COMCHIP
SSMMDD SSwwiittcchinngg Diode
(Lead-free Device)
CDSF355-B01
SMD Diodes Specialist
High Speed
Features
Designed for mounting on small surface.
Extremely thin/leadless package.
Low leakage current.
1005(2512)
0.102(2.60)
0.095(2.40)
0.051(1.30)
0.043(1.10)
High mounting capability, strong surge
withstand, high reliability.
Mechanical data
0.035(0.90)
0.027(0.70)
Case: 1005 (2512) standard package,
molded plastic.
0.020(0.50) Typ.
Terminals: Gold plated, solderable per
MIL-STD-750, method 2026.
0.012 (0.30) Typ.
Polarity: Indicated by cathode band.
0.020(0.50) Typ.
Mounting position: Any.
Dimensions in inches and (millimeter)
Weight: 0.006 gram (approximately)
Maximum Rating ( at TA = 25 C unless otherwise noted )
Parameter
Repetitive peak reverse voltage
Reverse voltage
Symbol
Conditions
Typ Max Unit
Min
VRRM
90
80
V
VR
V
Average forward current
IO
100
mA
8.3 ms single half sine-wave superimposed
on rate load ( JEDEC method )
Forward current , surge peak
IFSM
1000
mA
Repetitive peak forward current
Power Dissipation
IFRM
225
300
mA
PD
mW
TSTG
+125
+125
-40
-40
Storage temperature
C
C
T j
Junction temperature
Electrical Characteristics ( at TA = 25 C unless otherwise noted )
Parameter
Conditions
Symbol Min Typ Max
Unit
Forward voltage
I F = 100 mADC
VF
1.0
V
Reverse current
VR = 80 V
IR
0.1
uA
Capacitance between terminals
Reverse recovery time
f = 1MHz, and 0.5VDC reversevoltage
CT
3
4
pF
VR = 6V, IF = 10 mA, RL =50 ohms
Trr
nS
REV:A
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