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NX5P3090

型号：

NX5P3090

品牌：

NXP[ NXP ]

页数：

33 页

PDF大小：

1311 K

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NX5P3090  
USB PD and type C current-limited power switch  
Rev. 1 — 1 August 2016  
Product data sheet  
1. General description  
The NX5P3090 is a precision adjustable current-limited power switch for USB PD  
application. The device includes under voltage lockout, over-temperature protection, and  
reverse current protection circuits to automatically isolate the switch terminals when a  
fault condition occurs. The 29 V tolerance on VBUS pin ensures the device is able to work  
on a USB PD port; a current limit input (ILIM) pin defines the over-current limit threshold;  
an open-drain fault output (FAULT) indicates when a fault condition has occurred.  
The over-current limit threshold can be programmed from 400 mA to 3.3 A, using an  
external resistor between the ILIM pin and GND pin. In the over current condition, the  
device will clamp the output current to the value set by ILIM and keep the switch on while  
assert the FAULT flag. To minimize current surges during turn on, the device has built in  
soft start which controls the power switch rise time.  
Surge protection has been integrated in the device to enhance system robustness. The  
enable input includes integrated logic level translation making the device compatible with  
lower voltage processors and controllers.  
NX5P3090 is offered in a 12 bump 1.35 x 1.65 mm, 0.4 mm pitch WLCSP package.  
2. Features and benefits  
VINT supply voltage range from 2.5 V to 5.5 V  
29 V tolerance on VBUS and EN pin  
Adjustable current limit from 400 mA to 3.3 A  
Clamped current output in over-current condition  
Very low ON resistance: 34 m(typical)  
Active HIGH EN pin with internal pull down resistor  
All time Reverse Current Protection  
Over Temperature Protection  
Surge protection: IEC61000-4-5 exceeds ±80 V on VBUS  
Safety approvals  
UL 62368-1, 2nd Edition, File no. 20160526-E470128  
IEC 62368-1 (ed.2), File no. DK-54536-UL  
ESD protection  
IEC61000-4-2 contact discharge exceeds 8 kV on VBUS  
HBM ANSI/ESDA/JEDEC JS-001 Class 2 exceeds 2 kV  
CDM AEC standard Q100-01 (JESD22-C101E) exceeds 500 V  
Specified from 40 C to +85 C ambient temperature  
NX5P3090  
NXP Semiconductors  
USB PD and type C current-limited power switch  
3. Applications  
Notebook and Ultrabook  
USB PD and Type C port/hubs  
Tablet and Smart phone  
4. Ordering information  
Table 1.  
Ordering information  
Type number  
Topside  
marking  
Package  
Name  
Description  
Version  
NX5P3090UK  
X5PT2  
WLCSP12  
wafer level chip-scale package; 12 bumps; 1.65 x 1.35 x  
0.525 mm; 0.4 mm pitch (backside coating included)  
SOT1390-5  
4.1 Ordering options  
Table 2.  
Ordering options  
Type number  
Orderable  
part number  
Package  
Packing method  
Minimum  
order quantity  
Temperature  
Tamb = 40 C to +85 C  
NX5P3090UK  
NX5P3090UKZ  
WLCSP12  
REEL 7" Q1/T1  
*SPECIAL MARK  
CHIPS DP  
3000  
5. Marking  
Table 3.  
Marking  
Line  
A
Marking  
Description  
X5PT2  
basic type name  
B
mmmmm  
Z5YWW  
wafer lot code (mmmmm)  
manufacturing code  
C
Z = foundry location  
5 = assembly location  
Y = assembly year code  
WW = assembly week code  
NX5P3090  
All information provided in this document is subject to legal disclaimers.  
© NXP Semiconductors N.V. 2016. All rights reserved.  
Product data sheet  
Rev. 1 — 1 August 2016  
2 of 33  
NX5P3090  
NXP Semiconductors  
USB PD and type C current-limited power switch  
6. Functional diagram  
REVERSE-CURRENT  
PROTECTION  
ILIM  
OVER-CURRENT  
CLAMPING  
VINT  
VBUS  
UVLO  
EN  
SURGE  
PROTECTION  
CONTROL  
Rpd  
FAULT  
THERMAL  
SHUTDOWN  
aaa-024124  
Fig 1. Logic diagram  
NX5P3090  
All information provided in this document is subject to legal disclaimers.  
© NXP Semiconductors N.V. 2016. All rights reserved.  
Product data sheet  
Rev. 1 — 1 August 2016  
3 of 33  
NX5P3090  
NXP Semiconductors  
USB PD and type C current-limited power switch  
7. Pinning information  
7.1 Pinning  
ball A1  
index area  
NX5P3090  
NX5P3090  
1
2
3
1
2
3
A
B
C
D
A
B
C
D
EN  
/FAULT ILIM  
VINT GND  
VBUS GND  
VINT  
VINT  
VBUS VBUS GND  
Transparent top view  
Transparent top view  
aaa-024125  
aaa-024126  
Fig 2. Pin configuration  
Fig 3. Pin map  
7.2 Pin description  
Table 4.  
Symbol  
Pin description  
Pin  
Description  
VBUS  
ILIM  
C2, D1, D2  
A3  
power output; 29 V tolerance  
current limiter setting. connects a resistor to GND to set the threshold  
FAULT  
EN  
A2  
fault condition indicator (open-drain output)  
enable input (active HIGH)  
ground (0 V)  
A1  
GND  
VINT  
B3, C3, D3  
B1, C1, B2  
power input  
NX5P3090  
All information provided in this document is subject to legal disclaimers.  
© NXP Semiconductors N.V. 2016. All rights reserved.  
Product data sheet  
Rev. 1 — 1 August 2016  
4 of 33  
NX5P3090  
NXP Semiconductors  
USB PD and type C current-limited power switch  
8. Functional description  
Table 5.  
Function table[1]  
VINT  
EN  
X
VBUS  
FAULT  
Switch  
<2.5V  
X
Z
Z
Z
L
L
L
under voltage lockout, switch open  
disabled; switch open  
L
2.5V to 5.5V  
2.5V to 5.5V  
2.5V to 5.5V  
2.5V to 5.5V  
2.5V to 5.5V  
X
H
H
H
H
VBUS=VINT  
enabled; switch closed  
0V to VINT  
over-current, clamped current output, switch closed  
reverse current; switch open  
Over-temperature; switch open  
VBUS>VINT+40mV (>4ms)  
Z
[1] H = HIGH voltage level; L = LOW voltage level.  
8.1 EN Input  
When the EN pin is set LOW, the N-channel MOSFET will be disabled, the device will  
enter low-power mode disabling all protection circuits and setting the FAULT pin high  
impedance. When EN is set HIGH, all protection circuits will be enabled and then, if no  
fault conditions exist, the N-channel MOSFET will be turn on. There is a 100 us de-glitch  
time on EN pin from LOW to HIGH.  
8.2 Under-voltage lock-out  
Independently of the logic level on the EN pin, the under-voltage lockout (UVLO) circuit  
disables the N-channel MOSFET and enters low power mode until the input voltage  
reaches the UVLO turn-on threshold level VUVLO.  
8.3 ILIM  
The over-current protection circuit's (OCP) trigger value Iocp can be set using an external  
resistor RILIM connected between ILIM pin and GND pin. When EN is HIGH and the ILIM  
pin is pulled to ground, the N-channel MOSFET will be disabled and the FAULT output set  
LOW. The detailed IOCP setting is given in Section 8.4.  
8.4 Over-current protection (OCP)  
The device offers over current protection when enabled, three possible over-current  
conditions can occur. These conditions are:  
• Over-current at start-up, ISW > Iocp when enabling the N-channel MOSFET.  
• Over-current after enabled, ISW > Iocp when the N-channel MOSFET is already ON.  
• Short circuit after enabled, ISW > 10 A (typical).  
In the over current condition, because the device clamps the output current rather than  
completely shut down the switch, the power dissipation on the device might be increased  
which could lead to over temperature protection (see Section 8.7).  
8.4.1 Over-current at start-up  
If the device senses a VBUS short to GND or over-current while enabling the N-channel  
MOSFET, OCP is triggered. It limits the output current to Iocp and after the de-glitch time  
sets the FAULT output LOW.  
NX5P3090  
All information provided in this document is subject to legal disclaimers.  
© NXP Semiconductors N.V. 2016. All rights reserved.  
Product data sheet  
Rev. 1 — 1 August 2016  
5 of 33  
NX5P3090  
NXP Semiconductors  
USB PD and type C current-limited power switch  
8.4.2 Over-current when enabled  
If the device senses ISW > Iocp after enabled, OCP is triggered. It limits the output current  
to Iocp and after the de-glitch time sets the FAULT output LOW. Limiting the output current  
reduces VO(VOUT)  
.
8.4.3 Short circuit when enabled  
If the device senses ISW > 10 A after enabled, a short circuit is detected. The device  
disables the N-channel MOSFET immediately. It then re-enables the N-channel MOSFET  
and limit the output current to Iocp, and after the de-glitch time the FAULT output is set  
LOW.  
8.5 Reverse-Current protection (RCP)  
When the VBUS pin voltage exceeds the input voltage by 40 mV (typical) the device will  
protect itself from damage by switching off the MOSFET after 4 ms de-glitch time.  
When the VBUS pin voltage exceeds the VINT voltage by 100 mV, the device will  
shutdown the FET immediately without any de-glitch time.  
FAULT pin will be set LOW in the reverse-current protection condition.  
In the RCP state, when the VBUS voltage drops below VINT voltage, the device will exit  
the RCP state in 128 us and resume normal operation.  
Before normal turn on, the device will always check the RCP condition first, if higher  
voltage is detected on VBUS pin, it will never turn on the power MOSFET even EN pin is  
pulled HIGH.  
8.6 FAULT output  
The FAULT output is an open-drain output that requires an external pull-up resistor. If any  
of the protection circuits is activated, the FAULT output will be set LOW to indicate a fault  
has occurred. The FAULT output will return to the high impedance state automatically  
once the fault condition is removed. An internal delay (de-glitch) circuit for the over-current  
protection (8 ms typical) and reverse-current protection (4 ms typical) is used when  
entering fault conditions. This ensures that FAULT is not accidentally asserted.  
Over-temperature condition will not be deglitched, the FAULT signal will be asserted  
immediately.  
8.7 Over-temperature protection  
When EN is HIGH, the device junction temperature exceeds 140 °C, the over-temperature  
protection (OTP) circuit will disable the N-channel MOSFET and indicate a fault condition  
by setting the FAULT pin LOW. Any transition on the EN pin will have no effect. Once the  
device temperature decreases below 115 °C the device will return to the defined state.  
NX5P3090  
All information provided in this document is subject to legal disclaimers.  
© NXP Semiconductors N.V. 2016. All rights reserved.  
Product data sheet  
Rev. 1 — 1 August 2016  
6 of 33  
NX5P3090  
NXP Semiconductors  
USB PD and type C current-limited power switch  
9. Application diagram  
USB connector  
5 V  
SOURCE  
VINT  
VBUS  
ILIM  
VBUS  
C
INT  
V
DD  
C
BUS  
47 KΩ  
/FAULT  
EN  
USB  
CONTROLLER/  
PROCESSOR  
R
ILIM  
GND  
GND  
aaa-024128  
0.1 F ceramic capacitor (CINT) is required for local decoupling. Higher capacitor values CINT further reduce the voltage drop at  
the input. When driving inductive loads, a larger capacitance CINT prevents voltage spikes from exceeding absolute maximum  
voltage of VIN. The CBUS capacitor should be placed as closer as possible to VBUS pin.  
Fig 4. Application diagram  
NX5P3090  
All information provided in this document is subject to legal disclaimers.  
© NXP Semiconductors N.V. 2016. All rights reserved.  
Product data sheet  
Rev. 1 — 1 August 2016  
7 of 33  
NX5P3090  
NXP Semiconductors  
USB PD and type C current-limited power switch  
10. Limiting values  
Table 6.  
Limiting values  
In accordance with the Absolute Maximum Rating System (IEC 60134). Voltages are referenced to GND (ground = 0 V).  
Symbol  
Parameter  
Conditions  
VBUS, EN  
Min  
0.5  
0.5  
0.5  
0.5  
50  
50  
-
Max  
Unit  
V
[1]  
[2]  
VI  
input voltage  
+29  
VINT  
+6  
V
ILIM  
+6  
V
[1]  
VO  
IIK  
output voltage  
FAULT  
+6  
V
input clamping current  
input EN: VI(EN) < 0.5 V  
input ILIM: VI(ILIM) < 0.5 V  
input IILIM  
-
mA  
mA  
mA  
mA  
mA  
mA  
A
-
II(source)  
IOK  
input source current  
1
output clamping current VO < 0 V  
50  
50  
50  
-
-
ISK  
switch clamping current input VIN: VI(VIN) < 0.5 V  
output VOUT: VO(VOUT) < 0.5 V  
-
-
[3]  
[4]  
ISW  
switch current  
VSW > 0.5 V  
3.6  
+150  
Tj(max)  
maximum junction  
temperature  
40  
C  
Tstg  
Ptot  
storage temperature  
total power dissipation  
65  
+150  
910  
C  
-
mW  
[1] The minimum input voltage rating may be exceeded if the input current rating is observed.  
[2] The minimum and maximum switch voltage ratings may be exceeded if the switch clamping current rating is observed.  
[3] Internally limited.  
[4] The (absolute) maximum power dissipation depends on the junction temperature Tj. Higher power dissipation is allowed in conjunction  
with lower ambient temperatures. The conditions to determine the specified values are Tamb = 25 °C and the use of a two layer PCB.  
11. Recommended operating conditions  
Table 7.  
Recommended operating conditions  
Symbol Parameter  
Conditions  
VINT  
Min  
2.5  
0
Max  
5.5  
20  
5
Unit  
V
VI  
input voltage  
EN; VBUS (OFF state)  
VBUS  
V
VO  
Output voltage  
0
V
ISW  
switch current  
Tj = 40 C to +85 C  
output FAULT  
input ILIM  
0
3
A
IO(sink)  
RILIM  
Cdec  
Tamb  
output sink current  
current limit resistance  
decoupling capacitance  
ambient temperature  
10  
16  
0.1  
40  
-
mA  
k  
F  
C  
[1]  
140  
-
VIN to GND  
+85  
[1] Current-limit threshold resistor range from ILIM to GND.  
NX5P3090  
All information provided in this document is subject to legal disclaimers.  
© NXP Semiconductors N.V. 2016. All rights reserved.  
Product data sheet  
Rev. 1 — 1 August 2016  
8 of 33  
NX5P3090  
NXP Semiconductors  
USB PD and type C current-limited power switch  
12. Thermal characteristics  
Table 8.  
Symbol  
Rth(j-a)  
Thermal characteristics  
Parameter  
Conditions  
Typ  
Unit  
[1]  
thermal resistance from junction to ambient  
109  
K/W  
[1] Rth(j-a) is dependent upon board layout. To minimize Rth(j-a), ensure all pins have a solid connection to larger copper layer areas. In  
multi-layer PCBs, the second layer should be used to create a large heat spreader area below the device. Avoid using solder-stop  
varnish under the device.  
13. Static characteristics  
Table 9.  
Static characteristics  
At recommended operating conditions; VI(VINT) = VI(EN), RFAULT = 10 kunless otherwise specified; Voltages are referenced  
to GND (ground = 0 V). See Figure 10  
Symbol  
Parameter  
Conditions  
Min  
Typ[1]  
Max  
Unit  
VIH  
HIGH-level input  
voltage  
EN input; VI(VINT) = 2.5 V to 5.5 V;  
1.2  
-
-
V
VIL  
II  
LOW-level input  
voltage  
EN input; VIVINT) = 2.5 V to 5.5 V;  
EN input; VI(VINT) = 5.0 V;  
-
-
-
-
0.4  
7.5  
V
input leakage  
current  
A  
I(VIN)  
supply current  
VBUS open; VI(VINT) = 5.0 V  
EN = GND (low power mode);  
EN = VI(VIN); RILIM = 33 k  
-
-
-
-
0.9  
196  
210  
1
5
A  
A  
A  
A  
280  
290  
10  
EN = VI(VIN); RILIM = 16 k  
IS(OFF)  
VBUS OFF-State  
leakage current  
VI(VINT) = 5.0 V; VI(VBUS) = 0 V; EN = LOW  
VINT OFF-state  
leakage current  
VI(VBUS) = 5.0 V; VI(VINT) = 0 V;  
EN = LOW  
-
-
1
10  
10  
A  
A  
M  
IS(ON)  
Rpd  
RCP leakage  
current  
VI(VINT) = 0 V; VI(VBUS) = 5 V; EN = 5 V  
0.9  
1
EN pin Pull-down  
resistance  
VI(VINT) = 5 V  
Vtrip  
trip level voltage  
RCP; VI(VINT) = 2.5 V to 5.5 V  
VINT pin  
-
-
40  
-
mV  
V
VUVLO  
under voltage  
2.27  
2.45  
lockout voltage  
Vhys(UVLO) under voltage  
lockout hysteresis  
voltage  
-
100  
-
mV  
VOL  
LOW-level output  
voltage  
FAULT; IO = 8 mA  
-
-
-
0.5  
-
V
CI  
EN pin  
13.5  
pF  
[1] Typical values are measured at Tamb = 25 C.  
NX5P3090  
All information provided in this document is subject to legal disclaimers.  
© NXP Semiconductors N.V. 2016. All rights reserved.  
Product data sheet  
Rev. 1 — 1 August 2016  
9 of 33  
NX5P3090  
NXP Semiconductors  
USB PD and type C current-limited power switch  
13.1 Graphs  
DDDꢀꢁꢂꢃꢂꢄꢅ  
ꢅ
ꢉꢈꢁ  
ꢃꢈꢇ  
ꢃꢈꢉ  
ꢂꢈꢆ  
ꢂ
,
ꢋ9,1ꢌ  
ꢋX$ꢌ  
ꢀꢁꢂ  
ꢀꢃꢄ  
ꢃꢂ  
ꢅꢄ  
ꢆꢂ  
ꢇꢄ  
7
DPE  
ꢊꢋƒ&ꢌ  
VI(EN) = GND; VI(VINT) = 5.0 V  
Fig 5. OFF state supply current versus temperature  
DDDꢀꢁꢂꢃꢂꢃꢁ  
ꢉꢄꢂ  
,
ꢋ9,1ꢌ  
ꢋX$ꢌ  
ꢉꢅꢂ  
ꢉꢃꢂ  
ꢃꢎꢂ  
ꢃꢍꢂ  
ꢃꢄꢂ  
ꢋꢉꢌ  
ꢋꢃꢌ  
ꢀꢁꢂ  
ꢀꢃꢄ  
ꢃꢂ  
ꢅꢄ  
ꢆꢂ  
ꢇꢄ  
7
DPE  
ꢊꢋƒ&ꢌ  
VI(EN) = VI(VINT); VI(VINT) = 5.0 V  
ILIM = 33 K  
(2) RILIM = 16 K  
(1)  
R
Fig 6. ON state supply current versus temperature  
NX5P3090  
All information provided in this document is subject to legal disclaimers.  
© NXP Semiconductors N.V. 2016. All rights reserved.  
Product data sheet  
Rev. 1 — 1 August 2016  
10 of 33  
NX5P3090  
NXP Semiconductors  
USB PD and type C current-limited power switch  
DDDꢀꢁꢂꢃꢂꢃꢆ  
ꢄ
,,  
RIIꢋ9,17ꢌ  
ꢋX$ꢌ  
ꢁ
ꢅ
ꢉ
ꢃ
ꢂ
ꢋꢅꢌ  
ꢋꢃꢌ  
ꢋꢉꢌ  
ꢉꢈꢄ  
ꢅ
ꢅꢈꢄ  
ꢁ
ꢁꢈꢄ  
ꢄ
ꢄꢈꢄ  
9
ꢊꢋ9ꢌ  
,ꢋ9,17ꢌ  
VI(EN) = GND; VI(VBUS) = 0 V; RILIM = 16 K  
amb = -40 C  
(1)  
T
(2) Tamb = +25 C  
(3) Tamb = +85 C  
Fig 7. VBUS off state leakage versus temperature  
DDDꢀꢁꢂꢃꢆꢄꢂ  
ꢉꢈꢄ  
,,  
RIIꢋ9%86ꢌ  
ꢋȝ$ꢌ  
ꢉ
ꢃꢈꢄ  
ꢃ
ꢋꢅꢌ  
ꢋꢉꢌ  
ꢋꢃꢌ  
ꢂꢈꢄ  
ꢂ
ꢉꢈꢄ  
ꢅꢈꢃ  
ꢅꢈꢍ  
ꢁꢈꢅ  
ꢁꢈꢎ  
ꢄꢈꢄ  
9
ꢊꢋ9ꢌ  
,ꢋ9%86ꢌ  
VI(EN) = GND; VI(VINT) = 0 V; RILIM = 16 K  
Tamb = -40 C  
(1)  
(2) Tamb = +25 C  
(3) Tamb = +85 C  
Fig 8. VINT off state leakage versus temperature  
NX5P3090  
All information provided in this document is subject to legal disclaimers.  
© NXP Semiconductors N.V. 2016. All rights reserved.  
Product data sheet  
Rev. 1 — 1 August 2016  
11 of 33  
NX5P3090  
NXP Semiconductors  
USB PD and type C current-limited power switch  
DDDꢀꢁꢆꢅꢃꢇꢆ  
ꢄꢂ  
9%86ꢏꢊ9,17  
ꢋ9ꢌ  
ꢁꢂ  
,
%86  
ꢋ$ꢌ  
ꢁꢂ  
ꢅꢂ  
ꢉꢂ  
ꢃꢂ  
ꢅꢉ  
ꢉꢁ  
ꢃꢆ  
ꢇ
ꢋꢉꢌ  
ꢋꢃꢌ  
ꢋꢅꢌ  
ꢂ
ꢂ
ꢀꢆꢂ  
ꢀꢅꢂ  
ꢂ
ꢅꢂ  
ꢆꢂ  
ꢎꢂ  
7LPHꢊꢋȝVꢌ  
ꢃꢉꢂ  
RILIM = 20 k; VI(VINT) = 0 V  
(1) Surge current  
(2) Surge voltage on VBUS  
Fig 9. Surge protection waveform  
VINT  
VBUS  
ILIM  
VIN  
VOUT  
10 μF  
1 μF  
10 kΩ  
FAULT  
EN  
FAULT signal  
control signal  
R
ILIM  
GND  
aaa-024133  
Fig 10. Typical characteristics reference schematic  
13.2 Thermal shutdown  
Table 10. Thermal shutdown  
VI(VINT) = VI(EN), RFAULT = 10 kunless otherwise specified; Voltages are referenced to GND (ground = 0 V).  
Symbol  
Parameter  
Conditions  
Min  
Typ  
Max  
Unit  
Tth(ots)  
over temperature shutdown  
threshold temperature  
VI(VINT) = 2.5 to 5.5 V  
-
140  
-
C  
Tth(otp)hys  
hysteresis of over temperature  
protection threshold temperature  
VI(VINT) = 2.5 to 5.5 V  
-
25  
-
C  
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USB PD and type C current-limited power switch  
13.3 ON resistance  
Table 11. ON resistance  
VI(VINT) = VI(EN), RFAULT = 10 kunless otherwise specified; Voltages are referenced to GND (ground = 0 V). See Figure 10  
Symbol Parameter  
RON ON resistance  
Conditions  
Min  
Typ  
Max  
Unit  
VI(VINT) = 2.5 to 5.5 V; see Figure 11  
Tamb = 25 C  
-
-
34  
-
37  
46  
m  
m  
Tamb = 40 C to +85 C  
13.4 ON resistance graphs  
DDDꢀꢁꢂꢃꢂꢇꢇ  
ꢆꢂ  
5RQ  
ꢋPŸꢌ  
ꢄꢂ  
ꢁꢂ  
ꢅꢂ  
ꢉꢂ  
ꢃꢂ  
ꢀꢁꢂ  
ꢀꢃꢄ  
ꢃꢂ  
ꢅꢄ  
ꢆꢂ  
ꢇꢄ  
7
DPE  
ꢊꢋƒ&ꢌ  
VI(VINT) = 5.0 V  
Fig 11. Typical ON resistance versus temperature  
DDDꢀꢁꢂꢃꢂꢇꢈ  
ꢆꢂꢂ  
5RQ  
ꢋPȍꢌ  
ꢁꢇꢂ  
ꢅꢆꢂ  
ꢉꢁꢂ  
ꢃꢉꢂ  
ꢂ
ꢅꢈꢄ  
ꢃꢉꢈꢇ  
ꢉꢉꢈꢃ  
ꢅꢃꢈꢁ  
ꢁꢂꢈꢍ  
7LPHꢊꢋPVꢌ  
ꢄꢂ  
VI(VINT) = 5.0 V  
Fig 12. Typical ON resistance versus enable time  
NX5P3090  
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Product data sheet  
Rev. 1 — 1 August 2016  
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USB PD and type C current-limited power switch  
13.5 Current limit  
Table 12. Current limit  
VI(VINT) = VI(EN), RFAULT = 10 kunless otherwise specified; Voltages are referenced to GND (ground = 0 V). See Figure 10  
Symbol  
Parameter  
Conditions  
Min  
Typ[1]  
Max  
Unit  
Iocp  
over current  
protection current  
VI(VINT) = 2.5 to 5.5 V; Tamb = 40 C to +85 C;  
RILIM = 140 k  
330  
421  
465  
mA  
mA  
mA  
mA  
mA  
mA  
mA  
mA  
RILIM = 100 k  
480  
581  
625  
RILIM = 54 k  
915  
1057  
1723  
2330  
2848  
3490  
180  
1107  
1780  
2398  
2920  
3585  
220  
RILIM = 33 k  
1505  
2085  
2567  
3186  
125  
RILIM = 24.5 k  
RILIM = 20 k  
RILIM = 16 k  
ILIM shorted to VINT  
[1] Typical values are measured at Tamb = 25 C. 1 % tolerance resistor is recommend for RILIM  
Iocp can be calculated with below equation, x = RILIM (k):  
IOCPMAX= 49495x–0.948  
IOCPTYP= 52775x–0.979  
IOCPMIN= 57949x–1.042  
(1)  
(2)  
(3)  
13.6 Current limit graphs  
DDDꢀꢁꢂꢃꢂꢄꢉ  
ꢄ
,
2&3  
ꢋ$ꢌ  
ꢁ
ꢅ
ꢉ
ꢃ
ꢂ
ꢃꢆ  
ꢅꢃꢈꢄ  
ꢁꢍ  
ꢆꢉꢈꢄ  
ꢍꢇ  
ꢎꢅꢈꢄ  
ꢃꢂꢎ  
ꢃꢉꢁꢈꢄ  
ꢊꢋ.Ÿꢌ  
ꢃꢁꢂ  
5
,/,0  
Fig 13. Typical over current protection current versus external resistor value RILIM  
NX5P3090  
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Rev. 1 — 1 August 2016  
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USB PD and type C current-limited power switch  
14. Dynamic characteristics  
Table 13. Dynamic characteristics  
At recommended operating conditions; VI(VINT) = VI(EN), RFAULT = 10 kunless otherwise specified; voltages are referenced to  
GND (ground = 0 V).  
Symbol  
Parameter  
Conditions  
Min  
Typ[1]  
Max  
Unit  
tTLH  
LOW to HIGH output  
transition time  
VOUT; CL = 1 F; RL = 100 ; see Figure 14  
and Figure 15  
VI(VINT) = 5.0 V  
VI(VINT) = 2.5 V  
-
-
2.5  
1.4  
-
-
ms  
ms  
tTHL  
HIGH to LOW output  
transition time  
VOUT; CL = 1 F; RL = 100 ; see Figure 14  
and Figure 15  
VI(VINT) = 5.0 V  
VI(VINT) = 2.5 V  
-
-
0.2  
0.2  
-
-
ms  
ms  
ten  
enable time  
disable time  
deglitch time  
EN to VOUT; CL = 1 F; RL = 100 ;  
seeFigure 14and Figure 15  
VI(VINT) = 5.0 V  
-
1.5  
-
ms  
tdis  
EN to VOUT; CL = 1 F; RL = 100 ; see  
Figure 14 and Figure 15  
VI(VINT) = 5.0 V  
-
-
-
13  
8
-
-
-
s  
tdegl  
FAULT in OCP; VI(VINT) = 5 V  
RCP; FAULT in RCP; VI(VINT) = 5 V  
ms  
ms  
4
[1] Typical values are measured at Tamb = 25 C.  
14.1 Waveform and test circuits  
V
I
EN input  
V
M
GND  
t
en  
t
dis  
V
OH  
V
x
VBUS output  
V
Y
GND  
t
t
THL  
TLH  
aaa-024134  
Measurement points are given in Table 14.  
Logic level: VOH is the typical output voltage that occurs with the output load.  
Fig 14. Switching times and rise and fall times  
Table 14. Measurement points  
Supply voltage  
VI(VIN)  
EN Input  
VM  
Output  
VX  
VY  
5.0 V  
0.5 VI(EN)  
0.9 VOH  
0.1 VOH  
NX5P3090  
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Product data sheet  
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USB PD and type C current-limited power switch  
EN  
VOUT  
VIN  
G
V
R
C
L
V
EXT  
I
L
aaa-011077  
Test data is given in Table 15.  
Definitions test circuit:  
RL = Load resistance.  
CL = Load capacitance including jig and probe capacitance.  
EXT = External voltage for measuring switching times.  
V
Fig 15. Test circuit for measuring switching times  
Table 15. Test data  
Supply voltage  
VEXT  
EN Input  
VI(EN)  
Load  
CL  
RL  
5.0 V  
0 to VI(VIN)  
1 F  
100   
DDDꢀꢁꢂꢁꢃꢇꢂ  
ꢆ
ꢉ
9
,
9,1  
ꢋ$ꢌ  
%86ꢏꢊ(1  
ꢋ9ꢌ  
ꢄ
ꢁ
ꢅ
ꢉ
ꢃ
ꢂ
ꢃꢈꢆꢍ  
ꢃꢈꢅꢅ  
ꢃ
ꢋꢅꢌ  
ꢋꢃꢌ  
ꢋꢉꢌ  
ꢂꢈꢆꢍ  
ꢂꢈꢅꢅ  
ꢂ
ꢀꢃ  
ꢃ
ꢅ
ꢄ
ꢍ
ꢎ
WLPHꢊꢋPVꢌ  
VI(VINT) = 5 V; RL = 5.1 ; CL = 1 F;  
(1) VO(VBUS)  
(2) I(VIN)  
(3) VI(EN)  
Fig 16. Typical 1 F load enable time and inrush current  
NX5P3090  
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Product data sheet  
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NXP Semiconductors  
USB PD and type C current-limited power switch  
DDDꢀꢁꢂꢁꢃꢇꢃ  
ꢆ
ꢉ
99  
,
9,1  
%86ꢏꢊꢊ(1  
ꢋ9ꢌ  
ꢋ$ꢌ  
ꢃꢈꢆꢍ  
ꢄ
ꢁ
ꢅ
ꢉ
ꢃ
ꢂ
ꢃꢈꢅꢅ  
ꢃ
ꢋꢅꢌ  
ꢋꢃꢌ  
ꢋꢉꢌ  
ꢂꢈꢆꢍ  
ꢂꢈꢅꢅ  
ꢂ
ꢀꢃ  
ꢃ
ꢅ
ꢄ
ꢍ
ꢎ
WLPHꢊꢋPVꢌ  
VI(VIN) = 5 V; RL = 5.1 ; CL = 100 F;  
(1) VO(VBUS)  
(2) I(VIN)  
(3) VI(EN)  
Fig 17. Typical 100 F load enable time and inrush current  
DDDꢀꢁꢂꢁꢃꢇꢄ  
ꢆ
ꢉ
9
,
9,1  
ꢋ$ꢌ  
ꢃꢈꢆꢍ  
%86ꢏꢊ(1  
ꢋ9ꢌ  
ꢄ
ꢁ
ꢅ
ꢉ
ꢃ
ꢂ
ꢃꢈꢅꢅ  
ꢃ
ꢋꢅꢌ  
ꢋꢉꢌ  
ꢋꢃꢌ  
ꢂꢈꢆꢍ  
ꢂꢈꢅꢅ  
ꢂ
ꢀꢄ  
ꢄ
ꢃꢄ  
ꢉꢄ  
ꢅꢄ  
ꢁꢄ  
ꢄꢄ  
ꢆꢄ  
ꢍꢄ  
WLPHꢊꢋXVꢌ  
VI(VINT) = 5 V; RL = 5.1 ; CL = 1 F;  
(1) VO(VBUS)  
(2) I(VIN)  
(3) VI(EN)  
Fig 18. Typical 1 F load turn off  
NX5P3090  
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Product data sheet  
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NXP Semiconductors  
USB PD and type C current-limited power switch  
DDDꢀꢁꢂꢁꢃꢇꢊ  
ꢆ
ꢉ
9
,
9,1  
%86ꢏꢊ(1  
ꢋ9ꢌ  
ꢋ$ꢌ  
ꢃꢈꢆꢍ  
ꢄ
ꢁ
ꢅ
ꢉ
ꢃ
ꢂ
ꢃꢈꢅꢅ  
ꢃ
ꢋꢃꢌ  
ꢋꢉꢌ  
ꢋꢅꢌ  
ꢂꢈꢆꢍ  
ꢂꢈꢅꢅ  
ꢂ
ꢀꢂꢈꢉ  
ꢂꢈꢉ  
ꢂꢈꢆ  
ꢃ
ꢃꢈꢁ  
ꢃꢈꢇ  
ꢉꢈꢉ  
ꢉꢈꢆ  
ꢅ
WLPHꢊꢋPVꢌ  
VI(VIN) = 5 V; RL = 5.1 ; CL = 100 F  
(1) VO(VBUS)  
(2) I(VIN)  
(3) VI(EN)  
Fig 19. Typical 100 F load turn off  
DDDꢀꢁꢂꢃꢂꢄꢄ  
ꢆ
9%86ꢏ  
9,17ꢏꢊꢐ)/7  
ꢋ9ꢌ  
ꢅ
,,  
9,1  
ꢋ$ꢌ  
ꢁꢈꢇ  
ꢃꢈꢇ  
ꢂꢈꢆ  
ꢅꢈꢆ  
ꢉꢈꢁ  
ꢃꢈꢉ  
ꢂ
ꢋꢃꢌ  
ꢋꢉꢌ  
ꢋꢁꢌ  
ꢋꢅꢌ  
ꢀꢂꢈꢆ  
ꢀꢃꢈꢇ  
ꢀꢅ  
ꢀꢃꢂ  
ꢀꢍ  
ꢀꢁ  
ꢀꢃ  
ꢉ
ꢄ
7LPHꢊꢋPVꢌ  
VI(VINT) = 4 V  
(1) VO(VBUS)  
(2) VI(VINT)  
(3) I(VIN)  
(4) FAULT  
Fig 20. Reverse-current protection response  
NX5P3090  
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Product data sheet  
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USB PD and type C current-limited power switch  
DDDꢀꢁꢂꢃꢂꢄꢃ  
ꢆ
ꢉ
9%86ꢏ  
,
9,1  
9,17ꢏꢐ)/7  
ꢋ$ꢌ  
ꢋ9ꢌ  
ꢁꢈꢇ  
ꢃꢈꢁ  
ꢂꢈꢇ  
ꢂꢈꢉ  
ꢅꢈꢆ  
ꢉꢈꢁ  
ꢃꢈꢉ  
ꢂ
ꢋꢁꢌ  
ꢋꢉꢌ  
ꢋꢃꢌ  
ꢋꢅꢌ  
ꢀꢂꢈꢁ  
ꢀꢃ  
ꢀꢃꢄ  
ꢀꢃꢃ  
ꢀꢍ  
ꢀꢅ  
ꢃ
ꢄ
7LPHꢊꢋPVꢌ  
VI(VIN) = 4V  
(1) VO(VBUS)  
(2) VI(VINT)  
(3) I(VIN)  
(4) FAULT  
Fig 21. Reverse-current protection recovery  
DDDꢀꢁꢂꢃꢂꢄꢊ  
ꢆ
ꢅ
9%86ꢏ  
,,  
9,1  
9,17ꢏꢊꢐ)/7  
ꢋ$ꢌ  
ꢋ9ꢌ  
ꢄ
ꢉꢈꢄ  
ꢉ
ꢁ
ꢅ
ꢉ
ꢃ
ꢂ
ꢋꢁꢌ  
ꢋꢉꢌ  
ꢋꢃꢌ  
ꢋꢅꢌ  
ꢃꢈꢄ  
ꢃ
ꢂꢈꢄ  
ꢂ
ꢀꢃꢅ  
ꢀꢃꢃ  
ꢀꢎ  
ꢀꢍ  
ꢀꢄ  
ꢀꢅ  
ꢀꢃ  
ꢃ
ꢅ
7LPHꢊꢋPVꢌ  
VI(VIN) = 5 V; RILIM = 33 k.  
(1) VO(VBUS)  
.
(2) VI(VINT)  
(3) I(VIN)  
(4) FAULT  
Fig 22. Device into current limit after enabled  
NX5P3090  
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Product data sheet  
Rev. 1 — 1 August 2016  
19 of 33  
NX5P3090  
NXP Semiconductors  
USB PD and type C current-limited power switch  
DDDꢀꢁꢂꢃꢂꢄꢇ  
ꢆ
ꢅ
9%86ꢏ  
,,  
9,1  
9,17ꢏꢊꢐ)/7  
ꢋ9ꢌ  
ꢋ$ꢌ  
ꢁꢈꢇ  
ꢉꢈꢁ  
ꢃꢈꢇ  
ꢃꢈꢉ  
ꢂꢈꢆ  
ꢂ
ꢅꢈꢆ  
ꢉꢈꢁ  
ꢃꢈꢉ  
ꢂ
ꢋꢁꢌ  
ꢋꢅꢌ  
ꢋꢉꢌ  
ꢋꢃꢌ  
ꢀꢄ  
ꢀꢃ  
ꢅ
ꢍ
ꢃꢃ  
ꢃꢄ  
7LPHꢊꢋPVꢌ  
VI(VIN) = 5 V; RILIM = 33 k.  
(1) VO(VBUS)  
(2) VI(VINT)  
(3) I(VIN)  
(4) FAULT  
Fig 23. Device start up with VBUS short to GND  
NX5P3090  
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Product data sheet  
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USB PD and type C current-limited power switch  
15. Package outline  
:/&63ꢀꢁꢂꢃZDIHUꢃOHYHOꢃFKLSꢄVFDOHꢃSDFNDJHꢅ  
ꢀꢁꢃEXPSVꢅꢃꢀꢆꢇꢈꢃ[ꢃꢀꢆꢉꢈꢃ[ꢃꢊꢆꢈꢁꢈꢃPPꢃꢋ%DFNVLGHꢃFRDWLQJꢃLQFOXGHGꢌ  
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8QLW  
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PLQ  
ꢂꢈꢇ  
ꢃꢈꢉ ꢂꢈꢂꢄ ꢂꢈꢃꢄ ꢂꢈꢂꢅ  
ꢂꢈꢁꢇꢄ ꢂꢈꢃꢍ ꢂꢈꢅꢂꢂ ꢂꢈꢉꢅ ꢃꢈꢆꢉ ꢃꢈꢅꢉ  
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ꢃꢄꢀꢃꢃꢀꢂꢅ  
627ꢃꢅꢎꢂꢀꢄ  
Fig 24. Package outline WLCSP12  
NX5P3090  
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Product data sheet  
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USB PD and type C current-limited power switch  
16. Packing information  
16.1 Packing method  
%DUFRGHꢊODEHO  
'U\ꢀDJHQW  
%DJ  
(6'ꢊSULQW  
5HODWLYHꢊKXPLGLW\  
LQGLFDWRU  
0RLVWXUHꢊFDXWLRQ  
SULQW  
(6'ꢊHPERVVHG  
5HHOꢊDVVHPEO\  
7DSH  
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ODEHOꢊVLGHꢊRIꢊUHHO  
4$ꢊVHDO  
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ODEHO  
3UHSULQWHGꢊ(6'  
ZDUQLQJ  
%DUFRGHꢊODEHO  
'U\SDFNꢊ,'ꢊVWLFNHU  
3ULQWHGꢊSODQRꢊER[  
DDDꢀꢁꢆꢉꢄꢁꢃ  
Fig 25. Reel dry pack for SMD: guard band; embossed tape  
NX5P3090  
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Product data sheet  
Rev. 1 — 1 August 2016  
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NXP Semiconductors  
USB PD and type C current-limited power switch  
Table 16. Dimensions and quantities  
Reel dimensions  
d w (mm) [1]  
SPQ/PQ  
(pcs) [2]  
Reels  
per box  
Outer box dimensions  
l w h (mm)  
180 8  
3000  
1
209 206 34  
[1] d = reel diameter; w = tape width.  
[2] Packing quantity dependent on specific product type.  
View ordering and availability details at NXP order portal, or contact your local NXP representative.  
16.2 Product orientation  
4ꢃꢐ7ꢃ 4ꢉꢐ7ꢅ  
EDOOꢊꢃ  
4ꢅꢐ7ꢁ 4ꢁꢐ7ꢉ  
DDDꢀꢁꢆꢃꢄꢆꢄ  
DDDꢀꢁꢆꢈꢉꢊꢈ  
Tape pocket quadrants  
Ball 1 is in quadrant Q1/T1  
Fig 26. Product orientation in carrier tape  
16.3 Carrier tape dimensions  
4 mm  
A
0
K
0
W
B
0
P
1
T
direction of feed  
001aao148  
Fig 27. Carrier tape dimensions  
Table 17. Carrier tape dimensions  
In accordance with IEC 60286-3.  
A0 (mm)  
B0 (mm)  
K0 (mm)  
T (mm)  
P1 (mm)  
W (mm)  
8 0.3 / 0.1  
1.61 0.05  
1.78 0.05  
0.73 0.05  
0.25 0.02  
4.0 0.1  
NX5P3090  
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Product data sheet  
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16.4 Reel dimensions  
A
Z
W2  
B
Ø C  
Ø D  
detail Z  
001aao149  
Fig 28. Schematic view of reel  
Table 18. Reel dimensions  
In accordance with IEC 60286-3.  
A [nom]  
(mm)  
W2 [max]  
(mm)  
B [min]  
(mm)  
C [min]  
(mm)  
D [min]  
(mm)  
180  
14.4  
1.5  
12.8  
20.2  
NX5P3090  
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16.5 Barcode label  
Fixed text  
Country of origin  
i.e. "Made in....." or  
"Diffused in EU [+]  
Assembled in......  
NXP SEMICONDUCTORS  
MADE IN >COUNTRY<  
Optional product information*  
[PRODUCT INFO]  
Re-approval date code*  
Packing unit (PQ) identification  
nd  
Origin code  
(33T) PUID: B.0987654321  
(30T) LOT2  
(31D) REDATE  
Product Manufacturing Code  
MSL at the Peak Body solder  
temperature with tin/lead*  
MSL at the higher lead-free  
Peak Body Temperature*  
2D matrix with all data  
2
2
2
traceability lot number*  
(youngest) date code*  
Quantity*  
(30D) DATE2 (32T) ORIG  
nd  
nd  
(30Q) QTY2  
(31T) PMC  
(31P) MSL/PBT  
(1T) LOT  
(9D) DATE  
Traceability lot number  
Date code  
With linear barcode  
Quantity  
With linear barcode  
Type number  
MSL/PBT  
(including the data identifiers)  
(Q) QTY  
Additional info if halogen  
free product  
Additional info on RoHS  
HALOGEN FREE  
RoHS compliant  
(30P) TYPE  
(1P) CODENO  
NXP 12NC  
With linear barcode  
Lead-free symbol  
001aak714  
Fig 29. Example of typical box and reel information barcode label  
Table 19. Barcode label dimensions  
Box barcode label  
Reel barcode label  
l w (mm)  
l w (mm)  
100 75  
100 75  
NX5P3090  
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17. Soldering of WLCSP packages  
17.1 Introduction to soldering WLCSP packages  
This text provides a very brief insight into a complex technology. A more in-depth account  
of soldering WLCSP (Wafer Level Chip-Size Packages) can be found in application note  
AN10439 “Wafer Level Chip Scale Package” and in application note AN10365 “Surface  
mount reflow soldering description”.  
Wave soldering is not suitable for this package.  
All NXP WLCSP packages are lead-free.  
17.2 Board mounting  
Board mounting of a WLCSP requires several steps:  
1. Solder paste printing on the PCB  
2. Component placement with a pick and place machine  
3. The reflow soldering itself  
17.3 Reflow soldering  
Key characteristics in reflow soldering are:  
• Lead-free versus SnPb soldering; note that a lead-free reflow process usually leads to  
higher minimum peak temperatures (see Figure 30) than a SnPb process, thus  
reducing the process window  
• Solder paste printing issues, such as smearing, release, and adjusting the process  
window for a mix of large and small components on one board  
• Reflow temperature profile; this profile includes preheat, reflow (in which the board is  
heated to the peak temperature), and cooling down. It is imperative that the peak  
temperature is high enough for the solder to make reliable solder joints (a solder paste  
characteristic) while being low enough that the packages and/or boards are not  
damaged. The peak temperature of the package depends on package thickness and  
volume and is classified in accordance with Table 20.  
Table 20. Lead-free process (from J-STD-020D)  
Package thickness (mm) Package reflow temperature (C)  
Volume (mm3)  
< 350  
260  
350 to 2000  
260  
> 2000  
260  
< 1.6  
1.6 to 2.5  
> 2.5  
260  
250  
245  
250  
245  
245  
Moisture sensitivity precautions, as indicated on the packing, must be respected at all  
times.  
Studies have shown that small packages reach higher temperatures during reflow  
soldering, see Figure 30.  
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USB PD and type C current-limited power switch  
maximum peak temperature  
= MSL limit, damage level  
temperature  
minimum peak temperature  
= minimum soldering temperature  
peak  
temperature  
time  
001aac844  
MSL: Moisture Sensitivity Level  
Fig 30. Temperature profiles for large and small components  
For further information on temperature profiles, refer to application note AN10365  
“Surface mount reflow soldering description”.  
17.3.1 Stand off  
The stand off between the substrate and the chip is determined by:  
• The amount of printed solder on the substrate  
• The size of the solder land on the substrate  
• The bump height on the chip  
The higher the stand off, the better the stresses are released due to TEC (Thermal  
Expansion Coefficient) differences between substrate and chip.  
17.3.2 Quality of solder joint  
A flip-chip joint is considered to be a good joint when the entire solder land has been  
wetted by the solder from the bump. The surface of the joint should be smooth and the  
shape symmetrical. The soldered joints on a chip should be uniform. Voids in the bumps  
after reflow can occur during the reflow process in bumps with high ratio of bump diameter  
to bump height, i.e. low bumps with large diameter. No failures have been found to be  
related to these voids. Solder joint inspection after reflow can be done with X-ray to  
monitor defects such as bridging, open circuits and voids.  
17.3.3 Rework  
In general, rework is not recommended. By rework we mean the process of removing the  
chip from the substrate and replacing it with a new chip. If a chip is removed from the  
substrate, most solder balls of the chip will be damaged. In that case it is recommended  
not to re-use the chip again.  
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Device removal can be done when the substrate is heated until it is certain that all solder  
joints are molten. The chip can then be carefully removed from the substrate without  
damaging the tracks and solder lands on the substrate. Removing the device must be  
done using plastic tweezers, because metal tweezers can damage the silicon. The  
surface of the substrate should be carefully cleaned and all solder and flux residues  
and/or underfill removed. When a new chip is placed on the substrate, use the flux  
process instead of solder on the solder lands. Apply flux on the bumps at the chip side as  
well as on the solder pads on the substrate. Place and align the new chip while viewing  
with a microscope. To reflow the solder, use the solder profile shown in application note  
AN10365 “Surface mount reflow soldering description”.  
17.3.4 Cleaning  
Cleaning can be done after reflow soldering.  
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18. Abbreviations  
Table 21. Abbreviations  
Acronym  
ESD  
Description  
ElectroStatic Discharge  
Charged Device Model  
Human Body Model  
CDM  
HBM  
USB  
Universal Serial Bus  
VOIP  
Voice over Internet Protocol  
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USB PD and type C current-limited power switch  
19. Revision history  
Table 22. Revision history  
Document ID  
Release date  
20160801  
Data sheet status  
Change notice  
Supersedes  
NX5P3090 v.1  
Product data sheet  
-
-
NX5P3090  
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20. Legal information  
20.1 Data sheet status  
Document status[1][2]  
Product status[3]  
Development  
Definition  
Objective [short] data sheet  
This document contains data from the objective specification for product development.  
This document contains data from the preliminary specification.  
This document contains the product specification.  
Preliminary [short] data sheet Qualification  
Product [short] data sheet Production  
[1]  
[2]  
[3]  
Please consult the most recently issued document before initiating or completing a design.  
The term ‘short data sheet’ is explained in section “Definitions”.  
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status  
information is available on the Internet at URL http://www.nxp.com.  
Suitability for use — NXP Semiconductors products are not designed,  
20.2 Definitions  
authorized or warranted to be suitable for use in life support, life-critical or  
safety-critical systems or equipment, nor in applications where failure or  
malfunction of an NXP Semiconductors product can reasonably be expected  
to result in personal injury, death or severe property or environmental  
damage. NXP Semiconductors and its suppliers accept no liability for  
inclusion and/or use of NXP Semiconductors products in such equipment or  
applications and therefore such inclusion and/or use is at the customer’s own  
risk.  
Draft — The document is a draft version only. The content is still under  
internal review and subject to formal approval, which may result in  
modifications or additions. NXP Semiconductors does not give any  
representations or warranties as to the accuracy or completeness of  
information included herein and shall have no liability for the consequences of  
use of such information.  
Short data sheet — A short data sheet is an extract from a full data sheet  
with the same product type number(s) and title. A short data sheet is intended  
for quick reference only and should not be relied upon to contain detailed and  
full information. For detailed and full information see the relevant full data  
sheet, which is available on request via the local NXP Semiconductors sales  
office. In case of any inconsistency or conflict with the short data sheet, the  
full data sheet shall prevail.  
Applications — Applications that are described herein for any of these  
products are for illustrative purposes only. NXP Semiconductors makes no  
representation or warranty that such applications will be suitable for the  
specified use without further testing or modification.  
Customers are responsible for the design and operation of their applications  
and products using NXP Semiconductors products, and NXP Semiconductors  
accepts no liability for any assistance with applications or customer product  
design. It is customer’s sole responsibility to determine whether the NXP  
Semiconductors product is suitable and fit for the customer’s applications and  
products planned, as well as for the planned application and use of  
customer’s third party customer(s). Customers should provide appropriate  
design and operating safeguards to minimize the risks associated with their  
applications and products.  
Product specification — The information and data provided in a Product  
data sheet shall define the specification of the product as agreed between  
NXP Semiconductors and its customer, unless NXP Semiconductors and  
customer have explicitly agreed otherwise in writing. In no event however,  
shall an agreement be valid in which the NXP Semiconductors product is  
deemed to offer functions and qualities beyond those described in the  
Product data sheet.  
NXP Semiconductors does not accept any liability related to any default,  
damage, costs or problem which is based on any weakness or default in the  
customer’s applications or products, or the application or use by customer’s  
third party customer(s). Customer is responsible for doing all necessary  
testing for the customer’s applications and products using NXP  
Semiconductors products in order to avoid a default of the applications and  
the products or of the application or use by customer’s third party  
customer(s). NXP does not accept any liability in this respect.  
20.3 Disclaimers  
Limited warranty and liability — Information in this document is believed to  
be accurate and reliable. However, NXP Semiconductors does not give any  
representations or warranties, expressed or implied, as to the accuracy or  
completeness of such information and shall have no liability for the  
consequences of use of such information. NXP Semiconductors takes no  
responsibility for the content in this document if provided by an information  
source outside of NXP Semiconductors.  
Limiting values — Stress above one or more limiting values (as defined in  
the Absolute Maximum Ratings System of IEC 60134) will cause permanent  
damage to the device. Limiting values are stress ratings only and (proper)  
operation of the device at these or any other conditions above those given in  
the Recommended operating conditions section (if present) or the  
Characteristics sections of this document is not warranted. Constant or  
repeated exposure to limiting values will permanently and irreversibly affect  
the quality and reliability of the device.  
In no event shall NXP Semiconductors be liable for any indirect, incidental,  
punitive, special or consequential damages (including - without limitation - lost  
profits, lost savings, business interruption, costs related to the removal or  
replacement of any products or rework charges) whether or not such  
damages are based on tort (including negligence), warranty, breach of  
contract or any other legal theory.  
Terms and conditions of commercial sale — NXP Semiconductors  
products are sold subject to the general terms and conditions of commercial  
sale, as published at http://www.nxp.com/profile/terms, unless otherwise  
agreed in a valid written individual agreement. In case an individual  
agreement is concluded only the terms and conditions of the respective  
agreement shall apply. NXP Semiconductors hereby expressly objects to  
applying the customer’s general terms and conditions with regard to the  
purchase of NXP Semiconductors products by customer.  
Notwithstanding any damages that customer might incur for any reason  
whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards  
customer for the products described herein shall be limited in accordance  
with the Terms and conditions of commercial sale of NXP Semiconductors.  
Right to make changes — NXP Semiconductors reserves the right to make  
changes to information published in this document, including without  
limitation specifications and product descriptions, at any time and without  
notice. This document supersedes and replaces all information supplied prior  
to the publication hereof.  
No offer to sell or license — Nothing in this document may be interpreted or  
construed as an offer to sell products that is open for acceptance or the grant,  
conveyance or implication of any license under any copyrights, patents or  
other industrial or intellectual property rights.  
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Product data sheet  
Rev. 1 — 1 August 2016  
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USB PD and type C current-limited power switch  
Export control — This document as well as the item(s) described herein  
may be subject to export control regulations. Export might require a prior  
authorization from competent authorities.  
NXP Semiconductors’ specifications such use shall be solely at customer’s  
own risk, and (c) customer fully indemnifies NXP Semiconductors for any  
liability, damages or failed product claims resulting from customer design and  
use of the product for automotive applications beyond NXP Semiconductors’  
standard warranty and NXP Semiconductors’ product specifications.  
Non-automotive qualified products — Unless this data sheet expressly  
states that this specific NXP Semiconductors product is automotive qualified,  
the product is not suitable for automotive use. It is neither qualified nor tested  
in accordance with automotive testing or application requirements. NXP  
Semiconductors accepts no liability for inclusion and/or use of  
Translations — A non-English (translated) version of a document is for  
reference only. The English version shall prevail in case of any discrepancy  
between the translated and English versions.  
non-automotive qualified products in automotive equipment or applications.  
In the event that customer uses the product for design-in and use in  
automotive applications to automotive specifications and standards, customer  
(a) shall use the product without NXP Semiconductors’ warranty of the  
product for such automotive applications, use and specifications, and (b)  
whenever customer uses the product for automotive applications beyond  
20.4 Trademarks  
Notice: All referenced brands, product names, service names and trademarks  
are the property of their respective owners.  
21. Contact information  
For more information, please visit: http://www.nxp.com  
For sales office addresses, please send an email to: salesaddresses@nxp.com  
NX5P3090  
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USB PD and type C current-limited power switch  
22. Contents  
1
General description. . . . . . . . . . . . . . . . . . . . . . 1  
17.3  
Reflow soldering . . . . . . . . . . . . . . . . . . . . . . 26  
Stand off. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27  
Quality of solder joint . . . . . . . . . . . . . . . . . . . 27  
Rework. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27  
Cleaning. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28  
17.3.1  
17.3.2  
17.3.3  
17.3.4  
2
Features and benefits . . . . . . . . . . . . . . . . . . . . 1  
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2  
Ordering information. . . . . . . . . . . . . . . . . . . . . 2  
Ordering options. . . . . . . . . . . . . . . . . . . . . . . . 2  
Marking. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2  
Functional diagram . . . . . . . . . . . . . . . . . . . . . . 3  
3
4
4.1  
5
18  
19  
Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . 29  
Revision history . . . . . . . . . . . . . . . . . . . . . . . 30  
6
20  
Legal information . . . . . . . . . . . . . . . . . . . . . . 31  
Data sheet status . . . . . . . . . . . . . . . . . . . . . . 31  
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . 31  
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . 31  
Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . 32  
7
7.1  
7.2  
Pinning information. . . . . . . . . . . . . . . . . . . . . . 4  
Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4  
Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 4  
20.1  
20.2  
20.3  
20.4  
8
8.1  
8.2  
8.3  
Functional description . . . . . . . . . . . . . . . . . . . 5  
EN Input . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5  
Under-voltage lock-out . . . . . . . . . . . . . . . . . . . 5  
ILIM. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5  
Over-current protection (OCP) . . . . . . . . . . . . . 5  
Over-current at start-up . . . . . . . . . . . . . . . . . . 5  
Over-current when enabled . . . . . . . . . . . . . . . 6  
Short circuit when enabled . . . . . . . . . . . . . . . . 6  
Reverse-Current protection (RCP) . . . . . . . . . . 6  
FAULT output . . . . . . . . . . . . . . . . . . . . . . . . . . 6  
Over-temperature protection . . . . . . . . . . . . . . 6  
21  
22  
Contact information . . . . . . . . . . . . . . . . . . . . 32  
Contents. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33  
8.4  
8.4.1  
8.4.2  
8.4.3  
8.5  
8.6  
8.7  
9
Application diagram . . . . . . . . . . . . . . . . . . . . . 7  
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 8  
Recommended operating conditions. . . . . . . . 8  
Thermal characteristics . . . . . . . . . . . . . . . . . . 9  
10  
11  
12  
13  
Static characteristics. . . . . . . . . . . . . . . . . . . . . 9  
Graphs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10  
Thermal shutdown . . . . . . . . . . . . . . . . . . . . . 12  
ON resistance. . . . . . . . . . . . . . . . . . . . . . . . . 13  
ON resistance graphs. . . . . . . . . . . . . . . . . . . 13  
Current limit . . . . . . . . . . . . . . . . . . . . . . . . . . 14  
Current limit graphs . . . . . . . . . . . . . . . . . . . . 14  
13.1  
13.2  
13.3  
13.4  
13.5  
13.6  
14  
14.1  
15  
Dynamic characteristics . . . . . . . . . . . . . . . . . 15  
Waveform and test circuits . . . . . . . . . . . . . . . 15  
Package outline . . . . . . . . . . . . . . . . . . . . . . . . 21  
16  
Packing information . . . . . . . . . . . . . . . . . . . . 22  
Packing method . . . . . . . . . . . . . . . . . . . . . . . 22  
Product orientation . . . . . . . . . . . . . . . . . . . . . 23  
Carrier tape dimensions . . . . . . . . . . . . . . . . . 23  
Reel dimensions. . . . . . . . . . . . . . . . . . . . . . . 24  
Barcode label . . . . . . . . . . . . . . . . . . . . . . . . . 25  
16.1  
16.2  
16.3  
16.4  
16.5  
17  
17.1  
17.2  
Soldering of WLCSP packages. . . . . . . . . . . . 26  
Introduction to soldering WLCSP packages . . 26  
Board mounting . . . . . . . . . . . . . . . . . . . . . . . 26  
Please be aware that important notices concerning this document and the product(s)  
described herein, have been included in section ‘Legal information’.  
© NXP Semiconductors N.V. 2016.  
All rights reserved.  
For more information, please visit: http://www.nxp.com  
For sales office addresses, please send an email to: salesaddresses@nxp.com  
Date of release: 1 August 2016  
Document identifier: NX5P3090  
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