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XTR105TDC1

型号:

XTR105TDC1

品牌:

TI[ TEXAS INSTRUMENTS ]

页数:

5 页

PDF大小:

110 K

XTR105-DIE  
www.ti.com  
SBOS648 AUGUST 2012  
4-20mA CURRENT TRANSMITTER WITH SENSOR EXCITATION AND LINEARIZATION  
1
FEATURES  
Low Unadjusted Error  
Two Precision Current Sources  
Linearization  
APPLICATIONS  
Industrial Process Control  
Factory Automation  
2- or 3-Wire RTD Operation  
Low Offset Drift  
SCADA Remote Data Acquisition  
Remote Temperature and Pressure  
Transducers  
Low Output Current Noise  
High PSR  
High CMR  
Wide Supply Range  
DESCRIPTION  
The XTR105 is a monolithic 4-20mA, 2-wire current transmitter with two precision current sources. It provides  
complete current excitation for platinum RTD temperature sensors and bridges, instrumentation amplifiers, and  
current output circuitry on a single integrated circuit.  
Versatile linearization circuitry provides a 2nd-order correction to the RTD, typically achieving a 40:1  
improvement in linearity.  
Instrumentation amplifier gain can be configured for a wide range of temperature or pressure measurements.  
Total unadjusted error of the complete current transmitter is low enough to permit use without adjustment in  
many applications. This includes zero output current drift, span drift, and nonlinearity. The XTR105 operates on  
loop power-supply voltages.  
ORDERING INFORMATION(1)  
PACKAGE  
DESIGNATOR  
PRODUCT  
PACKAGE  
ORDERABLE PART NUMBER  
PACKAGE QUANTITY  
XTR105TDC1  
XTR105TDC2  
80  
10  
XTR105  
TD  
Bare die in waffle pack(2)  
(1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI  
web site at www.ti.com.  
(2) Processing is per the Texas Instruments commercial production baseline and is in compliance with the Texas Instruments Quality  
Control System in effect at the time of manufacture. Electrical screening consists of DC parametric and functional testing at room  
temperature only. Unless otherwise specified by Texas Instruments AC performance and performance over temperature is not  
warranted. Visual Inspection is performed in accordance with MIL-STD-883 Test Method 2010 Condition B at 75X minimum.  
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of  
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
PRODUCTION DATA information is current as of publication date.  
Copyright © 2012, Texas Instruments Incorporated  
Products conform to specifications per the terms of the Texas  
Instruments standard warranty. Production processing does not  
necessarily include testing of all parameters.  
XTR105-DIE  
SBOS648 AUGUST 2012  
www.ti.com  
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with  
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.  
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more  
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.  
BARE DIE INFORMATION  
BACKSIDE  
POTENTIAL  
BOND PAD  
METALLIZATION COMPOSITION  
BOND PAD  
THICKNESS  
DIE THICKNESS  
BACKSIDE FINISH  
10.5 mils.  
Silicon with backgrind  
Floating  
AlCu (0.5%)  
1100 nm  
2
Submit Documentation Feedback  
Copyright © 2012, Texas Instruments Incorporated  
XTR105-DIE  
www.ti.com  
SBOS648 AUGUST 2012  
Table 1. Bond Pad Coordinates in Microns  
DESCRIPTION  
PAD NUMBER  
X MIN  
-1612.9  
-1176.02  
-972.82  
-590.55  
-180.34  
157.48  
Y MIN  
-462.28  
-833.12  
-817.88  
-833.12  
-833.12  
-802.64  
-848.36  
-848.36  
-848.36  
-513.08  
-281.94  
514.35  
751.84  
716.28  
731.52  
731.52  
576.58  
360.68  
X MAX  
-1511.3  
-1074.42  
-805.18  
-488.95  
-12.7  
Y MAX  
-360.68  
-731.52  
-716.28  
-731.52  
-731.52  
-701.04  
-746.76  
-746.76  
-746.76  
-411.48  
-180.34  
615.95  
854.44  
817.88  
833.12  
833.12  
678.18  
462.28  
IR1  
VIN-  
RG  
1
2
3
RG  
4
RG  
5
RG  
6
259.08  
N/C  
7
407.67  
509.27  
N/C  
8
613.41  
715.01  
IRET  
IO  
9
1483.36  
1511.3  
1584.96  
1612.9  
10  
11  
12  
13  
14  
15  
16  
17  
18  
E (Emitter)  
B (Base)  
V+  
1483.36  
1483.36  
1508.76  
175.26  
1584.96  
1584.96  
1610.26  
276.86  
VREG  
VLIN  
VIN+  
N/C  
-1123.95  
-1408.43  
-1612.9  
-1612.9  
-1022.35  
-1306.83  
-1511.3  
-1511.3  
IR2  
Copyright © 2012, Texas Instruments Incorporated  
Submit Documentation Feedback  
3
PACKAGE OPTION ADDENDUM  
www.ti.com  
21-Aug-2012  
PACKAGING INFORMATION  
Status (1)  
Eco Plan (2)  
MSL Peak Temp (3)  
Samples  
Orderable Device  
Package Type Package  
Drawing  
Pins  
Package Qty  
Lead/  
Ball Finish  
(Requires Login)  
XTR105TDC1  
XTR105TDC2  
ACTIVE  
ACTIVE  
0
0
80  
10  
TBD  
TBD  
Call TI  
Call TI  
N / A for Pkg Type  
N / A for Pkg Type  
(1) The marketing status values are defined as follows:  
ACTIVE: Product device recommended for new designs.  
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.  
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.  
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.  
OBSOLETE: TI has discontinued the production of the device.  
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability  
information and additional product content details.  
TBD: The Pb-Free/Green conversion plan has not been defined.  
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that  
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.  
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between  
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.  
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight  
in homogeneous material)  
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.  
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information  
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and  
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.  
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.  
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.  
Addendum-Page 1  
IMPORTANT NOTICE  
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TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms  
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Copyright © 2012, Texas Instruments Incorporated  
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