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LZ0P3800

型号:

LZ0P3800

描述:

四分之一式内置镜头彩色CMOS图像传感器,具有110的k个像素[ 1/4-type Built-in Lens Color CMOS Image Sensor with 110 k Pixels ]

品牌:

SHARP[ SHARP ELECTRIONIC COMPONENTS ]

页数:

14 页

PDF大小:

111 K

LZ0P3800  
1/4-type Built-in Lens Color CMOS  
Image Sensor with 110 k Pixels  
LZ0P3800  
DESCRIPTION  
PIN CONNECTIONS  
The LZ0P3800 is a 1/4-type (4.5 mm) 110 000-  
pixel built-in lens color CMOS (Complementary  
Metal Oxide Semiconductor) image sensor that  
consists of a timing generator (TG), a correlated  
double sampling (CDS) circuit, an auto gain control  
(AGC) circuit and an analog-to-digital converter  
(ADC) circuit. With small lens and WLCC-type flat  
package, possible to make ultra small color camera  
easily.  
36-PIN WLCC TYPE  
TOP VIEW  
REFIN  
AGCSET  
BIAS3  
AGCOUT  
AGND  
AVDD  
1
2
3
4
5
6
7
8
9
30 BIAS2  
29 NC  
28 SCLK  
27 SDI  
26 VD  
25 HD  
24 CLK  
23 D7  
FEATURES  
• Progressive scan  
• Square pixel  
OFS  
ADL  
DAL  
22 D6  
• Compatible with CIF standard  
• Number of effective pixels : 367 (H) x 291 (V)  
• Number of optical black pixels  
– Horizontal : 13 front and 13 rear  
– Vertical : 4 front and 4 rear  
• Pixel pitch : 9.4 µm (H) x 9.4 µm (V)  
• R, G, and B primary color mosaic filters  
• Image inversion function (horizontally and/or  
vertically)  
DAH 10  
AGND 11  
DGND 12  
21 D5  
20 D4  
19 D3  
• Power save mode  
• Analog output and 8-bit digital output  
• Variable gain control (3 to 30 dB)  
• Variable electronic shutter (1/30 to 1/10 000 s)  
• Single +3.0 V power supply  
• Built-in optical low-pass-filter  
• Integrated lens : 52˚ horizontal viewing angle  
• Package  
– 36-pin WLCC* type  
– Base section size : 16 mm (H) x 13 mm (V)  
• Package height : approx. 10 mm  
* Window Leadless Chip Carrier  
In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in equipment using any SHARP devices shown in  
catalogs, data books, etc. Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device.  
1
LZ0P3800  
BLOCK DIAGRAM  
HD, VD  
CLK  
AGC  
CONTROL  
8-BIT  
D/A  
TG  
DATA  
DIGITAL  
VIDEO  
OUTPUT  
8-BIT  
A/D  
CMOS  
AGC  
IMAGE  
SENSOR  
ANALOG  
VIDEO  
OUTPUT  
AGC OUTPUT  
2
LZ0P3800  
PIN DESCRIPTION  
PIN NO. SYMBOL  
I/O  
I
A/D  
DESCRIPTION  
1
2
3
4
5
6
7
8
9
REFIN  
AGCSET  
BIAS3  
AGCOUT  
AGND  
AVDD  
OFS  
ADL  
DAL  
Analog Reference voltage for analog input  
Analog Connect to AGC bias resistor  
Analog Analog bias voltage 3 for image sensor  
Analog AGC output  
O
I
O
O
O
O
O
O
O
O
O
O
I
Analog Analog ground  
Analog Analog power supply  
Analog Offset bias voltage for AGC output  
Analog Bottom ADC reference voltage  
Analog Bottom DAC reference voltage  
Analog Top DAC reference voltage  
Analog Analog ground  
Digital Digital ground  
Digital Digital power supply  
Digital Clock input for oscillator  
Digital Clock output for oscillator  
Digital ADC signal output (LSB)  
Digital ADC signal output  
10 DAH  
11 AGND  
12 DGND  
13 DVDD  
14 CKI  
15 CKO  
16 D0  
17 D1  
18 D2  
19 D3  
20 D4  
21 D5  
22 D6  
23 D7  
24 CLK  
25 HD  
Digital ADC signal output  
Digital ADC signal output  
Digital ADC signal output  
Digital ADC signal output  
Digital ADC signal output  
Digital ADC signal output (MSB)  
Digital Clock output (9.0 MHz)  
Digital Horizontal drive pulse input  
Digital Vertical drive pulse input  
Digital Data input (AGC gain, offset, shutter control, etc.)  
Digital Shift clock for data.  
26 VD  
I
27 SDI  
28 SCLK  
29 NC  
30 BIAS2  
31 BIAS1  
32 CLP2  
33 CLP1  
34 SIGOUT  
35 SIGIN  
36 NC  
I
I
O
I
No connection  
Analog Analog bias voltage 2 for image sensor  
Analog Analog bias voltage 1 for image sensor  
Analog Analog bias voltage 2 for clamp circuit  
Analog Analog bias voltage 1 for clamp circuit  
Analog Analog image signal output  
Analog Analog image signal input  
No connection  
3
LZ0P3800  
ABSOLUTE MAXIMUM RATINGS  
(TA = +25 ˚C)  
PARAMETER  
Power supply voltage  
Input signal voltage  
Storage temperature  
SYMBOL  
VDD  
RATING  
–0.3 to +4.3  
UNIT  
V
VØ  
TSTG  
–0.3 to VDD +0.3  
–20 to +70  
V
˚C  
RECOMMENDED OPERATING CONDITIONS  
PARAMETER  
Power supply voltage  
Operating temperature  
Oscillation frequency  
SYMBOL MIN.  
TYP. MAX. UNIT NOTE  
VDD  
TOPR  
fCK  
2.7  
–10  
3.0  
+25  
9.0  
3.3  
+60  
V
˚C  
MHz  
V
LOW level  
HIGH level  
VØL  
0
0.2VDD  
VDD  
Digital input voltage  
Analog input voltage  
1
2
3
VØH  
0.8VDD  
V
(Connect to pin  
through a capacitor)  
(Connect to GND  
Analog bias voltage  
through a capacitor)  
NOTES :  
1. Applied to input pins HD, VD, SDI and SCLK.  
2. Applied to input pins SIGIN and REFIN. Do not connect to DC directly.  
3. Applied to pins BIAS1, BIAS2, BIAS3, OFS, ADL, DAL, DAH, CLP1 and CLP2.  
Do not connect to GND directly.  
4
LZ0P3800  
CHARACTERISTICS (1/30 s progressive scan readout mode)  
(TA : +25 ˚C, Operating conditions : The typical values specified in "RECOMMENDED OPERATING CONDITIONS"  
.
Color temperature of light source : 3 200 K)  
• Measurement point : Analog image signal output (pin no. 34), before AGC circuit and AD converter.  
PARAMETER  
Standard output voltage  
Saturation output voltage  
Sensitivity (Green channel)  
Resolution (at center)  
Resolution (at corner)  
Shading  
SYMBOL  
MIN.  
TYP.  
150  
1 000  
300  
150  
100  
40  
MAX.  
UNIT  
mV  
mV  
mV  
TV line  
TV line  
%
%
mA  
NOTE  
V
O
1
2
3
4
5
6
7
8
V
SAT  
R
600  
200  
Difference of center position  
Supply current  
±10  
I
VDD  
10  
NOTES :  
1. The average output voltage of G signal in the central  
area (H/10, V/10) under uniform illumination.  
5. The resolution in the peripheral area (image height : Y =  
0.8) under the conditions mentioned above.  
The standard exposure conditions are defined as when  
VO is 150 mV.  
6. Defined by the following formula at the brightness of  
standard output voltage : (Vco/Vce) x 100 [%]  
2. The average output voltage of G signal in the central  
area (H/10, V/10) under 10 times exposure of the  
standard exposure conditions.  
3. The average output voltage of G signal in the central  
area (H/10, V/10) when a 1 000 lux light source with a  
white board of 90% reflector is imaged.  
4. The resolution in the central area (H/10, V/10) at which  
the image of the TV resolution chart (ex. EIAJ test chart)  
can be distinguished on the B/W video monitor when  
converted into composite video signals.  
Vco : Output voltage at edge (image height : Y = 0.8) of  
the image (at video output).  
Vce : Output voltage at center of the image (at video output).  
7. The difference between the center position of image and  
that of the monitor. This is the ratio for the horizontal  
underscanning monitor size which includes the decentering  
eccentricity when turning the lens head one time.  
8. Total current of analog and digital power supplies, in the  
dark and at the standard load conditions.  
LENS SPECIFICATIONS  
PARAMETER  
Construction  
Focal length  
F No.  
SPECIFICATION  
NOTE  
Single (non-spherical, plastic)  
4.0 mm [TYP. : reference]  
2.8±5%  
Viewing angle  
H : 52˚, V : 40˚, Diagonal : 65˚ [TYP. : reference]  
TV distortion  
≤ –3.2%  
∞ to 10 cm  
0.00005 to 0.001 N·m  
1
2
3
Focus adjustment range  
Torque of focusing  
NOTES :  
1. TV distortion is defined by the formula, (∆y/y) x 100 [%]  
at capturing rectangular pattern sized horizontal by  
vertical as 4 by 3.  
2. The best focus point of an object can be obtained by  
turning the lens head within this range.  
3. Torques which are necessary for turning the lens.  
"y" is defined as the vertical height of the center of the  
horizontal line.  
∆y is defined as the difference between the vertical height  
of the center of the horizontal line and an edge of it.  
* Be careful not to remove the lens head by turning it  
counterclockwise too much when adjusting macro.  
∆y  
y
5
LZ0P3800  
PIXEL STRUCTURE  
OPTICAL BLACK  
(4 PIXELS)  
OPTICAL BLACK  
(13 PIXELS)  
OPTICAL BLACK  
(13 PIXELS)  
367 (H) X 291 (V)  
• OB (A) : Reference signal  
formed by optically shielded  
pixels.  
OB OB  
(A) (B)  
OB OB  
(B) (A)  
6
7
7
6
• OB (B) : Standard signal gen-  
erated electrically.  
OPTICAL BLACK  
(4 PIXELS)  
COLOR FILTER ARRAY  
(1, 291)  
(367, 291)  
R
G
R
G
R
G
G
R
G
R
G
R
G
G
B
G
B
G
B
R
G
R
G
R
G
R
G
R
G
R
G
G
B
G
B
G
B
R
G
R
G
R
G
G
R
G
R
G
R
G
B
G
B
G
B
B
G
B
G
B
G
B
G
B
G
B
G
G
R
G
R
G
R
B
G
B
G
B
G
G
R
G
R
G
R
G
R
G
R
G
R
B
G
B
G
B
G
G
R
G
R
G
R
B
G
B
G
B
G
G
R
G
R
G
R
R
G
R
G
R
(1, 1)  
(367, 1)  
6
LZ0P3800  
TIMING CHART  
HORIZONTAL PULSE TIMING  
HD  
906 910  
01  
4
8
12 16 20 24 28 32 36 40 44 48 52 56 60 64 68 72 76 80 84 889092  
CLK  
Normal  
ADOUT  
(D0-D7)  
361 363 365 367OBB  
OBBOBA  
OBBOBA  
OBA  
OBA  
ππππ  
ππππ  
πππππ  
πππππ  
Mirror  
7
5
3
1
OBB  
HD  
104 108 112 116 120 124 128 132 136 140 144 148 152 156 160 164 168 172 176 180 184 188 192 196 200  
CLK  
Normal  
Mirror  
ADOUT  
(D0-D7)  
OBA  
OBA  
OBAOBB  
OBAOBB  
OBB  
2
4
6
8
10  
ππππ  
ππππ  
OBB 366 364 362 360 358  
• The rising edge of the HD pulse must be between two rising edges of CLK (0) and CLK (1).  
• The falling edge of the HD pulse must be between two rising edges of CLK (78) and CLK (79).  
PHASE RELATIONS BETWEEN DIGITAL OUTPUT (ADOUT) AND CLOCK (CLK)  
CLK  
SYMBOL MIN. TYP. MAX. UNIT  
∆t  
∆t  
0
15  
40  
ns  
ADOUT  
(D0-D7)  
SDI, SCLK  
Forbidden Period  
VERTICAL PULSE TIMING  
VD  
HD  
328 329 330  
1
2
3
4
5
6
7
8
9
10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39  
Normal  
Mirror  
ADOUT  
(D0-D7)  
288 289 290 291 OB OB OB OB  
OB OB  
OB OB  
4
3 2 1 OB OB OB OB  
• The rising edge and falling edge of the VD pulse must be in high period of the HD pulses.  
SERIAL DATA TIMING (SDI, SCLK)  
AGC  
Offset  
Shutter  
D0  
D10  
D20  
D30  
D38  
SDI  
SCLK  
• Data in SDI are taken at the rising edge of SCLK.  
• Clock frequency of SCLK should be 1/16 of that of CLK.  
• Do not insert the SDI and SCLK pulses between 36H* and 37H*. Refer to "VERTICAL PULSE TIMING".  
• Refer to "SERIAL DATA INPUTS" for the contents of serial data from D0 to D38.  
* It means ordinal number of the HD pulse.  
7
LZ0P3800  
SERIAL DATA INPUTS  
DATA  
D0  
NAME  
FUNCTION  
Not used.  
D1  
D2  
D3  
(Fix to low level.)  
Auto gain control  
(0 to 20 dB)  
AGC7 (MSB)  
AGC6  
D4  
AGC5  
D5  
AGC4  
D6  
AGC3  
D7  
AGC2  
D8  
AGC1  
D9  
AGC0 (LSB)  
D10  
D11  
D12  
D13  
D14  
D15  
D16  
D17  
D18  
D19  
D20  
D21  
D22  
D23  
D24  
D25  
D26  
D27  
D28  
D29  
D30  
D31  
D32  
D33  
D34  
D35  
D36  
D37  
D38  
Not used.  
(Fix to low level.)  
OFS7 (MSB)  
OFS6  
OFS5  
OFS4  
OFS3  
OFS2  
OFS1  
OFS0 (LSB)  
Offset level control of AGC output  
(0.9 to 1.5 V)  
Not used. (Fix to low level.)  
Shutter speed control  
(Exposure time is 1 to 1/330 frame period.)  
SHT8 (MSB)  
SHT7  
SHT6  
SHT5  
SHT4  
SHT3  
SHT2  
SHT1  
SHT0 (LSB)  
MIRH  
H : Horizontal mirror inversion image, L : Normal image  
H : Vertical mirror inversion image, L : Normal image  
Phase selection of AD clock  
(Fix to low level.)  
Selection of fixed gain  
MIRV  
SAD1 (MSB)  
SAD0 (LSB)  
MAX2 (MSB)  
MAX1  
MAX0 (LSB)  
LPMD  
(3 to 10 dB)  
H : Power save mode (AGC and AD off), L : All active  
8
LZ0P3800  
Setting of Auto Gain Control  
• One LSB of the gain code represents approximately 0.078 dB.  
• Nominal gain values at typical codes are shown below.  
AUTO GAIN CONTROL  
D2  
D3  
D4  
D5  
D6  
D7  
D8  
D9  
(dB)  
0
1
L
L
L
L
L
L
L
L
H
L
H
L
L
H
L
H
L
L
H
L
L
H
H
L
L
L
H
H
L
L
L
L
H
L
H
L
L
H
L
H
L
L
H
L
H
L
L
L
H
H
H
L
L
L
H
H
L
L
L
H
H
H
L
L
H
L
L
H
L
H
H
L
H
L
L
H
L
2
L
L
L
3
4
5
6
7
8
9
10  
11  
12  
13  
14  
15  
16  
17  
18  
19  
20  
L
L
L
L
L
L
L
H
H
H
H
H
H
H
H
H
H
H
L
L
H
H
L
L
L
H
H
L
L
L
H
H
H
H
H
L
L
L
L
L
H
H
L
H
H
H
L
H
H
L
H
L
L
H
H
L
H
L
L
H
H
H
L
L
H
H
H
L
H
L
H
H
H
H
H
L
L
H
H
H
H
H
H
H
H
L
H
H
Setting of Offset Level  
• One LSB of the offset code represents approximately 0.002 V.  
• Nominal offset values at typical codes are shown below.  
OFFSET LEVEL (V)  
D13  
L
L
D14  
L
L
H
L
L
D15  
L
H
L
L
H
L
D16  
L
L
H
L
L
D17  
L
H
L
L
H
L
D18  
L
L
H
L
L
D19  
L
H
L
L
H
L
D20  
L
H
H
L
L
H
H
0.9  
1.0  
1.1  
1.2  
1.3  
1.4  
1.5  
L
H
H
H
H
H
H
H
H
H
H
H
H
H
9
LZ0P3800  
Setting of Shutter Speed  
• One LSB of the shutter speed code represents 1H, where 1H is the HD pulse period.  
• Shutter speed values at typical codes are shown below.  
SHUTTER SPEED  
D22  
D23  
D24  
D25  
D26  
D27  
D28  
D29  
D30  
(Exposure Time Unit : 1H)  
330  
329  
328  
·
L
L
L
L
L
L
L
L
L
L
L
L
L
L
L
L
L
L
L
L
L
L
L
H
L
H
L
300  
·
·
200  
·
·
100  
·
·
10  
·
L
L
L
H
H
L
L
L
L
L
H
L
L
L
H
L
L
L
H
L
H
H
H
L
L
L
L
L
L
H
H
H
L
H
L
H
3
2
1
H
H
H
L
L
L
H
H
H
L
L
L
L
L
L
L
H
H
H
L
L
H
L
L
H
L
H
Setting of Fixed Gain  
• One LSB of the gain code represents 1 dB.  
FIXED GAIN  
D35  
D36  
D37  
(dB)  
3
4
5
6
7
8
9
10  
L
L
L
L
L
H
H
L
L
H
H
L
H
L
H
L
H
L
H
L
H
H
H
H
10  
LZ0P3800  
EXAMPLE OF OPERATION CIRCUIT  
D3  
D4  
DGND  
AGND  
DAH  
D5  
D6  
DAL  
D7  
ADL  
CLK  
HD  
OFS  
AVDD  
VD  
AGND  
AGCOUT  
BIAS3  
AGCSET  
REFIN  
SDI  
SCLK  
NC  
+
BIAS2  
11  
PACKAGES FOR CCD AND CMOS DEVICES  
PACKAGE  
(Unit : mm)  
36 WLCC TYPE  
+0  
–0.1  
16.0  
+0  
–0.1  
Approx. 10  
7.5  
5.0  
16.0  
32-0.50  
1.35  
P1.0  
Ø12.0  
4-R0.2  
2.0  
4-R0.5  
+0  
2-Ø1.1  
4-R1.0  
18  
31  
36  
–0.1  
2-R0.95  
2-Ø1.35  
±0.05  
2-Ø1.55  
+0  
–0.1  
13  
Ø11.0  
12  
1
2-C0.2  
1.0  
2.9  
6.0  
1
2.0  
4-R0.5  
36-R0.2  
15.6  
32-1.0  
4-1.55  
P1.0  
0.5  
±0.1  
±0.1  
13.3  
15.6  
¿Applicable model¡  
LZ0P3800  
12  
PRECAUTIONS FOR BUILT-IN LENS CMOS IMAGE SENSORS  
PRECAUTIONS FOR BUILT-IN LENS  
CMOS IMAGE SENSORS  
1. Package Breakage  
2. Electrostatic Damage  
In order to prevent the package, the lens holder,  
and the lens from being broken, follow the  
instructions below :  
As compared with general MOS-LSI, CMOS image  
sensor has lower ESD. Therefore, take the  
following anti-static measures when handling the  
CMOS image sensor :  
1) The CMOS image sensor is a precise optical  
component and the package-base material is  
ceramic.  
1) Always discharge static electricity by grounding  
the human body and the instrument to be used.  
To ground the human body, provide resistance  
of about 1 M$ between the human body and  
the ground to be on the safe side.  
2) When directly handling the device with the  
fingers, hold the lens holder and do not touch  
the lead.  
3) To avoid generating static electricity,  
a. do not scrub the device with cloth etc.  
b. do not attach any tape or labels.  
4) When storing or transporting the device, put it in  
a container of conductive material.  
Therefore,  
ø Take care not to drop the device when  
mounting, handling, or transporting.  
ø Avoid giving a shock to the package.  
Especially when leads are fixed to the socket  
or the circuit board, a small shock could  
break the package more easily than when  
the package isn’t fixed.  
2) When adjusting the focus, screw the lens holder  
to the circuit board before soldering the leads.  
At that time, make sure to use a circuit board  
with plenty of strength, and to avoid the  
package and the lens holder from being broken,  
the following screw and clamp torque are  
recommended.  
3. Dust and Contamination  
Dust or contamination on the surface of the lens  
and the inside of the lens holder could deteriorate  
the output characteristics or cause a scar. In order  
to minimize dust or contamination on the device,  
take the following precautions :  
ø Recommended mounting screw :  
Ø1.7 tapping screw (B-tight type),  
Length, L = the thickness of the circuit board  
+ 6 mm  
1) Do not remove the lens from the body.  
Especially when adjusting macro, be careful  
not to remove the lens by turning it counter-  
clockwise too much.  
2) Do not touch the surface of the lens with the  
fingers. If dust or contamination gets on the  
surface of the lens, the following cleaning  
method is recommended :  
ø Recommended clamp torque : 0.012 N·m  
[however, when the thickness of the circuit  
board is thinner than t = 2.0 mm]  
3) If any damage or breakage occurs on the  
surface of the lens, its characteristics could  
deteriorate.  
Therefore,  
ø Do not hit the lens.  
ø Do not give a shock large enough to cause  
distortion.  
ø Do not scrub or scratch the surface of the  
lens.  
ø Handle the built-in lens CMOS image sensor  
in a clean environment such as a cleaned  
booth. (The cleanliness level should be, if  
possible, class 1 000 at least.)  
– Even a soft cloth or applicator, if dry, could  
cause dust to scratch the lens.  
13  
PRECAUTIONS FOR BUILT-IN LENS CMOS IMAGE SENSORS  
ø Dust from static electricity should be blown  
ø Do not put too much force onto the lens and  
the lens holder while soldering.  
ø Be careful not to let the soldering iron touch  
the lens holder.  
off with an ionized air blower. For anti-  
electrostatic measures, however, ground all  
the leads on the device before blowing off  
the dust.  
– Soldering can be quickly/neatly done by  
laying the soldering iron so it lightly touches  
the border between the package and the  
circuit board and sliding it in sideways.  
2) There is no guarantee of the performance of  
the device which has been removed or  
resoldered after being soldered once under the  
conditions mentioned above.  
ø The contamination on the surface of the lens  
should be wiped off with a clean applicator  
soaked in isopropyl alcohol. Wipe slowly and  
gently in one direction only.  
– Frequently replace the applicator and do not  
use the same applicator to clean more than  
one device.  
ø Make sure there is no dust or contamination  
on the lens and screw it on the lens holder.  
– In case there seems to be an inferior device,  
consult with our sales office before removing  
it.  
4. Other  
3) Avoid using or storing the CMOS image sensor  
at high temperature or high humidity as it is a  
precise optical component. Do not give a  
mechanical shock to the CMOS image sensor.  
4) Do not expose the device to strong light. For  
the color device, long exposure to strong light  
will fade the color of the color filters.  
1) Soldering should be manually performed within  
2 seconds per pin at 400 ˚C maximum at  
soldering iron.  
ø Use ESD-measured soldering iron  
ø The conditions of the soldering time in which  
the soldering iron touches the package.  
– In case where the soldering may exceed 2  
seconds per pin, resume the work after the  
device returns to normal temperature.  
14  
厂商 型号 描述 页数 下载

APITECH

LZ0402B105MBNBB [ Data Line Filter, 1 Function(s), 25V, 0.05A, EIA STD PACKAGE SIZE 0402, 2 PIN ] 4 页

APITECH

LZ0402B105MBNBT [ Data Line Filter, 1 Function(s), 25V, 0.05A, EIA STD PACKAGE SIZE 0402, 2 PIN ] 4 页

APITECH

LZ0402Y155MBNBB [ Data Line Filter, 1 Function(s), 25V, 0.05A, EIA STD PACKAGE SIZE 0402, 2 PIN ] 4 页

APITECH

LZ0402Y155MBNBT [ Data Line Filter, 1 Function(s), 25V, 0.05A, EIA STD PACKAGE SIZE 0402, 2 PIN ] 4 页

APITECH

LZ0402Y205MBNBB [ Data Line Filter, 1 Function(s), 25V, 0.05A, EIA STD PACKAGE SIZE 0402, 2 PIN ] 4 页

APITECH

LZ0402Y205MBNBT [ Data Line Filter, 1 Function(s), 25V, 0.05A, EIA STD PACKAGE SIZE 0402, 2 PIN ] 4 页

APITECH

LZ0402Z824MBNBT [ Data Line Filter, 1 Function(s), 25V, 0.05A, EIA STD PACKAGE SIZE 0402, 2 PIN ] 4 页

APITECH

LZ0603A103MCNAB [ Data Line Filter, 1 Function(s), 25V, 0.1A, EIA STD PACKAGE SIZE 0603, 2 PIN ] 4 页

APITECH

LZ0603A103MCNAT [ Data Line Filter, 1 Function(s), 25V, 0.1A, EIA STD PACKAGE SIZE 0603, 2 PIN ] 4 页

APITECH

LZ0603A104MCNAB [ Data Line Filter, 1 Function(s), 25V, 0.1A, EIA STD PACKAGE SIZE 0603, 2 PIN ] 4 页

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