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PXFC192207SH

型号:

PXFC192207SH

品牌:

INFINEON[ Infineon ]

页数:

8 页

PDF大小:

1072 K

PXFC192207SH  
Thermally-Enhanced High Power RF LDMOS FET  
220 W, 28 V, 1805 – 1990 MHz  
Description  
PXFC192207SH  
Package H-37288G-4/2  
The PXFC192207SH is a 220-watt LDMOS FET intended for  
use in multi-standard cellular power amplifier applications in  
the 1805 to 1990 MHz frequency band. Features include input  
and output matching, high gain and thermally-enhanced pack-  
age with earless flanges. Manufactured with Infineon's ad-  
vanced LDMOS process, this device provides excellent thermal  
performance and superior reliability.  
Features  
Two-carrier WCDMA Drive-up  
VDD = 28 V, IDQ = 1600 mA, VGS = 2.75 V,  
ƒ = 1880 MHz, 3GPP WCDMA signal,  
PAR = 8 dB, 10 MHz carrier spacing,  
BW 3.84 MHz  
Broadband internal input and output matching  
Typical Pulsed CW performance, 1880 MHz, 28 V,  
10 µs pulse width, 10% duty cycle, class AB  
- Output power at P  
- Efficiency = 55%  
- Gain = 20 dB  
= 220 W  
1dB  
22  
21  
20  
19  
18  
17  
16  
15  
56  
48  
40  
32  
24  
16  
8
Gain  
Typical single-carrier WCDMA performance, 1880  
MHz, 28 V, 10 dB PAR @ 0.01% CCDF  
- Output power = 50 W  
- Efficiency = 29%  
- Gain = 20 dB  
- ACPR = –34 dBc @5 MHz  
Capable of handling 10:1 VSWR @28 V, 200 W  
(CW) output power  
Efficiency  
Integrated ESD protection  
Low thermal resistance  
0
c192207sh_g1  
29  
33  
37  
41  
45  
49  
53  
Pb-free and RoHS compliant  
Output Power (dBm)  
RF Characteristics  
Two-carrier WCDMA Specifications (tested in Infineon production test fixture)  
= 28 V, I = 1600 mA, P = 50 W avg, ƒ = 1980 MHz, ƒ = 1990 MHz, 3GPP signal, channel bandwidth = 3.84 MHz,  
V
DD  
DQ  
OUT  
1
2
peak/average = 8 dB @ 0.01% CCDF  
Characteristic  
Gain  
Symbol  
Min  
19  
Typ  
20  
Max  
Unit  
dB  
G
ps  
Drain Efficiency  
Intermodulation Distortion  
hD  
29  
30.5  
–32  
%
IMD  
–29  
dBc  
All published data at T  
= 25°C unless otherwise indicated  
CASE  
ESD: Electrostatic discharge sensitive device—observe handling precautions!  
Data Sheet 1 of 8  
Rev. 02, 2014-10-31  
PXFC192207SH  
DC Characteristics  
Characteristic  
Conditions  
Symbol  
Min  
65  
Typ  
Max  
Unit  
V
Drain-Source Breakdown Voltage  
Drain Leakage Current  
V
GS  
= 0 V, I = 10 mA  
V(  
BR)DSS  
DS  
V
V
= 28 V, V = 0 V  
I
I
1
µA  
µA  
W
DS  
DS  
GS  
DSS  
DSS  
= 63 V, V = 0 V  
10  
GS  
On-State Resistance  
Operating Gate Voltage  
Gate Leakage Current  
V
GS  
= 10 V, V = 0.1 V  
R
0.03  
2.6  
DS  
DS(on)  
V
= 28 V, I  
= 1600 mA  
V
GS  
2.3  
2.9  
1
V
DS  
DQ  
V
GS  
= 10 V, V = 0 V  
I
GSS  
µA  
DS  
Maximum Ratings  
Parameter  
Symbol  
Value  
65  
Unit  
V
Drain-Source Voltage  
Gate-Source Voltage  
Operating Voltage  
V
DSS  
V
–6 to +10  
0 to +32  
225  
V
GS  
DD  
V
V
Junction Temperature  
Storage Temperature Range  
T
°C  
J
T
STG  
–65 to +150  
0.28  
°C  
Thermal Resistance (T  
= 70°C, 200 W CW)  
R
qJC  
°C/W  
CASE  
Ordering Information  
Type and Version  
Order Code  
Package Description  
Shipping  
PXFC192207SH V1 R250  
PXFC192207SHV1R250XTMA1  
H-37288G-4/2, earless flange  
Tape & Reel, 250 pcs  
Data Sheet  
2 of 8  
Rev. 02, 2014-10-31  
PXFC192207SH  
Typical Performance (data taken in a production test fixture)  
Two-carrier WCDMA Drive-up  
Two-carrier WCDMA Drive-up  
VDD = 28 V, IDQ = 1600 mA, VGS = 2.75 V,  
ƒ = 1880 MHz, 3GPP WCDMA signal,  
PAR = 8 dB, 10 MHz carrier spacing,  
BW 3.84 MHz  
VDD = 28 V, IDQ = 1600 mA, VGS = 2.75V,  
3GPP WCDMA signal, PAR = 8 dB,  
10 MHz carrier spacing, BW 3.84 MHz  
-15  
-25  
-35  
-45  
-55  
-65  
-5  
-15  
-25  
-35  
-45  
-55  
-65  
60  
50  
40  
30  
20  
10  
0
IMD Low  
IMD Up  
ACPR  
Efficiency  
1805 IMDL  
1842.5 IMDL  
1880 IMDL  
1805 IMDU  
1842.5 IMDU  
1880 IMDU  
c192207sh_g3  
c192207sh_g2  
29  
33  
37  
41  
45  
49  
53  
29  
33  
37  
41  
45  
49  
53  
Output Power (dBm)  
Output Power (dBm)  
Pulsed CW Performance  
VDD = 28 V, IDQ = 1600 mA  
Pulsed CW Performance at various VDD  
IDQ = 1600 mA, ƒ = 1880 MHz  
1805 Gain  
1842.5 Gain  
1880 Gain  
1805 Eff  
22  
60  
21  
60  
Gain  
1842.5 Eff  
1880 Eff  
21  
20  
19  
18  
17  
16  
50  
40  
30  
20  
10  
0
20  
19  
18  
17  
16  
15  
50  
40  
30  
20  
10  
0
Gain  
24V Gain  
28V Gain  
32V Gain  
24V Eff  
28V Eff  
Efficiency  
Efficiency  
c192207sh_g5  
c192207sh_g4  
27  
32  
37  
42  
47  
52  
57  
27  
32  
37  
42  
47  
52  
57  
Output Power (dBm)  
Output Power (dBm)  
`Data Sheet  
3 of 8  
Rev. 02, 2014-10-31  
PXFC192207SH  
Typical Performance (cont.)  
Small Signal CW Performance  
Gain & Input Return Loss  
VDD = 28 V, IDQ = 1600 mA  
21  
20  
19  
18  
17  
0
Gain  
-5  
-10  
-15  
-20  
IRL  
c192207sh_g6  
1650  
1750  
1850  
1950  
2050  
Frequency (MHz)  
Broadband Circuit Impedance  
D
Z Source W  
Z Load W  
Freq  
[MHz]  
Z Source  
Z Load  
R
jX  
R
jX  
1805  
1843  
1880  
1.57  
1.50  
1.42  
–6.18  
–5.97  
–5.76  
1.13  
1.11  
1.09  
–3.50  
–3.32  
–3.18  
G
S
Load Pull Performance  
Main Side Load Pull Performance – Pulsed CW signal: 10 µs, 10% duty cycle, V  
= 28 V, I  
= 1600 mA  
DQ  
DD  
P
1dB  
Max Output Power  
Max PAE  
Zs  
[W]  
Freq  
[MHz]  
Zl  
[W]  
Gain  
[dB]  
P
P
PAE  
[%]  
Zl  
[W]  
Gain  
[dB]  
P
P
OUT  
PAE  
OUT  
OUT  
OUT  
[dBm]  
54.30  
54.40  
54.30  
54.10  
[W]  
269  
275  
269  
257  
[dBm]  
52.30  
53.00  
52.50  
52.00  
[W]  
170  
200  
178  
158  
[%]  
61.7  
62.1  
61.2  
60.1  
1805 0.62 – j4.61 0.79 – j3.74  
1880 1.25 – j5.48 0.82 – j3.85  
1930 1.83 – j6.05 0.79 – j4.00  
1990 3.23 – j6.50 0.81 – j4.14  
19.7  
19.9  
19.5  
20.1  
50.8  
52.8  
51.1  
51.4  
2.00 – j3.31  
1.62 – j3.45  
1.60 – j3.33  
1.40 – j3.31  
22.7  
22.1  
22.2  
22.7  
Data Sheet  
4 of 8  
Rev. 02, 2014-10-31  
PXFC192207SH  
Reference Circuit , 1805 – 1880 MHz  
R803 C803  
R802 C801 C802  
RO4350, .020  
(62)  
R801  
S3  
VDD  
R804  
S1  
S2  
VDD  
R102  
C209  
C204 C205  
C203  
C103  
C104  
R101  
C202  
C201  
RF_OUT  
RF_IN  
C102  
C101  
C206  
C207 C208  
C210  
VDD  
RO4350, .020  
PXFC192207SH_IN_01  
PXFC192207SH_OUT_01  
p
x f c 1 9 2 2 0 7 s h _ C D _ 1 0 - 2 4 - 2 0 1 4  
Reference circuit assembly diagram (not to scale)  
`Data Sheet  
5 of 8  
Rev. 02, 2014-10-31  
PXFC192207SH  
Reference Circuit (cont.)  
Reference Circuit Assembly  
DUT  
PXFC192207SH V1  
Test Fixture Part No.  
PCB  
LTN/PXFC192207SH V1  
Rogers 4350, 0.508 mm [0.020”] thick, 2 oz. copper, εr = 3.66, ƒ = 1805 – 1880 MHz  
Find Gerber files for this test fixture on the Infineon Web site at http://www.infineon.com/rfpower  
Components Information  
Component  
Description  
Suggested Manufacturer  
P/N  
Input  
C101, C103  
Capacitor, 33 pF  
Capacitor, 0.9 pF  
Capacitor, 10 µF  
Capacitor, 1000 pF  
Resistor, 10 W  
ATC  
ATC800A330JT250  
ATC800A0R9CT250  
UMK325C7106MM-T  
ECJ-1VB1H102K  
ERJ-8GEYJ100V  
ERJ-8GEYJ101V  
ERJ-3GEYJ132V  
ERJ-3GEYJ122V  
BCP56  
C102  
ATC  
C104  
Taiyo Yuden  
C801, C802, C803  
Panasonic Electronic Components  
Panasonic Electronic Components  
Panasonic Electronic Components  
Panasonic Electronic Components  
Panasonic Electronic Components  
Infineon Technologies  
Texas Instruments  
R101, R102, R801  
R802  
R803  
R804  
S1  
Resistor, 100 W  
Resistor, 1300 W  
Resistor, 1200 W  
Transistor  
S2  
Voltage Regulator  
Potentiometer, 2k W  
LM78L05ACM  
S3  
Bourns Inc.  
3224W-1-202E  
Output  
C201  
C202  
Capacitor, 33 pF  
Capacitor, 0.5 pF  
Capacitor, 10 µF  
ATC  
ATC800A330JT250  
ATC800B0R5CW500  
UMK325C7106MM-T  
ATC  
C203, C204, C205,  
C206, C207, C208  
Taiyo Yuden  
C209, C210  
Capacitor, 220 µF  
Panasonic Electronic Components  
EEE-FP1V221AP  
Data Sheet  
6 of 8  
Rev. 02, 2014-10-31  
PXFC192207SH  
Package Outline Specifications  
Package H-37288G-4/2  
+0.13  
-0.08  
2X 0.13  
21.72  
[.855]  
+.005  
.005  
[
]
-.003  
(SPH V)  
D
45° x .64  
[.025]  
1.49±0.25  
[.059±.010]  
1.98  
[.078]  
+0.25  
1.00  
-0.10  
+.010  
.039  
2X 2.29  
[.090]  
[
]
-.004  
2X 30.0°  
V
D
V
9.78  
[.385]  
(14.75±0.50  
[.581±.020])  
C
L
C
L
9.40  
[.370]  
G
+.38  
-.13  
4X R0.51  
+.015  
-.005  
R.020  
[
]
C
L
4X 5°±3°  
2X 17.75  
[.699]  
2X 0.13±0.08  
[.005±.003]  
(SPH D, G)  
+.25  
-.13  
4.04  
.159  
22.35±.20  
+.010  
-.005  
[.880±.008]  
[
]
1.02  
[.040]  
H-37288G-4/2_gw_po_01_07-18-2013  
23.11  
[.910]  
S
Diagram Notes—unless otherwise specified:  
1. Interpret dimensions and tolerances per ASME Y14.5M-1994.  
2. Primary dimensions are mm. Alternate dimensions are inches.  
3. All tolerances 0.127 [.005] unless specified otherwise.  
4. Pins: D – drain; G – gate; S – source; V – VDD.  
5. Lead thickness: 0.10 + 0.051/-0.025 mm [.004 +0.002/-0.001 inch].  
6. Gold plating thickness: 1.14 0.38 micron [45 15 microinch].  
Find the latest and most complete information about products and packaging at the Infineon Internet page  
http://www.infineon.com/rfpower  
`Data Sheet  
7 of 8  
Rev. 02, 2014-10-31  
PXFC192207SH V1  
Revision History  
Revision  
Date  
Data Sheet Type  
Advance  
Page  
All  
Subjects (major changes since last revision)  
01  
02  
2014-07-24  
2014-10-31  
Data Sheet reflects advance specification for product development  
Data Sheet reflects released product specification  
Production  
All  
We Listen toYour Comments  
Any information within this document that you feel is wrong, unclear or missing at all?  
Your feedback will help us to continuously improve the quality of this document.  
Please send your proposal (including a reference to this document) to:  
highpowerRF@infineon.com  
To request other information, contact us at:  
+1 877 465 3667 (1-877-GO-LDMOS) USA  
or +1 408 776 0600 International  
Edition 2014-10-31  
Published by  
Infineon Technologies AG  
85579 Neubiberg, Germany  
© 2014 Infineon Technologies AG  
All Rights Reserved.  
Legal Disclaimer  
The information given in this document shall in no event be regarded as a guarantee of conditions or characteristics.  
With respect to any examples or hints given herein, any typical values stated herein and/or any information regarding the  
application of the device, Infineon Technologies hereby disclaims any and all warranties and liabilities of any kind,  
including without limitation, warranties of non-infringement of intellectual property rights of any third party.  
Information  
For further information on technology, delivery terms and conditions and prices, please contact the nearest  
Infineon Technologies Office (www.infineon.com/rfpower).  
Warnings  
Due to technical requirements, components may contain dangerous substances. For information on the types in question,  
please contact the nearest Infineon Technologies Office.  
Infineon Technologies components may be used in life-support devices or systems only with the express written approval of In-  
fineon Technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support device  
or system or to affect the safety or effectiveness of that device or system. Life support devices or systems are intended to be  
implanted in the human body or to support and/or maintain and sustain and/or protect human life. If they fail, it is  
reasonable to assume that the health of the user or other persons may be endangered.  
Data Sheet  
8 of 8  
Rev. 02, 2014-10-31  
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