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XTR116UA/2K5

型号：

XTR116UA/2K5

品牌：

TI[ TEXAS INSTRUMENTS ]

页数：

13 页

PDF大小：

259 K

下载PDF手册
XTR115  
XTR116  
XTR116  
XTR115  
SBOS124A – JANUARY 2000 – REVISED NOVEMBER 2003  
4-20mA CURRENT LOOP TRANSMITTERS  
FEATURES  
APPLICATIONS  
ꢀ LOW QUIESCENT CURRENT: 200µA  
ꢀ 5V REGULATOR FOR EXTERNAL CIRCUITS  
ꢀ VREF FOR SENSOR EXCITATION:  
ꢀ 2-WIRE, 4-20mA CURRENT LOOP  
TRANSMITTER  
ꢀ SMART TRANSMITTER  
ꢀ INDUSTRIAL PROCESS CONTROL  
ꢀ TEST SYSTEMS  
XTR115: 2.5V  
XTR116: 4.096V  
ꢀ LOW SPAN ERROR: 0.05%  
ꢀ COMPATIBLE WITH HART MODEM  
ꢀ CURRENT AMPLIFIER  
ꢀ LOW NONLINEARITY ERROR: 0.003%  
ꢀ WIDE LOOP SUPPLY RANGE: 7.5V to 36V  
ꢀ SO-8 PACKAGE  
ꢀ VOLTAGE-TO-CURRENT AMPLIFIER  
used for offsetting or to excite transducers. A current  
return pin (IRET) senses any current used in external  
circuitry to assure an accurate control of the output  
current.  
DESCRIPTION  
The XTR115 and XTR116 are precision current out-  
put converters designed to transmit analog 4-to-20mA  
signals over an industry standard current loop. They  
provide accurate current scaling and output current  
limit functions.  
The XTR115 is a fundamental building block of  
smart sensors using 4-to-20mA current transmission.  
The XTR115 and XTR116 are specified for opera-  
tion over the extended industrial temperature range,  
–40°C to +85°C.  
The on-chip voltage regulator (5V) can be used to  
power external circuitry. A precision on-chip VREF  
(2.5V for XTR115 and 4.096V for XTR116) can be  
XTR115  
XTR116  
VREG  
+5V  
Regulator  
V+  
7
+5V  
8
VREF  
1
Voltage  
Reference  
XTR115: 2.5V  
XTR116: 4.096V  
VLOOP  
B
6
RIN  
IIN  
2
RL  
A1  
+
E
5
VIN  
–
RLIM  
3
IRET  
100 VIN  
R1  
2.475kΩ  
R2  
25Ω  
IO  
=
RIN  
4
I = 100 • IIN  
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of  
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
All trademarks are the property of their respective owners.  
PRODUCTION DATA information is current as of publication date.  
Products conform to specifications per the terms of Texas Instruments  
standard warranty. Production processing does not necessarily include  
testing of all parameters.  
Copyright © 2000-2003, Texas Instruments Incorporated  
www.ti.com  
SPECIFICATIONS  
At TA = +25°C, V+ = 24V, RIN = 20kΩ, and TIP29C external transistor, unless otherwise noted.  
XTR115U  
XTR116U  
XTR115UA  
XTR116UA  
PARAMETER  
CONDITIONS  
MIN  
TYP  
MAX  
MIN  
TYP  
MAX  
UNITS  
OUTPUT  
Output Current Equation  
Output Current, Linear Range  
Over-Scale Limit  
IO  
IO = IIN • 100  
ꢀ
0.25  
25  
ꢀ
ꢀ
ꢀ
mA  
mA  
mA  
ILIM  
IMIN  
32  
0.2  
ꢀ
ꢀ
Under-Scale Limit  
IREG = 0, IREF = 0  
0.25  
SPAN  
Span (Current Gain)  
Error(1)  
vs Temperature  
Nonlinearity  
S
100  
±0.05  
±3  
ꢀ
ꢀ
ꢀ
ꢀ
A/A  
%
ppm/°C  
%
IIN = 250µA to 25mA  
TA = –40°C to +85°C  
IIN = 250µA to 25mA  
±0.2  
±20  
±0.01  
±0.4  
ꢀ
±0.02  
±0.003  
INPUT  
Offset Voltage (Op Amp)  
vs Temperature  
vs Supply Voltage, V+  
Bias Current  
vs Temperature  
Noise: 0.1Hz to 10Hz  
VOS  
IIN = 40µA  
TA = –40°C to +85°C  
V+ = 7.5V to 36V  
±100  
±0.7  
±0.1  
–35  
150  
0.6  
±250  
±3  
±2  
ꢀ
ꢀ
ꢀ
ꢀ
ꢀ
ꢀ
±500  
±6  
ꢀ
µV  
µV/°C  
µV/V  
nA  
pA/°C  
µVp-p  
IB  
en  
DYNAMIC RESPONSE  
Small Signal Bandwidth  
Slew Rate  
CLOOP = 0, RL = 0  
380  
3.2  
ꢀ
ꢀ
kHz  
mA/µs  
(2)  
VREF  
XTR115  
XTR116  
2.5  
4.096  
±0.05  
±20  
±1  
±100  
10  
16  
ꢀ
ꢀ
ꢀ
ꢀ
ꢀ
ꢀ
ꢀ
ꢀ
V
V
%
Voltage Accuracy  
vs Temperature  
vs Supply Voltage, V+  
vs Load  
Noise: 0.1Hz to 10Hz  
Short-Circuit Current  
IREF = 0  
±0.25  
±35  
±10  
±0.5  
±75  
ꢀ
TA = –40°C to +85°C  
V+ = 7.5V to 36V  
IREF = 0mA to 2.5mA  
ppm/°C  
ppm/V  
ppm/mA  
µVp-p  
mA  
(2)  
VREG  
Voltage  
5
±0.05  
±0.1  
1
ꢀ
ꢀ
ꢀ
ꢀ
V
V
Voltage Accuracy  
vs Temperature  
vs Supply Voltage, V+  
vs Output Current  
Short-Circuit Current  
IREG = 0  
TA = –40°C to +85°C  
V+ = 7.5V to 36V  
±0.1  
ꢀ
mV/°C  
mV/V  
See Typical Curves  
12  
ꢀ
ꢀ
mA  
POWER SUPPLY  
Specified  
Voltage Range  
Quiescent Current  
Over Temperature, –40°C to +85°C  
V+  
+24  
V
V
µA  
µA  
+7.5  
+36  
250  
300  
ꢀ
ꢀ
ꢀ
ꢀ
200  
240  
ꢀ
ꢀ
TEMPERATURE RANGE  
Specification  
Operating  
–40  
–55  
–55  
+85  
+125  
+125  
ꢀ
ꢀ
ꢀ
ꢀ
ꢀ
ꢀ
°C  
°C  
°C  
Storage  
Thermal Resistance  
θJA  
150  
ꢀ
°C/W  
ꢀ Specifications the same as XTR115U and XTR116U.  
NOTES: (1) Does not include initial error or TCR of RIN. (2) Voltage measured with respect to IRET pin.  
XTR115, XTR116  
2
SBOS124A  
www.ti.com  
PIN CONFIGURATION  
ABSOLUTE MAXIMUM RATINGS(1)  
Power Supply, V+ (referenced to IO pin) .......................................... 40V  
Input Voltage (referenced to IRET pin) ........................................ 0V to V+  
Output Current Limit ............................................................... Continuous  
Top View  
SO-8  
V
V
REG, Short-Circuit .................................................................. Continuous  
REF, Short-Circuit .................................................................. Continuous  
1
2
3
4
VREF  
IIN  
IRET  
IO  
8
7
6
5
VREG  
Operating Temperature ................................................ –55°C to +125°C  
Storage Temperature Range ....................................... –55°C to +125°C  
Lead Temperature (soldering, 10s).............................................. +300°C  
Junction Temperature ................................................................... +165°C  
V+  
B (Base)  
E (Emitter)  
NOTE: (1) Stresses above these ratings may cause permanent damage.  
Exposure to absolute maximum conditions for extended periods may degrade  
device reliability.  
ELECTROSTATIC  
DISCHARGE SENSITIVITY  
This integrated circuit can be damaged by ESD. Texas Instru-  
ments recommends that all integrated circuits be handled with  
appropriate precautions. Failure to observe proper handling  
and installation procedures can cause damage.  
PACKAGE/ORDERING INFORMATION  
For the most current package and ordering information, see  
the Package Option Addendum located at the end of this  
data sheet.  
ESD damage can range from subtle performance degrada-  
tion to complete device failure. Precision integrated circuits  
may be more susceptible to damage because very small  
parametric changes could cause the device not to meet its  
published specifications.  
XTR115, XTR116  
3
SBOS124A  
www.ti.com  
TYPICAL PERFORMANCE CURVES  
At TA = +25°C, V+ = 24V, RIN = 20kΩ, and TIP29C external transistor, unless otherwise noted.  
CURRENT GAIN vs FREQUENCY  
260  
QUIESCENT CURRENT vs TEMPERATURE  
40  
240  
(V+) = 36V  
220  
200  
180  
160  
COUT = 0  
L = 0Ω  
30  
20  
10  
R
(V+) = 24V  
COUT = 10nF  
L = 250Ω  
R
(V+) = 7.5V  
10k  
100k  
Frequency (Hz)  
1M  
–75  
–50  
–25  
0
25  
50  
75  
100  
125  
Temperature (°C)  
REFERENCE VOLTAGE vs TEMPERATURE  
OVER-SCALE CURRENT vs TEMPERATURE  
With External Transistor  
0.1  
0
34  
33  
32  
31  
30  
29  
28  
V+ = 36V  
V+ = 7.5V  
V+ = 24V  
–0.1  
–0.2  
–0.3  
–75  
–50  
–25  
0
25  
50  
75  
100  
125  
–75  
–50  
–25  
0
25  
50  
75  
100  
125  
Temperature (°C)  
Temperature (°C)  
VREG VOLTAGE vs VREG CURRENT  
5.5  
5.0  
4.5  
+125°C  
–55°C  
–55°C  
+25°C  
+25°C  
Sinking  
Current  
Sourcing  
Current  
+125°C  
–1  
0
1
2
3
4
IREG Current (mA)  
XTR115, XTR116  
4
SBOS124A  
www.ti.com  
and upward. Full-scale inputs greater than 0.5V are recom-  
mend to minimize the effect of offset voltage and drift of A1.  
APPLICATIONS INFORMATION  
The XTR115 and XTR116 are identical devices except for  
the reference voltage output, pin 1. This voltage is available  
for external circuitry and is not used internally. Further  
discussions that apply to both devices will refer to the  
“XTR115/6.”  
EXTERNAL TRANSISTOR  
The external transistor, Q1, conducts the majority of the full-  
scale output current. Power dissipation in this transistor can  
approach 0.8W with high loop voltage (40V) and 20mA  
output current. The XTR115/6 is designed to use an external  
transistor to avoid on-chip thermal-induced errors. Heat  
produced by Q1 will still cause ambient temperature changes  
that can affect the XTR115/6. To minimize these effects,  
locate Q1 away from sensitive analog circuitry, including  
XTR115/6. Mount Q1 so that heat is conducted to the  
outside of the transducer housing.  
Figure 1 shows basic circuit connections with representative  
simplified input circuitry. The XTR115/6 is a two-wire  
current transmitter. Its input signal (pin 2) controls the output  
current. A portion of this current flows into the V+ power  
supply, pin 7. The remaining current flows in Q1. External  
input circuitry connected to the XTR115/6 can be powered  
from VREG or VREF. Current drawn from these terminals  
must be returned to IRET, pin 3. This IRET pin is a “local  
ground” for input circuitry driving the XTR115/6.  
The XTR115/6 is designed to use virtually any NPN transis-  
tor with sufficient voltage, current and power rating. Case  
style and thermal mounting considerations often influence  
the choice for any given application. Several possible choices  
are listed in Figure 1. A MOSFET transistor will not improve  
the accuracy of the XTR115/6 and is not recommended.  
The XTR115/6 is a current-input device with a gain of 100.  
A current flowing into pin 2 produces IO = 100 • IIN. The  
input voltage at the IIN pin is zero (referred to the IRET pin).  
A voltage input is created with an external input resistor, as  
shown. Common full-scale input voltages range from 1V  
XTR115  
XTR116  
IREG  
IO  
5V  
VREG  
8
+5V  
Regulator  
V+  
7
XTR115: 2.5V  
XTR116: 4.096V  
IREF  
(1)  
VREF  
Voltage  
Reference  
1
VLOOP  
RIN  
20kΩ  
B
6
IIN  
10nF  
Q1  
VIN  
IIN  
2
Input  
Circuitry  
RL  
A1  
E
5
RLIM  
3
IRET  
R1  
2.475kΩ  
R2  
25Ω  
All return current  
from IREG and IREF  
IO  
4
I = 100 • IIN  
For IO = 4mA to 20mA  
IN = 40µA to 200µA  
I
NOTE: (1) See also Figure 5.  
With RIN = 20kΩ  
IN = 0.8V to 4V  
V
Possible choices for Q1 (see text).  
TYPE  
PACKAGE  
2N4922  
TIP29C  
TIP31B  
TO-225  
TO-220  
TO-220  
FIGURE 1. Basic Circuit Connections.  
XTR115, XTR116  
5
SBOS124A  
www.ti.com  
MINIMUM-SCALE CURRENT  
MAXIMUM OUTPUT CURRENT  
The quiescent current of the XTR115/6 (typically 200µA)  
is the lower limit of its output current. Zero input current  
(IIN = 0) will produce an IO equal to the quiescent current.  
Output current will not begin to increase until IIN > IQ /100.  
Current drawn from VREF or VREG will add to this minimum  
output current. This means that more than 3.7mA is avail-  
able to power external circuitry while still allowing the  
output current to go below 4mA.  
The XTR115/6 provides accurate, linear output up to 25mA.  
Internal circuitry limits the output current to approximately  
32mA to protect the transmitter and loop power/measure-  
ment circuitry.  
It is possible to extend the output current range of the  
XTR115/6 by connecting an external resistor from pin 3 to  
pin 5, to change the current limit value. Since all output  
current must flow through internal resistors, it is possible to  
damage with excessive current. Output currents greater than  
45mA may cause permanent damage.  
OFFSETTING THE INPUT  
A low scale of 4mA is produced by creating a 40µA input  
current. This can be created with the proper value resistor  
from VREF (Figure 2), or by generating offset in the input  
drive circuitry.  
XTR115  
XTR116  
VREG  
VREF  
RIN  
VO  
D/A  
XTR115  
VREG  
XTR115  
XTR116  
VREG  
VREF  
IIN  
2.5V  
40µA  
VREF  
Voltage  
Reference  
R0  
62.5kΩ  
Digital  
Control  
IO  
D/A  
Optical  
Isolation  
IIN  
IRET  
A1  
0 to 160µA  
XTR115  
XTR116  
5V  
VREG  
RIN  
Filter  
PWM  
Out  
Digital  
Control  
IRET  
µC  
R1  
2.475kΩ  
Optical  
Isolation  
IRET  
FIGURE 2. Creating Low-Scale Offset.  
FIGURE 3. Digital Control Methods.  
XTR115, XTR116  
6
SBOS124A  
www.ti.com  
REVERSE-VOLTAGE PROTECTION  
Most surge protection zener diodes have a diode character-  
istic in the forward direction that will conduct excessive  
current, possibly damaging receiving-side circuitry if the  
loop connections are reversed. If a surge protection diode is  
used, a series diode or diode bridge should be used for  
protection against reversed connections.  
The XTR115/6 low compliance voltage rating (7.5V) per-  
mits the use of various voltage protection methods without  
compromising operating range. Figure 4 shows a diode  
bridge circuit which allows normal operation even when the  
voltage connection lines are reversed. The bridge causes a  
two diode drop (approximately 1.4V) loss in loop supply  
voltage. This results in a compliance voltage of approxi-  
mately 9V—satisfactory for most applications. A diode can  
be inserted in series with the loop supply voltage and the V+  
pin to protect against reverse output connection lines with  
only a 0.7V loss in loop supply voltage.  
RADIO FREQUENCY INTERFERENCE  
The long wire lengths of current loops invite radio frequency  
interference. RF can be rectified by the input circuitry of the  
XTR115/6 or preceding circuitry. This generally appears as  
an unstable output current that varies with the position of  
loop supply or input wiring.  
OVER-VOLTAGE SURGE PROTECTION  
Interference may also enter at the input terminals. For  
integrated transmitter assemblies with short connection to  
the sensor, the interference more likely comes from the  
current loop connections.  
Remote connections to current transmitters can sometimes be  
subjected to voltage surges. It is prudent to limit the maximum  
surge voltage applied to the XTR115/6 to as low as practical.  
Various zener diode and surge clamping diodes are specially  
designed for this purpose. Select a clamp diode with as low a  
voltage rating as possible for best protection. For example, a  
36V protection diode will assure proper transmitter operation  
at normal loop voltages, yet will provide an appropriate level  
of protection against voltage surges. Characterization tests on  
several production lots showed no damage with loop supply  
voltages up to 65V.  
8
Maximum VPS must be  
less than minimum  
voltage rating of zener  
diode.  
V+  
7
6
VREG  
1
VREF  
RIN  
2
3
0.01µF  
XTR115  
XTR116  
1N4148  
Diodes  
B
IIN  
Q1  
(1)  
D1  
VIN  
E
RL  
VPS  
5
4
IRET  
IO  
The diode bridge causes  
a 1.4V loss in loop supply  
voltage.  
NOTE: (1) Zener Diode 36V: 1N4753A or Motorola  
P6KE39A. Use lower voltage zener diodes with loop  
power supply voltages less than 30V for increased  
protection. See “Over-Voltage Surge Protection.”  
FIGURE 4. Reverse Voltage Operation and Over-Voltage Surge Protection.  
XTR115, XTR116  
7
SBOS124A  
www.ti.com  
If capacitive loading must be placed on the VREF pin, one of the compensation schemes shown below must be used to ensure stable operation.  
Values of capacitance must remain within the given ranges.  
XTR115  
XTR116  
(1)  
RISO  
10Ω  
IO  
VREG  
+5V  
Regulator  
V+  
7
8
ILOAD  
+
CHF  
CLF  
(0-2.5mA)  
(10pF to 0.5µF)  
(2.2µF to 22µF)  
VREF  
1
Voltage  
Reference  
VLOOP  
OR  
B
6
IIN  
2
RL  
A1  
E
5
(1)  
+
CLF  
(2.2µF to 22µF)  
RLIM  
3
CHF  
ILOAD  
(0-2.5mA)  
IRET  
(10pF to 0.5µF)  
R1  
2.475kΩ  
R2  
25Ω  
100 VIN  
RIN  
(1)  
RCOMP  
IO  
4
=
50Ω  
I = 100 • IIN  
NOTE: (1) Required compensation components.  
FIGURE 5. Stable Operation with Capacitive Load on VREF  
.
XTR115, XTR116  
8
SBOS124A  
www.ti.com  
PACKAGE OPTION ADDENDUM  
www.ti.com  
24-Jan-2013  
PACKAGING INFORMATION  
Orderable Device  
XTR115U  
Status Package Type Package Pins Package Qty  
Eco Plan Lead/Ball Finish  
MSL Peak Temp  
Op Temp (°C)  
Top-Side Markings  
Samples  
Drawing  
(1)  
(2)  
(3)  
(4)  
ACTIVE  
SOIC  
SOIC  
SOIC  
SOIC  
D
8
8
8
8
75  
2500  
2500  
75  
Green (RoHS  
& no Sb/Br)  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
Level-3-260C-168 HR  
Level-3-260C-168 HR  
Level-3-260C-168 HR  
Level-3-260C-168 HR  
XTR  
115U  
XTR115U/2K5  
XTR115U/2K5E4  
XTR115UA  
ACTIVE  
ACTIVE  
ACTIVE  
D
D
D
Green (RoHS  
& no Sb/Br)  
XTR  
115U  
Green (RoHS  
& no Sb/Br)  
XTR  
115U  
Green (RoHS  
& no Sb/Br)  
XTR  
115U  
A
XTR115UA/2K5  
XTR115UA/2K5E4  
XTR115UAE4  
ACTIVE  
ACTIVE  
ACTIVE  
SOIC  
SOIC  
SOIC  
D
D
D
8
8
8
2500  
2500  
75  
Green (RoHS  
& no Sb/Br)  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
Level-3-260C-168 HR  
Level-3-260C-168 HR  
Level-3-260C-168 HR  
XTR  
115U  
A
Green (RoHS  
& no Sb/Br)  
XTR  
115U  
A
Green (RoHS  
& no Sb/Br)  
XTR  
115U  
A
XTR115UG4  
XTR116U  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
SOIC  
SOIC  
SOIC  
SOIC  
SOIC  
D
D
D
D
D
8
8
8
8
8
75  
75  
Green (RoHS  
& no Sb/Br)  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
Level-3-260C-168 HR  
Level-3-260C-168 HR  
Level-3-260C-168 HR  
Level-3-260C-168 HR  
Level-3-260C-168 HR  
XTR  
115U  
Green (RoHS  
& no Sb/Br)  
XTR  
116U  
XTR116U/2K5  
XTR116U/2K5G4  
XTR116UA  
2500  
2500  
75  
Green (RoHS  
& no Sb/Br)  
XTR  
116U  
Green (RoHS  
& no Sb/Br)  
XTR  
116U  
Green (RoHS  
& no Sb/Br)  
XTR  
116U  
A
XTR116UA/2K5  
ACTIVE  
ACTIVE  
SOIC  
SOIC  
D
D
8
8
2500  
2500  
Green (RoHS  
& no Sb/Br)  
CU NIPDAU  
CU NIPDAU  
Level-3-260C-168 HR  
Level-3-260C-168 HR  
XTR  
116U  
A
XTR116UA/2K5E4  
Green (RoHS  
& no Sb/Br)  
XTR  
116U  
A
Addendum-Page 1  
PACKAGE OPTION ADDENDUM  
www.ti.com  
24-Jan-2013  
Orderable Device  
Status Package Type Package Pins Package Qty  
Eco Plan Lead/Ball Finish  
MSL Peak Temp  
Op Temp (°C)  
Top-Side Markings  
Samples  
Drawing  
(1)  
(2)  
(3)  
(4)  
XTR116UAE4  
XTR116UG4  
ACTIVE  
SOIC  
SOIC  
D
8
8
75  
75  
Green (RoHS  
& no Sb/Br)  
CU NIPDAU  
CU NIPDAU  
Level-3-260C-168 HR  
XTR  
116U  
A
ACTIVE  
D
Green (RoHS  
& no Sb/Br)  
Level-3-260C-168 HR  
XTR  
116U  
(1) The marketing status values are defined as follows:  
ACTIVE: Product device recommended for new designs.  
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.  
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.  
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.  
OBSOLETE: TI has discontinued the production of the device.  
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability  
information and additional product content details.  
TBD: The Pb-Free/Green conversion plan has not been defined.  
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that  
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.  
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between  
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.  
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight  
in homogeneous material)  
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.  
(4) Only one of markings shown within the brackets will appear on the physical device.  
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information  
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and  
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.  
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.  
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.  
Addendum-Page 2  
IMPORTANT NOTICE  
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other  
changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest  
issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and  
complete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale  
supplied at the time of order acknowledgment.  
TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms  
and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary  
to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily  
performed.  
TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and  
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adequate design and operating safeguards.  
TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or  
other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information  
published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or  
endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the  
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Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration  
and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered  
documentation. Information of third parties may be subject to additional restrictions.  
Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service  
voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice.  
TI is not responsible or liable for any such statements.  
Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements  
concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support  
that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which  
anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause  
harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use  
of any TI components in safety-critical applications.  
In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is to  
help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and  
requirements. Nonetheless, such components are subject to these terms.  
No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties  
have executed a special agreement specifically governing such use.  
Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use in  
military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components  
which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and  
regulatory requirements in connection with such use.  
TI has specifically designated certain components as meeting ISO/TS16949 requirements, mainly for automotive use. In any case of use of  
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Products  
Applications  
Audio  
www.ti.com/audio  
amplifier.ti.com  
dataconverter.ti.com  
www.dlp.com  
Automotive and Transportation www.ti.com/automotive  
Communications and Telecom www.ti.com/communications  
Amplifiers  
Data Converters  
DLP® Products  
DSP  
Computers and Peripherals  
Consumer Electronics  
Energy and Lighting  
Industrial  
www.ti.com/computers  
www.ti.com/consumer-apps  
www.ti.com/energy  
dsp.ti.com  
Clocks and Timers  
Interface  
www.ti.com/clocks  
interface.ti.com  
logic.ti.com  
www.ti.com/industrial  
www.ti.com/medical  
Medical  
Logic  
Security  
www.ti.com/security  
Power Mgmt  
Microcontrollers  
RFID  
power.ti.com  
Space, Avionics and Defense  
Video and Imaging  
www.ti.com/space-avionics-defense  
www.ti.com/video  
microcontroller.ti.com  
www.ti-rfid.com  
www.ti.com/omap  
OMAP Applications Processors  
Wireless Connectivity  
TI E2E Community  
e2e.ti.com  
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Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265  
Copyright © 2013, Texas Instruments Incorporated  
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