꢉꢊꢂ606ꢌꢃ 6.10  
ꢉꢊꢂ6068ꢃ ꢌ.6ꢇ  
ꢀ.ꢃ  
ꢉꢊꢋꢌꢍꢎꢏ ꢐꢋꢊꢑꢒꢓꢔꢕ  
ꢅꢆꢇ606ꢁꢈ 1.ꢂ0  
ꢅꢆꢇ606ꢃꢈ ꢁ.ꢀ0  
ꢅꢆꢇ606ꢄꢈ 6.10  
ꢅꢆꢇ6068ꢈ ꢄ.6ꢃ  
ꢀ.0  
1.ꢃ  
1.0  
0.ꢃ  
0.0  
ꢃꢄꢅE ꢆ ꢀꢇ ꢈꢃ  
ꢃꢄꢅE ꢆ 100 ꢈꢃ  
0
0
100 ꢀ00 ꢁ00 ꢂ00 ꢃ00 600 ꢄ00  
0
6
8
10  
ꢀꢁꢂiꢃ ꢄꢅꢆtꢂꢇꢈ ꢉꢄꢊ  
ꢀꢁꢂꢃꢄ ꢅꢆꢇtꢈꢉꢊ ꢋꢅꢌ  
Figure 18. Maximum Allowable Drain Current vs. Drain Voltage.  
Figure 19. Output Characteristics.  
10000  
ꢄꢃ  
ꢉꢊꢋꢌꢍꢎꢏ ꢐꢋꢊꢑꢒꢓꢔꢕ  
ꢉꢊꢋꢌꢍꢎꢏ ꢐꢋꢊꢑꢒꢓꢔꢕ  
ꢄꢅꢆ606ꢁꢇ 1.ꢂ0  
ꢄꢅꢆ606ꢃꢇ ꢁ.ꢀ0  
ꢄꢅꢆ606ꢈꢇ 6.10  
ꢅꢆꢇ606ꢁꢈ 1.ꢂ0  
ꢅꢆꢇ606ꢃꢈ ꢁ.ꢀ0  
ꢅꢆꢇ606ꢄꢈ 6.10  
1000  
ꢄꢅꢆ6068ꢇ ꢈ.6ꢃ  
ꢅꢆꢇ6068ꢈ ꢄ.6ꢃ  
ꢃ0  
100  
ꢀꢃ  
10  
1
ꢉꢖꢍꢑꢊꢗꢍꢎꢏ ꢐꢓeꢘꢙeꢎꢊꢚ ꢛ 100 ꢜꢝꢞ  
0
1
100 ꢀ00 ꢁ00 ꢂ00 ꢃ00 600  
0
100 ꢀ00 ꢁ00 ꢂ00 ꢃ00 600  
ꢀꢁꢂiꢃ ꢄꢅꢆtꢂꢇꢈ ꢉꢄꢊ  
ꢀꢁꢂiꢃ ꢄꢅꢆtꢂꢇꢈ ꢉꢄꢊ  
Figure 20. COSS vs. Drain Voltage.  
Figure 21. Drain Capacitance Power.  
1.1  
VSR(t)  
-0.0  
-0.3  
1.0  
0.ꢀ  
-1.8  
ꢁꢂ0 ꢁꢃꢂ  
0
ꢃꢂ ꢂ0 ꢄꢂ 100 1ꢃꢂ 1ꢂ0  
500 ns  
ꢙꢚꢇctiꢆꢇ Tꢂꢍꢛꢂꢁꢃtꢚꢁꢂ ꢋꢜꢑꢒ  
Time (ns)  
Figure 22. Breakdown vs. Temperature.  
Figure 23. SYNCHRONOUS RECTIFIER DRIVE Pin Negative  
Voltage.  
28  
Rev. E 06/18  
www.power.com  
LYTSwitch-6  
Typical Performance Curves  
1.ꢁ  
1.ꢀ  
1.0  
0.8  
0.6  
0.ꢁ  
0.ꢀ  
ꢂ.ꢃ  
ꢂ.0  
ꢁ.ꢃ  
ꢅꢍꢎꢏꢐꢑꢒ ꢓꢎꢍꢔꢕꢖꢗꢘ  
ꢈꢉꢊꢋꢌꢍꢎ ꢏꢊꢉꢐꢑꢒꢓꢔ  
ꢉꢊꢂ60ꢋꢌ 1.ꢁ0  
ꢉꢊꢂ60ꢋꢇ ꢌ.ꢀ0  
ꢉꢊꢂ60ꢋꢋ ꢇ.ꢀ0  
ꢅꢆꢇ60ꢄꢁ 1.ꢂ0  
ꢅꢆꢇ60ꢄꢃ ꢁ.ꢀ0  
ꢅꢆꢇ60ꢄꢄ ꢃ.ꢀ0  
ꢁ.0  
ꢀ.ꢃ  
ꢀ.0  
1.ꢃ  
1.0  
0.ꢃ  
0.0  
ꢃꢄꢅE ꢆ ꢀꢇ ꢈꢃ  
ꢃꢄꢅE ꢆ 100 ꢈꢃ  
0
0
100 ꢀ00 ꢁ00 ꢂ00 ꢃ00 600 ꢄ00 800  
0
6
8
10  
ꢀꢁꢂiꢃ ꢄꢅꢆtꢂꢇꢈ ꢉꢄꢊ  
ꢀꢁꢂiꢃ ꢄꢅꢆtꢂꢇꢈ ꢉꢄꢊ  
Figure 24. Maximum Allowable Drain Current vs. Drain Voltage.  
Figure 25. Output Characteristics.  
10000  
100  
ꢈꢉꢊꢋꢌꢍꢎ ꢏꢊꢉꢐꢑꢒꢓꢔ  
ꢄꢅꢆ60ꢇꢁ 1.ꢂ0  
ꢄꢅꢆ60ꢇꢃ ꢁ.ꢀ0  
ꢅꢉꢙꢚꢇꢋꢌ ꢍꢙꢉꢈꢛꢎꢜꢝ  
ꢖꢗꢘ60ꢄꢁ 1.ꢂ0  
ꢖꢗꢘ60ꢄꢃ ꢁ.ꢀ0  
ꢖꢗꢘ60ꢄꢄ ꢃ.ꢀ0  
ꢄꢅꢆ60ꢇꢇ ꢃ.ꢀ0  
1000  
ꢄꢃ  
100  
10  
1
ꢃ0  
ꢀꢃ  
ꢅꢆꢇꢈꢉꢊꢇꢋꢌ ꢍꢎeꢏꢐeꢋꢉꢑ ꢒ 100 ꢓꢔꢕ  
0
1
100 ꢀ00 ꢁ00 ꢂ00 ꢃ00 600  
0
100 ꢀ00 ꢁ00 ꢂ00 ꢃ00 600  
ꢀꢁꢂiꢃ ꢄꢅꢆtꢂꢇꢈ ꢉꢄꢊ  
ꢀꢁꢂiꢃ ꢄꢅꢆtꢂꢇꢈ ꢉꢄꢊ  
Figure 26. COSS vs. Drain Voltage.  
Figure 27. Drain Capacitance Power.  
29  
Rev. E 06/18  
www.power.com  
LYTSwitch-6  
30  
Rev. E 06/18  
www.power.com  
LYTSwitch-6  
MSL Table  
Part Number  
MSL Rating  
LYT60xxC  
3
ESD and Latch-Up Table  
Test  
Conditions  
JESD78D  
Results  
Latch-up at 125 °C  
> ±100 mA or > 1.5 × VMAX on all pins  
> ±2000 V on all pins  
Human Body Model ESD  
ANSI/ESDA/JEDEC JS-001-2014  
ANSI/ESDA/JEDEC  
JS-002-2014  
Charge Device Model ESD  
> ±500 V on all pins  
Part Ordering Information  
• LYTSwitch-6 Product Family  
• LYT-6 Series Number  
• Package Identifier  
C
InSOP-24D  
• Tape & Reel and Other Options  
TL Tape & Reel, 2 k pcs per reel.  
LYT 6065 C - TL  
31  
Rev. E 06/18  
www.power.com  
Revision Notes  
Date  
E
E
Code L. Added Applications section.  
Fixed error in equation on page 14.  
02/18  
06/18  
For the latest updates, visit our website: www.power.com  
Power Integrations reserves the right to make changes to its products at any time to improve reliability or manufacturability. Power Integrations  
does not assume any liability arising from the use of any device or circuit described herein. POWER INTEGRATIONS MAKES NO WARRANTY  
HEREIN AND SPECIFICALLY DISCLAIMS ALL WARRANTIES INCLUDING, WITHOUT LIMITATION, THE IMPLIED WARRANTIES OF MERCHANTABILITY,  
FITNESS FOR A PARTICULAR PURPOSE, AND NON-INFRINGEMENT OF THIRD PARTY RIGHTS.  
Patent Information  
The products and applications illustrated herein (including transformer construction and circuits external to the products) may be covered by one  
or more U.S. and foreign patents, or potentially by pending U.S. and foreign patent applications assigned to Power Integrations. A complete list of  
Power Integrations patents may be found at www.power.com. Power Integrations grants its customers a license under certain patent rights as set  
forth at www.power.com/ip.htm.  
Life Support Policy  
POWER INTEGRATIONS PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS  
WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF POWER INTEGRATIONS. As used herein:  
1. A Life support device or system is one which, (i) is intended for surgical implant into the body, or (ii) supports or sustains life, and (iii) whose  
failure to perform, when properly used in accordance with instructions for use, can be reasonably expected to result in significant injury or  
death to the user.  
2. A critical component is any component of a life support device or system whose failure to perform can be reasonably expected to cause the  
failure of the life support device or system, or to affect its safety or effectiveness.  
The PI logo, TOPSwitch, TinySwitch, SENZero, SCALE, SCALE-iDriver, SCALE-iFlex, Qspeed, PeakSwitch, LYTSwitch, LinkZero, LinkSwitch,  
InnoSwitch, HiperTFS, HiperPFS, HiperLCS, DPA-Switch, CAPZero, Clampless, EcoSmart, E-Shield, Filterfuse, FluxLink, StakFET, PI Expert and PI  
FACTS are trademarks of Power Integrations, Inc. Other trademarks are property of their respective companies. ©2018, Power Integrations, Inc.  
Power Integrations Worldwide Sales Support Locations  
World Headquarters  
5245 Hellyer Avenue  
San Jose, CA 95138, USA  
Main: +1-408-414-9200  
Customer Service:  
Worldwide: +1-65-635-64480  
Americas: +1-408-414-9621  
e-mail: usasales@power.com  
Germany (AC-DC/LED Sales)  
Lindwurmstrasse 114  
D-80337 München  
Germany  
Phone: +49-89-5527-39100  
e-mail: eurosales@power.com  
Italy  
Singapore  
51 Newton Road  
Via Milanese 20, 3rd. Fl.  
20099 Sesto San Giovanni (MI) Italy #19-01/05 Goldhill Plaza  
Phone: +39-024-550-8701  
e-mail: eurosales@power.com  
Singapore, 308900  
Phone: +65-6358-2160  
e-mail: singaporesales@power.com  
Japan  
Germany (Gate Driver Sales)  
HellwegForum 1  
59469 Ense  
Yusen Shin-Yokohama 1-chome Bldg. Taiwan  
1-7-9, Shin-Yokohama, Kohoku-ku  
Yokohama-shi,  
5F, No. 318, Nei Hu Rd., Sec. 1  
Nei Hu Dist.  
China (Shanghai)  
Rm 2410, Charity Plaza, No. 88  
North Caoxi Road  
Shanghai, PRC 200030  
Phone: +86-21-6354-6323  
e-mail: chinasales@power.com  
Germany  
Tel: +49-2938-64-39990  
e-mail: igbt-driver.sales@power.com e-mail: japansales@power.com  
Kanagawa 222-0033 Japan  
Phone: +81-45-471-1021  
Taipei 11493, Taiwan R.O.C.  
Phone: +886-2-2659-4570  
e-mail: taiwansales@power.com  
India  
#1, 14th Main Road  
Vasanthanagar  
Korea  
RM 602, 6FL  
UK  
Building 5, Suite 21  
The Westbrook Centre  
Milton Road  
Cambridge  
CB4 1YG  
China (Shenzhen)  
17/F, Hivac Building, No. 2, Keji Nan Bangalore-560052 India  
8th Road, Nanshan District,  
Shenzhen, China, 518057  
Phone: +86-755-8672-8689  
e-mail: chinasales@power.com  
Korea City Air Terminal B/D, 159-6  
Samsung-Dong, Kangnam-Gu,  
Seoul, 135-728, Korea  
Phone: +82-2-2016-6610  
e-mail: koreasales@power.com  
Phone: +91-80-4113-8020  
e-mail: indiasales@power.com  
Phone: +44 (0) 7823-557484  
e-mail: eurosales@power.com  
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