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EXC3B

型号:

EXC3B

品牌:

PANASONIC[ PANASONIC ]

页数:

7 页

PDF大小:

134 K

Chip Bead Cores  
Chip Bead Cores  
Type:  
EXCCL  
EXCML  
EXC3B  
Discontinued  
Features  
Recommended Applications  
Effective noise suppression for power lines and high  
Digital equipment such as PCs, word processors,  
printers, HDD, PCC, CD-ROMs, DVD-ROMs.  
Digital audio and video equipment such as VCRs,  
DVC, CD Players, DVD Players.  
speed signal lines  
Easy pattern layout on PC Board  
RoHS compliant  
AC adapters, and switching power supplies.  
Electronic musical instruments, and other digital  
equipment.  
Type: EXCCL, EXCML  
Low DC Resistance 3 to 8 m typical: Rated  
Ω
current (3 and 4 Amperes) (type: EXCML)  
Low impedance  
Type: EXC3B  
High impedance for high speed signal line noise  
Increased attenuation  
Ω
Ω
60 -1 A, 120 -0.5 A are achieved by using 1608  
size (type: EXC3BP)  
Type: EXCCL  
Explanation of Part Numbers  
1
2
3
4
5
6
7
8
9
10  
11  
12  
&
9
$
$
-
6
Product Code  
Type Part kind  
Size  
Form  
Suffix  
Code  
U
Packing  
Embossed Carrier Taping  
Noise Filter  
Chip type  
Bead core  
Code Dimensions (mm)  
4532  
3225  
3216  
4.5L3.2L1.8  
3.2L2.5L1.6  
3.2L1.6L1.6  
Design and specications are each subject to change without notice. Ask factory for the current technical specications before purchase and/or use.  
Should a safety concern arise regarding this product, please be sure to contact us immediately.  
02 Nov. 2012  
Chip Bead Cores  
Discontinued  
Construction  
Dimensions in mm (not to scale)  
A
A
L
Mass  
Dimensions (mm)  
Type  
(inch size)  
Ferrite core  
(Weight)  
[mg/pc.]  
Electrode  
L
W
H
A
EXCCL4532  
(1812)  
4.5 0.4 3.2 0.3 1.8 0.2 0.5 0.2 125.8  
EXCCL3225  
3.2 0.3 2.5 0.3 1.6 0.3 0.5 0.3  
3.2 0.3 1.6 0.3 1.6 0.3 0.5 0.3  
60.5  
37  
(1210)  
EXCCL3216  
(1206)  
Type: EXCML  
Explanation of Part Numbers  
1
2
3
4
5
6
7
8
9
10  
11  
12  
&
9
$
.
-
"
6
Product Code  
Type Part kind  
Size  
Material  
Nominal Impedance  
Form  
Molded  
Chip type  
The first two digits are  
significant figure of  
impedance value and the  
third one denotes the  
Code  
U
Packing  
Noise Filter  
Bead core  
Code Dimensions (mm)  
45  
32  
20  
16  
4.5L1.6 L1.1  
3.2L1.6 L0.9  
2.0L1.25L0.9  
1.6L0.8 L0.8  
Embossed Carrier Taping  
(EXCML16 to 32)  
Embossed Carrier Taping  
(EXCML45)  
number of zeros following  
H
Construction  
Dimensions in mm (not to scale)  
T
e
W
L
Ferrite core  
Electrode  
Mass  
Dimensions (mm)  
Type  
(inch size)  
(Weight)  
[mg/pc.]  
L
W
T
e
EXCML16  
(0603)  
Conductor  
1.6 0.2  
0.8 0.2  
0.8 0.2  
(0.4)  
(0.5)  
(0.6)  
(0.6)  
4.5  
10.5  
21.5  
36.0  
EXCML20  
2.0 0.2 1.25 0.20 0.9 0.2  
(0805)  
EXCML32  
(1206)  
3.2 0.3  
4.5 0.3  
1.6 0.3  
1.6 0.3  
0.9 0.2  
1.1 0.2  
EXCML45  
(1806)  
Design and specications are each subject to change without notice. Ask factory for the current technical specications before purchase and/or use.  
Should a safety concern arise regarding this product, please be sure to contact us immediately.  
02 Nov. 2012  
Chip Bead Cores  
Discontinued  
Type: EXC3B  
Explanation of Part Numbers  
1
2
3
4
5
6
7
8
9
10  
11  
12  
&
9
$
#
#
)
Product Code  
Size  
Type Characteristics  
Nominal Impedance  
Form  
Suffix  
Multilayer  
Chip type  
Bead Core  
High frequency  
High attenuation  
for signal Lines  
High frequency  
High attenuation  
for Power Lines  
The first two digits are  
significant figure of  
impedance value and the  
third one denotes the  
number of zeros following  
Code  
H
Packing  
Noise Filter  
Code Dimensions (mm)  
1.6L0.8L0.8  
B
P
3
Embossed Carrier Taping  
Construction  
Dimensions in mm (not to scale)  
T
e
Ferrite core  
Electrode  
W
L
Inner Conductor  
Mass  
Dimensions (mm)  
Type  
(inch size)  
(Weight)  
[mg/pc.]  
L
W
T
e
EXC3BB  
(0603)  
1.6 0.2 0.8 0.2 0.8 0.2 0.3 0.2  
1.6 0.2 0.8 0.2 0.8 0.2 0.3 0.2  
4.5  
4.5  
EXC3BP  
(0603)  
Ratings  
Impedance  
Rated Current  
(mA DC)  
DC Resistance  
Type  
Part Number  
(Ω) max.  
(Ω) at 100 MHz  
tol.(%)  
4532  
3225  
3216  
4516  
3216  
2012  
1608  
EXCCL4532U1  
EXCCL3225U1  
EXCCL3216U1  
EXCML45A910H  
EXCML32A680U  
EXCML20A390U  
EXCML16A270U  
EXC3BP600H  
EXC3BP121H  
EXC3BB221H  
EXC3BB601H  
EXC3BB102H  
115  
45  
2000  
2000  
2000  
3000  
3000  
4000  
4000  
1000  
500  
0.1  
0.05  
0.05  
0.016  
0.012  
0.008  
0.006  
0.07  
0.1  
25  
91  
68  
39  
25  
27  
60  
120  
220  
600  
1000  
1608  
200  
0.3  
100  
0.8  
50  
1
Category Temperature Range –25 °C to +85 °C  
Design and specications are each subject to change without notice. Ask factory for the current technical specications before purchase and/or use.  
Should a safety concern arise regarding this product, please be sure to contact us immediately.  
02 Nov. 2012  
Chip Bead Cores  
Impedance Characteristics (Reference Data) Measured by HP4291A  
∣ ∣  
Z : Impedance  
R : Resistance  
X : Reactance  
Discontinued  
LEXCML16A270U (1608)  
LEXCCL4532U1 (4532)  
140  
120  
100  
80  
140  
120  
100  
80  
Z
R
60  
60  
X
40  
20  
0
40  
20  
0
Z
R
X
10  
100  
1000  
10000  
1
1
10  
100  
1000  
10000  
10000  
10000  
Frequency(MHz)  
Frequency(MHz)  
LEXCCL3225U1 (3225)  
LEXCML20A390U (2012)  
140  
120  
100  
80  
140  
120  
100  
80  
60  
60  
40  
20  
0
Z
Z
40  
20  
0
R
R
X
X
1
10  
100  
1000  
10000  
1
10  
100  
1000  
Frequency(MHz)  
Frequency(MHz)  
LEXCML32A680U (3216)  
LEXCCL3216U1 (3216)  
140  
120  
100  
140  
120  
100  
80  
Z
80  
60  
40  
20  
0
R
60  
Z
40  
20  
0
X
R
X
1
10  
100  
1000  
10000  
1
10  
100  
1000  
Frequency(MHz)  
Frequency(MHz)  
LEXCML45A910H (4516)  
180  
160  
140  
120  
100  
Z
R
80  
60  
40  
20  
0
X
1
10  
100  
1000  
10000  
Frequency(MHz)  
Design and specications are each subject to change without notice. Ask factory for the current technical specications before purchase and/or use.  
Should a safety concern arise regarding this product, please be sure to contact us immediately.  
02 Nov. 2012  
Chip Bead Cores  
Impedance Characteristics (Reference Data) Measured by HP4291A  
∣ ∣  
Z : Impedance  
R : Resistance  
X : Reactance  
Discontinued  
LEXC3BB221H (1608)  
LEXC3BP121H (1608)  
1400  
1200  
1000  
800  
600  
400  
200  
0
200  
150  
100  
50  
Z
R
X
Z
R
0
X
1
10  
100  
1000  
10000  
10000  
10000  
1
10  
100  
1000  
10000  
Frequency(MHz)  
Frequency(MHz)  
LEXC3BB601H (1608)  
LEXC3BP600H (1608)  
1400  
1200  
1000  
800  
600  
400  
200  
0
200  
150  
100  
50  
Z
R
R
Z
X
X
0
1
10  
100  
1000  
1
10  
100  
1000  
10000  
Frequency(MHz)  
Frequency(MHz)  
LEXC3BB102H (1608)  
1400  
1200  
Z
1000  
800  
600  
400  
200  
0
R
X
1
10  
100  
1000  
Frequency(MHz)  
Design and specications are each subject to change without notice. Ask factory for the current technical specications before purchase and/or use.  
Should a safety concern arise regarding this product, please be sure to contact us immediately.  
02 Nov. 2012  
Chip Bead Cores  
Packaging Methods (Taping)  
Standard Quantity  
Discontinued  
Part Number  
Kind of Taping  
Pitch (P1)  
8 mm  
Quantity  
EXCCL4532U1  
EXCCL3225U1  
EXCCL3216U1  
EXCML45A910H  
EXCML32A680U  
EXCML20A390U  
EXCML16A270U  
EXC3B□□□□H  
1000 pcs./reel  
2000 pcs./reel  
3000 pcs./reel  
Embossed Carrier Taping  
4 mm  
4000 pcs./reel  
Embossed Carrier Taping  
Taping Reel  
T
Sprocket hole  
Compartment  
fD0  
f C  
A
f D  
E
P1  
P2  
P0  
t2  
Chip component  
Tape running direction  
f A  
W
Embossed Carrier Dimensions (mm)  
Part Number  
A
B
W
F
P1  
P2  
P0  
0D0  
t2  
EXCCL4532U1  
EXCCL3225U1  
EXCCL3216U1  
EXCML45A910H  
EXCML32A680U  
EXCML20A390U  
EXCML16A270U  
EXC3B□□□□H  
3.6 0.2  
2.9 0.2  
2.0 0.2  
1.9 0.2  
1.9 0.2  
1.5 0.2  
1.0 0.2  
1.0 0.1  
4.9 0.2  
3.6 0.2  
3.6 0.2  
4.8 0.2  
3.5 0.2  
2.3 0.2  
1.8 0.2  
1.8 0.1  
12.0 0.2  
5.5 0.1  
8.0 0.1  
2.4 max.  
8.0 0.2  
12.0 0.2  
3.5 0.1  
5.5 0.1  
2.1 max.  
1.8 max.  
4.0 0.1  
2.0 0.1  
4.0 0.1  
1.5 0.1  
8.0 0.2  
3.5 0.1  
1.6 max.  
Standard Reel Dimensions (mm)  
Part Number  
0A  
0B  
0C  
0D  
E
W
T
EXCCL4532U1  
EXCCL3225U1  
EXCCL3216U1  
EXCML45A910H  
EXCML32A680U  
EXCML20A390U  
EXCML16A270U  
EXC3B□□□□H  
13.0 0.3  
09.0 0.3  
13.0 0.3  
16.5 max.  
13 max.  
180.003.0  
60.0 1.0  
13.0 0.5  
21.0 0.8  
2.0 0.5  
16.5 max.  
09.0 0.3  
13 max.  
Design and specications are each subject to change without notice. Ask factory for the current technical specications before purchase and/or use.  
Should a safety concern arise regarding this product, please be sure to contact us immediately.  
02 Nov. 2012  
Chip Bead Cores  
Recommended Land Pattern Dimensions in mm (not to scale)  
Discontinued  
(mm)  
Part Number  
EXCCL4532U1  
EXCCL3225U1  
A
3
B
C
5.4  
4.1  
4.1  
2.8  
2.1  
1.2  
1.7  
1.7  
EXCCL3216U1  
EXCML45A910H  
EXCML32A680U  
EXCML20A390U  
EXCML16A270U  
EXC3B□□□□H  
A
B
2.6 to 3  
1.6 to 2  
0.8 to 1.2  
0.6 to 1  
0.8 to 1  
5.5 to 6.5  
4 to 5  
1.2 to 1.6  
1.2 to 1.6  
1 to 1.2  
0.8 to 1  
0.8 to 1  
3 to 4  
2 to 3  
C
2 to 2.6  
Recommended Soldering Conditions  
Recommendations and precautions are described below.  
Recommended soldering conditions for reflow  
· Reflow soldering shall be performed a maximum of  
two times.  
· Please contact us for additional information when  
used in conditions other than those specified.  
· Please measure the temperature of the terminals  
and study every kind of solder and printed circuit  
board for solderability before actual use.  
For soldering (Example : Sn-37Pb)  
Temperature  
Time  
Preheating  
Main heating  
Peak  
140 °C to 160 °C  
Above 200 °C  
235 10 °C  
60 s to 120 s  
30 s to 40 s  
max. 10 s  
Peak  
Preheating  
For lead-free soldering (Example : Sn/3Ag/0.5Cu)  
Temperature  
150 °C to 170 °C  
Above 230 °C  
max. 260 °C  
Time  
Heating  
Preheating  
Main heating  
Peak  
60 s to 120 s  
30 s to 40 s  
max. 10 s  
Time  
Flow soldering  
· Flow soldering may cause this product to come off because the adhesiveness of the product element is low.  
Please consult our sales representative in advance about flow soldering.  
<Repair with hand soldering>  
Preheat with a blast of hot air or similar method. Use a soldering iron with a tip temperature of 350 °C or less. Solder  
each electrode for 3 seconds or less.  
Never touch this product with the tip of a soldering iron.  
Safety Precautions  
The following are precautions for individual products. Please also refer to the common precautions for Noise Suppression  
Device shown on this catalog.  
1. Use rosin-based flux or halogen-free flux.  
2. For cleaning, use an alcohol-based cleaning agent. Before using any other type, consult with our sales person  
in advance.  
3. Do not apply shock to Chip Bead Cores (hereafter called the bead cores) or pinch them with a hard tool (e.g.  
pliers and tweezers). Otherwise, their bodies may be chipped, affecting their performance.  
Excessive mechanical stress may damage the bead cores. Handle with care.  
4. Store the bead cores in a location with a temperature ranging from -5 °C to +40 °C and a relative humidity of  
40 % to 60 %, where there are no rapid changes in temperature or humidity.  
5. Use the bead cores within a year (EXC3B Type: within half a year) after the date of the outgoing inspection  
indicated on the packages.  
Design and specications are each subject to change without notice. Ask factory for the current technical specications before purchase and/or use.  
Should a safety concern arise regarding this product, please be sure to contact us immediately.  
02 Nov. 2012  
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