NICHIA STS-DA1-3115H <Cat.No.180625>
(2) Directions for Use
● The circuit must be designed to ensure that the Absolute Maximum Ratings are not exceeded for each LED. The LEDs should be
operated at a constant current per LED. In the case of operating at a constant voltage, Circuit B is recommended. If Circuit A is
used, it may cause the currents flowing through the LEDs to vary due to the variation in the forward voltage characteristics of the
LEDs on the circuit.
(A)
(B)
● This LED is designed to be operated at a forward current. Ensure that no voltage is applied to the LED in the forward/reverse
direction while the LED is off. If the LEDs are used in an environment where reverse voltages are applied to the LED continuously,
it may cause electrochemical migration to occur causing the LED to be damaged. When not in use for a long period of time, the
system’s power should be turned off to ensure that there are no issues/damage.
● To stabilize the LED characteristics while in use, Nichia recommends that the LEDs are operated at currents ≥ 10% of the sorting
current.
● Ensure that transient excessive voltages (e.g. lighting surge) are not applied to the LEDs.
● If the LEDs are used for outdoor applications, ensure that necessary measures are taken (e.g. protecting the LEDs from water/salt
damage and high humidity).
● Although this LED is specifically designed to emit invisible light, a small amount of light in the visible region exists in the emission
spectrum. Ensure that when using the LEDs for sensors, verification is performed to ensure that the emission spectrum is fit for
the intended use.
● If this LED is stored and/or used constantly under high temperature and high humidity conditions, it may accelerate the
deterioration of the die; this may cause the radiant flux to decrease. If the LEDs are stored and/or used under these conditions,
sufficient verification must be done prior to use to ensure that there are no issues for the chosen application.
(3) Handling Precautions
● Do not handle the LEDs with bare hands:
- this may contaminate the LED surface and have an effect on the optical characteristics,
- this may cause the LED to deform and/or the wire to break causing a catastrophic failure (i.e. the LED not to illuminate).
● When handling the product with tweezers, be careful not to apply excessive force to the glass. Otherwise, The glass can be cut,
chipped, delaminate or deformed, causing wire-bond breaks and catastrophic failures.
● Dropping may cause damage to the LED (e.g. deformation).
● Do not stack assembled PCBs together. Otherwise, it may cause damage to the glass cover (e.g. cut, scratch, chip, crack,
delamination and deformation) and the wire to break causing a catastrophic failure (i.e. the LED not to illuminate).
(4) Design Consideration
● To operate the LEDs, using a copper-core PCB is recommended; this may cause issues (e.g. cracks in the glass cover/solder joints
due to thermal stress) depending on the reflow soldering conditions. Ensure that sufficient verification is performed prior to use
to ensure that there are no issues with the PCB/soldering conditions for the chosen application.
● If the LEDs are soldered to a PCB and the PCB assembly is bent (e.g. PCB depaneling process), it may cause the LED package to
break. The PCB layout should be designed to minimize the mechanical stress on the LEDs when the PCB assembly is bent/warped.
● The amount of mechanical stress exerted on the LED from depaneling may vary depending on the LED position/orientation on the
PCB assembly (e.g. especially in areas near V-groove scores). The PCB layout should be designed to minimize the mechanical
stress on the LEDs when the PCB is separated into individual PCB assemblies.
● To separate a PCB populated with the LEDs, use a specially designed tool. Do not break the PCB by hand.
● If an aluminum-core PCB is used to operate the LEDs, it may cause thermal stress during operation causing damage to the solder
joints (e.g. crack). Ensure that sufficient verification is performed prior to use.
● Volatile organic compounds that have been released from materials present around the LEDs (e.g. housing, gasket/seal, adhesive,
secondary lens, lens cover, thermal grease, etc.) may adhere to the LED glass cover and other areas (e.g. package). If the LEDs
are being used in a hermetically sealed environment, these volatile compounds can discolor after being exposed to heat and/or
photon energy and it may greatly reduce the LED light output. In this case, ventilating the environment may improve the
reduction in light output. Perform a light-up test of the chosen application for optical evaluation to ensure that there are no issues.
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