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IX4340NE

型号：

IX4340NE

品牌：

IXYS[ IXYS CORPORATION ]

页数：

10 页

PDF大小：

250 K

下载PDF手册
IX4340  
5-Ampere, Dual Low-Side  
MOSFET Driver  
INTEGRATED  
C
IRCUITS  
D
IVISION  
Features  
Description  
• Two Independent Drivers, Each Capable of Sourcing  
and Sinking 5A  
The IX4340 is a dual, high current, low side gate  
driver. Each of the two outputs is capable of sourcing  
and sinking 5A of peak current, and has a maximum  
voltage rating of 20V. The two outputs can be  
paralleled for higher current applications. Fast  
propagation delay times (16ns typical) and fast rise  
and fall times (7ns) make the IX4340 well suited for  
high frequency applications.  
• CMOS and TTL Compatible Inputs  
• Independent Enable for Each Driver  
• 5V to 20V Supply Voltage Range  
• -40°C to +125°C Extended Operating Temperature  
Range  
• ±4kV ESD Rating (Human Body Model)  
• Thermally enhanced 8-pin SOIC and 8-pin MSOP  
packages and standard 8-pin SOIC package  
• Under Voltage Lockout Circuitry  
The inputs are TTL and CMOS logic compatible, and  
there is an independent Enable function for each  
output. Under voltage lockout circuitry (UVLO)  
prevents the high side source driver from conducting  
until there is sufficient supply voltage. The outputs are  
held low if the logic inputs are floating.  
• Fast Propagation Delays (16ns typical)  
• Fast Rise and Fall Times (7ns typical)  
Applications  
• Switch-Mode Power Supplies  
• DC-DC Converters  
• Motor Controllers  
The IX4340 is available in standard 8-pin SOIC and  
thermally enhanced 8-pin SOIC and MSOP packages.  
• Power Inverters  
Ordering Information  
Part Number Description  
IX4340N  
8-Pin SOIC (100/Tube)  
8-Pin SOIC (4000/Reel)  
IX4340NTR  
8-Pin SOIC w/ Exposed Thermal Pad  
(100/Tube)  
IX4340NE  
8-Pin SOIC w/ Exposed Thermal Pad  
(4000/Reel)  
IX4340NETR  
IX4340UE  
8-Pin MSOP w/ Exposed Thermal Pad  
(100/Tube)  
8-Pin MSOP w/ Exposed Thermal Pad  
(5000/Reel)  
IX4340UETR  
IX4340 Functional Block Diagram  
VCC  
VCC  
ENA  
INA  
1
2
3
4
8
7
6
5
ENB  
VCC  
OUTA  
VCC  
VCC  
VCC  
GND  
INB  
UVLO  
VCC  
OUTB  
DS-IX4340-R05  
www.ixysic.com  
1
IX4340  
INTEGRATED  
C
IRCUITS  
D
IVISION  
1. Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3  
1.1 Pin Configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3  
1.2 Logic Table . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3  
1.3 Pin Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3  
1.4 Absolute Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3  
1.5 Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4  
1.6 Thermal Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4  
2. Performance Data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5  
3. Manufacturing Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7  
3.1 Moisture Sensitivity . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7  
3.2 ESD Sensitivity . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7  
3.3 Soldering Profile. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7  
3.4 Board Wash . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7  
3.5 Mechanical Dimensions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8  
2
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R05  
IX4340  
INTEGRATED  
C
IRCUITS  
D
IVISION  
1 Specifications  
1.1 Pin Configuration  
1.2 Logic Table  
V
IXx  
1
ENx  
OUTx  
CC  
ENA  
INA  
1
2
3
4
8
7
6
5
ENB  
1
1
0
x
V
V
V
V
>UVLO  
>UVLO  
>UVLO  
<UVLO  
1
0
0
0
CC  
CC  
CC  
CC  
ON  
ON  
ON  
ON  
0
OUTA  
A
B
x
VCC  
GND  
INB  
x
OUTB  
1.3 Pin Definitions  
Pin # Name Description  
Enable input for Channel A. A logic high (or floating) enables Channel A (the state of OUTA is determined by INA). A logic  
low disables OUTA (OUTA held low regardless of INA).  
1
ENA  
2
3
4
5
6
7
INA Channel A logic input. Internally pulled to GND.  
GND Ground. Common ground reference for the device.  
INB Channel B logic input. Internally pulled to GND.  
OUTB Channel B output, capable of sourcing and sinking 5A  
V
Supply Voltage.  
CC  
OUTA Channel A output, capable of sourcing and sinking 5A  
Enable input for Channel B. A logic high (or floating) enables Channel B (the state of OUTB is determined by INB). A logic  
low disables OUTB (OUTB held low regardless of INB).  
8
ENB  
The thermal pad on the bottom of the thermally enhanced devices, IX4340NE and IX4340UE, may be connected to GND or left floating;  
it must not be connected to any other net. The thermal pad is not intended to carry current.  
1.4 Absolute Maximum Ratings  
Parameter  
Symbol  
Minimum  
Maximum  
Units  
V
Supply Voltage  
-0.3  
-0.3  
-
20  
20  
V
V
CC  
V
Input Voltage  
IN  
I
Output Current  
±5  
A
OUT  
V
ESD Rating (Human Body Model)  
Junction Temperature  
Storage Temperature  
-4000  
-55  
+4000  
+150  
+150  
V
ESD  
T
°C  
J
T
-65  
°C  
STG  
Absolute maximum electrical ratings are at T =25°C  
A
Absolute maximum ratings are stress ratings. Stresses in excess of these ratings can cause permanent damage to the device.  
Functional operation of the device at conditions beyond those indicated in the operational sections of this data sheet is not  
implied.  
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3
IX4340  
INTEGRATED  
C
IRCUITS  
D
IVISION  
1.5 Electrical Characteristics  
= 12V, T = -40°C to +125°C, unless otherwise noted.  
V
CC  
J
Parameter  
Conditions  
OUTA and OUTB Open  
VCC Rising  
Symbol  
Minimum  
Typical  
Maximum  
Units  
Supply  
Supply Current  
mA  
ICC  
-
1.4  
2.5  
Under Voltage Lockout (UVLO)  
UVLO Rising Threshold  
UVLOON  
UVLOOFF  
UVLOHYS  
3.5  
3.1  
0.2  
3.85  
3.3  
4.2  
3.5  
0.8  
VCC Falling  
UVLO Falling Threshold  
V
V
UVLO Threshold Hysteresis  
-
0.5  
Logic Inputs (INA, INB, ENA, ENB)  
Input Low Voltage  
-
-
VIL  
VIH  
-
-
-
0.8  
-
Input High Voltage  
2.5  
Output Drivers (OUTA, OUTB)  
Output Pull-Up Resistance  
IOUT = -100mA, TJ = 25°C  
OUT = -100mA  
IOUT = 100mA, TJ = 25°C  
OUT = 100mA  
CLOAD = 1.8nF  
LOAD = 1.8nF  
-
-
-
-
-
1
1.5  
1.8  
1.1  
1.4  
15  
ROH  
I
1.3  
0.6  
0.8  
7
Output Pull-Down Resistance  
ROL  
I
Rise Time  
tR  
tF  
C
Fall Time  
-
5
7
16  
16  
-
15  
30  
30  
5
C
= 1.8nF  
= 1.8nF  
-
Propagation Delay, Low to High  
Propagation Delay, High to Low  
Propagation Delay Matching  
tDLH  
tDHL  
tM  
ns  
LOAD  
LOAD  
C
5
-5  
VIH  
VIL  
INx  
t
t
DLH  
DHL  
90%  
10%  
OUTx  
t
t
R
F
1.6 Thermal Characteristics  
Parameter  
Symbol  
Rating  
Units  
IX4340N Thermal Impedance, Junction to Ambient  
IX4340NE Thermal Impedance, Junction-to-Ambient  
IX4340NE Thermal Impedance, Junction-to-Case  
IX4340UE Thermal Impedance, Junction-to-Ambient  
IX4340UE Thermal Impedance, Junction-to-Case  
120  
85  
JA  
JA  
10  
°C/W  
JC  
40  
JA  
10  
JC  
4
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IX4340  
INTEGRATED  
C
IRCUITS  
D
IVISION  
2 Performance Data  
Unless otherwise noted, data presented in these graphs is typical of device operation at T =25ºC.  
A
Supply Current vs.Temperature  
Outputs in DC ON/OFF Condition  
(ENA=ENB=VCC=12V)  
Operating Supply Current  
vs.Temperature (Outputs Switching)  
(VCC=12V, f=500kHz, CL=500pF)  
Operating Supply Current  
vs. Frequency  
(CL=1.8nF, Both Channels Switching)  
1.7  
1.6  
1.5  
1.4  
1.3  
1.2  
12.0  
11.5  
11.0  
10.5  
10.0  
9.5  
150  
125  
100  
75  
Input=VCC  
VCC=18V  
VCC=12V  
VCC=10V  
VCC=5V  
Input=0V  
50  
9.0  
25  
8.5  
8.0  
0
-50 -25  
0
25  
50  
75 100 125 150  
-50  
0
50  
100  
150  
0
500  
1000  
1500  
2000  
Temperature (ºC)  
Temperature (ºC)  
Frequency (kHz)  
Input Threshold vs.Temperature  
(VCC= 12V)  
Enable Threshold vs.Temperature  
(VCC=12V)  
UVLO Threshold vs.Temperature  
2.50  
2.25  
2.00  
1.75  
1.50  
1.25  
1.00  
2.50  
2.25  
2.00  
1.75  
1.50  
1.25  
1.00  
4.0  
3.8  
3.6  
3.4  
3.2  
3.0  
VIH  
UVLOON  
VIH  
UVLOOFF  
VIL  
VIL  
-50 -25  
0
25  
50  
75 100 125 150  
-50 -25  
0
25  
50  
75 100 125 150  
-50 -25  
0
25  
50  
75 100 125 150  
Temperature (ºC)  
Temperature (ºC)  
Temperature (ºC)  
Input To Output Propagation Delay  
vs.Temperature  
Enable to Output Propagation Delay  
vs.Temperature  
Propagation Delay vs. Supply Voltage  
(VCC=12V, CL=1.8 nF)  
(CL=1.8nF)  
(VCC=12V, CL=1.8nF)  
30  
25  
20  
15  
10  
22  
21  
20  
19  
18  
17  
16  
15  
14  
35  
30  
25  
20  
15  
10  
EN to Output Low  
Input to Output Low  
EN to Output Low  
tDHL  
EN to Output High  
tDLH  
Input to Output High  
EN to Output High  
-50 -25  
0
25  
50  
75 100 125 150  
-50 -25  
0
25  
50  
75 100 125 150  
4
6
8
10  
12  
14  
16  
18  
Temperature (ºC)  
Temperature (ºC)  
Supply Voltage (V)  
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IX4340  
INTEGRATED  
C
IRCUITS  
D
IVISION  
Output Pull-Up Resistance  
vs.Temperature  
(VCC=12V, IOUT = -100mA)  
Rise Time vs.Temperature  
(VCC=12V, CL=1.8nF)  
Rise Time vs. Supply Voltage  
(CL=1.8nF )  
7.0  
6.9  
6.8  
6.7  
6.6  
6.5  
6.4  
6.3  
6.2  
11  
10  
9
1.6  
1.4  
1.2  
1.0  
0.8  
0.6  
8
7
6
5
4
-50 -25  
0
25  
50  
75 100 125 150  
4
6
8
10 12 14 16 18 20 22  
Supply Voltage (V)  
-50 -25  
0
25  
50  
75 100 125 150  
Temperature (ºC)  
Temperature (ºC)  
Output Pull-Down Resistance  
vs.Temperature  
Fall Time vs.Temperature  
(VCC=12V, CL=1.8 nF)  
Fall Time vs. Supply Voltage  
(VCC= 12V, IOUT= 100mA)  
(CL=1.8nF )  
7.00  
6.75  
6.50  
6.25  
6.00  
11  
10  
9
0.9  
0.8  
0.7  
0.6  
0.5  
0.4  
8
7
6
5
4
-50 -25  
0
25  
50  
75 100 125 150  
4
6
8
10 12 14 16 18 20 22  
Supply Voltage (V)  
-50 -25  
0
25  
50  
75 100 125 150  
Temperature (ºC)  
Temperature (ºC)  
6
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IX4340  
INTEGRATED  
C
IRCUITS  
D
IVISION  
3 Manufacturing Information  
3.1 Moisture Sensitivity  
All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated  
Circuits Division classifies its plastic encapsulated devices for moisture sensitivity according to the latest  
version of the joint industry standard, IPC/JEDEC J-STD-020, in force at the time of product evaluation.  
We test all of our products to the maximum conditions set forth in the standard, and guarantee proper  
operation of our devices when handled according to the limitations and information in that standard as well as to any  
limitations set forth in the information or standards referenced below.  
Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced  
product performance, reduction of operable life, and/or reduction of overall reliability.  
This product carries a Moisture Sensitivity Level (MSL) classification as shown below, and should be handled  
according to the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033.  
Device  
Moisture Sensitivity Level (MSL) Classification  
IX4340N & IX4340NE  
IX4340UE  
MSL 1  
MSL 2  
3.2 ESD Sensitivity  
This product is ESD Sensitive, and should be handled according to the industry standard JESD-625.  
3.3 Soldering Profile  
Provided in the table below is the Classification Temperature (T ) of this product and the maximum dwell time the  
C
body temperature of this device may be (T - 5)ºC or greater. The classification temperature sets the Maximum Body  
C
Temperature allowed for this device during lead-free reflow processes. For through-hole devices, and any other  
processes, the guidelines of J-STD-020 must be observed.  
Classification Temperature (TC)  
Dwell Time (tp)  
Device  
Max Reflow Cycles  
IX4340N, IX4340NE, & IX4340UE  
260°C  
30 seconds  
3
3.4 Board Wash  
IXYS Integrated Circuits Division recommends the use of no-clean flux formulations. Board washing to reduce or  
remove flux residue following the solder reflow process is acceptable provided proper precautions are taken to  
prevent damage to the device. These precautions include but are not limited to: using a low pressure wash and  
providing a follow up bake cycle sufficient to remove any moisture trapped within the device due to the washing  
process. Due to the variability of the wash parameters used to clean the board, determination of the bake temperature  
and duration necessary to remove the moisture trapped within the package is the responsibility of the user  
(assembler). Cleaning or drying methods that employ ultrasonic energy may damage the device and should not be  
used. Additionally, the device must not be exposed to flux or solvents that are Chlorine- or Fluorine-based.  
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IX4340  
INTEGRATED  
C
IRCUITS  
D
IVISION  
3.5 Mechanical Dimensions  
3.5.1 IX4340NE Package Dimensions  
PCB Land Pattern  
0.60  
(0.024)  
0.31 / 0.51  
(0.012 / 0.020)  
8x  
BOTTOM VIEW  
1.55  
(0.061)  
TOP VIEW  
5
5.80 / 6.20  
(0.228 / 0.244)  
3.85  
(0.152)  
2.11  
(0.083)  
1.94 / 2.29  
(0.076 / 0.090)  
3.80 / 4.00  
(0.150 / 0.157)  
PIN #1  
1.27  
0.05  
6x  
1.94 / 2.29  
(0.076 / 0.090)  
1.25 MIN  
(0.049 MIN)  
2.11  
(0.083)  
4
1.70 MAX  
(0.067 MAX)  
0.10 / 0.25  
(0.004 / 0.010)  
4.80 / 5.00  
(0.189 / 0.197)  
A
0.25  
(0.010)  
Dimensions  
MIN / MAX  
GAUGE PLANE  
SEATING PLANE  
A
0.10  
(0.004)  
0.40 / 1.27  
(0.016 / 0.050)  
0 / 0.15  
(0 / 0.006)  
8°- 0°  
Notes:  
1. Controlling dimension: millimeters.  
2. All dimensions are in mm (inches).  
3. This package conforms to JEDEC Standard MS-012, variation BA, Rev. F.  
4. Dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not exceed 0.15mm per end.  
5. Dimension does not include interlead flash or protrusion. Interlead flash or protrusion shall not exceed 0.25mm per side.  
6. The thermal pad on the bottom of the device may be connected to GND or left floating; it must not be connected to any other signal.  
The thermal pad is not intended to carry current.  
7. Lead thickness includes plating.  
3.5.2 IX4340N Package Dimensions  
0.31 / 0.51  
(0.012 / 0.020)  
8x  
PCB Land Pattern  
TOP VIEW  
1.55  
(0.061)  
5
5.80 / 6.20  
(0.228 / 0.244)  
3.75  
(0.148)  
3.80 / 4.00  
(0.150 / 0.157)  
0.10 / 0.25  
(0.004 / 0.010)  
A
0.25  
(0.010)  
PIN #1  
1.27  
0.05  
6x  
0.60  
(0.024)  
GAUGE PLANE  
SEATING PLANE  
1.25 MIN  
(0.049 MIN)  
A
0.40 / 1.27  
(0.016 / 0.050)  
4
8°- 0°  
1.75 MAX  
(0.069 MAX)  
4.80 / 5.00  
(0.189 / 0.197)  
Dimensions  
MIN / MAX  
0.10  
(0.004)  
0.10 / 0.25  
(0.004 / 0.010)  
Notes:  
1. Controlling dimension: millimeters.  
2. All dimensions are in mm (inches).  
3. This package conforms to JEDEC Standard MS-012, variation AA, Rev. F.  
4. Dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not exceed 0.15mm per end.  
5. Dimension does not include interlead flash or protrusion. Interlead flash or protrusion shall not exceed 0.25mm per side.  
6. Lead thickness includes plating.  
8
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INTEGRATED  
C
IRCUITS  
D
IVISION  
3.5.3 IX4340NTR & IX4340NETR Tape & Reel Dimensions  
330 DIA.  
(13.00 inch DIA)  
W=12.0 0.3  
B0=5.20  
K0=2.10  
A0=6.50  
P1=8.00  
K1=1.70  
Notes:  
1. 10 sprocket hole pitch cumulative tolerance 0.2.  
2. Camber in compliance with EIA 481.  
Embossed Carrier  
3. Pocket position relative to sprocket hole measured  
as true position of pocket, not pocket hole.  
4. All dimensions in millimeters.  
Embossment  
3.5.4 IX4340UE Package Dimensions  
MILLIMETERS  
INCHES  
NOM  
MIN  
-
NOM MAX MIN  
-
MAX  
0.043  
0.006  
D1  
1.10 -  
0.15 0.00  
-
-
A
0.00  
0.75  
0.22  
0.08  
-
0.85  
A1  
A2  
b
0.95 0.030 0.033 0.037  
-
0.38 0.009  
0.23 0.003  
-
0.015  
0.009  
-
-
c
3.00 BSC  
-
0.118 BSC  
-
D
1.42  
1.93 0.056  
1.73 0.054  
0.076  
D1  
E
E1  
E
E2  
4.90 BSC  
3.00 BSC  
-
0.193 BSC  
0.118 BSC  
-
E1  
E2  
e
1.38  
0.40  
0º  
0.068  
0.65 BSC  
0.60  
0.026 BSC  
0.80 0.016 0.024 0.031  
L
0.95 REF  
-
0.037 REF  
-
L1  
8º  
LAND PATTERN  
0º  
8º  
b
e
-
-
-
-
-
4.30  
1.70  
0.45  
1.90  
1.35  
-
-
-
-
-
-
-
-
-
-
0.169  
0.067  
0.018  
0.075  
0.053  
-
-
-
-
-
V
W
X
Y
D
‘A’  
c
Z
A
Recommended PCB Land Pattern  
V
H
A2  
Gauge plane  
A1  
0.10  
Seating plane  
L
Detail ‘A’  
0.25  
L1  
Y
X
Notes:  
1. JEDEC outline:Thermally enhanced: MO-187 AA-T.  
2. Dimension D does not include mold flash, protrusions or gate burrs. Mold flash, protrusions or gate burrs shall not exceed 0.15mm per end.  
Z
W
3. Dimension “b” does not include dambar protrusion. Allowable dambar protrusion shall be 0.08mm total in excess of the “b” dimension at maximum  
material condition.The dambar cannot be located on the lower radius of the foot. Minimum space between protrusion and an adjacent lead shalll  
not be less than 0.07mm.  
4. D and E1 dimensions are determined at datum H .  
5.The thermal pad on the bottom of the device may be connected to GND or left floating; it must not be connected to any other signal.  
The thermal pad is not intended to carry current.  
R05  
www.ixysic.com  
9
IX4340  
INTEGRATED  
C
IRCUITS  
D
IVISION  
3.5.5 IX4340UETR Tape & Reel Dimensions  
8.00  
(0.315)  
330 DIA.  
(13.00 inch DIA)  
2.00 0.05 See Note 3  
(0.079 0.002)  
1.75 0.10  
(0.069 0.004)  
4.00 See Note 1  
(0.157)  
A
0.3 0.05  
(0.012 0.002)  
5.50 0.05  
(0.217 0.002)  
3.30  
(0.130)  
W=12.0 0.3  
(0.472 0.012)  
1.20  
(0.047)  
5.20  
(0.205)  
A
NOTES:  
1. 10 sprocket hole pitch cumulative  
tolerance: 0.2 (0.008).  
Embossed Carrier  
3.40  
1.20 1.60  
(0.047) (0.063)  
(0.134)  
4.20  
(0.165)  
2. Camber in compliance with EIA 481.  
3. Pocket position relative to sprocket hole  
measured as true position of pocket, not  
pocket hole.  
DIMENSIONS:  
mm  
(inches)  
Embossment  
For additional information please visit our website at: www.ixysic.com  
IXYS Integrated Circuits Division makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make  
changes to specifications and product descriptions at any time without notice. Neither circuit patent licenses nor indemnity are expressed or implied. Except as set forth in IXYS Integrated  
Circuits Division’s Standard Terms and Conditions of Sale, IXYS Integrated Circuits Division assumes no liability whatsoever, and disclaims any express or implied warranty, relating to its  
products including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringement of any intellectual property right.  
The products described in this document are not designed, intended, authorized or warranted for use as components in systems intended for surgical implant into the body, or in other  
applications intended to support or sustain life, or where malfunction of IXYS Integrated Circuits Division’s product may result in direct physical harm, injury, or death to a person or severe  
property or environmental damage. IXYS Integrated Circuits Division reserves the right to discontinue or make changes to its products at any time without notice.  
Specification: DS-IX4340-R05  
©Copyright 2018, IXYS Integrated Circuits Division  
All rights reserved. Printed in USA.  
1/18/2018  
10  
www.ixysic.com  
R05  
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