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XZCB25X92S-4

型号:

XZCB25X92S-4

品牌:

SUNLED[ SUNLED CORPORATION ]

页数:

6 页

PDF大小:

327 K

數位簽署者:F.Cui  
DNcn=F.Cui,o,ou,  
email=rd02_p40@ cn.  
com,c=<>  
日期 2013.12.23  
14:37:27+08'00'  
Part Number: XZCB25X92S-4  
F.Cui  
3.5x3.5 mm SMD CHIP LED LAMP  
Features  
3.5mm X 3.5mm X 1.15mm SMD LED  
Zener diode provided for ESD Protection  
IR-reflow compatible  
Applications  
Signal and symbol luminaire for orientation.  
Marker lights (e.g. steps, exit ways, etc).  
Decorative and entertainment lighting.  
Commercial and residential lighting.  
Automotive interior lighting.  
Ideal for accent lighting  
Standard Package: 2,000pcs / Reel  
MSL (Moisture Sensitivity Level): 2a  
RoHS compliant  
ATTENTION  
OBSERVE PRECAUTIONS  
FOR HANDLING  
ELECTROSTATIC  
DISCHARGE  
SENSITIVE  
DEVICES  
Notes:  
1. All dimensions are in millimeters (inches).  
2. Tolerance is ±0.25(0.01") unless otherwise noted.  
3. Specifications are subject to change without notice.  
Dec 16, 2013  
XDSB4088 V3-Z Layout: Maggie L.  
P. 1/6  
Part Number: XZCB25X92S-4  
3.5x3.5 mm SMD CHIP LED LAMP  
Handling Precautions  
Compare to epoxy encapsulant that is hard and brittle, silicone is softer and flexible. Although its characteristic  
significantly reduces thermal stress, it is more susceptible to damage by external mechanical force.  
As a result, special handling precautions need to be observed during assembly using silicone encapsulated  
LED products. Failure to comply might lead to damage and premature failure of the LED.  
1. Handle the component along the side surfaces by using forceps or appropriate tools.  
2. Do not directly touch or handle the silicone lens surface. It may damage the internal circuitry.  
3. Do not stack together assembled PCBs containing exposed LEDs. Impact may scratch the silicone lens or  
damage the internal circuitry.  
4.1. The inner diameter of the SMD pickup nozzle should not exceed the size of the LED to prevent air leaks.  
4.2. A pliable material is suggested for the nozzle tip to avoid scratching or damaging the LED surface during pickup.  
4.3. The dimensions of the component must be accurately programmed in the pick-and-place machine to insure precise  
pickup and avoid damage during production.  
5. As silicone encapsulation is permeable to gases, some corrosive substances such as H2S might corrode silver plating of  
leadframe. Special care should be taken if an LED with silicone encapsulation is to be used near such substances.  
Dec 16, 2013  
XDSB4088 V3-Z Layout: Maggie L.  
P. 2/6  
Part Number: XZCB25X92S-4  
3.5x3.5 mm SMD CHIP LED LAMP  
Luminous Intensity  
CIE127-2007*  
(IF=150mA)  
cd  
Luminous Flux  
CIE127-2007*  
(IF=150mA)*  
lm  
Viewing  
Angle  
2 θ 1/2 [1]  
Part  
Number  
Emitting  
Color  
Emitting  
Material  
Lens-color  
min.  
0.7*  
typ.  
min.  
2.4*  
typ.  
3.3*  
XZCB25X92S-4  
Blue  
InGaN  
Water Clear  
1.295*  
120°  
Notes:  
1. θ 1/2 is the angle from optical centerline where the luminous intensity is 1/2 of the optical peak value.  
2. Luminous intensity / luminous flux: +/-15%.  
3. LEDs are binned according to their luminous flux.  
* Luminous intensity / luminous flux value is in accordance with CIE127-2007 standards.  
Absolute Maximum Ratings at TA=25°C  
Parameter  
Symbol  
PD  
Value  
Unit  
mW  
°C  
Power Dissipation  
600  
110  
Junction Temperature [1]  
Operating Temperature  
Storage Temperature  
DC Forward Current[1]  
Peak Forward Current [2]  
Reverse Voltage  
TJ  
Top  
Tstg  
IF  
-40 To +85  
-40 To +85  
150  
°C  
°C  
mA  
mA  
V
IFM  
VR  
300  
5
Thermal Resistance [1]  
(Junction/ambient)  
Rth j-a  
Rth j-S  
180  
°C/W  
Thermal Resistance [1]  
(Junction/solder point)  
85  
°C/W  
V
Electrostatic Discharge Threshold (HBM)  
Notes:  
1.Results from mounting on PC board FR4(pad size70mm2), mounted on pc board-metal core PCB is recommend  
for lowest thermal Resistance.  
8000  
2.1/10 Duty Cycle, 0.1ms Pulse Width.  
Electrical / Optical Characteristics at TA=25°C  
Parameter  
Symbol  
Value  
Unit  
Forward Voltage IF = 150mA [Min.]  
Forward Voltage IF = 150mA [Typ.]  
Forward Voltage IF = 150mA [Max.]  
Allowable Reverse Current [Max.]  
2.7  
3.5  
4.0  
85  
VF [2]  
V
IR  
mA  
nm  
nm  
Wavelength at peak emission IF=150mA CIE127-2007* [Typ.]  
Dominant Wavelength IF=150mA CIE127-2007* [Typ.]  
λ peak  
λ dom [1]  
445*  
450*  
Δλ  
20  
nm  
Spectral bandwidth at 50% Φ REL MAX IF = 150mA [Typ.]  
Temperature coefficient of λ peak  
IF = 150mA, - 10°C T 100°C [Typ.]  
TC λ peak  
0.12  
nm/°C  
Temperature coefficient of λ dom  
IF = 150mA, - 10°C T 100°C [Typ.]  
TC λ dom  
0.10  
-2.3  
nm/°C  
mV/°C  
Temperature coefficient of VF  
TCV  
IF = 150mA, - 10°C T100°C [Typ.]  
Notes:  
1.The dominant Wavelength (λd) above is the setup value of the sorting machine. (Tolerance λd : ±1nm. )  
2. Forward Voltage: +/-0.1V.  
*Wavelength value is in accordance with CIE127-2007 standards.  
Dec 16, 2013  
XDSB4088 V3-Z Layout: Maggie L.  
P. 3/6  
Part Number: XZCB25X92S-4  
3.5x3.5 mm SMD CHIP LED LAMP  
Dec 16, 2013  
XDSB4088 V3-Z Layout: Maggie L.  
P. 4/6  
Part Number: XZCB25X92S-4  
3.5x3.5 mm SMD CHIP LED LAMP  
LED is recommended for reflow soldering and  
soldering profile is shown below.  
The device has a single mounting surface.  
The device must be mounted according to  
the specifications.  
Reel Dimension  
Recommended Soldering Pattern  
Tape Specification (Units : mm)  
Dec 16, 2013  
XDSB4088 V3-Z Layout: Maggie L.  
P. 5/6  
Part Number: XZCB25X92S-4  
3.5x3.5 mm SMD CHIP LED LAMP  
PACKING & LABEL SPECIFICATIONS  
TERMS OF USE  
1. Data presented in this document reflect statistical figures and should be treated as technical reference only.  
2. Contents within this document are subject to improvement and enhancement changes without notice.  
3. The product(s) in this document are designed to be operated within the electrical and environmental specifications indicated on the datasheet.  
User accepts full risk and responsibility when operating the product(s) beyond their intended specifications.  
4. The product(s) described in this document are intended for electronic applications in which a person’s life is not reliant upon the LED. Please  
consult with a SunLED representative for special applications where the LED may have a direct impact on a person’s life.  
5. The contents within this document may not be altered without prior consent by SunLED.  
6. Additional technical notes are available at http://www.SunLEDusa.com/TechnicalNotes.asp  
Dec 16, 2013  
XDSB4088 V3-Z Layout: Maggie L.  
P. 6/6  
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