REVISION N
QTH-XXX-01-X-D-EMX-XX
No OF POSITIONS
ASO ONLY (APPLICATION SPECIFIC ORDER)
OPTION
-TY: TRAY PACKAGING
-030, -060, -090,
**-120, **-150
(PER ROW)
N
EDGE MOUNT THICKNESS
-EM2: .064[1.63] +/-.004 PCB
(USE QTH-30-01-D-EM2-XX &
T-1S42-01-X)
N **SEE NOTE 13
DO NOT
SCALE FROM
THIS PRINT
-EM3:
* = SEE NOTE 12
LEAD STYLE
-01: .1680[4.267]
(USE QTH-30-01-D-EM3-XX &
T-1S42-02-X)
SEE NOTE 12
{(No OF POS / 30) x .7875 [20.003]} + .3900 [9.910] REF
QTH-30-01-D-EMX-XX
C1
ROW SPECIFICATION
-D: DOUBLE
(USE QTH-30-01-D-EMX-XX)
(No OF POS / 30) x .7875 [20.003] REF
.7875 20.003 REF
No OF BANKS
PLATING SPECIFICATION
-F: FLASH SELECTIVE GOLD WITH MATTE TIN TAILS
(USE T-1S42-XX-F & T-1G1-01-F) [SEE NOTE 8]
-L: LIGHT SELECTIVE GOLD WITH MATTE TIN TAILS
(USE T-1S42-XX-L & T-1G1-01-L)
01
.2350 5.97
.1550 3.94 REF
REF
-H: HEAVY GOLD
(USE T-1S42-XX-H & T-1G1-01-G)
-C: ELECTRO-POLISHED SELECTIVE
(USE T-1S42-XX-C, T-1G1-01-L)
02
.6440 16.36 REF
.0470 1.19
REF
29 EQ SPACES
@ .01969 [.5000]
C3
.1680 4.267
(SEE NOTE 7)
T-1S42-XX-X
T-1G1-01-X
"A"
'A'
C2
.160 4.06 REF
.2782 7.067
REF
SEE NOTE 7
.1750 4.45
.118 3.00
REF
"A"
"B" .0030[.076]
(INSIDE TO INSIDE OF PIN)
.7450 18.92 REF
2
MAX SWAY
(TYP)
"A" REF
"C" REF
N
.1432 3.638
SECTION "A"-"A"
.0400 1.02 REF
.0080 0.20 REF
.01969 0.500 (TYP)
.0058 0.15
REF
.1400 3.56 REF
NOTES:
.0150 0.38 REF
C
1.
REPRESENTS A CRITICAL DIMENSION.
2. BURR ALLOWANCE: .0015[.038] MAX.
3. MINIMUM PUSHOUT FORCE: 5 OZ.
DETAIL 'A'
SCALE 3 : 1
4. MINIMUM GROUND PLANE RETENTION: 1 LB.
5. NOTE DELETED.
UNLESS OTHERWISE SPECIFIED,
DIMENSIONS ARE IN INCHES.
PROPRIETARY NOTE
6. PARTS TO BE MOLDED TO POSITION.
THIS DOCUMENT CONTAINS INFORMATION
CONFIDENTIAL AND PROPRIETARY TO
C4
7. GROUND PLANE TO BE WITHIN .004[.10] COPLANARITY & MAX VARIENCE OF .002.
8. -L PLATING CAN BE SUBSTITUTED FOR -F PLATING (TERMINAL),
-G PLATING CAN BE SUBSTITUTED FOR -F PLATING (GROUND PLANE).
9. NOTE DELETED.
TOLERANCES ARE:
SAMTEC, INC. AND SHALL NOT BE REPRODUCED
OR TRANSFERRED TO OTHER DOCUMENTS OR
DISCLOSED TO OTHERS OR USED FOR ANY
PURPOSE OTHER THAN THAT WHICH IT WAS
OBTAINED WITHOUT THE EXPRESSED WRITTEN
CONSENT OF SAMTEC, INC.
DECIMALS
ANGLES
2
.XX: .01[.3]
.XXX: .005[.13]
.XXXX: .0020[.051]
520 PARK EAST BLVD, NEW ALBANY, IN 47150
PHONE: 812-944-6733
FAX: 812-948-5047
e-Mail: info@SAMTEC.com
code: 55322
10. BOARD THICKNESS TO BE MEASURED FROM SOLDER PAD TO SOLDER PAD.
11. SEE www.samtec.com/processing/edgemt_tectalk/index.htm FOR
PROCESSING EDGE MOUNT PARTS TO BOARD.
SHEET SCALE: 1.5:1
MATERIAL:
DO NOT SCALE DRAWING
DESCRIPTION:
.5mm HS EDGE MOUNT TERMINAL ASSEMBLY
INSULATOR: LCP, COLOR: BLACK
12. -EM3 IS NOT A STANDARD OFFERING; AVAILABLE AS AN ASP ONLY. PLEASE CONTACT SAMTEC
INTERCONNECT PROCESSING GROUP WITH ORDER INQUIRIES
13. FOR NEW APPLICATIONS REQUIRING THESE POSITIONS, PLEASE CONTACT SAMTEC
INTERCONNECT PROCESSING GROUP.
TERMINAL & GROUND PLANE: PHOS BRONZE
DWG. NO.
QTH-XXX-01-X-D-EMX-XX
N
DEAN P
4/20/2000
SHEET 1 OF 1
BY:
c:\enterprisevault\DWG\MISC\MKTG\QTH-XXX-01-X-D-EMX-XX-MKT.SLDDRW
